ZA200303525B - A heat conductive material. - Google Patents
A heat conductive material. Download PDFInfo
- Publication number
- ZA200303525B ZA200303525B ZA200303525A ZA200303525A ZA200303525B ZA 200303525 B ZA200303525 B ZA 200303525B ZA 200303525 A ZA200303525 A ZA 200303525A ZA 200303525 A ZA200303525 A ZA 200303525A ZA 200303525 B ZA200303525 B ZA 200303525B
- Authority
- ZA
- South Africa
- Prior art keywords
- diamond
- silicon
- thermal conductivity
- conductive material
- carbide
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title claims description 14
- 239000010432 diamond Substances 0.000 claims abstract description 139
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 120
- 239000002245 particle Substances 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 33
- 239000010703 silicon Substances 0.000 claims abstract description 31
- 239000002131 composite material Substances 0.000 claims abstract description 24
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 40
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 22
- 229910000676 Si alloy Inorganic materials 0.000 claims description 21
- 229910052799 carbon Inorganic materials 0.000 claims description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 229910052735 hafnium Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052702 rhenium Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 23
- 239000010949 copper Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 238000001764 infiltration Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 11
- 239000010439 graphite Substances 0.000 description 10
- 229910002804 graphite Inorganic materials 0.000 description 10
- 238000005087 graphitization Methods 0.000 description 10
- 230000008595 infiltration Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 239000003575 carbonaceous material Substances 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002296 pyrolytic carbon Substances 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 238000007582 slurry-cast process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2000129403A RU2206502C2 (ru) | 2000-11-21 | 2000-11-21 | Композиционный материал |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200303525B true ZA200303525B (en) | 2004-03-30 |
Family
ID=20242528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200303525A ZA200303525B (en) | 2000-11-21 | 2003-05-07 | A heat conductive material. |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US6914025B2 (ko) |
| EP (1) | EP1337497B1 (ko) |
| JP (1) | JP4862169B2 (ko) |
| KR (1) | KR100758178B1 (ko) |
| CN (1) | CN1263704C (ko) |
| AT (1) | ATE342244T1 (ko) |
| AU (1) | AU9184801A (ko) |
| DE (1) | DE60123825T2 (ko) |
| ES (1) | ES2273889T3 (ko) |
| HK (1) | HK1072929A1 (ko) |
| RU (1) | RU2206502C2 (ko) |
| WO (1) | WO2002042240A2 (ko) |
| ZA (1) | ZA200303525B (ko) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027304B2 (en) * | 2001-02-15 | 2006-04-11 | Integral Technologies, Inc. | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| EP2428590B1 (en) * | 2001-11-09 | 2018-08-15 | Sumitomo Electric Industries, Ltd. | Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| GB0223321D0 (en) * | 2002-10-08 | 2002-11-13 | Element Six Ltd | Heat spreader |
| US7173334B2 (en) * | 2002-10-11 | 2007-02-06 | Chien-Min Sung | Diamond composite heat spreader and associated methods |
| AT7382U1 (de) * | 2003-03-11 | 2005-02-25 | Plansee Ag | Wärmesenke mit hoher wärmeleitfähigkeit |
| CN100345637C (zh) * | 2003-03-14 | 2007-10-31 | 攀枝花钢铁有限责任公司钢铁研究院 | 一种耐冲击构件及制造方法 |
| SE0301117L (sv) | 2003-04-14 | 2004-10-15 | Skeleton Technologies Ag | Metod att tillverka en diamantkomposit |
| US7279023B2 (en) | 2003-10-02 | 2007-10-09 | Materials And Electrochemical Research (Mer) Corporation | High thermal conductivity metal matrix composites |
| DE102005024790A1 (de) | 2005-05-26 | 2006-12-07 | Eos Gmbh Electro Optical Systems | Strahlungsheizung zum Heizen des Aufbaumaterials in einer Lasersintervorrichtung |
| US7359487B1 (en) * | 2005-09-15 | 2008-04-15 | Revera Incorporated | Diamond anode |
| US7791188B2 (en) | 2007-06-18 | 2010-09-07 | Chien-Min Sung | Heat spreader having single layer of diamond particles and associated methods |
| WO2010027504A1 (en) * | 2008-09-08 | 2010-03-11 | Materials And Electrochemical Research (Mer) Corporation | Machinable metal/diamond metal matrix composite compound structure and method of making same |
| US20110027603A1 (en) * | 2008-12-03 | 2011-02-03 | Applied Nanotech, Inc. | Enhancing Thermal Properties of Carbon Aluminum Composites |
| US20100139885A1 (en) * | 2008-12-09 | 2010-06-10 | Renewable Thermodynamics, Llc | Sintered diamond heat exchanger apparatus |
| US20100149756A1 (en) * | 2008-12-16 | 2010-06-17 | David Rowcliffe | Heat spreader |
| KR101005608B1 (ko) * | 2008-12-26 | 2011-01-05 | 대중기계 주식회사 | 재단기의 재단도 높이 조정 장치 |
| MD249Z (ro) * | 2009-04-29 | 2011-02-28 | Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы | Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat |
| CN101578030B (zh) * | 2009-06-12 | 2011-10-26 | 陈伟恩 | 散热结构及其制造方法 |
| US9394851B2 (en) | 2009-07-10 | 2016-07-19 | Etalim Inc. | Stirling cycle transducer for converting between thermal energy and mechanical energy |
| RU2413329C9 (ru) * | 2009-09-08 | 2016-04-20 | ООО "Научно-производственное предприятие "Томилинский электронный завод" | Теплоотводящий элемент |
| WO2011049479A1 (en) * | 2009-10-21 | 2011-04-28 | Andrey Mikhailovich Abyzov | Composite material having high thermal conductivity and process of fabricating same |
| US9006086B2 (en) | 2010-09-21 | 2015-04-14 | Chien-Min Sung | Stress regulated semiconductor devices and associated methods |
| WO2012040373A2 (en) | 2010-09-21 | 2012-03-29 | Ritedia Corporation | Diamond particle mololayer heat spreaders and associated methods |
| US8778784B2 (en) | 2010-09-21 | 2014-07-15 | Ritedia Corporation | Stress regulated semiconductor devices and associated methods |
| WO2012065245A1 (en) | 2010-11-18 | 2012-05-24 | Etalim Inc. | Stirling cycle transducer apparatus |
| US8946603B2 (en) * | 2011-09-16 | 2015-02-03 | Be Aerospace, Inc. | Drain/fill fitting |
| US9315732B1 (en) * | 2014-12-12 | 2016-04-19 | Infinitus Renewable Energy, LLC | Ash filter and reboiler |
| WO2016164498A1 (en) * | 2015-04-06 | 2016-10-13 | M Cubed Technologies, Inc. | Article having diamond-only contact surfaces |
| US12071367B2 (en) | 2018-07-16 | 2024-08-27 | Corning Incorporated | Glass substrates including uniform parting agent coatings and methods of ceramming the same |
| CN112437759A (zh) | 2018-07-16 | 2021-03-02 | 康宁股份有限公司 | 具有改善的翘曲的玻璃制品的陶瓷化方法 |
| US11834363B2 (en) | 2018-07-16 | 2023-12-05 | Corning Incorporated | Methods for ceramming glass with nucleation and growth density and viscosity changes |
| US12077464B2 (en) | 2018-07-16 | 2024-09-03 | Corning Incorporated | Setter plates and methods of ceramming glass articles using the same |
| KR102618611B1 (ko) | 2018-07-16 | 2023-12-27 | 코닝 인코포레이티드 | 개선된 특성을 갖는 유리 세라믹 물품 및 이의 제조 방법 |
| RU2731703C1 (ru) * | 2019-11-15 | 2020-09-08 | Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт конструкционных материалов "Прометей" имени И.В. Горынина Национального исследовательского центра "Курчатовский институт" (НИЦ "Курчатовский институт" - ЦНИИ КМ "Прометей") | Композиционный материал |
| RU2759858C1 (ru) * | 2020-12-25 | 2021-11-18 | Государственное Научное Учреждение Институт Порошковой Металлургии Имени Академика О.В. Романа | Способ получения износостойкого композиционного материала на основе карбида кремния |
| CN112694335B (zh) * | 2020-12-29 | 2022-09-27 | 北京科技大学广州新材料研究院 | 金刚石-碳化硅基板及其制备方法与应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151686A (en) | 1978-01-09 | 1979-05-01 | General Electric Company | Silicon carbide and silicon bonded polycrystalline diamond body and method of making it |
| US4220455A (en) | 1978-10-24 | 1980-09-02 | General Electric Company | Polycrystalline diamond and/or cubic boron nitride body and process for making said body |
| US4242106A (en) | 1979-01-02 | 1980-12-30 | General Electric Company | Composite of polycrystalline diamond and/or cubic boron nitride body/silicon carbide substrate |
| WO1982000140A1 (en) | 1980-07-09 | 1982-01-21 | Gen Electric | Silicon carbide composite and process for production |
| AU7919682A (en) | 1981-01-21 | 1982-07-29 | General Electric Company | Silicon carbide-diamond/boron nitride composite |
| US4381271A (en) | 1981-02-02 | 1983-04-26 | General Electric Company | Use of fired fibrous graphite in fabricating polycrystalline diamond and/or cubic boron nitride/silicon carbide/silicon composite bodies |
| WO1990001986A1 (en) | 1988-08-17 | 1990-03-08 | The Australian National University | Diamond compact possessing low electrical resistivity |
| JPH06199571A (ja) | 1991-06-20 | 1994-07-19 | Nippon Seratetsuku:Kk | 耐摩耗性セラミックス材料およびその製造方法 |
| RU2036779C1 (ru) | 1992-12-08 | 1995-06-09 | Акционерное общество закрытого типа "Карбид" | Способ получения алмазосодержащего материала |
| US6264882B1 (en) | 1994-05-20 | 2001-07-24 | The Regents Of The University Of California | Process for fabricating composite material having high thermal conductivity |
| JP3617232B2 (ja) | 1997-02-06 | 2005-02-02 | 住友電気工業株式会社 | 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ |
| JP3893681B2 (ja) | 1997-08-19 | 2007-03-14 | 住友電気工業株式会社 | 半導体用ヒートシンクおよびその製造方法 |
| PL339012A1 (en) | 1997-09-05 | 2000-12-04 | Frenton Ltd | Method of obtaining a composite material: diamond - silicon carbide - silicon and copmosite material obtained thereby |
| CN100349825C (zh) | 1998-09-28 | 2007-11-21 | 费伦顿有限公司 | 制备金刚石复合材料的方法及由该方法制备的复合材料 |
| US6447852B1 (en) * | 1999-03-04 | 2002-09-10 | Ambler Technologies, Inc. | Method of manufacturing a diamond composite and a composite produced by same |
-
2000
- 2000-11-21 RU RU2000129403A patent/RU2206502C2/ru not_active IP Right Cessation
-
2001
- 2001-09-10 CN CNB018192742A patent/CN1263704C/zh not_active Expired - Fee Related
- 2001-09-10 US US10/432,165 patent/US6914025B2/en not_active Expired - Fee Related
- 2001-09-10 DE DE2001623825 patent/DE60123825T2/de not_active Expired - Lifetime
- 2001-09-10 WO PCT/EP2001/010439 patent/WO2002042240A2/en active IP Right Grant
- 2001-09-10 ES ES01972038T patent/ES2273889T3/es not_active Expired - Lifetime
- 2001-09-10 EP EP01972038A patent/EP1337497B1/en not_active Expired - Lifetime
- 2001-09-10 KR KR1020037006802A patent/KR100758178B1/ko not_active IP Right Cessation
- 2001-09-10 AT AT01972038T patent/ATE342244T1/de not_active IP Right Cessation
- 2001-09-10 AU AU9184801A patent/AU9184801A/xx not_active Withdrawn
- 2001-09-10 JP JP2002544380A patent/JP4862169B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-07 ZA ZA200303525A patent/ZA200303525B/en unknown
-
2005
- 2005-06-08 HK HK05104806A patent/HK1072929A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20040053039A1 (en) | 2004-03-18 |
| DE60123825T2 (de) | 2007-05-16 |
| US6914025B2 (en) | 2005-07-05 |
| EP1337497B1 (en) | 2006-10-11 |
| KR100758178B1 (ko) | 2007-09-12 |
| DE60123825D1 (de) | 2006-11-23 |
| AU9184801A (en) | 2002-06-03 |
| ES2273889T3 (es) | 2007-05-16 |
| CN1263704C (zh) | 2006-07-12 |
| ATE342244T1 (de) | 2006-11-15 |
| CN1575265A (zh) | 2005-02-02 |
| JP4862169B2 (ja) | 2012-01-25 |
| RU2206502C2 (ru) | 2003-06-20 |
| WO2002042240A2 (en) | 2002-05-30 |
| KR20030074623A (ko) | 2003-09-19 |
| WO2002042240A3 (en) | 2002-10-10 |
| EP1337497A2 (en) | 2003-08-27 |
| HK1072929A1 (en) | 2005-09-16 |
| JP2004525050A (ja) | 2004-08-19 |
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