JPWO2025052997A1 - - Google Patents
Info
- Publication number
- JPWO2025052997A1 JPWO2025052997A1 JP2025544278A JP2025544278A JPWO2025052997A1 JP WO2025052997 A1 JPWO2025052997 A1 JP WO2025052997A1 JP 2025544278 A JP2025544278 A JP 2025544278A JP 2025544278 A JP2025544278 A JP 2025544278A JP WO2025052997 A1 JPWO2025052997 A1 JP WO2025052997A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023146372 | 2023-09-08 | ||
| PCT/JP2024/030331 WO2025052997A1 (ja) | 2023-09-08 | 2024-08-26 | プリプレグ、積層板、プリント配線板及び半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025052997A1 true JPWO2025052997A1 (https=) | 2025-03-13 |
Family
ID=94923186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025544278A Pending JPWO2025052997A1 (https=) | 2023-09-08 | 2024-08-26 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025052997A1 (https=) |
| KR (1) | KR20260038917A (https=) |
| CN (1) | CN120981515A (https=) |
| TW (1) | TW202517718A (https=) |
| WO (1) | WO2025052997A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6065438B2 (ja) * | 2012-07-25 | 2017-01-25 | 日立化成株式会社 | プリプレグ、これを用いた積層板及び多層プリント配線板 |
| KR102376567B1 (ko) * | 2016-04-05 | 2022-03-21 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물 및 그 제조 방법, 프리프레그, 레진 시트, 적층판, 금속박 피복 적층판, 그리고 프린트 배선판 |
| JP7092043B2 (ja) * | 2019-01-16 | 2022-06-28 | 日東紡績株式会社 | 透明複合シート |
| US12195566B2 (en) * | 2019-06-28 | 2025-01-14 | Mitsubishi Gas Chemical Company, Inc. | Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device |
| KR20240095198A (ko) * | 2021-11-01 | 2024-06-25 | 가부시끼가이샤 레조낙 | 수지 조성물, 프리프레그, 적층판, 금속 접착 적층판, 프린트 배선판 및 반도체 패키지 |
-
2024
- 2024-08-26 WO PCT/JP2024/030331 patent/WO2025052997A1/ja active Pending
- 2024-08-26 KR KR1020267004239A patent/KR20260038917A/ko active Pending
- 2024-08-26 CN CN202480026885.4A patent/CN120981515A/zh active Pending
- 2024-08-26 JP JP2025544278A patent/JPWO2025052997A1/ja active Pending
- 2024-09-02 TW TW113133055A patent/TW202517718A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025052997A1 (ja) | 2025-03-13 |
| CN120981515A (zh) | 2025-11-18 |
| TW202517718A (zh) | 2025-05-01 |
| KR20260038917A (ko) | 2026-03-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251024 |