JPWO2025052997A1 - - Google Patents

Info

Publication number
JPWO2025052997A1
JPWO2025052997A1 JP2025544278A JP2025544278A JPWO2025052997A1 JP WO2025052997 A1 JPWO2025052997 A1 JP WO2025052997A1 JP 2025544278 A JP2025544278 A JP 2025544278A JP 2025544278 A JP2025544278 A JP 2025544278A JP WO2025052997 A1 JPWO2025052997 A1 JP WO2025052997A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025544278A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025052997A1 publication Critical patent/JPWO2025052997A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69Insulating materials thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
JP2025544278A 2023-09-08 2024-08-26 Pending JPWO2025052997A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023146372 2023-09-08
PCT/JP2024/030331 WO2025052997A1 (ja) 2023-09-08 2024-08-26 プリプレグ、積層板、プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
JPWO2025052997A1 true JPWO2025052997A1 (https=) 2025-03-13

Family

ID=94923186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025544278A Pending JPWO2025052997A1 (https=) 2023-09-08 2024-08-26

Country Status (5)

Country Link
JP (1) JPWO2025052997A1 (https=)
KR (1) KR20260038917A (https=)
CN (1) CN120981515A (https=)
TW (1) TW202517718A (https=)
WO (1) WO2025052997A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6065438B2 (ja) * 2012-07-25 2017-01-25 日立化成株式会社 プリプレグ、これを用いた積層板及び多層プリント配線板
KR102376567B1 (ko) * 2016-04-05 2022-03-21 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물 및 그 제조 방법, 프리프레그, 레진 시트, 적층판, 금속박 피복 적층판, 그리고 프린트 배선판
JP7092043B2 (ja) * 2019-01-16 2022-06-28 日東紡績株式会社 透明複合シート
US12195566B2 (en) * 2019-06-28 2025-01-14 Mitsubishi Gas Chemical Company, Inc. Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
KR20240095198A (ko) * 2021-11-01 2024-06-25 가부시끼가이샤 레조낙 수지 조성물, 프리프레그, 적층판, 금속 접착 적층판, 프린트 배선판 및 반도체 패키지

Also Published As

Publication number Publication date
WO2025052997A1 (ja) 2025-03-13
CN120981515A (zh) 2025-11-18
TW202517718A (zh) 2025-05-01
KR20260038917A (ko) 2026-03-19

Similar Documents

Publication Publication Date Title
BR102022025291A2 (https=)
BR102023014872A2 (https=)
BR102023012440A2 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BR102023007252A2 (https=)
BR102023005164A2 (https=)
BR102023001987A2 (https=)
BR102023001877A2 (https=)
BR102023000289A2 (https=)
BR102022026909A2 (https=)
BR202022009269U2 (https=)
BR202022005961U2 (https=)
BR202022001779U2 (https=)
BR202022000931U2 (https=)
BY13141U (https=)
BY13151U (https=)
BY13135U (https=)
BY13136U (https=)
BY13137U (https=)
BY13138U (https=)
BY13139U (https=)
BY13140U (https=)
CN307047683S (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251024