YU6083A - Growth method of a monocrystalline silicon on a masking layer - Google Patents
Growth method of a monocrystalline silicon on a masking layerInfo
- Publication number
- YU6083A YU6083A YU00060/83A YU6083A YU6083A YU 6083 A YU6083 A YU 6083A YU 00060/83 A YU00060/83 A YU 00060/83A YU 6083 A YU6083 A YU 6083A YU 6083 A YU6083 A YU 6083A
- Authority
- YU
- Yugoslavia
- Prior art keywords
- monocrystalline silicon
- masking layer
- growth method
- growth
- masking
- Prior art date
Links
- 230000000873 masking effect Effects 0.000 title 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
- H01L21/02642—Mask materials other than SiO2 or SiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33895882A | 1982-01-12 | 1982-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
YU6083A true YU6083A (en) | 1985-10-31 |
Family
ID=23326867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
YU00060/83A YU6083A (en) | 1982-01-12 | 1983-01-12 | Growth method of a monocrystalline silicon on a masking layer |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS58120595A (de) |
DE (1) | DE3300716A1 (de) |
FR (1) | FR2522695B1 (de) |
GB (1) | GB2113465B (de) |
IN (1) | IN157312B (de) |
IT (1) | IT1173651B (de) |
SE (1) | SE462756B (de) |
YU (1) | YU6083A (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6214424A (ja) * | 1985-07-11 | 1987-01-23 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2505754B2 (ja) * | 1986-07-11 | 1996-06-12 | キヤノン株式会社 | 光電変換装置の製造方法 |
US4829016A (en) * | 1987-10-19 | 1989-05-09 | Purdue Research Foundation | Bipolar transistor by selective and lateral epitaxial overgrowth |
US5403771A (en) * | 1990-12-26 | 1995-04-04 | Canon Kabushiki Kaisha | Process for producing a solar cell by means of epitaxial growth process |
JP3272532B2 (ja) * | 1993-12-27 | 2002-04-08 | 富士通株式会社 | 半導体装置の製造方法 |
JP4832022B2 (ja) * | 2005-07-29 | 2011-12-07 | 株式会社日立国際電気 | 基板処理装置 |
JP2010141079A (ja) * | 2008-12-11 | 2010-06-24 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法 |
JP2010147142A (ja) * | 2008-12-17 | 2010-07-01 | Hitachi Kokusai Electric Inc | 半導体製造方法と装置 |
US20110272011A1 (en) * | 2009-06-05 | 2011-11-10 | Amberwave, Inc. | Solar Cell |
JP2012054364A (ja) * | 2010-08-31 | 2012-03-15 | Nobuyuki Akiyama | シリコン薄膜の製造方法、シリコン薄膜太陽電池の製造方法、シリコン薄膜、シリコン薄膜太陽電池 |
CN115198352B (zh) * | 2022-08-24 | 2024-03-26 | 西安奕斯伟材料科技股份有限公司 | 一种外延生长方法及外延晶圆 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL260072A (de) * | 1960-01-15 | |||
US3746608A (en) * | 1963-05-14 | 1973-07-17 | Nitto Boseki Co Ltd | Shaped article of synthetic resin having mechanically disordered orientation |
DE2059116C3 (de) * | 1970-12-01 | 1974-11-21 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung eines Halbleiterbauelementes |
US3945864A (en) * | 1974-05-28 | 1976-03-23 | Rca Corporation | Method of growing thick expitaxial layers of silicon |
DE3008058A1 (de) * | 1980-03-03 | 1981-09-17 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zur herstellung einer monolithisch integrierten halbleiterschaltungsanordnung |
-
1982
- 1982-09-10 IN IN1046/CAL/82A patent/IN157312B/en unknown
- 1982-12-30 GB GB08236936A patent/GB2113465B/en not_active Expired
- 1982-12-31 FR FR8222189A patent/FR2522695B1/fr not_active Expired
-
1983
- 1983-01-04 SE SE8300040A patent/SE462756B/sv not_active IP Right Cessation
- 1983-01-05 JP JP58000398A patent/JPS58120595A/ja active Granted
- 1983-01-10 IT IT19043/83A patent/IT1173651B/it active
- 1983-01-11 DE DE19833300716 patent/DE3300716A1/de active Granted
- 1983-01-12 YU YU00060/83A patent/YU6083A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JPS58120595A (ja) | 1983-07-18 |
JPH0435439B2 (de) | 1992-06-11 |
FR2522695B1 (fr) | 1987-02-27 |
GB2113465B (en) | 1986-08-06 |
DE3300716A1 (de) | 1983-07-21 |
IT8319043A0 (it) | 1983-01-10 |
FR2522695A1 (fr) | 1983-09-09 |
IN157312B (de) | 1986-03-01 |
SE8300040D0 (sv) | 1983-01-04 |
SE8300040L (sv) | 1983-07-13 |
SE462756B (sv) | 1990-08-27 |
IT1173651B (it) | 1987-06-24 |
GB2113465A (en) | 1983-08-03 |
DE3300716C2 (de) | 1993-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5796518A (en) | Method of forming polycrystalline silicon layer | |
DE3072023D1 (en) | Method to make a silicon layer being partly polycrystalline and partly monocrystalline | |
GB2116067B (en) | Method for growing a low defect monocrystalline layer on a mask | |
GB2146045B (en) | A method of making p-doped silicon films and devices made therefrom | |
EP0207272A3 (en) | A method of producing a thin semiconductor layer | |
DE3380614D1 (en) | Method for making polycrystalline silicon film resistors | |
DE3571892D1 (en) | Method of forming a semiconductor structure having dielectrically isolated monocrystalline silicon regions | |
GB2322584B (en) | Method of manufacturing monocrystalline parts | |
GB2162206B (en) | Process for forming monocrystalline thin film of element semiconductor | |
GB2220300B (en) | A method of manufacturing silicon substrate | |
DE3362661D1 (en) | Method of producing a single-crystal silicon film | |
JPS55105382A (en) | Method of roughening surface of silicon substrate | |
GB2206448B (en) | A method of producing a semiconductor device | |
DE3567320D1 (en) | A method of forming a semiconductor device using a mask | |
GB2078697B (en) | Method of producing a group ii-vi semiconductor crystal compound | |
YU6083A (en) | Growth method of a monocrystalline silicon on a masking layer | |
EP0174553A3 (en) | Method for production of silicon thin film piezoresistive devices | |
EP0172621A3 (en) | Method for growing a single crystal of compound semiconductor | |
GB2162862B (en) | A method of growing a thin film single crystalline semiconductor | |
EP0167208A3 (en) | A method for growing an oxide layer on a silicon surface | |
JPS54159171A (en) | Method of forming epitaxial silicon layer | |
DE3462565D1 (en) | Method of forming large number of monocrystalline semiconductor regions on surface of insulator | |
DE3362193D1 (en) | Method of producing a silicon carbide body | |
DE3367295D1 (en) | Method of forming a magnetic layer on a substrate | |
DE3469892D1 (en) | Method of making a silicon nitride body |