GB9502863D0 - Method for fabricating semiconductor device - Google Patents
Method for fabricating semiconductor deviceInfo
- Publication number
- GB9502863D0 GB9502863D0 GBGB9502863.5A GB9502863A GB9502863D0 GB 9502863 D0 GB9502863 D0 GB 9502863D0 GB 9502863 A GB9502863 A GB 9502863A GB 9502863 D0 GB9502863 D0 GB 9502863D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- fabricating semiconductor
- fabricating
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6018729A JP2861785B2 (en) | 1994-02-15 | 1994-02-15 | Method for forming wiring of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9502863D0 true GB9502863D0 (en) | 1995-04-05 |
| GB2286721A GB2286721A (en) | 1995-08-23 |
Family
ID=11979763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9502863A Withdrawn GB2286721A (en) | 1994-02-15 | 1995-02-14 | Method for fabricating semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2861785B2 (en) |
| GB (1) | GB2286721A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100291585B1 (en) * | 1997-07-25 | 2001-11-30 | 윤종용 | Method for etching metal layer of semiconductor device |
| US6177353B1 (en) * | 1998-09-15 | 2001-01-23 | Infineon Technologies North America Corp. | Metallization etching techniques for reducing post-etch corrosion of metal lines |
| JP2000138224A (en) | 1998-11-04 | 2000-05-16 | Fujitsu Ltd | Method for manufacturing semiconductor device |
| JP4646346B2 (en) * | 2000-01-28 | 2011-03-09 | パナソニック株式会社 | Manufacturing method of electronic device |
| US7772097B2 (en) | 2007-11-05 | 2010-08-10 | Asm America, Inc. | Methods of selectively depositing silicon-containing films |
| JP5877658B2 (en) * | 2011-06-14 | 2016-03-08 | ローム株式会社 | Semiconductor device and manufacturing method thereof |
| CN102956430A (en) * | 2012-05-25 | 2013-03-06 | 深圳市华星光电技术有限公司 | Method for replacing helium atoms on film layer |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1059882A (en) * | 1976-08-16 | 1979-08-07 | Northern Telecom Limited | Gaseous plasma etching of aluminum and aluminum oxide |
| JPS6033367A (en) * | 1983-08-04 | 1985-02-20 | Nec Corp | Dry etching method of aluminum |
| US5219485A (en) * | 1985-10-11 | 1993-06-15 | Applied Materials, Inc. | Materials and methods for etching silicides, polycrystalline silicon and polycides |
| US4809851A (en) * | 1987-04-03 | 1989-03-07 | World Container Corporation | Collapsible container |
| JP2558738B2 (en) * | 1987-09-25 | 1996-11-27 | 株式会社東芝 | Surface treatment method |
| JPH02189919A (en) * | 1989-01-18 | 1990-07-25 | Nec Corp | Dry etching method |
| JP3016261B2 (en) * | 1991-02-14 | 2000-03-06 | ソニー株式会社 | Method for manufacturing semiconductor device |
| JPH0547721A (en) * | 1991-08-20 | 1993-02-26 | Sony Corp | Etching method |
| JPH05102142A (en) * | 1991-10-04 | 1993-04-23 | Sony Corp | Method for forming aluminum metallic pattern |
| JPH05160084A (en) * | 1991-12-11 | 1993-06-25 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1994
- 1994-02-15 JP JP6018729A patent/JP2861785B2/en not_active Expired - Fee Related
-
1995
- 1995-02-14 GB GB9502863A patent/GB2286721A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| GB2286721A (en) | 1995-08-23 |
| JPH07230993A (en) | 1995-08-29 |
| JP2861785B2 (en) | 1999-02-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |