ZA201005419B - Microelectronic substrate cleaning compositions - Google Patents
Microelectronic substrate cleaning compositionsInfo
- Publication number
- ZA201005419B ZA201005419B ZA2010/05419A ZA201005419A ZA201005419B ZA 201005419 B ZA201005419 B ZA 201005419B ZA 2010/05419 A ZA2010/05419 A ZA 2010/05419A ZA 201005419 A ZA201005419 A ZA 201005419A ZA 201005419 B ZA201005419 B ZA 201005419B
- Authority
- ZA
- South Africa
- Prior art keywords
- cleaning compositions
- substrate cleaning
- microelectronic substrate
- microelectronic
- compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
- H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
- H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3244908P | 2008-02-29 | 2008-02-29 | |
| PCT/US2009/033148 WO2009108474A1 (en) | 2008-02-29 | 2009-02-05 | Microelectronic substrate cleaning compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA201005419B true ZA201005419B (en) | 2011-04-28 |
Family
ID=40419175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA2010/05419A ZA201005419B (en) | 2008-02-29 | 2010-07-29 | Microelectronic substrate cleaning compositions |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US8168577B2 (enExample) |
| EP (1) | EP2247672B1 (enExample) |
| JP (1) | JP5512554B2 (enExample) |
| KR (1) | KR101570256B1 (enExample) |
| CN (1) | CN101959977B (enExample) |
| BR (1) | BRPI0908905A2 (enExample) |
| CA (1) | CA2716641A1 (enExample) |
| IL (1) | IL207605A (enExample) |
| TW (1) | TW200942608A (enExample) |
| WO (1) | WO2009108474A1 (enExample) |
| ZA (1) | ZA201005419B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101838483B (zh) * | 2010-05-11 | 2012-07-04 | 华北电网有限公司北京超高压公司 | 一种溶解型防污闪涂层清除剂及其制备方法 |
| WO2018180256A1 (ja) * | 2017-03-31 | 2018-10-04 | 関東化學株式会社 | 洗浄液組成物 |
| CN115386954A (zh) * | 2022-09-17 | 2022-11-25 | 中国科学院新疆理化技术研究所 | 化合物氟硼酸锂钠和氟硼酸锂钠双折射晶体及制备方法和用途 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4401747A (en) | 1982-09-02 | 1983-08-30 | J. T. Baker Chemical Company | Stripping compositions and methods of stripping resists |
| US4491530A (en) | 1983-05-20 | 1985-01-01 | Allied Corporation | Brown stain suppressing phenol free and chlorinated hydrocarbons free photoresist stripper |
| US5480585A (en) | 1992-04-02 | 1996-01-02 | Nagase Electronic Chemicals, Ltd. | Stripping liquid compositions |
| US5568461A (en) * | 1994-04-20 | 1996-10-22 | Matsushita Electric Industrial Co., Ltd. | Optical information recording and reproducing apparatus |
| JPH07311469A (ja) * | 1994-05-17 | 1995-11-28 | Hitachi Chem Co Ltd | ポリイミド系樹脂膜のレジスト剥離残り除去液およびポリイミド系樹脂膜パターンの製造法 |
| US5571447A (en) | 1995-03-20 | 1996-11-05 | Ashland Inc. | Stripping and cleaning composition |
| JPH1055993A (ja) | 1996-08-09 | 1998-02-24 | Hitachi Ltd | 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法 |
| US6043206A (en) | 1996-10-19 | 2000-03-28 | Samsung Electronics Co., Ltd. | Solutions for cleaning integrated circuit substrates |
| KR100248113B1 (ko) * | 1997-01-21 | 2000-03-15 | 이기원 | 전자 표시 장치 및 기판용 세정 및 식각 조성물 |
| US6150282A (en) | 1997-11-13 | 2000-11-21 | International Business Machines Corporation | Selective removal of etching residues |
| US6432209B2 (en) | 1998-03-03 | 2002-08-13 | Silicon Valley Chemlabs | Composition and method for removing resist and etching residues using hydroxylazmmonium carboxylates |
| JPH11323394A (ja) | 1998-05-14 | 1999-11-26 | Texas Instr Japan Ltd | 半導体素子製造用洗浄剤及びそれを用いた半導体素子の製造方法 |
| KR100288769B1 (ko) | 1998-07-10 | 2001-09-17 | 윤종용 | 포토레지스트용스트리퍼조성물 |
| US6828289B2 (en) | 1999-01-27 | 2004-12-07 | Air Products And Chemicals, Inc. | Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature |
| US6761835B2 (en) | 2000-07-07 | 2004-07-13 | Tdk Corporation | Phosphor multilayer and EL panel |
| US6777380B2 (en) | 2000-07-10 | 2004-08-17 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
| US20030022800A1 (en) | 2001-06-14 | 2003-01-30 | Peters Darryl W. | Aqueous buffered fluoride-containing etch residue removers and cleaners |
| US6773873B2 (en) * | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
| EP1512050A2 (en) * | 2002-06-07 | 2005-03-09 | Mallinckrodt Baker, Inc. | Cleaning compositions for microelectronic substrates |
| US7192860B2 (en) | 2002-06-20 | 2007-03-20 | Honeywell International Inc. | Highly selective silicon oxide etching compositions |
| US6677286B1 (en) | 2002-07-10 | 2004-01-13 | Air Products And Chemicals, Inc. | Compositions for removing etching residue and use thereof |
| US7166419B2 (en) | 2002-09-26 | 2007-01-23 | Air Products And Chemicals, Inc. | Compositions substrate for removing etching residue and use thereof |
| CA2544198C (en) * | 2003-10-29 | 2011-07-26 | Mallinckrodt Baker, Inc. | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors |
| US8030263B2 (en) | 2004-07-01 | 2011-10-04 | Air Products And Chemicals, Inc. | Composition for stripping and cleaning and use thereof |
| JP2006041446A (ja) * | 2004-07-30 | 2006-02-09 | Sumitomo Chemical Co Ltd | 電子部品洗浄液 |
| PT1828848E (pt) * | 2004-12-10 | 2010-05-21 | Mallinckrodt Baker Inc | Composições de limpeza para microelectrónica, não aquosas e não corrosivas, contendo inibidores da corrosão poliméricos |
| EP1853973A1 (en) | 2005-02-25 | 2007-11-14 | Ekc Technology, Inc. | Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material |
| KR20070117624A (ko) * | 2005-04-04 | 2007-12-12 | 말린크로트 베이커, 인코포레이티드 | 기판 공정 적용시의 이온 주입 포토레지스트 세척용 조성물 |
| JP2006310603A (ja) * | 2005-04-28 | 2006-11-09 | Nissan Chem Ind Ltd | ホウ素化合物を含む半導体用洗浄液組成物及び洗浄方法 |
| EP1894230A2 (en) * | 2005-06-13 | 2008-03-05 | Advanced Technology Materials, Inc. | Compositions and methods for selective removal of metal or metal alloy after metal silicide formation |
| KR100655647B1 (ko) * | 2005-07-04 | 2006-12-08 | 삼성전자주식회사 | 반도체 기판용 세정액 조성물, 이의 제조 방법, 이를이용한 반도체 기판의 세정 방법 및 반도체 장치의 제조방법 |
| AU2006340825A1 (en) * | 2005-11-09 | 2007-10-04 | Advanced Technology Materials, Inc. | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
| US7582508B2 (en) | 2006-05-31 | 2009-09-01 | Byoung-Choo Park | Method for manufacturing an organic semiconductor device that utilizes ionic salt |
| WO2008023858A1 (en) | 2006-08-25 | 2008-02-28 | Hanwha Chemical Corporation | Manufacturing methods of fine cerium oxide particles and its slurry for shallow trench isolation process of semiconductor |
| US20080139436A1 (en) * | 2006-09-18 | 2008-06-12 | Chris Reid | Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material |
| US20080125342A1 (en) | 2006-11-07 | 2008-05-29 | Advanced Technology Materials, Inc. | Formulations for cleaning memory device structures |
| EP2108039A2 (en) | 2006-12-21 | 2009-10-14 | Advanced Technology Materials, Inc. | Liquid cleaner for the removal of post-etch residues |
| US8026201B2 (en) * | 2007-01-03 | 2011-09-27 | Az Electronic Materials Usa Corp. | Stripper for coating layer |
-
2009
- 2009-02-05 US US12/811,257 patent/US8168577B2/en not_active Expired - Fee Related
- 2009-02-05 KR KR1020107019104A patent/KR101570256B1/ko active Active
- 2009-02-05 BR BRPI0908905A patent/BRPI0908905A2/pt not_active IP Right Cessation
- 2009-02-05 EP EP09714861.3A patent/EP2247672B1/en not_active Not-in-force
- 2009-02-05 WO PCT/US2009/033148 patent/WO2009108474A1/en not_active Ceased
- 2009-02-05 CN CN2009801068386A patent/CN101959977B/zh active Active
- 2009-02-05 CA CA2716641A patent/CA2716641A1/en not_active Abandoned
- 2009-02-05 JP JP2010548782A patent/JP5512554B2/ja active Active
- 2009-02-25 TW TW098106023A patent/TW200942608A/zh unknown
-
2010
- 2010-07-29 ZA ZA2010/05419A patent/ZA201005419B/en unknown
- 2010-08-12 IL IL207605A patent/IL207605A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100125270A (ko) | 2010-11-30 |
| US20110046036A1 (en) | 2011-02-24 |
| IL207605A0 (en) | 2010-12-30 |
| WO2009108474A1 (en) | 2009-09-03 |
| TW200942608A (en) | 2009-10-16 |
| EP2247672A1 (en) | 2010-11-10 |
| CA2716641A1 (en) | 2009-09-03 |
| US8168577B2 (en) | 2012-05-01 |
| CN101959977A (zh) | 2011-01-26 |
| KR101570256B1 (ko) | 2015-11-18 |
| JP5512554B2 (ja) | 2014-06-04 |
| JP2011516620A (ja) | 2011-05-26 |
| BRPI0908905A2 (pt) | 2015-09-22 |
| CN101959977B (zh) | 2013-12-04 |
| EP2247672B1 (en) | 2013-06-05 |
| IL207605A (en) | 2014-02-27 |
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