TW202517718A - 預浸體、積層板、印刷線路板及半導體封裝體 - Google Patents

預浸體、積層板、印刷線路板及半導體封裝體 Download PDF

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Publication number
TW202517718A
TW202517718A TW113133055A TW113133055A TW202517718A TW 202517718 A TW202517718 A TW 202517718A TW 113133055 A TW113133055 A TW 113133055A TW 113133055 A TW113133055 A TW 113133055A TW 202517718 A TW202517718 A TW 202517718A
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TW
Taiwan
Prior art keywords
prepreg
resin
mass
group
carbon atoms
Prior art date
Application number
TW113133055A
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English (en)
Chinese (zh)
Inventor
井口景太郎
佐藤力
檜山駿
島田麻未
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202517718A publication Critical patent/TW202517718A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
TW113133055A 2023-09-08 2024-09-02 預浸體、積層板、印刷線路板及半導體封裝體 TW202517718A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-146372 2023-09-08
JP2023146372 2023-09-08

Publications (1)

Publication Number Publication Date
TW202517718A true TW202517718A (zh) 2025-05-01

Family

ID=94923186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113133055A TW202517718A (zh) 2023-09-08 2024-09-02 預浸體、積層板、印刷線路板及半導體封裝體

Country Status (5)

Country Link
JP (1) JPWO2025052997A1 (https=)
KR (1) KR20260038917A (https=)
CN (1) CN120981515A (https=)
TW (1) TW202517718A (https=)
WO (1) WO2025052997A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6065438B2 (ja) * 2012-07-25 2017-01-25 日立化成株式会社 プリプレグ、これを用いた積層板及び多層プリント配線板
KR102376567B1 (ko) * 2016-04-05 2022-03-21 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물 및 그 제조 방법, 프리프레그, 레진 시트, 적층판, 금속박 피복 적층판, 그리고 프린트 배선판
JP7092043B2 (ja) * 2019-01-16 2022-06-28 日東紡績株式会社 透明複合シート
US12195566B2 (en) * 2019-06-28 2025-01-14 Mitsubishi Gas Chemical Company, Inc. Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
KR20240095198A (ko) * 2021-11-01 2024-06-25 가부시끼가이샤 레조낙 수지 조성물, 프리프레그, 적층판, 금속 접착 적층판, 프린트 배선판 및 반도체 패키지

Also Published As

Publication number Publication date
WO2025052997A1 (ja) 2025-03-13
CN120981515A (zh) 2025-11-18
JPWO2025052997A1 (https=) 2025-03-13
KR20260038917A (ko) 2026-03-19

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