IT7822339A0 - Dispositivi semiconduttori incapsulati in materiale plastico. - Google Patents

Dispositivi semiconduttori incapsulati in materiale plastico.

Info

Publication number
IT7822339A0
IT7822339A0 IT7822339A IT2233978A IT7822339A0 IT 7822339 A0 IT7822339 A0 IT 7822339A0 IT 7822339 A IT7822339 A IT 7822339A IT 2233978 A IT2233978 A IT 2233978A IT 7822339 A0 IT7822339 A0 IT 7822339A0
Authority
IT
Italy
Prior art keywords
plastic material
semiconductor devices
devices encapsulated
encapsulated
semiconductor
Prior art date
Application number
IT7822339A
Other languages
English (en)
Other versions
IT1094380B (it
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of IT7822339A0 publication Critical patent/IT7822339A0/it
Application granted granted Critical
Publication of IT1094380B publication Critical patent/IT1094380B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01019—Potassium [K]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT22339/78A 1977-04-18 1978-04-14 Dispositivi semiconduttori incapsulati in materiale plastico IT1094380B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78833077A 1977-04-18 1977-04-18

Publications (2)

Publication Number Publication Date
IT7822339A0 true IT7822339A0 (it) 1978-04-14
IT1094380B IT1094380B (it) 1985-08-02

Family

ID=25144164

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22339/78A IT1094380B (it) 1977-04-18 1978-04-14 Dispositivi semiconduttori incapsulati in materiale plastico

Country Status (10)

Country Link
US (1) US4124864A (it)
JP (1) JPS53136963A (it)
BE (1) BE866112A (it)
DE (1) DE2815776A1 (it)
GB (1) GB1568461A (it)
IN (1) IN148328B (it)
IT (1) IT1094380B (it)
PL (1) PL205896A1 (it)
SE (1) SE437443B (it)
YU (1) YU71478A (it)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331970A (en) * 1978-09-18 1982-05-25 General Electric Company Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4285003A (en) * 1979-03-19 1981-08-18 Motorola, Inc. Lower cost semiconductor package with good thermal properties
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
US4689719A (en) * 1980-09-25 1987-08-25 Siemens Aktiengesellschaft Housing-free vertically insertable single-in-line circuit module
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
JPS58500463A (ja) * 1981-03-23 1983-03-24 モトロ−ラ・インコ−ポレ−テッド めっきのしてないパッケ−ジを含む半導体デバイス
US4680617A (en) * 1984-05-23 1987-07-14 Ross Milton I Encapsulated electronic circuit device, and method and apparatus for making same
IT1185410B (it) * 1985-10-10 1987-11-12 Sgs Microelettronica Spa Metodo e contenitore perfezionato per dissipare il calore generato da una piastrina a circuito integrato
JPH0815167B2 (ja) * 1986-03-26 1996-02-14 株式会社日立製作所 半導体装置
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
JPH02502322A (ja) * 1987-02-19 1990-07-26 オリン コーポレーション プラスチック製のピングリッドアレイを製作する方法及びそれにより生産される製品
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
WO2009020835A2 (en) 2007-08-03 2009-02-12 Errcive, Inc. Porous bodies and methods
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
CN101673722A (zh) * 2008-09-10 2010-03-17 日月光半导体制造股份有限公司 导线架
US8277743B1 (en) 2009-04-08 2012-10-02 Errcive, Inc. Substrate fabrication
JPWO2013047533A1 (ja) * 2011-09-29 2015-03-26 シャープ株式会社 半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
JPS5026292Y1 (it) * 1968-01-29 1975-08-06
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
US3969752A (en) * 1973-12-03 1976-07-13 Power Hybrids, Inc. Hybrid transistor
US4023198A (en) * 1974-08-16 1977-05-10 Motorola, Inc. High frequency, high power semiconductor package

Also Published As

Publication number Publication date
IN148328B (it) 1981-01-17
YU71478A (en) 1982-06-30
IT1094380B (it) 1985-08-02
GB1568461A (en) 1980-05-29
BE866112A (fr) 1978-08-14
JPS53136963A (en) 1978-11-29
PL205896A1 (pl) 1979-01-29
DE2815776A1 (de) 1978-10-19
SE7803106L (sv) 1978-10-19
SE437443B (sv) 1985-02-25
US4124864A (en) 1978-11-07

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