ZA976259B - Method for altering cable semiconductor layer - Google Patents

Method for altering cable semiconductor layer

Info

Publication number
ZA976259B
ZA976259B ZA976259A ZA976259A ZA976259B ZA 976259 B ZA976259 B ZA 976259B ZA 976259 A ZA976259 A ZA 976259A ZA 976259 A ZA976259 A ZA 976259A ZA 976259 B ZA976259 B ZA 976259B
Authority
ZA
South Africa
Prior art keywords
semiconductor layer
cable semiconductor
altering cable
altering
layer
Prior art date
Application number
ZA976259A
Other languages
English (en)
Inventor
Gary A Shreve
Nanayakkara Liyanage Somasiri
Justine Anne Mooney
Alan George Hulme-Lowe
Curtis Roy Guilbert
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of ZA976259B publication Critical patent/ZA976259B/xx

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/10—Cable junctions protected by boxes, e.g. by distribution, connection or junction boxes
    • H02G15/103—Cable junctions protected by boxes, e.g. by distribution, connection or junction boxes with devices for relieving electrical stress
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/14—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for joining or terminating cables
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/02—Cable terminations
    • H02G15/06—Cable terminating boxes, frames or other structures
    • H02G15/064—Cable terminating boxes, frames or other structures with devices for relieving electrical stress
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/02—Cable terminations
    • H02G15/06—Cable terminating boxes, frames or other structures
    • H02G15/064—Cable terminating boxes, frames or other structures with devices for relieving electrical stress
    • H02G15/068—Cable terminating boxes, frames or other structures with devices for relieving electrical stress connected to the cable shield only
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/18—Cable junctions protected by sleeves, e.g. for communication cable
    • H02G15/184—Cable junctions protected by sleeves, e.g. for communication cable with devices for relieving electrical stress
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/18—Cable junctions protected by sleeves, e.g. for communication cable
    • H02G15/184—Cable junctions protected by sleeves, e.g. for communication cable with devices for relieving electrical stress
    • H02G15/188—Cable junctions protected by sleeves, e.g. for communication cable with devices for relieving electrical stress connected to a cable shield only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49123—Co-axial cable
ZA976259A 1996-08-01 1997-07-15 Method for altering cable semiconductor layer ZA976259B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/690,958 US5770257A (en) 1996-08-01 1996-08-01 Method for altering cable semiconductive layer

Publications (1)

Publication Number Publication Date
ZA976259B true ZA976259B (en) 1999-01-15

Family

ID=24774634

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA976259A ZA976259B (en) 1996-08-01 1997-07-15 Method for altering cable semiconductor layer

Country Status (8)

Country Link
US (3) US5770257A (pt)
EP (1) EP0916142A1 (pt)
JP (1) JP2000516439A (pt)
AU (1) AU1162597A (pt)
BR (1) BR9612682A (pt)
CA (1) CA2261030C (pt)
WO (1) WO1998006107A1 (pt)
ZA (1) ZA976259B (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3926149C2 (de) * 1988-08-15 1995-03-23 Mitel Corp Schaltungskarte für eine Telefonzentrale
DE19857334A1 (de) * 1998-12-11 2000-06-15 Rxs Schrumpftech Garnituren Kabelgarnitur zum Schutz einer Kabelverbindung in der Mittelspannungstechnik
US7186929B2 (en) * 2005-07-08 2007-03-06 3M Innovative Properties Company Sealing member for an entry port
JP5920923B2 (ja) 2012-09-03 2016-05-18 矢崎総業株式会社 ワイヤハーネス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644662A (en) * 1971-01-11 1972-02-22 Gen Electric Stress cascade-graded cable termination
CA1022633A (en) * 1974-05-04 1977-12-13 Shuji Yamamoto Dual coated power cable with calcium oxide filler
JPS60235304A (ja) * 1984-05-08 1985-11-22 株式会社フジクラ 直流電力ケ−ブル
JPH0664929B2 (ja) * 1985-04-02 1994-08-22 レイケム・コ−ポレイシヨン 電気デバイス
JPH01246708A (ja) * 1988-03-29 1989-10-02 Hitachi Cable Ltd 剥離容易性半導電性樹脂組成物
US5173684A (en) * 1989-09-08 1992-12-22 Mitsubishi Cable Industries, Ltd. Low molecular weight organic liquid sensor and detection system using same

Also Published As

Publication number Publication date
BR9612682A (pt) 1999-07-20
CA2261030A1 (en) 1998-02-12
CA2261030C (en) 2003-01-21
JP2000516439A (ja) 2000-12-05
US5770257A (en) 1998-06-23
US5885651A (en) 1999-03-23
EP0916142A1 (en) 1999-05-19
WO1998006107A1 (en) 1998-02-12
AU1162597A (en) 1998-02-25
US5973266A (en) 1999-10-26

Similar Documents

Publication Publication Date Title
HUP9700931A3 (en) Layer coating-composition for providing corrosion
TW474456U (en) Semiconductor apparatus
GB2296819B (en) Method for fabricating semiconductor devices
EP0847078A4 (en) MANUFACTURING METHOD OF SEMICONDUCTOR ARRANGEMENTS
GR3037051T3 (en) Stabilizer-combination for cable insulations
GB2291536B (en) Method for manufacturing semiconductor device
AU6120898A (en) Wiring forming method for semiconductor device and semiconductor device
HUP0103181A3 (en) Method for oxidizing hydrocarbons
SG53055A1 (en) Method and apparatus for manufacturing semiconductor devices
TW347909U (en) Wiring apparatus for semiconductor apparatus
GB2313708B (en) Method of fabricating semiconductor device
GB2326280B (en) Method for fabricating semiconductor device
ZA976259B (en) Method for altering cable semiconductor layer
GB9502863D0 (en) Method for fabricating semiconductor device
GB2281402B (en) Method for evaluating semiconductor layer
GB2307344B (en) Method for planarization of semiconductor device
KR100238220B1 (en) Plattening method of semiconductor device
GB2320802B (en) Method for fabricating semiconductor devices having triple wells
KR100230396B1 (en) Semiconductor device making method
EP1115145A4 (en) METHOD FOR MANUFACTURING A COMPOUND SEMICONDUCTOR LAYER AND COMPOUND SEMICONDUCTOR DEVICE
EP0794560A3 (en) Production method for insulated semiconductor device
GB2318451B (en) Method of fabricating semiconductor device
TW369209U (en) Semiconductor fabricating apparatus
AU1040197A (en) Method for manufacturing semiconductor device
GB9705934D0 (en) Assembly method for offshore platform