TWI372791B - Etching compositions for copper-containing materials - Google Patents
Etching compositions for copper-containing materialsInfo
- Publication number
- TWI372791B TWI372791B TW097145188A TW97145188A TWI372791B TW I372791 B TWI372791 B TW I372791B TW 097145188 A TW097145188 A TW 097145188A TW 97145188 A TW97145188 A TW 97145188A TW I372791 B TWI372791 B TW I372791B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- containing materials
- etching compositions
- etching
- compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008005517A JP4916455B2 (en) | 2008-01-15 | 2008-01-15 | Etching composition for copper-containing materials |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200940747A TW200940747A (en) | 2009-10-01 |
TWI372791B true TWI372791B (en) | 2012-09-21 |
Family
ID=40945269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097145188A TWI372791B (en) | 2008-01-15 | 2008-11-21 | Etching compositions for copper-containing materials |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4916455B2 (en) |
KR (1) | KR101191064B1 (en) |
CN (1) | CN101498000B (en) |
TW (1) | TWI372791B (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011019222A2 (en) * | 2009-08-13 | 2011-02-17 | 동우 화인켐 주식회사 | Etchant composition for forming copper interconnects |
EP2537960B1 (en) * | 2010-02-15 | 2015-04-01 | Mitsubishi Gas Chemical Company, Inc. | ETCHING SOLUTION and etching method FOR MULTILAYER THIN FILM HAVING COPPER LAYER AND MOLYBDENUM LAYER CONTAINED THEREIN |
KR101343729B1 (en) | 2010-02-22 | 2013-12-19 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Method of forming circuits upon flexible laminate substrate |
KR101608873B1 (en) * | 2010-03-18 | 2016-04-05 | 삼성디스플레이 주식회사 | Etchant for metal wire and method for manufacturing metal wire using the same |
JP5531708B2 (en) * | 2010-03-26 | 2014-06-25 | メック株式会社 | Copper etching solution and substrate manufacturing method |
CN103222349A (en) | 2010-11-12 | 2013-07-24 | 吉坤日矿日石金属株式会社 | Method for forming circuit on flexible laminate substrate |
JP5535060B2 (en) * | 2010-12-28 | 2014-07-02 | 株式会社Adeka | Etching composition for copper-containing material and method for etching copper-containing material |
TW201250059A (en) * | 2011-03-08 | 2012-12-16 | Nagase Chemtex Corp | Etching liquid |
CN102330098B (en) * | 2011-08-31 | 2014-01-29 | 东莞市富默克化工有限公司 | Surface treating agent for quickly increasing surface roughness and deoxidizing for circuit board |
JP5933950B2 (en) * | 2011-09-30 | 2016-06-15 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Etching solution for copper or copper alloy |
CN104160486B (en) * | 2012-03-13 | 2016-11-02 | 株式会社Adeka | The application of etchant and engraving method |
JP2014036064A (en) * | 2012-08-08 | 2014-02-24 | Ube Ind Ltd | Method of manufacturing printed circuit board |
EP2754732B1 (en) * | 2013-01-15 | 2015-03-11 | ATOTECH Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
JP6078394B2 (en) * | 2013-03-27 | 2017-02-08 | 株式会社Adeka | Etching solution composition and etching method |
KR102128061B1 (en) * | 2013-04-05 | 2020-06-29 | 해성디에스 주식회사 | Etchant composition for copper-containing metal film and etching method using the same |
KR102107476B1 (en) * | 2013-04-10 | 2020-05-07 | 해성디에스 주식회사 | Etchant composition for copper-containing metal film and etching method using the same |
KR101593110B1 (en) * | 2013-11-21 | 2016-02-11 | 주식회사 익스톨 | Etchant composition with stabilizer for touch screen panel |
JP6164614B2 (en) | 2013-12-06 | 2017-07-19 | メック株式会社 | Etching solution, replenisher, and method for forming copper wiring |
KR102331036B1 (en) | 2014-10-10 | 2021-11-26 | 삼영순화(주) | Etching solution composition and etching method using the same |
KR101571843B1 (en) * | 2015-06-24 | 2015-11-25 | 진정복 | Nano etching composition for improving the surface adhension |
JP6218000B2 (en) | 2016-02-19 | 2017-10-25 | メック株式会社 | Copper microetching agent and method of manufacturing wiring board |
KR102598530B1 (en) | 2018-01-05 | 2023-11-06 | 가부시키가이샤 아데카 | Compositions and Etching Methods |
CN108774747A (en) * | 2018-06-12 | 2018-11-09 | 江苏博敏电子有限公司 | A kind of electrolytic etching prepares the electrolytic etching liquid of PCB fine-lines |
WO2020035982A1 (en) | 2018-08-13 | 2020-02-20 | 株式会社Adeka | Composition and etching method |
CN109041423A (en) * | 2018-09-21 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of pcb board and a kind of electronic equipment |
US11268025B2 (en) * | 2019-06-13 | 2022-03-08 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
CN111809182A (en) * | 2020-07-08 | 2020-10-23 | 江苏和达电子科技有限公司 | Etching liquid for copper/molybdenum (niobium)/IGZO film layer and preparation method and application thereof |
JP7507041B2 (en) | 2020-08-25 | 2024-06-27 | 株式会社Adeka | Composition, etching method, and method for forming circuit pattern |
CN112239869A (en) * | 2020-10-26 | 2021-01-19 | 杭州电子科技大学 | Corrosion inhibitor for reducing side etching of etched antenna and use method thereof |
JP7274221B2 (en) * | 2020-11-11 | 2023-05-16 | メック株式会社 | Etching agent and circuit board manufacturing method |
CN114807944A (en) * | 2021-01-28 | 2022-07-29 | 江苏悦锌达新材料有限公司 | Environment-friendly deplating agent and preparation method and use method thereof |
CN113026018B (en) * | 2021-03-01 | 2022-11-22 | 四川江化微电子材料有限公司 | Etching solution composition of copper-molybdenum alloy and etching method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001181867A (en) * | 1999-12-20 | 2001-07-03 | Asahi Denka Kogyo Kk | Microetching agent |
JP2001181868A (en) * | 1999-12-20 | 2001-07-03 | Asahi Denka Kogyo Kk | Microetching agent for copper and copper alloy |
JP3962239B2 (en) * | 2001-10-30 | 2007-08-22 | 株式会社Adeka | Etching composition and pattern forming method |
KR100505328B1 (en) * | 2002-12-12 | 2005-07-29 | 엘지.필립스 엘시디 주식회사 | ETCHING SOLUTIONS AND METHOD TO REMOVE MOLYBDENUM RESIDUE FOR Cu MOLYBDENUM MULTILAYERS |
JP4018559B2 (en) * | 2003-02-27 | 2007-12-05 | メック株式会社 | Manufacturing method of electronic substrate |
TWI282377B (en) * | 2003-07-25 | 2007-06-11 | Mec Co Ltd | Etchant, replenishment solution and method for producing copper wiring using the same |
JP4224436B2 (en) * | 2003-07-25 | 2009-02-12 | メック株式会社 | Etching agent, replenisher, and copper wiring manufacturing method using the same |
JPWO2005086551A1 (en) * | 2004-03-03 | 2007-08-09 | イビデン株式会社 | Etching solution, etching method, and printed wiring board |
US7456114B2 (en) * | 2005-12-21 | 2008-11-25 | Kesheng Feng | Microetching composition and method of using the same |
-
2008
- 2008-01-15 JP JP2008005517A patent/JP4916455B2/en active Active
- 2008-11-21 CN CN2008101074562A patent/CN101498000B/en active Active
- 2008-11-21 TW TW097145188A patent/TWI372791B/en active
- 2008-12-24 KR KR1020080132908A patent/KR101191064B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20090078736A (en) | 2009-07-20 |
CN101498000B (en) | 2012-07-18 |
KR101191064B1 (en) | 2012-10-15 |
CN101498000A (en) | 2009-08-05 |
TW200940747A (en) | 2009-10-01 |
JP4916455B2 (en) | 2012-04-11 |
JP2009167459A (en) | 2009-07-30 |
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