JPS53136963A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS53136963A
JPS53136963A JP4474078A JP4474078A JPS53136963A JP S53136963 A JPS53136963 A JP S53136963A JP 4474078 A JP4474078 A JP 4474078A JP 4474078 A JP4474078 A JP 4474078A JP S53136963 A JPS53136963 A JP S53136963A
Authority
JP
Japan
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4474078A
Other languages
English (en)
Japanese (ja)
Inventor
Sutanrei Guriinbaagu Reon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of JPS53136963A publication Critical patent/JPS53136963A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4474078A 1977-04-18 1978-04-14 Semiconductor Pending JPS53136963A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78833077A 1977-04-18 1977-04-18

Publications (1)

Publication Number Publication Date
JPS53136963A true JPS53136963A (en) 1978-11-29

Family

ID=25144164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4474078A Pending JPS53136963A (en) 1977-04-18 1978-04-14 Semiconductor

Country Status (10)

Country Link
US (1) US4124864A (enExample)
JP (1) JPS53136963A (enExample)
BE (1) BE866112A (enExample)
DE (1) DE2815776A1 (enExample)
GB (1) GB1568461A (enExample)
IN (1) IN148328B (enExample)
IT (1) IT1094380B (enExample)
PL (1) PL205896A1 (enExample)
SE (1) SE437443B (enExample)
YU (1) YU71478A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184757A (ja) * 2011-09-29 2016-10-20 シャープ株式会社 半導体装置

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331970A (en) * 1978-09-18 1982-05-25 General Electric Company Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4285003A (en) * 1979-03-19 1981-08-18 Motorola, Inc. Lower cost semiconductor package with good thermal properties
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
US4689719A (en) * 1980-09-25 1987-08-25 Siemens Aktiengesellschaft Housing-free vertically insertable single-in-line circuit module
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
WO1982003294A1 (en) * 1981-03-23 1982-09-30 Inc Motorola Semiconductor device including plateless package
US4680617A (en) * 1984-05-23 1987-07-14 Ross Milton I Encapsulated electronic circuit device, and method and apparatus for making same
IT1185410B (it) * 1985-10-10 1987-11-12 Sgs Microelettronica Spa Metodo e contenitore perfezionato per dissipare il calore generato da una piastrina a circuito integrato
JPH0815167B2 (ja) * 1986-03-26 1996-02-14 株式会社日立製作所 半導体装置
KR960010011B1 (ko) * 1987-02-19 1996-07-25 폴 와인스타인 플라스틱 핀 그리드 어레이 실장 제조공정
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
KR100587020B1 (ko) 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
CN101827638B (zh) 2007-08-03 2016-07-13 埃尔西韦公司 多孔体和方法
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
CN101673722A (zh) * 2008-09-10 2010-03-17 日月光半导体制造股份有限公司 导线架
US8277743B1 (en) 2009-04-08 2012-10-02 Errcive, Inc. Substrate fabrication

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
JPS5026292Y1 (enExample) * 1968-01-29 1975-08-06
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
US3969752A (en) * 1973-12-03 1976-07-13 Power Hybrids, Inc. Hybrid transistor
US4023198A (en) * 1974-08-16 1977-05-10 Motorola, Inc. High frequency, high power semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184757A (ja) * 2011-09-29 2016-10-20 シャープ株式会社 半導体装置

Also Published As

Publication number Publication date
SE7803106L (sv) 1978-10-19
SE437443B (sv) 1985-02-25
IT1094380B (it) 1985-08-02
DE2815776A1 (de) 1978-10-19
IT7822339A0 (it) 1978-04-14
IN148328B (enExample) 1981-01-17
YU71478A (en) 1982-06-30
US4124864A (en) 1978-11-07
BE866112A (fr) 1978-08-14
PL205896A1 (pl) 1979-01-29
GB1568461A (en) 1980-05-29

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