GB2281402B - Method for evaluating semiconductor layer - Google Patents

Method for evaluating semiconductor layer

Info

Publication number
GB2281402B
GB2281402B GB9417460A GB9417460A GB2281402B GB 2281402 B GB2281402 B GB 2281402B GB 9417460 A GB9417460 A GB 9417460A GB 9417460 A GB9417460 A GB 9417460A GB 2281402 B GB2281402 B GB 2281402B
Authority
GB
United Kingdom
Prior art keywords
semiconductor layer
evaluating semiconductor
evaluating
layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9417460A
Other versions
GB9417460D0 (en
GB2281402A (en
Inventor
Yoshihiro Hisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9417460D0 publication Critical patent/GB9417460D0/en
Publication of GB2281402A publication Critical patent/GB2281402A/en
Application granted granted Critical
Publication of GB2281402B publication Critical patent/GB2281402B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Hall/Mr Elements (AREA)
GB9417460A 1993-08-31 1994-08-30 Method for evaluating semiconductor layer Expired - Fee Related GB2281402B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21545493A JPH0766259A (en) 1993-08-31 1993-08-31 Semiconductor layer evaluation method

Publications (3)

Publication Number Publication Date
GB9417460D0 GB9417460D0 (en) 1994-10-19
GB2281402A GB2281402A (en) 1995-03-01
GB2281402B true GB2281402B (en) 1997-03-19

Family

ID=16672641

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9417460A Expired - Fee Related GB2281402B (en) 1993-08-31 1994-08-30 Method for evaluating semiconductor layer

Country Status (2)

Country Link
JP (1) JPH0766259A (en)
GB (1) GB2281402B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10790203B2 (en) 2016-04-26 2020-09-29 Active Layer Parametrics, Inc. Methods and systems for material property profiling of thin films
US11289386B2 (en) 2016-04-26 2022-03-29 Active Layer Parametrics, Inc. Methods and apparatus for test pattern forming and film property measurement

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2907059B2 (en) * 1995-04-27 1999-06-21 日本電気株式会社 Impurity diffusion profile measurement method
US6579730B2 (en) 2001-07-18 2003-06-17 Applied Materials, Inc. Monitoring process for oxide removal
WO2005022135A1 (en) * 2003-08-27 2005-03-10 Prussin Simon A In situ determination of resistivity, mobility and dopant concentration profiles
CN114235899B (en) * 2021-12-16 2023-11-03 安徽光智科技有限公司 Method for detecting carrier concentration of ultra-high purity germanium single crystal

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150042A (en) * 1991-09-23 1992-09-22 The United States Of America As Represented By The Secretary Of The Air Force On-wafer Hall-effect measurement system
US5217907A (en) * 1992-01-28 1993-06-08 National Semiconductor Corporation Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150042A (en) * 1991-09-23 1992-09-22 The United States Of America As Represented By The Secretary Of The Air Force On-wafer Hall-effect measurement system
US5217907A (en) * 1992-01-28 1993-06-08 National Semiconductor Corporation Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10790203B2 (en) 2016-04-26 2020-09-29 Active Layer Parametrics, Inc. Methods and systems for material property profiling of thin films
US11289386B2 (en) 2016-04-26 2022-03-29 Active Layer Parametrics, Inc. Methods and apparatus for test pattern forming and film property measurement
US11699622B2 (en) 2016-04-26 2023-07-11 Active Layer Parametrics, Inc. Methods and apparatus for test pattern forming and film property measurement

Also Published As

Publication number Publication date
JPH0766259A (en) 1995-03-10
GB9417460D0 (en) 1994-10-19
GB2281402A (en) 1995-03-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000830