BE866112A - Dispositifs semiconducteurs encapsules dans de la matiere plastique - Google Patents
Dispositifs semiconducteurs encapsules dans de la matiere plastiqueInfo
- Publication number
- BE866112A BE866112A BE186894A BE186894A BE866112A BE 866112 A BE866112 A BE 866112A BE 186894 A BE186894 A BE 186894A BE 186894 A BE186894 A BE 186894A BE 866112 A BE866112 A BE 866112A
- Authority
- BE
- Belgium
- Prior art keywords
- plastic material
- semiconductor devices
- devices encapsulated
- encapsulated
- semiconductor
- Prior art date
Links
Classifications
-
- H10W40/778—
-
- H10W70/481—
-
- H10W72/07533—
-
- H10W72/5449—
-
- H10W74/00—
-
- H10W90/756—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78833077A | 1977-04-18 | 1977-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE866112A true BE866112A (fr) | 1978-08-14 |
Family
ID=25144164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE186894A BE866112A (fr) | 1977-04-18 | 1978-04-18 | Dispositifs semiconducteurs encapsules dans de la matiere plastique |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4124864A (enExample) |
| JP (1) | JPS53136963A (enExample) |
| BE (1) | BE866112A (enExample) |
| DE (1) | DE2815776A1 (enExample) |
| GB (1) | GB1568461A (enExample) |
| IN (1) | IN148328B (enExample) |
| IT (1) | IT1094380B (enExample) |
| PL (1) | PL205896A1 (enExample) |
| SE (1) | SE437443B (enExample) |
| YU (1) | YU71478A (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331970A (en) * | 1978-09-18 | 1982-05-25 | General Electric Company | Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation |
| US4346396A (en) * | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
| US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
| US4285003A (en) * | 1979-03-19 | 1981-08-18 | Motorola, Inc. | Lower cost semiconductor package with good thermal properties |
| US4295151A (en) * | 1980-01-14 | 1981-10-13 | Rca Corporation | Method of bonding two parts together and article produced thereby |
| US4339768A (en) * | 1980-01-18 | 1982-07-13 | Amp Incorporated | Transistors and manufacture thereof |
| JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
| LU83439A1 (de) * | 1980-09-25 | 1981-10-29 | Siemens Ag | Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul |
| US4689719A (en) * | 1980-09-25 | 1987-08-25 | Siemens Aktiengesellschaft | Housing-free vertically insertable single-in-line circuit module |
| JPS58500463A (ja) * | 1981-03-23 | 1983-03-24 | モトロ−ラ・インコ−ポレ−テッド | めっきのしてないパッケ−ジを含む半導体デバイス |
| US4546374A (en) * | 1981-03-23 | 1985-10-08 | Motorola Inc. | Semiconductor device including plateless package |
| US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
| IT1185410B (it) * | 1985-10-10 | 1987-11-12 | Sgs Microelettronica Spa | Metodo e contenitore perfezionato per dissipare il calore generato da una piastrina a circuito integrato |
| JPH0815167B2 (ja) * | 1986-03-26 | 1996-02-14 | 株式会社日立製作所 | 半導体装置 |
| US4965227A (en) * | 1987-05-21 | 1990-10-23 | Olin Corporation | Process for manufacturing plastic pin grid arrays and the product produced thereby |
| US5144412A (en) * | 1987-02-19 | 1992-09-01 | Olin Corporation | Process for manufacturing plastic pin grid arrays and the product produced thereby |
| AU1298988A (en) * | 1987-02-19 | 1988-09-14 | Olin Corporation | Process for manufacturing plastic pin grid arrays and the product produced thereby |
| US5049973A (en) * | 1990-06-26 | 1991-09-17 | Harris Semiconductor Patents, Inc. | Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s) |
| SG59997A1 (en) * | 1995-06-07 | 1999-02-22 | Ibm | Apparatus and process for improved die adhesion to organic chip carries |
| JP2000049184A (ja) * | 1998-05-27 | 2000-02-18 | Hitachi Ltd | 半導体装置およびその製造方法 |
| FR2782573B1 (fr) * | 1998-08-24 | 2003-10-17 | Possehl Electronic France Sa | Support metallique, notamment pour composants electroniques de puissance |
| KR100587020B1 (ko) | 2004-09-01 | 2006-06-08 | 삼성전기주식회사 | 고출력 발광 다이오드용 패키지 |
| WO2009020835A2 (en) | 2007-08-03 | 2009-02-12 | Errcive, Inc. | Porous bodies and methods |
| DE102007051870A1 (de) * | 2007-10-30 | 2009-05-07 | Robert Bosch Gmbh | Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses |
| CN101673722A (zh) * | 2008-09-10 | 2010-03-17 | 日月光半导体制造股份有限公司 | 导线架 |
| US8277743B1 (en) | 2009-04-08 | 2012-10-02 | Errcive, Inc. | Substrate fabrication |
| CN103828041B (zh) * | 2011-09-29 | 2016-07-06 | 夏普株式会社 | 半导体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1514273B2 (de) * | 1964-08-21 | 1974-08-22 | Nippon Electric Co., Ltd., Tokio | Halbleiteranordmng |
| JPS5026292Y1 (enExample) * | 1968-01-29 | 1975-08-06 | ||
| NL157456B (nl) * | 1968-07-30 | 1978-07-17 | Philips Nv | Halfgeleiderinrichting in een isolerende kunststofomhulling. |
| US3820153A (en) * | 1972-08-28 | 1974-06-25 | Zyrotron Ind Inc | Plurality of semiconductor elements mounted on common base |
| US3969752A (en) * | 1973-12-03 | 1976-07-13 | Power Hybrids, Inc. | Hybrid transistor |
| US4023198A (en) * | 1974-08-16 | 1977-05-10 | Motorola, Inc. | High frequency, high power semiconductor package |
-
1978
- 1978-02-28 IN IN217/CAL/78A patent/IN148328B/en unknown
- 1978-03-17 SE SE7803106A patent/SE437443B/sv not_active IP Right Cessation
- 1978-03-27 YU YU00714/78A patent/YU71478A/xx unknown
- 1978-04-06 GB GB13547/78A patent/GB1568461A/en not_active Expired
- 1978-04-07 PL PL20589678A patent/PL205896A1/xx unknown
- 1978-04-12 DE DE19782815776 patent/DE2815776A1/de not_active Withdrawn
- 1978-04-14 IT IT22339/78A patent/IT1094380B/it active
- 1978-04-14 JP JP4474078A patent/JPS53136963A/ja active Pending
- 1978-04-18 BE BE186894A patent/BE866112A/xx unknown
- 1978-05-05 US US05/903,119 patent/US4124864A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| IN148328B (enExample) | 1981-01-17 |
| SE7803106L (sv) | 1978-10-19 |
| PL205896A1 (pl) | 1979-01-29 |
| IT7822339A0 (it) | 1978-04-14 |
| DE2815776A1 (de) | 1978-10-19 |
| SE437443B (sv) | 1985-02-25 |
| IT1094380B (it) | 1985-08-02 |
| GB1568461A (en) | 1980-05-29 |
| YU71478A (en) | 1982-06-30 |
| US4124864A (en) | 1978-11-07 |
| JPS53136963A (en) | 1978-11-29 |
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