Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/02—Fibres or whiskers
  • C08K7/04—Fibres or whiskers inorganic
  • C08K7/14—Glass
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
  • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
  • H10W70/69—Insulating materials thereof
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Definitions

• the wiring density of printed wiring boards has been increasing remarkably in recent years, and the diameter of through-holes has been decreasing accordingly.
• the insulating layer In order to obtain good plating properties in the reduced diameter through-holes, it is necessary for the insulating layer to have high water wettability so that the plating solution can easily flow in, but conventional materials do not have sufficient water wettability.
• the present embodiment aims to provide a prepreg whose cured product has excellent water wettability, and a laminate, printed wiring board, and semiconductor package that use the prepreg.
• a prepreg comprising: [2] The prepreg according to the above [1], wherein the siloxane-modified maleimide resin has a structure derived from a maleimide resin having one or more N-substituted maleimide groups and a structure derived from a siloxane compound having two primary amino groups.
• the glass fiber further contains SiO2 , The prepreg according to the above [1] or [2], wherein the total content of the Al 2 O 3 and the SiO 2 in the glass fiber is 70 mass% or more.
• a printed wiring board having a cured product of the prepreg according to any one of [1] to [5] above.
• a semiconductor package comprising the printed wiring board according to [6] above and a semiconductor element.
• a method for producing a printed wiring board comprising forming through-holes in a cured product of the prepreg according to any one of [1] to [5] above, and then forming a conductor layer in the through-hole by plating.
• a numerical range indicated using “to” indicates a range including the numerical values before and after “to” as the minimum and maximum values, respectively.
• a numerical range of "X to Y" (X and Y are real numbers) means a numerical range of not less than X and not more than Y.
• the expression “not less than X” means X and a numerical value exceeding X.
• the expression “not more than Y” means Y and a numerical value less than Y.
• Each lower limit and upper limit of a numerical range described herein may be arbitrarily combined with the lower limit or upper limit of any other numerical range. In the numerical ranges described in this specification, the lower or upper limit of the numerical range may be replaced with values shown in the examples.
• each component and material exemplified in this specification may be used alone or in combination of two or more types.
• the content of each component in the resin composition means the total amount of the multiple substances present in the resin composition, unless otherwise specified.
• containing XX used in this specification includes both the meaning of containing XX in a reacted state if XX is capable of reacting, and the meaning of simply containing XX.
• solids refers to components other than the solvent, and components that are liquid at 25°C are also considered to be solids.
• containing XX used in this specification includes both the meaning of containing XX in a reacted state if XX is capable of reacting, and the meaning of simply containing XX.
• the weight average molecular weight (Mw) in this specification means a value measured in terms of polystyrene by gel permeation chromatography (GPC). Specifically, the weight average molecular weight (Mw) in this specification can be measured by the method described in the Examples.
• si-cured product is synonymous with a resin composition in the B-stage state in JIS K 6800 (2006)
• cured product is synonymous with a resin composition in the C-stage state in JIS K 6800 (2006).
• This embodiment also includes any combination of the items described in this specification.
• the prepreg of this embodiment is A resin composition containing a siloxane-modified maleimide resin; A fiber base material containing glass fibers having an Al 2 O 3 content of 20 mass% or more; It is a prepreg containing.
• the resin composition contained in the prepreg of the present embodiment contains a siloxane-modified maleimide resin.
• the siloxane-modified maleimide resin may be referred to as "(A) siloxane-modified maleimide resin” or "component (A).”
• component (A) siloxane-modified maleimide resin or "component (A).”
• each component may be abbreviated as component (A), component (B), etc., and other components may be abbreviated in a similar manner.
• each component contained in the resin composition will be described in order.
• (A) Siloxane-modified maleimide resin There are no particular limitations on the component (A) as long as it is a maleimide resin modified with a siloxane compound.
• the siloxane-modified maleimide resin (A) may be used alone or in combination of two or more kinds.
• the siloxane-modified maleimide resin is preferably one having a structure derived from a maleimide resin having one or more N-substituted maleimide groups [hereinafter, sometimes referred to as "maleimide resin (AX)” or “(AX) component”] and a structure derived from a siloxane compound having two primary amino groups [hereinafter, sometimes referred to as "siloxane diamine”].
• the content of the structure derived from the maleimide resin (AX) in the siloxane-modified maleimide resin (A) is preferably 5 to 95% by mass, more preferably 30 to 93% by mass, and even more preferably 60 to 90% by mass, from the viewpoint of heat resistance.
• the maleimide resin (AX) is preferably an aromatic maleimide resin having two or more N-substituted maleimide groups, and more preferably an aromatic bismaleimide resin having two N-substituted maleimide groups.
• aromatic maleimide resin means a compound having an N-substituted maleimide group directly bonded to an aromatic ring.
• aromatic bismaleimide resin means a compound having two N-substituted maleimide groups directly bonded to an aromatic ring.
• aromatic polymaleimide resin means a compound having three or more N-substituted maleimide groups directly bonded to an aromatic ring.
• aliphatic maleimide resin means a compound having an N-substituted maleimide group directly bonded to an aliphatic hydrocarbon.
• the maleimide resin (AX) is preferably a maleimide resin represented by the following general formula (A-1):
• halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
• n A1 is an integer of 2 or more, the multiple R A1 may be the same or different.
• the divalent organic group represented by the general formula (A-3-1) represented by X A2 in the above general formula (A-3) is as follows.
• R A4 and R A5 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom.
• X A3 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond.
• n A4 and n A5 each independently represent an integer of 0 to 4. * represents a bonding site.
• Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R A4 and R A5 in the above general formula (A-3-1) include the same as those mentioned above for R A1 .
• Examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X A3 in the above general formula (A-3-1) include the same as those represented by X A2 above.
• n A4 and n A5 each independently represent an integer of 0 to 4, and both are preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.
• a plurality of R A4s or a plurality of R A5s may be the same or different.
• n A6 is an integer of 0 to 10. * represents a binding site.
• n A7 is a number from 0 to 5. * represents a binding site.
• R A6 and R A7 each independently represent a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms.
• n A8 represents an integer of 1 to 8. * represents a bonding site.
• Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R A6 and R A7 in the above general formula (A-6) include the same as those mentioned above for R A1 .
• n A8 in the above general formula (A-6) is an integer of 2 or greater, a plurality of R A6s or a plurality of R A7s may be the same or different.
• ⁇ Structure derived from siloxane diamine is a structure formed by a Michael addition reaction between one or both of the two primary amino groups contained in the siloxane diamine and an N-substituted maleimide group contained in the maleimide resin (AX).
• the structure derived from siloxane diamine contained in the siloxane-modified maleimide resin (A) may be of one type alone or of two or more types.
• the content of the siloxane diamine-derived structure in the (A) siloxane-modified maleimide resin is preferably 5 to 95% by mass, more preferably 7 to 70% by mass, and even more preferably 10 to 40% by mass, from the viewpoint of low thermal expansion.
• siloxane diamine is not particularly limited as long as it is a siloxane compound having two primary amino groups.
• the siloxane diamine preferably contains a divalent group having a structure represented by the following general formula (A-7).
• R A8 and R A9 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. * represents a bonding site.
• an aliphatic hydrocarbon group having 1 to 5 carbon atoms an aliphatic hydrocarbon group having 1 to 3 carbon atoms is preferable, an alkyl group having 1 to 3 carbon atoms is more preferable, and a methyl group is even more preferable.
• the substituent on the phenyl group in the substituted phenyl group represented by R A8 and R A9 include the above-mentioned aliphatic hydrocarbon groups having 1 to 5 carbon atoms.
• the siloxane diamine is preferably a silicone compound having primary amino groups at both ends, and more preferably a compound represented by the following general formula (A-8).
• R A8 and R A9 are the same as those in the above general formula (A-7), R A10 and R A11 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a phenyl group or a substituted phenyl group, X A4 and X A5 each independently represent a divalent organic group, and n A9 is an integer from 2 to 100.
• Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R A10 and R A11 in the above general formula (A-8) include the same as those mentioned above for R A8 and R A9 .
• arylene group examples include arylene groups having 6 to 20 carbon atoms, such as a phenylene group and a naphthylene group.
• X A4 and X A5 are preferably an alkylene group or an arylene group, and more preferably an alkylene group.
• n A9 is an integer of 2 to 100, preferably an integer of 2 to 50, more preferably an integer of 3 to 40, and even more preferably an integer of 5 to 30.
• n A9 is an integer of 2 or more, a plurality of R A8s or a plurality of R A9s may be the same or different.
• the primary amino group equivalent of the siloxane diamine is preferably 300 to 2,000 g/mol, more preferably 400 to 1,500 g/mol, and even more preferably 500 to 1,000 g/mol.
• the siloxane-modified maleimide resin (A) can be produced, for example, by subjecting a maleimide resin (AX) to a Michael addition reaction with a siloxane diamine in an organic solvent.
• the reaction temperature for the Michael addition reaction is preferably 50 to 160° C., more preferably 60 to 150° C., and even more preferably 70 to 140° C., from the viewpoints of workability such as reaction rate, and suppression of gelation of the product during the reaction.
• the reaction time for the Michael addition reaction is preferably 0.5 to 10 hours, more preferably 1 to 6 hours, and even more preferably 1.5 to 4 hours, from the viewpoints of productivity and allowing the reaction to proceed sufficiently.
• a reaction catalyst may be used as necessary. However, these reaction conditions can be appropriately adjusted depending on the types of raw materials used, and are not particularly limited.
• the weight average molecular weight (Mw) of the (A) siloxane-modified maleimide resin is preferably 1,000 to 20,000, more preferably 3,000 to 15,000, and even more preferably 5,000 to 10,000, from the viewpoints of ease of handling and moldability.
• the content of the siloxane-modified maleimide resin (A) in the resin composition is preferably 10 to 70 mass%, more preferably 20 to 60 mass%, and even more preferably 30 to 50 mass%, based on the total amount (100 mass%) of the resin components in the resin composition.
• the content of the siloxane-modified maleimide resin (A) is within the above range, the heat resistance, low thermal expansion property, moldability, and copper foil adhesion tend to be improved.
• resin component refers to a resin and a compound that forms a resin through a curing reaction.
• resin components include component (A), component (B), component (C), and component (D).
• components (E), (F), and the like are not included in the resin component.
• the content of the resin component in the resin composition is preferably 5 to 70 mass %, more preferably 10 to 60 mass %, and further preferably 20 to 40 mass %, based on the total solid content (100 mass %) of the resin composition.
• the content of the resin component is equal to or more than the lower limit, the heat resistance, moldability, processability, and copper foil adhesion tend to be improved.
• the content of the resin component is equal to or less than the upper limit, the low thermal expansion property tends to be improved.
• the resin composition further contains, as component (B), a maleimide resin other than component (A) [hereinafter, sometimes referred to as “maleimide resin (B)”.].
• the prepreg of the present embodiment tends to have better heat resistance because the resin composition contains the maleimide resin (B).
• the maleimide resin (B) may be used alone or in combination of two or more kinds.
• Examples of the maleimide resin (B) include the maleimide resin (AX) described above. Among these, a maleimide resin having three or more N-substituted maleimide groups is preferred, and a maleimide resin having three or more N-substituted maleimide groups bonded to an aromatic ring is more preferred.
• the number of N-substituted maleimide groups in a maleimide resin having three or more N-substituted maleimide groups may be six or less, or may be five or less, from the viewpoint of handleability.
• the maleimide resin (B) is preferably a compound represented by the following general formula (B-1):
• each X B1 is independently a divalent hydrocarbon group having 1 to 20 carbon atoms, and n B1 is an integer of 2 to 5.
• Examples of the divalent hydrocarbon group having 1 to 20 carbon atoms represented by X B1 in the above general formula (B-1) include divalent aliphatic hydrocarbon groups such as an alkylene group having 1 to 5 carbon atoms and an alkylidene group having 2 to 5 carbon atoms; and divalent hydrocarbon groups containing an aromatic hydrocarbon group represented by the following general formula (B-2).
• alkylene group having 1 to 5 carbon atoms examples include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc.
• the alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.
• the alkylidene group having 2 to 5 carbon atoms is preferably an alkylidene group having 2 to 4 carbon atoms, more preferably an alkylidene group having 2 or 3 carbon atoms, and further preferably an isopropylidene group.
• Ar B1 is a divalent aromatic hydrocarbon group
• X B2 and X B3 are each independently a divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms. * represents a bonding site.
• Examples of the divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by X and X in the above general formula (B-2) include the same alkylene groups having 1 to 5 carbon atoms and alkylidene groups having 2 to 5 carbon atoms as exemplified as X in the above general formula (B-1). Among these, a methylene group is preferred.
• Examples of the divalent aromatic hydrocarbon group represented by Ar B1 in the above general formula (B-2) include a phenylene group, a naphthylene group, a biphenylene group, and an anthranylene group. Of these, a biphenylene group is preferred.
• biphenylene group examples include a 4,2'-biphenylene group, a 4,3'-biphenylene group, a 4,4'-biphenylene group, and a 3,3'-biphenylene group. Of these, a 4,4'-biphenylene group is preferred.
• X B1 in the above general formula (B-1) is preferably an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms, more preferably a methylene group or an isopropylidene group, and even more preferably a methylene group.
• n B1 is an integer of 2 to 5, preferably an integer of 2 to 4, and more preferably 2 or 3.
• Examples of the compound represented by the above general formula (B-1) include polyphenylmethane maleimide, biphenyl aralkyl maleimide, etc.
• polyphenylmethane maleimide is preferred from the viewpoints of desmear resistance, heat resistance, low thermal expansion, and elastic modulus.
• the content of the maleimide resin (B) is preferably 10 to 70 mass%, more preferably 20 to 60 mass%, and even more preferably 30 to 50 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition.
• the content of the (B) maleimide resin is equal to or more than the lower limit, the desmear resistance, heat resistance, low thermal expansion property, and elastic modulus tend to be improved.
• the content of the (B) maleimide resin is equal to or less than the upper limit, the flowability of the resin composition is improved, and the moldability of the prepreg tends to be improved.
• the resin composition further contains an epoxy resin (C).
• the prepreg of the present embodiment tends to have better heat resistance because the resin composition contains the epoxy resin (C).
• the epoxy resin (C) may be used alone or in combination of two or more kinds.
• the epoxy resin (C) is preferably an epoxy resin having two or more epoxy groups.
• the epoxy resin (C) is classified into, for example, glycidyl ether type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, etc. Among these, the glycidyl ether type epoxy resin is preferred.
• Epoxy resins are classified into various epoxy resins according to the difference in the main skeleton, and the above-mentioned types of epoxy resins are further classified into bisphenol-type epoxy resins such as bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and bisphenol S-type epoxy resins; alicyclic epoxy resins such as dicyclopentadiene-type epoxy resins; aliphatic chain epoxy resins; novolac-type epoxy resins such as phenol novolac-type epoxy resins, cresol novolac-type epoxy resins, bisphenol A novolac-type epoxy resins, bisphenol F novolac-type epoxy resins, phenol aralkyl novolac-type epoxy resins, and biphenyl aralkyl novolac-type epoxy resins; stilbene-type epoxy resins; naphthalene-type epoxy resins such as naphthol novolac-type epoxy resins and naphthol aralkyl-type epoxy resins; biphenyl--
• the content of the epoxy resin (C) is preferably 1 to 30 mass%, more preferably 2 to 20 mass%, and even more preferably 3 to 10 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition.
• the content of the epoxy resin (C) is equal to or more than the lower limit, the heat resistance tends to be improved.
• the content of the epoxy resin (C) is equal to or less than the upper limit, the low thermal expansion property tends to be improved.
• the resin composition further contains (D) a benzoxazine resin.
• the prepreg of the present embodiment tends to have excellent toughness in the cured product because the resin composition contains the benzoxazine resin (D).
• the term "benzoxazine resin” refers to a resin having at least one benzoxazine ring in the molecule.
• the term "benzoxazine ring” refers to a ring structure in which one of two double bonds contained in a six-membered oxazine ring containing one oxygen atom and one nitrogen atom is dihydrogenated and the other double bond is condensed to a benzene ring.
• the benzoxazine resin (D) may be used alone or in combination of two or more kinds.
• Benzoxazine resin may have one or more benzoxazine rings, preferably two or three benzoxazine rings, and more preferably two.
• benzoxazine resin known benzoxazine resins can be used, such as P-d type benzoxazine, F-a type benzoxazine, ALP-d type benzoxazine, T-ala type benzoxazine, etc.
• benzoxazine resins include, for example, compounds represented by the following general formula (D-1) and compounds represented by the following general formula (D-2).
• R D1 , R D2 , R D3 and R D4 are each independently a hydrocarbon group having 1 to 10 carbon atoms.
• n D1 , n D2 , n D3 and n D4 are each independently an integer of 0 to 4.
• R D5 and R D6 are each independently a hydrocarbon group having 1 to 10 carbon atoms.
• R D7 and R D8 are each independently a hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom.
• n D5 and n D6 are integers from 0 to 3.
• examples of the hydrocarbon group having 1 to 10 carbon atoms represented by R D1 , R D2 , R D3 and R D4 include aliphatic hydrocarbon groups such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an n-octyl group, an n-decyl group, etc.; and aromatic hydrocarbon groups such as a phenyl group, etc.
• n D1 , n D2 , n D3 and n D4 each independently represent an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferable, with 0 being more preferable.
• examples of the alkylene group having 1 to 5 carbon atoms represented by X D1 include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc.
• the alkylene group an alkylene group having 1 to 3 carbon atoms is preferable, and a methylene group is more preferable.
• examples of the alkylidene group having 2 to 5 carbon atoms represented by X D1 include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc.
• an isopropylidene group is preferable.
• examples of the hydrocarbon group having 1 to 10 carbon atoms represented by R D5 and R D6 include the same as those represented by R D1 above.
• n D5 and n D6 each independently represent an integer of 0 to 3, and from the viewpoint of availability, an integer of 0 to 2 is preferable, with 0 being more preferable.
• examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X D2 include the same as those represented by X D1 above.
• examples of the hydrocarbon group having 1 to 10 carbon atoms represented by R D7 and R D8 include the same as those described above for R D5 and R D6 .
• R D7 and R D8 are preferably aromatic hydrocarbon groups, more preferably phenyl groups.
• the compound represented by general formula (D-1) above is preferred from the viewpoint of low thermal expansion and heat resistance.
• the content of the (D) benzoxazine resin is preferably 1 to 30 mass%, more preferably 5 to 25 mass%, and even more preferably 10 to 20 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition.
• the content of the benzoxazine resin (D) is equal to or greater than the lower limit, the toughness tends to be improved.
• the content of the benzoxazine resin (D) is equal to or less than the upper limit, the heat resistance tends to be improved.
• the resin composition further contains (E) an inorganic filler.
• the prepreg of the present embodiment tends to easily obtain superior low thermal expansion properties and heat resistance because the resin composition contains the inorganic filler (E).
• the inorganic filler (E) may be used alone or in combination of two or more kinds.
• inorganic fillers examples include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide, etc.
• silica, alumina, mica, and talc are preferred, silica and alumina are more preferred, and silica is even more preferred.
• fused silica is preferred from the viewpoints of dispersibility and moldability.
• the average particle size (D 50 ) of the inorganic filler (E) is preferably 0.1 to 10 ⁇ m, more preferably 0.2 to 1 ⁇ m, and even more preferably 0.3 to 0.8 ⁇ m, from the viewpoints of dispersibility and fine wiring properties.
• the average particle diameter ( D50 ) of the inorganic filler (E) refers to the particle diameter at the point corresponding to 50% volume when a cumulative frequency distribution curve of particle diameters is calculated assuming the total volume of the particles to be 100%.
• the average particle diameter of the inorganic filler (E) can be measured, for example, by a particle size distribution measuring device using a laser diffraction scattering method.
• the shape of the (E) inorganic filler may be, for example, spherical or crushed, with the spherical shape being preferred. From the viewpoint of improving dispersibility and adhesion to organic components, the inorganic filler (E) may be surface-treated with a surface treatment agent such as a silane coupling agent.
• the content of the inorganic filler (E) is preferably 30 to 90 mass%, more preferably 40 to 85 mass%, and even more preferably 60 to 80 mass%, relative to the total solid content (100 mass%) of the resin composition.
• the content of the (E) inorganic filler is equal to or more than the lower limit, the low thermal expansion property and the heat resistance tend to be improved.
• the content of the (E) inorganic filler is equal to or less than the upper limit, the moldability and the copper foil adhesion tend to be improved.
• the resin composition further contains (F) a curing accelerator.
• a curing accelerator By including the curing accelerator (F) in the resin composition, the curing property is improved, and there is a tendency that better copper foil adhesion can be easily obtained.
• the curing accelerator (F) may be used alone or in combination of two or more kinds.
• Examples of the curing accelerator include acid catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, tributylamine, pyridine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate; isocyanate mask imidazole compounds such as an addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; organic peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane,
• the content of the curing accelerator (F) is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and even more preferably 0.1 to 1 part by mass, relative to 100 parts by mass of the total amount of the resin components in the resin composition.
• the content of the curing accelerator (F) is equal to or more than the lower limit, a sufficient curing acceleration effect tends to be easily obtained.
• the content of the curing accelerator (F) is equal to or less than the upper limit, storage stability tends to be more easily improved.
• the resin composition may further contain, as necessary, one or more other optional components selected from the group consisting of resin materials other than the above-mentioned components, antioxidants, heat stabilizers, antistatic agents, UV absorbers, pigments, colorants, lubricants, organic solvents, and other additives.
• the above-mentioned optional components may each be used alone or in combination of two or more.
• the content of the above-mentioned optional components in the resin composition is not particularly limited, and may be used as necessary within a range that does not impair the effects of the present embodiment.
• the resin composition may not contain the above-mentioned optional components depending on the desired performance.
• the resin composition can be produced by mixing the components.
• the components may be dissolved or dispersed while being stirred.
• the mixing order, temperature, time, and other conditions are not particularly limited and may be set arbitrarily depending on the type of raw material, etc.
• the fiber base material contained in the prepreg of this embodiment contains glass fibers with an Al 2 O 3 content of 20 mass % or more.
• the cured product of the prepreg of this embodiment has excellent wettability with water.
• the content of Al 2 O 3 in the glass fiber is 20 mass % or more, preferably 21 to 35 mass %, more preferably 22 to 30 mass %, and further preferably 23 to 27 mass %, from the viewpoint of wettability with water.
• the content of Al 2 O 3 derived from glass fibers in the prepreg of this embodiment is preferably 9 to 50 mass%, more preferably 10 to 40 mass%, even more preferably 11 to 30 mass%, and still more preferably 12 to 20 mass%, from the viewpoint of wettability with water.
• the content of Al 2 O 3 in the total amount (100 mass%) of inorganic components contained in the prepreg of this embodiment is preferably 10 to 55 mass%, more preferably 11 to 45 mass%, even more preferably 12 to 35 mass%, and still more preferably 13 to 25 mass%, from the viewpoint of wettability with water.
• the glass fiber preferably further contains SiO2 .
• the SiO 2 content in the glass fiber is preferably 50 to 80 mass%, more preferably 55 to 75 mass%, and even more preferably 60 to 70 mass%, from the viewpoint of wettability with water.
• the glass fiber may contain other components such as Fe2O3, B2O3 , CaO , MgO, Na2O, K2O , Li2O , TiO2 , ZnO , ZrO2 , and F2 , in addition to SiO2 and Al2O3 .
• the components contained in the glass fiber other than SiO2 and Al2O3 are preferably one or more of the above other components.
• the glass fiber further contains MgO.
• the content of MgO in the glass fiber is preferably 2 to 20 mass %, more preferably 5 to 15 mass %, and further preferably 7 to 12 mass %.
• Preferred examples of the glass fiber include T-glass and S-glass.
• the thickness of the fiber base material is preferably 5 to 200 ⁇ m, more preferably 20 to 150 ⁇ m, even more preferably 50 to 110 ⁇ m, and even more preferably 70 to 100 ⁇ m, from the viewpoint of the mechanical strength of the prepreg and high-density wiring.
• the fiber base material has a basis weight of preferably 10 to 210 g/m 2 , more preferably 50 to 180 g/m 2 , and even more preferably 100 to 130 g/m 2 , from the viewpoints of the mechanical strength of the prepreg and high-density wiring.
• the content of the inorganic component contained in the prepreg of the present embodiment is preferably 50 to 97 mass%, more preferably 60 to 95 mass%, even more preferably 70 to 93 mass%, and still more preferably 80 to 90 mass%, from the viewpoint of wettability with water.
• the thickness of the prepreg of this embodiment is preferably 5 to 200 ⁇ m, more preferably 20 to 150 ⁇ m, and even more preferably 50 to 110 ⁇ m, from the viewpoints of the mechanical strength of the prepreg and high-density wiring.
• the laminate of the present embodiment is a laminate having a cured product of the prepreg of the present embodiment and a metal foil.
• metals for the metal foil include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements.
• the laminate of this embodiment can be produced, for example, by arranging metal foil on one or both sides of the prepreg of this embodiment and then hot-pressing and molding it. Usually, the B-staged prepreg is cured by this hot press molding to obtain the laminate of this embodiment. In the case of hot pressing, only one prepreg may be used, or two or more prepregs may be laminated together. The number of laminated prepregs may be, for example, 2 to 20, 4 to 18, or 6 to 16.
• a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, or the like can be used.
• the conditions for the hot pressing may be, for example, a temperature of 100 to 300° C., a time of 10 to 300 minutes, and a pressure of 1.5 to 5 MPa.
• the printed wiring board of this embodiment is a printed wiring board having a cured product of the prepreg of this embodiment.
• the printed wiring board of this embodiment can be produced, for example, by forming a conductor circuit on the cured product of the prepreg of this embodiment by a known method.
• the method for producing a printed wiring board of this embodiment involves forming through-holes in the cured product of the prepreg of this embodiment, and then forming a conductor layer in the through-hole by plating.
• the cured product of the prepreg forming the through-holes may be the laminate of the present embodiment described above, or may be a circuit board in which the prepreg of the present embodiment is laminated on one or both sides of the circuit board and cured.
• the through holes can be formed by known methods, such as a method using a drill, a laser, or plasma, or a combination of these.
• lasers used to form the through holes include a carbon dioxide laser, a YAG laser, a UV laser, and an excimer laser.
• the shape of the through-hole in plan view is not particularly limited, but is preferably circular.
• the diameter of the circular through-holes may be 300 ⁇ m or less, 200 ⁇ m or less, or 150 ⁇ m or less. Since the cured product of the prepreg of this embodiment has excellent wettability with water, even when the diameter of the through-holes is small, the plating solution easily flows in and good plating properties can be obtained in the through-holes.
• the diameter of the circular through-hole may be 40 ⁇ m or more, 100 ⁇ m or more, or 150 ⁇ m or more, as desired.
• the term "circular shape" is a concept that includes not only a perfect circle but also an ellipse, and in the case of an ellipse, the major axis of the ellipse is taken as the diameter.
• the surface of the cured prepreg may be roughened with an oxidizing agent.
• the so-called “smear” that occurs when forming the through-holes may be removed at the same time as the roughening treatment.
• a conductor layer is formed by plating on the surface of the roughened cured prepreg and in the through-holes.
• the plating method include electroless plating and electrolytic plating.
• the metal for plating include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing at least one of these metal elements. Among these, copper and nickel are preferred, and copper is more preferred.
• the conductor layer is patterned to form a circuit, and known methods such as a subtractive method, a full additive method, a semi-additive method (SAP: SemiAdditive Process), a modified semi-additive method (m-SAP: modified SemiAdditive Process), etc. can be used. Furthermore, by appropriately repeating the necessary steps, a multi-layer printed wiring board can be produced.
• SAP SemiAdditive Process
• m-SAP modified SemiAdditive Process
• the semiconductor package of this embodiment is a semiconductor package that includes the printed wiring board of this embodiment and a semiconductor element.
• the semiconductor package of this embodiment can be manufactured, for example, by mounting a semiconductor chip, a memory, and the like on the printed wiring board of this embodiment by a known method.
• the weight average molecular weight (Mw) was measured by the following method.
• the values were calculated from a calibration curve using standard polystyrene by gel permeation chromatography (GPC).
• the calibration curve was approximated by a third order equation using standard polystyrene: TSKstandard POLYSTYRENE (Type: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name].
• TSKstandard POLYSTYRENE Type: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40 [manufactured by Tosoh Corporation, trade name].
• the measurement conditions for GPC are shown below.
• Production Example 1 Production of siloxane-modified maleimide resin
• a silicone compound having primary amino groups at both ends manufactured by Momentive Performance Materials Japan LLC, product name: XF42-C5379, functional group equivalent of primary amino group: 740 g/mol
• 100 g of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, and 200 g of propylene glycol monomethyl ether were placed, and reacted at 120° C. for 2 hours to produce a siloxane-modified maleimide resin.
• the weight average molecular weight (Mw) of the obtained siloxane-modified maleimide resin was 8,000.
• Example 1 Comparative Example 1 (Production of resin composition) Each component shown in Table 1 was stirred and mixed with methyl isobutyl ketone to prepare a varnish-like resin composition having a solid content concentration of 55 to 65% by mass.
• the unit of the blending amount of each component is parts by mass, and in the case of a solution, it means parts by mass converted into solid content.
• the laminated plate was neutralized by immersion for 5 minutes in a neutralizing liquid (manufactured by Atotech Japan, product name "Reduction Solution Securigant P500”) heated to 40°C, to obtain a laminated plate after the desmear treatment.
• the laminated plate after the etching treatment and the laminated plate after the desmear treatment were used as the measurement objects, and the static contact angle when purified water was dropped onto each surface was measured under the following conditions.
• Measuring device NIC Co., Ltd., product name "LSE-B100TW” Measurement temperature: 25°C ⁇
• Droplet volume of purified water 1 ⁇ l (syringe diameter 25G)
• Image analysis method ⁇ /2 method Measurement time: 5 seconds after dropping
• Component (E) Fused silica: average particle size ( D50 ) 0.5 ⁇ m, spherical fused silica
• Example 1 of this embodiment has a small water contact angle and excellent water wettability.

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  • 2024-08-26 WO PCT/JP2024/030331 patent/WO2025052997A1/ja active Pending
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