WO2025100289A1 - 樹脂ギア - Google Patents
樹脂ギア Download PDFInfo
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- WO2025100289A1 WO2025100289A1 PCT/JP2024/038373 JP2024038373W WO2025100289A1 WO 2025100289 A1 WO2025100289 A1 WO 2025100289A1 JP 2024038373 W JP2024038373 W JP 2024038373W WO 2025100289 A1 WO2025100289 A1 WO 2025100289A1
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- Prior art keywords
- resin
- mass
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/028—Polyamidoamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
- F16H55/02—Toothed members; Worms
- F16H55/06—Use of materials; Use of treatments of toothed members or worms to affect their intrinsic material properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0233—Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
Definitions
- the present invention relates to plastic gears.
- Resin molded bodies made of a fiber base material and a matrix resin are used in a variety of fields due to their excellent light weight and mechanical properties.
- resin gears formed from resin molded bodies are lighter and quieter than metal gears, and are therefore used as parts for machine tools, industrial machinery, automobile engines, drive units for electric motorcycles, etc. (For example, see Patent Document 1 below).
- plastic gears used in automobile engines, drive units for electric motorcycles, etc. tend to have greater loads on their teeth due to the need to make the gears more compact and to replace metal gears. For this reason, there is a demand for plastic gears that are durable enough to achieve a long life even in high-load durability tests.
- the present invention aims to provide a resin gear with excellent durability.
- One aspect of the present invention relates to the inventions described in [1] to [5] below.
- the resin component is a cured product of a thermosetting resin composition impregnated into the fiber base material, and the thermosetting resin composition contains (A) a bis(2-oxazoline) compound and (B) an aromatic diamine compound.
- thermosetting resin composition further contains (C) an organic cyclic compound (excluding carboxylic acid compounds) having at least one polar functional group selected from the group consisting of a hydroxyl group, an amide group, and a carbonyl group, and at least one cyclic structure selected from the group consisting of an alicyclic ring and an aromatic ring.
- an organic cyclic compound excluding carboxylic acid compounds
- the content of the organic cyclic compound is 5 to 95 parts by mass when the total mass of the aromatic diamine compound and the organic cyclic compound is 100 parts by mass.
- the organic cyclic compound is 1-(2-hydroxyethyl)-2-pyrrolidone or N-(2,4,6-trichlorophenyl)maleimide.
- the present invention makes it possible to provide resin gears with excellent durability.
- FIG. 13 is a diagram showing the results of a motoring durability test of a resin gear.
- the present embodiment provides a detailed explanation of the embodiment of the present invention (hereinafter, "the present embodiment”).
- the present invention is not limited to the following embodiment.
- the resin gear of the present embodiment has teeth made of a resin molded body, and the resin molded body includes a fiber base material and a resin component.
- the fiber substrate examples include thermoplastic resin fibers such as polyphenylene sulfide, polyamide (aliphatic polyamide, aromatic polyamide), polyethylene, and polypropylene, inorganic fibers such as basalt fiber, alumina fiber, glass fiber, and carbon fiber, and metal fibers such as stainless steel fiber and aluminum fiber.
- the fiber substrate may contain one type of fiber alone or two or more types of fibers in combination.
- the fiber base material contains aramid fiber with a para-aramid fiber content of 80 to 100 mass %.
- para-aramid fibers fibers having a molecular structure represented by the following formulas (1) and (2) can be used.
- para-aramid fibers such as “Twaron” and “Technora” (both are product names manufactured by Teijin Limited), “Kevlar Pulp” (product name manufactured by Toray DuPont Co., Ltd.), “Taparan” (product name manufactured by Yantai Taiho New Materials Co., Ltd.), and “Heraklon” (product name manufactured by Kolon Industry Co., Ltd.) can be used.
- the aramid fibers may contain meta-aramid fibers (meta-aramid fibers) in addition to para-aramid fibers (para-aramid fibers).
- meta-aramid fiber a fiber having a molecular structure represented by the following formula (3) can be used.
- Meta-aramid fibers that can be used include commercially available products such as “Conex” (product name, manufactured by Teijin Limited), “Nomex” (product name, manufactured by DuPont Co., Ltd.), “Newstar” (product name, manufactured by Yantai Taiho New Materials Co., Ltd.), and “Tametal” (product name, manufactured by Yantai Taiho New Materials Co., Ltd.).
- the content of para-aramid fiber in the aramid fiber may be 85 to 100% by mass, or 85 to 90% by mass, based on the total amount of aramid fiber, from the viewpoint of improving the tensile strength of the resin molded body and achieving a higher level of durability.
- the content of aramid fibers in the fiber substrate may be 50-100% by mass, 60-100% by mass, or 100% by mass, based on the total amount of the fiber substrate.
- the fiber length of the aramid fiber may be 1 to 12 mm, 1 to 2 mm, 3 to 6 mm, or 7 to 12 mm, from the viewpoint of availability.
- the fiber diameter of the aramid fiber may be 8 to 12 ⁇ m from the viewpoints of availability and permeability of the resin into the substrate.
- the fiber substrate may contain an inorganic sliding material.
- inorganic sliding materials include carbon, molybdenum, molybdenum disulfide, potassium hexatitanate, potassium octatitanate, lithium potassium titanate, magnesium potassium titanate, and mica.
- the content of the inorganic sliding material in the resin molded body may be 10 parts by mass or less, or 5 parts by mass or less, per 100 parts by mass of the fiber base material, and no inorganic sliding material may be included.
- the proportion of the fiber base material in the resin molded body may be 35 to 55 volume percent, 35 to 50 volume percent, or 50 to 55 volume percent, from the viewpoint of ensuring mechanical strength and the resin impregnation speed.
- the content of the fiber substrate in the resin molded body may be 35 to 50 parts by mass, or 40 to 50 parts by mass, per 100 parts by mass of the fiber substrate and the cured product of the thermosetting resin composition of this embodiment, in order to facilitate impregnation of the substrate with the molten resin.
- the resin component examples include polyamide resin, polyaminoamide resin, epoxy resin, phenol resin, melamine resin, urea resin, polyimide resin, polyester resin, etc.
- the resin component may be a cured product of a thermosetting resin composition impregnated into a fiber substrate.
- thermosetting resin composition may contain (A) a bis(2-oxazoline) compound (hereinafter sometimes referred to as “component (A)”) and (B) an aromatic diamine compound (hereinafter sometimes referred to as “component (B)").
- component (A) a bis(2-oxazoline) compound
- component (B) an aromatic diamine compound
- the bis(2-oxazoline) compound is not particularly limited as long as it is a compound having two oxazoline skeletons in one molecule.
- the two oxazoline skeletons may be bonded directly or via an organic group.
- the component (A) may be used alone or in combination of two or more kinds.
- the bis(2-oxazoline) compound may be a compound represented by the following general formula (A).
- R 1 represents a single bond, an unsubstituted or substituted alkylene group, an unsubstituted or substituted phenylene group, or an unsubstituted or substituted pyridinediyl group
- R 2 and R 3 each independently represent a hydrogen atom, an alkyl group, or a phenyl group.
- R 1 has a substituent
- the substituent can be a methyl group
- component (A) examples include 2,2'-(1,3-phenylene)bis-2-oxazoline (hereinafter sometimes abbreviated as "PBO"), 2,2'-(1,4-phenylene)bis-2-oxazoline, 2,2'-(1,2-ethylene)bis-2-oxazoline, 2,2'-(1,4-butylene)bis-2-oxazoline, and 2,2'-(1,3-phenylene)bis-(5-methyl-2-oxazoline), (S,S)-2,6-bis(4-isopropyl-2-oxazolin-2-yl)pyridine, and (S,S)-2,2'-(dimethylmethylene)bis(4-phenyl-2-oxazoline).
- PBO 2,2'-(1,3-phenylene)bis-2-oxazoline
- PBO 2,2'-(1,4-phenylene)bis-2-oxazoline
- 2,2'-(1,2-ethylene)bis-2-oxazoline 2,2
- Component (A) may be PBO since it is inexpensive and readily available.
- the content of component (A) in the thermosetting resin composition may be 25 to 75 mass% based on the total solid content of the thermosetting resin composition.
- the solid content of the thermosetting resin composition means the components other than the solvent (components that form a cured product).
- aromatic diamine compounds examples include 4,4'-diaminodiphenylmethane (MDA), 3,3'-dichloro-4,4'-diaminodiphenylmethane (MOCA), 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), methylenebis(2-ethyl-6-methylaniline) and 4,4'-methylenebis(2-ethylaniline).
- MDA 4,4'-diaminodiphenylmethane
- MOCA 3,3'-dichloro-4,4'-diaminodiphenylmethane
- BAPP 2,2-bis[4-(4-aminophenoxy)phenyl]propane
- methylenebis(2-ethyl-6-methylaniline) 4,4'-methylenebis(2-ethylaniline).
- the component (B) may be used alone or in combination of two or more.
- the aromatic diamine compound may be an aromatic diamine compound containing a halogen atom, such as a chlorine atom or a bromine atom, in the molecule.
- a halogen atom such as a chlorine atom or a bromine atom
- the molecular weight of the aromatic diamine compound may be 150 or more, or 300 or more, in order to prevent volatilization, and may be 350 or less in order to improve the impregnation of the thermosetting resin composition into fiber substrates and to facilitate use in liquid form.
- the content of component (B) in the thermosetting resin composition may be 0.03 to 1.0 mol, 0.03 to 0.15 mol, 0.2 to 0.8 mol, or 0.8 to 1.0 mol per 1 mol of component (A) from the viewpoint of improving the mechanical strength of the resin molded body.
- the thermosetting resin composition may further contain, in addition to the above-mentioned components (A) and (B), (C) an organic cyclic compound (excluding carboxylic acid compounds) having at least one polar functional group selected from the group consisting of a hydroxyl group, an amide group, and a carbonyl group, and at least one cyclic structure selected from the group consisting of an alicyclic ring, a heterocyclic ring, and an aromatic ring (hereinafter, sometimes referred to as "component (C)").
- the carboxylic acid compound also includes an acid anhydride compound.
- the component (C) may be blended alone or in combination of two or more types.
- Component (C) may be a compound represented by the following general formulas (C1) to (C4).
- R 11 represents a hydrogen atom or an acetyl group.
- R 21 represents a vinyl group or an alkyl group having a hydroxyl group.
- Ar 31 represents an unsubstituted or substituted aromatic group.
- Ar 41 represents an aromatic group having a halogen atom.
- the component (C) may be a compound that satisfies one or more of the following conditions. (a) Having two or more polar functional groups selected from the group consisting of hydroxyl groups, amide groups, and carbonyl groups. (b) Having a chloro group.
- the thermosetting resin composition may contain, as component (C), at least one compound selected from the group consisting of 2-oxazolidone, 1-(2-hydroxyethyl)-2-pyrrolidone, phthalamide, and N-(2,4,6-trichlorophenyl)maleimide, or may contain at least one compound selected from the group consisting of 1-(2-hydroxyethyl)-2-pyrrolidone and N-(2,4,6-trichlorophenyl)maleimide.
- component (C) at least one compound selected from the group consisting of 2-oxazolidone, 1-(2-hydroxyethyl)-2-pyrrolidone, phthalamide, and N-(2,4,6-trichlorophenyl)maleimide, or may contain at least one compound selected from the group consisting of 1-(2-hydroxyethyl)-2-pyrrolidone and N-(2,4,6-trichlorophenyl)maleimide.
- the content of the (C) component in the thermosetting resin composition may be 0.05 to 2.0 mol, 0.05 to 0.5 mol, 0.5 to 1.0 mol, or 1.0 to 2.0 mol per mol of the (A) component, from the viewpoint of further improving the durability of the resin gear. Also, from the same viewpoint, the total content of the (B) component and the (C) component in the thermosetting resin composition may be 0.5 to 2.0 mol, 0.5 to 0.8 mol, 0.8 to 1.0 mol, or 1.0 to 2.0 mol per mol of the (A) component.
- the content of the (C) component in the thermosetting resin composition may be 5 to 95 parts by mass, 5 to 60 parts by mass, 5 to 30 parts by mass, 30 to 50 parts by mass, or 50 to 60 parts by mass, when the total mass of the (B) component and the (C) component is taken as 100 parts by mass.
- thermosetting resin composition of this embodiment may contain a curing accelerator, if necessary, to accelerate the curing reaction between the bis(2-oxazoline) compound and the components (B) and (C), etc.
- Cure accelerators include n-octyl bromide, p-toluenesulfonic acid esters such as ethyl p-toluenesulfonate, etc.
- the content of the curing accelerator in the thermosetting resin composition may be 0.3 to 5.0 parts by mass, 0.3 to 1.0 parts by mass, or 1.0 to 5.0 parts by mass, per 100 parts by mass of the total of the bis(2-oxazoline) compound, component (B), and component (C).
- the thermosetting resin composition may contain additives such as shock absorbing materials such as rubber, and organic sliding materials such as polyethylene glycol, as necessary.
- shock absorbing materials include silicone rubber, fluororubber, and nitrile rubber.
- the resin molded body can be produced by impregnating a fiber substrate with the above-mentioned thermosetting resin composition and then curing the thermosetting resin composition by heating.
- the fiber base material may be formed by a wet method in which the paper is made in water.
- thermosetting resin composition Curing conditions for the thermosetting resin composition include, for example, 160°C to 250°C for 3 to 20 minutes.
- the resin gear of this embodiment has teeth made of a resin molded body.
- the teeth may be formed, for example, by using a tooth-shaped mold during the stage of curing the above-mentioned thermosetting resin composition, or may be formed by cutting or the like after obtaining a resin molded body of a predetermined shape by the above-mentioned method.
- thermosetting resin composition The following compounds were prepared as raw materials for preparing the thermosetting resin composition.
- HEPL 1-(2-hydroxyethyl)-2-pyrrolidone (Tokyo Chemical Industry Co., Ltd.)
- T1987 N-(2,4,6-trichlorophenyl)maleimide (Tokyo Chemical Industry Co., Ltd.)
- OB n-octyl bromide (manufactured by Manac Corporation)
- Example 1 PBO as component (A) and MDA as component (B) were mixed in a mass ratio of 69:31 and heated to dissolve to obtain a liquid.
- OB as a curing accelerator was added to the liquid in a ratio of 0.9 parts by mass per 100 parts by mass of the total amount of components (A) and (B) to obtain a thermosetting resin composition.
- Cut fibers (fiber length 3 mm) of para-aramid fiber manufactured by Teijin Limited, product name Technora
- para-aramid fiber pulp manufactured by Toray DuPont Co., Ltd., product name Kevlar
- This fiber base material was compressed in the thickness direction in a papermaking die so that the ratio of the fiber base material in the resin molded body (hereinafter sometimes referred to as the "fiber base material volume ratio") was 45 volume%, and a cylindrical reinforcing fiber assembly was obtained.
- the cylindrical reinforcing fiber assembly obtained above was placed in a molding die and clamped, and the thermosetting resin composition prepared above was then injected and cured at a molding die temperature of 190°C for 4 minutes to form a disk (resin molded product). Teeth were then formed on the molded disk by cutting, resulting in a resin gear.
- Example 2 PBO as component (A), MDA as component (B), and HEPL as component (C) were mixed in a mass ratio of 69:25:6, and heated and dissolved to form a liquid.
- OB was added as a curing accelerator to this liquid in a ratio of 0.7 parts by mass per 100 parts by mass of the total amount of components (A), (B), and (C) to obtain a thermosetting resin composition.
- a resin gear was molded using this thermosetting resin composition in the same manner as in Example 1, except that the molding die temperature was set to 180°C.
- Example 3 PBO as component (A), MDA as component (B), and T1987 as component (C) were mixed in a mass ratio of 69:25:6, and heated and dissolved to obtain a liquid.
- OB was added as a curing accelerator to this liquid in a ratio of 0.9 parts by mass per 100 parts by mass of the total amount of components (A), (B), and (C) to obtain a thermosetting resin composition.
- a resin gear was molded in the same manner as in Example 1, except that this thermosetting resin composition was used.
- Example 4 PBO as component (A) and MDA as component (B) were mixed in a mass ratio of 73:27, and heated to dissolve to obtain a liquid.
- OB as a curing accelerator was added to the liquid in a ratio of 0.9 parts by mass per 100 parts by mass of the total amount of components (A) and (B) to obtain a thermosetting resin composition.
- a resin gear was molded in the same manner as in Example 1, except that this thermosetting resin composition was used.
- Example 1 A resin gear was molded in the same manner as in Example 1, except that cut fibers (fiber length 3 mm) of para-aramid fibers (manufactured by Teijin Limited, product name Technora), cut fibers (fiber length 3 mm) of meta-aramid fibers (manufactured by Teijin Limited, product name Conex), and para-aramid fiber pulp (manufactured by Toray DuPont Co., Ltd., product name Kevlar) were used in a mass ratio of 30:65:5.
- cut fibers (fiber length 3 mm) of para-aramid fibers manufactured by Teijin Limited, product name Technora
- cut fibers (fiber length 3 mm) of meta-aramid fibers manufactured by Teijin Limited, product name Conex
- para-aramid fiber pulp manufactured by Toray DuPont Co., Ltd., product name Kevlar
- Example 2 A resin gear was molded in the same manner as in Example 1, except that cut fibers (fiber length 3 mm) of para-aramid fiber (manufactured by Teijin Limited, product name Technora), cut fibers (fiber length 3 mm) of meta-aramid fiber (manufactured by Teijin Limited, product name Conex), and para-aramid fiber pulp (manufactured by Toray DuPont Co., Ltd., product name Kevlar) were used in a mass ratio of 53:42:5, and the fiber base material volume ratio was changed to 40 volume %.
- cut fibers (fiber length 3 mm) of para-aramid fiber manufactured by Teijin Limited, product name Technora
- cut fibers (fiber length 3 mm) of meta-aramid fiber manufactured by Teijin Limited, product name Conex
- para-aramid fiber pulp manufactured by Toray DuPont Co., Ltd., product name Kevlar
- the resin gear of Example 1 which contains aramid fiber with a para-aramid fiber content of 90% by mass as a fiber material, has high durability not only under high loads but also under low loads, compared to the resin gear of Comparative Example 1, which contains aramid fiber with a para-aramid fiber content of 35% by mass.
- the resin gear of the present invention can increase the durability life under both low and high load conditions.
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP24888586.5A EP4678942A1 (en) | 2023-11-08 | 2024-10-28 | Resin gear |
| CN202480024109.0A CN121013950A (zh) | 2023-11-08 | 2024-10-28 | 树脂齿轮 |
| JP2025556332A JPWO2025100289A1 (https=) | 2023-11-08 | 2024-10-28 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023190878 | 2023-11-08 | ||
| JP2023-190878 | 2023-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2025100289A1 true WO2025100289A1 (ja) | 2025-05-15 |
Family
ID=95695995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2024/038373 Pending WO2025100289A1 (ja) | 2023-11-08 | 2024-10-28 | 樹脂ギア |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4678942A1 (https=) |
| JP (1) | JPWO2025100289A1 (https=) |
| CN (1) | CN121013950A (https=) |
| WO (1) | WO2025100289A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01227061A (ja) | 1988-01-29 | 1989-09-11 | Abbott Lab | イオン捕捉イムノアッセイ法および装置 |
| JP2012167682A (ja) * | 2011-02-09 | 2012-09-06 | Shin Kobe Electric Mach Co Ltd | 樹脂製回転体及び樹脂製歯車、並びに樹脂製回転体の製造法 |
| JP2020105232A (ja) * | 2017-04-13 | 2020-07-09 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク |
| JP2020164759A (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
| JP2021173376A (ja) * | 2020-04-28 | 2021-11-01 | 昭和電工マテリアルズ株式会社 | 歯車 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6398280B2 (ja) * | 2014-04-16 | 2018-10-03 | 住友ベークライト株式会社 | ギア |
| WO2021085630A1 (ja) * | 2019-10-30 | 2021-05-06 | 旭化成株式会社 | セルロース微細繊維強化ポリアミド樹脂成形体 |
-
2024
- 2024-10-28 JP JP2025556332A patent/JPWO2025100289A1/ja active Pending
- 2024-10-28 WO PCT/JP2024/038373 patent/WO2025100289A1/ja active Pending
- 2024-10-28 EP EP24888586.5A patent/EP4678942A1/en active Pending
- 2024-10-28 CN CN202480024109.0A patent/CN121013950A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01227061A (ja) | 1988-01-29 | 1989-09-11 | Abbott Lab | イオン捕捉イムノアッセイ法および装置 |
| JP2012167682A (ja) * | 2011-02-09 | 2012-09-06 | Shin Kobe Electric Mach Co Ltd | 樹脂製回転体及び樹脂製歯車、並びに樹脂製回転体の製造法 |
| JP2020105232A (ja) * | 2017-04-13 | 2020-07-09 | Jnc株式会社 | 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク |
| JP2020164759A (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
| JP2021173376A (ja) * | 2020-04-28 | 2021-11-01 | 昭和電工マテリアルズ株式会社 | 歯車 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP4678942A1 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4678942A1 (en) | 2026-01-14 |
| JPWO2025100289A1 (https=) | 2025-05-15 |
| CN121013950A (zh) | 2025-11-25 |
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