YU71478A - Plastic hermetic semiconductor arrangement - Google Patents

Plastic hermetic semiconductor arrangement

Info

Publication number
YU71478A
YU71478A YU00714/78A YU71478A YU71478A YU 71478 A YU71478 A YU 71478A YU 00714/78 A YU00714/78 A YU 00714/78A YU 71478 A YU71478 A YU 71478A YU 71478 A YU71478 A YU 71478A
Authority
YU
Yugoslavia
Prior art keywords
semiconductor arrangement
hermetic semiconductor
plastic hermetic
plastic
arrangement
Prior art date
Application number
YU00714/78A
Other languages
English (en)
Inventor
S L Greenberg
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of YU71478A publication Critical patent/YU71478A/xx

Links

Classifications

    • H10W40/778—
    • H10W70/481—
    • H10W72/07533—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—
YU00714/78A 1977-04-18 1978-03-27 Plastic hermetic semiconductor arrangement YU71478A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78833077A 1977-04-18 1977-04-18

Publications (1)

Publication Number Publication Date
YU71478A true YU71478A (en) 1982-06-30

Family

ID=25144164

Family Applications (1)

Application Number Title Priority Date Filing Date
YU00714/78A YU71478A (en) 1977-04-18 1978-03-27 Plastic hermetic semiconductor arrangement

Country Status (10)

Country Link
US (1) US4124864A (enExample)
JP (1) JPS53136963A (enExample)
BE (1) BE866112A (enExample)
DE (1) DE2815776A1 (enExample)
GB (1) GB1568461A (enExample)
IN (1) IN148328B (enExample)
IT (1) IT1094380B (enExample)
PL (1) PL205896A1 (enExample)
SE (1) SE437443B (enExample)
YU (1) YU71478A (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331970A (en) * 1978-09-18 1982-05-25 General Electric Company Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4285003A (en) * 1979-03-19 1981-08-18 Motorola, Inc. Lower cost semiconductor package with good thermal properties
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
US4689719A (en) * 1980-09-25 1987-08-25 Siemens Aktiengesellschaft Housing-free vertically insertable single-in-line circuit module
JPS58500463A (ja) * 1981-03-23 1983-03-24 モトロ−ラ・インコ−ポレ−テッド めっきのしてないパッケ−ジを含む半導体デバイス
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
US4680617A (en) * 1984-05-23 1987-07-14 Ross Milton I Encapsulated electronic circuit device, and method and apparatus for making same
IT1185410B (it) * 1985-10-10 1987-11-12 Sgs Microelettronica Spa Metodo e contenitore perfezionato per dissipare il calore generato da una piastrina a circuito integrato
JPH0815167B2 (ja) * 1986-03-26 1996-02-14 株式会社日立製作所 半導体装置
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
AU1298988A (en) * 1987-02-19 1988-09-14 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
KR100587020B1 (ko) 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
WO2009020835A2 (en) 2007-08-03 2009-02-12 Errcive, Inc. Porous bodies and methods
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
CN101673722A (zh) * 2008-09-10 2010-03-17 日月光半导体制造股份有限公司 导线架
US8277743B1 (en) 2009-04-08 2012-10-02 Errcive, Inc. Substrate fabrication
CN103828041B (zh) * 2011-09-29 2016-07-06 夏普株式会社 半导体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
JPS5026292Y1 (enExample) * 1968-01-29 1975-08-06
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
US3969752A (en) * 1973-12-03 1976-07-13 Power Hybrids, Inc. Hybrid transistor
US4023198A (en) * 1974-08-16 1977-05-10 Motorola, Inc. High frequency, high power semiconductor package

Also Published As

Publication number Publication date
IN148328B (enExample) 1981-01-17
SE7803106L (sv) 1978-10-19
PL205896A1 (pl) 1979-01-29
IT7822339A0 (it) 1978-04-14
BE866112A (fr) 1978-08-14
DE2815776A1 (de) 1978-10-19
SE437443B (sv) 1985-02-25
IT1094380B (it) 1985-08-02
GB1568461A (en) 1980-05-29
US4124864A (en) 1978-11-07
JPS53136963A (en) 1978-11-29

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