WO2024169059A1 - 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 - Google Patents
光伏硅片清洗工艺优化方法及设备布置顺序调整方法 Download PDFInfo
- Publication number
- WO2024169059A1 WO2024169059A1 PCT/CN2023/093364 CN2023093364W WO2024169059A1 WO 2024169059 A1 WO2024169059 A1 WO 2024169059A1 CN 2023093364 W CN2023093364 W CN 2023093364W WO 2024169059 A1 WO2024169059 A1 WO 2024169059A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cleaning
- drying
- devices
- drying device
- cleaning device
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 254
- 238000000034 method Methods 0.000 title claims abstract description 65
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 238000001035 drying Methods 0.000 claims abstract description 169
- 230000007704 transition Effects 0.000 claims abstract description 51
- 238000005457 optimization Methods 0.000 claims description 27
- 230000006870 function Effects 0.000 claims description 22
- 235000012431 wafers Nutrition 0.000 abstract description 42
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000004590 computer program Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present application belongs to the technical field of photovoltaic silicon wafer production equipment, and in particular, relates to a photovoltaic silicon wafer cleaning process optimization method and an equipment layout sequence adjustment method.
- the texturing cleaning device usually includes a pre-cleaning device, which is used to use acid to clean the oil and metal ions on the surface of the silicon wafer; a texturing cleaning device, which first washes the silicon wafer with water and then texturizes the silicon wafer with alkali solution; a chemical polishing cleaning device, which uses alkali solution containing a composite solvent to remove a layer of the silicon wafer surface; a pickling device, which uses acid containing hydrogen peroxide to clean the silicon wafer surface, and a drying device, which is used to air-dry the silicon wafer that has passed through the above-mentioned cleaning device.
- the pre-cleaning device, the texturing cleaning device, the chemical polishing cleaning device, and the pickling device can be collectively referred to as a cleaning device in accordance with the process sequence.
- the photovoltaic silicon wafer cleaning control system is set in the PLC program of the texturing and cleaning device, which is used to control the basket transporting device to transport the basket carrying the photovoltaic silicon wafers to the cleaning device or the drying device in sequence according to the set conveying sequence.
- the texturing and cleaning device is customized according to the cleaning process, and the basket must traverse all the cleaning devices and drying devices.
- the program in the PLC needs to be modified as required.
- the prior art has no restrictions on the conveying sequence after the modified program, which makes it easy for the robot to move back and forth, thereby reducing the production efficiency of the photovoltaic silicon wafers.
- the technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a photovoltaic silicon wafer cleaning process optimization method that ensures production efficiency when modifying the cleaning sequence, and an equipment layout sequence adjustment method based on the above optimization method.
- a photovoltaic silicon wafer cleaning process optimization method comprising the following steps:
- the hanging basket handling device includes a conveying rail with multiple conveying sections and a robot arranged on each conveying section.
- the connecting area between two adjacent conveying sections is a transition section.
- the robots of two adjacent conveying sections can move to the transition section.
- the transition section corresponds to one or more cleaning devices or one or more drying devices.
- step S2 Determine whether all cleaning devices are earlier than all drying devices, if yes, proceed to step S3; if no, adjust the drying device in the conveying sequence to after all cleaning devices and then proceed to step S3;
- step S3 Determine whether the front-end cleaning device and drying device are earlier than the rear-end cleaning device and drying device. If yes, proceed to step S4; if not, adjust the order of the drying devices to ensure that the front-end cleaning device and drying device are earlier than the rear-end cleaning device and drying device, and then proceed to step S4;
- step S4 Determine whether at least one of the cleaning devices and drying devices corresponding to all transition sections is in the conveying sequence, if so, proceed to step S5, if not, adjust the cleaning device or drying device closest to the cleaning devices and drying devices corresponding to the transition section to the cleaning device and drying device corresponding to the transition section and then proceed to step S5;
- the cleaning device or drying device after adjustment in steps S2, S3 and S4 has exactly the same function as the cleaning device or drying device before adjustment.
- the processing time in each cleaning device and drying device is read to determine whether the processing time of the cleaning device and drying device at the front is greater than or equal to the processing time of the cleaning device and drying device at the back, and if so, the method ends; otherwise, the processing time of the cleaning device and drying device at the back is allocated to the cleaning device and drying device with exactly the same functions to meet the conditions.
- the photovoltaic silicon wafer cleaning process optimization method of the present invention allocates processing time in a time-averaged manner.
- the present application also provides a method for adjusting the arrangement order of photovoltaic silicon wafer cleaning equipment, comprising the following steps:
- the hanging basket handling device includes a conveying rail with multiple conveying sections and a manipulator arranged on each conveying section.
- the connecting area between two adjacent conveying sections is a transition section.
- the manipulators of two adjacent conveying sections can move to the transition section.
- the transition section corresponds to one or more cleaning devices or one or more drying devices.
- step S2 Determine whether all cleaning devices are prior to all drying devices, if yes, proceed to step S3; if no, adjust the layout of the drying device to after all cleaning devices and then proceed to step S3;
- step S3 Determine whether the front-end cleaning device and drying device are earlier than the rear-end cleaning device and drying device in the conveying sequence, if yes, proceed to step S4; if no, adjust the positions of the cleaning device and drying device to meet the requirement that the cleaning device and drying device are earlier than the rear-end cleaning device and drying device, and then proceed to step S4;
- step S4 Determine whether at least one of the cleaning devices and drying devices corresponding to all transition sections is in the conveying sequence, if so, proceed to step S5, if not, set the transition section to the corresponding cleaning device and drying device or increase the number of cleaning devices or drying devices corresponding to the transition section before proceeding to step S5;
- the method for adjusting the arrangement order of photovoltaic silicon wafer cleaning equipment of the present invention reads the processing time in each cleaning device and drying device, and determines whether the processing time of the cleaning device and drying device at the front is greater than or equal to the processing time of the cleaning device and drying device at the back, and ends the method if so; otherwise, a new cleaning device and drying device with exactly the same functions are added, and the processing time of the cleaning device and drying device at the back is allocated to the cleaning device and drying device with exactly the same functions to meet the conditions.
- the photovoltaic silicon wafer cleaning equipment arrangement sequence adjustment method of the present invention allocates processing time in a time-averaged manner.
- the photovoltaic silicon wafer cleaning process optimization method of the present invention ensures that the photovoltaic silicon wafer must be cleaned before drying by judging that all cleaning devices are prior to all drying devices, and judging whether the cleaning devices and drying devices at the front are prior to the cleaning devices and drying devices at the back ensures that the movement sequence of the manipulator during the working process can only be from front to back, avoiding the reciprocating movement of the manipulator back and forth, and at least one of the cleaning devices and drying devices corresponding to all transition sections needs to be in the conveying sequence, so that the cleaning devices or drying devices in all transition sections have flower baskets entering, so that the entire hanging basket handling device can smoothly complete the handover of the manipulators of different conveying sections in the transition section.
- the present application also provides an arrangement sequence adjustment method for equipment design based on the above photovoltaic silicon wafer cleaning process optimization method.
- Fig. 1 is a logic block diagram of a photovoltaic silicon wafer cleaning process optimization method according to an embodiment of the present application.
- This embodiment provides a photovoltaic silicon wafer cleaning process optimization method.
- the photovoltaic silicon wafer cleaning equipment based on the photovoltaic silicon wafer cleaning process includes a hanging basket transport device and a plurality of cleaning devices and a plurality of drying devices arranged in a row, wherein the cleaning device is used to clean the photovoltaic silicon wafers, and the drying device is used to dry the cleaned photovoltaic silicon wafers.
- the photovoltaic silicon wafer cleaning control system is used to control the hanging basket transport device to transport the hanging basket with the photovoltaic silicon wafers to the cleaning device or the drying device, and the order of transporting the hanging basket of the photovoltaic silicon wafers to the cleaning device or the drying device and the transportation order hereinafter.
- the hanging basket transport device includes a conveying rail with multiple conveying sections and a manipulator arranged on each conveying section.
- the connecting area between two adjacent conveying sections is a transition section.
- the manipulators of two adjacent conveying sections can move to the transition section.
- the transition section corresponds to one or more cleaning devices or one or more drying devices.
- Multiple conveying sections correspond to multiple manipulators, so that the manipulators can grab a basket in different conveying sections at the same time, so that multiple batches of silicon wafers can be cleaned at the same time, thereby improving work efficiency.
- the optimization method includes the following steps:
- step S2 Determine whether all cleaning devices are earlier than all drying devices, if yes, proceed to step S3; if no, adjust the drying device in the conveying sequence to after all cleaning devices and then proceed to step S3;
- step S3 Determine whether the front-end cleaning device and drying device are earlier than the rear-end cleaning device and drying device. If yes, proceed to step S4; if not, adjust the order of the drying devices to ensure that the front-end cleaning device and drying device are earlier than the rear-end cleaning device and drying device, and then proceed to step S4;
- step S4 Determine whether at least one of the cleaning devices and drying devices corresponding to all transition sections is in the conveying sequence, if so, proceed to step S5, if not, adjust the cleaning device or drying device closest to the cleaning devices and drying devices corresponding to the transition section to the cleaning device and drying device corresponding to the transition section and then proceed to step S5;
- Condition 2 The cleaning device and drying device at the front must be earlier than the cleaning device and drying device at the back;
- Condition three At least one of the cleaning devices and drying devices corresponding to all transition sections needs to be in the conveying sequence, so that the cleaning devices or drying devices in all transition sections must have flower baskets entering, so that the entire hanging basket handling device can smoothly complete the handover of the robots in different conveying sections in the transition section.
- the photovoltaic silicon wafer cleaning process optimization method of the present embodiment ensures that the photovoltaic silicon wafers must be cleaned before drying by judging that all cleaning devices are ahead of all drying devices.
- the judgment of whether the cleaning devices and drying devices at the front are ahead of the cleaning devices and drying devices at the back ensures that the movement sequence of the manipulator during the working process can only be from front to back, thereby avoiding the reciprocating movement of the manipulator back and forth.
- At least one of the cleaning devices and drying devices corresponding to all transition sections needs to be in the conveying sequence, so that the cleaning devices or drying devices in all transition sections have flower baskets entering, so that the entire hanging basket handling device can smoothly complete the handover of the manipulators in different conveying sections in the transition section, thereby improving production efficiency.
- the functions of the cleaning device or drying device after adjustment are completely the same as those of the cleaning device or drying device before adjustment, whichever is greater.
- the processing time in each cleaning device and drying device is read to determine whether the processing time of the cleaning device and drying device at the front is greater than or equal to the processing time of the cleaning device and drying device at the back. If so, the process ends; otherwise, the processing time of the cleaning device and drying device at the back is allocated to the cleaning device and drying device with exactly the same functions to meet the conditions.
- the processing time is allocated in a time-averaged manner.
- Cleaning process parameters and drying process parameters in the cleaning device and drying device usually include cleaning time, cleaning liquid type, cleaning liquid temperature, and cleaning liquid dosage. Drying process parameters include the problem of blowing gas and drying time. This application is limited to the adjustment of processing time, and other process parameters are adjusted synchronously for the cleaning device and drying device.
- the photovoltaic silicon wafer cleaning equipment as an example includes a first cleaning tank, a second cleaning tank, a third cleaning tank, a fourth cleaning tank, a fifth cleaning tank, a sixth cleaning tank, a first drying tank and a second drying tank arranged in sequence.
- the conveying sequence can be directly set to the first cleaning tank-the second cleaning tank-the third cleaning tank, the fourth cleaning tank-the fifth cleaning tank-the sixth cleaning tank-the first drying tank-the second drying tank, as shown in the "sequential conveying" in the following table. This is also the most common setting method. Of course, the user can also ignore one or more of the cleaning tanks or drying tanks as needed. At this point, the need for customized conveying sequence in this application arises.
- the numbers indicate the order of entry, and no numbers mean no entry.
- the first manipulator corresponds to "the first cleaning tank, the second cleaning tank, and the third cleaning tank
- the second manipulator corresponds to "the third cleaning tank, the fourth cleaning tank, and the fifth cleaning tank
- the third manipulator corresponds to "the fifth cleaning tank, the sixth cleaning tank, and the first drying tank
- the fourth manipulator corresponds to "the sixth cleaning tank, the first drying tank, and the second drying tank.
- the transition sections are the "third cleaning tank”, “sixth cleaning tank” and “first drying tank.”
- the functions of the third cleaning tank and the fourth cleaning tank are exactly the same, but the third cleaning tank is not in the conveying sequence as a transition section. Therefore, the fourth cleaning tank is adjusted to the third cleaning tank, and similarly, the fifth cleaning tank is adjusted to the sixth cleaning tank.
- the following is the optimization for processing time.
- the time in the table is the processing time.
- the first batch enters the first cleaning tank, 0-10min is the working time of the first cleaning tank, 10-17.5min is the working time of the third cleaning tank, 17.5-25min is the working time of the fourth cleaning tank, 25-32min is the working time of the fifth cleaning tank, 32-39min is the working time of the fifth cleaning tank, 39-44min is the working time of the first drying tank, and 44-49min is the working time of the second drying tank.
- the second batch should enter the second cleaning tank after 7.5 minutes.
- the working time of the second cleaning tank is 7.5-17.5 minutes
- the working time of the third cleaning tank is 17.5 minutes-25 minutes, and so on, avoiding the cleaning time of the first batch.
- the time can also be unevenly distributed, forming an optimization method such as "Optimized Situation 4'".
- the second batch should enter the second cleaning tank 8 minutes later, and so on.
- This embodiment provides a method for adjusting the arrangement sequence of photovoltaic silicon wafer cleaning equipment.
- This embodiment is used in the design process of photovoltaic silicon wafer cleaning equipment to standardize the arrangement sequence of cleaning devices and drying devices.
- the core concept is the same as that in Embodiment 1, and includes the following steps:
- the hanging basket handling device includes a conveying rail with multiple conveying sections and a manipulator arranged on each conveying section.
- the connecting area between two adjacent conveying sections is a transition section.
- the manipulators of two adjacent conveying sections can move to the transition section.
- the transition section corresponds to one or more cleaning devices or one or more drying devices.
- step S2 Determine whether all cleaning devices are prior to all drying devices, if yes, proceed to step S3; if no, adjust the layout of the drying device to after all cleaning devices and then proceed to step S3;
- step S3 Determine whether the front-end cleaning device and drying device are earlier than the rear-end cleaning device and drying device in the conveying sequence, if yes, proceed to step S4; if no, adjust the positions of the cleaning device and drying device to meet the requirement that the cleaning device and drying device are earlier than the rear-end cleaning device and drying device, and then proceed to step S4;
- step S4 Determine whether at least one of the cleaning devices and drying devices corresponding to all transition sections is in the conveying sequence, if so, proceed to step S5, if not, set the transition section to the corresponding cleaning device and drying device or increase the number of cleaning devices or drying devices corresponding to the transition section before proceeding to step S5 (that is, the setting position or corresponding number of the transition section can be adjusted);
- the processing time in each cleaning device and drying device is read to determine whether the processing time of the cleaning device and drying device at the front is greater than or equal to the processing time of the cleaning device and drying device at the back, and if so, the process ends; otherwise, a new cleaning device and drying device with exactly the same function is added, and the processing time of the cleaning device and drying device at the back is allocated to the cleaning device and drying device with exactly the same function to meet the conditions.
- the processing time is allocated in a time-averaged manner.
- the equipment can meet the requirements of higher work efficiency during the design phase.
- the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media that include computer-usable program code.
- These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device that implements the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.
- These computer program instructions may also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, whereby the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
一种光伏硅片清洗工艺优化方法及设备布置顺序调整方法,属于光伏硅片生产设备技术领域,通过对所有清洗装置均先于所有干燥装置的判断保证了光伏硅片必须先清洗再干燥,对位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置的判断,保证了机械手在工作过程中的移动顺序只能是从前往后,避免了机械手前后往复运动,所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置均需要处于输送顺序中,使得所有的过渡段里的清洗装置或者干燥装置都有花篮进入,以便于整个挂篮搬运装置顺利地在过渡段里完成不同输送段机械手的交接。通过自动化调整,提高了在工艺设定时的效率。
Description
本申请属于光伏硅片生产设备技术领域,尤其是涉及光伏硅片清洗工艺优化方法及设备布置顺序调整方法。
中国专利文献CN115411149A、CN115207154A公开了制绒清洗设备。制绒清洗装置通常包括预清洗装置,用于使用酸液完成对硅片表面油污及金属离子的清洗;制绒清洗装置,先对硅片进行水洗,之后使用碱液对硅片进行制绒;化学抛光清洗装置,使用含有复合溶剂的碱液去除硅片表面一层;酸洗装置,使用含有双氧水的酸液对硅片表面进行清洗,干燥装置,用于将经过上述清洗装置的硅片进行风干干燥。其中预清洗装置、制绒清洗装置、化学抛光清洗装置、酸洗装置按照工艺顺序进行排列均可统称为清洗装置。
光伏硅片清洗控制系统被设置在制绒清洗装置的PLC的程序中,用于控制挂篮搬运装置将带有光伏硅片的挂篮输送按照设置好的输送顺序将光伏硅片的挂篮依次输送至清洗装置或者干燥装置,通常来说,制绒清洗装置是根据清洗工艺来进行定制的,挂篮要遍历所有的清洗装置和干燥装置,当碰到工艺修改时,则需要按照要求修改PLC中的程序,但是现有技术中对于修改的程序后输送顺序没有限制,导致容易出现机械手的往复运动,进而降低了光伏硅片的生产效率。
本发明要解决的技术问题是:为解决现有技术中的不足,从而提供一种在修改清洗顺序时保证生产效率的光伏硅片清洗工艺优化方法,以及基于上述优化方法的设备布置顺序调整方法。
本发明解决其技术问题所采用的技术方案是:一种光伏硅片清洗工艺优化方法,包括以下步骤:
S1:读取挂篮搬运装置中机械手搭载花篮输送到清洗装置和干燥装置的输送顺序,挂篮搬运装置包括具有多个输送段的输送轨和每个输送段上设置的机械手,相邻两个输送段之间的连接区域为过渡段,相邻两个输送段的机械手均能运动到过渡段,过渡段对应的一个或多个清洗装置或者一个或多个干燥装置;
S2:判断所有清洗装置是否均早于所有干燥装置,若是则进入S3步骤;若否则将输送顺序中干燥装置调整到所有清洗装置之后再进入S3步骤;
S3:判断位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置,若是则进入S4步骤;若否则将干燥装置调整先后顺序以符合位置靠前的清洗装置和干燥装置早于位置靠后的清洗装置和干燥装置后再进入S4步骤;
S4:判断所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置是否处于输送顺序中,若是则进入S5步骤,若否则将离过渡段对应的清洗装置和干燥装置中最近的清洗装置或干燥装置调整到过渡段对应的清洗装置和干燥装置再进入S5步骤;
S5:输出经过调整后的输送顺序。
优选地,本发明的光伏硅片清洗工艺优化方法,S2、S3和S4步骤中调整后的清洗装置或干燥装置与调整前的清洗装置或干燥装置功能完全相同。
优选地,本发明的光伏硅片清洗工艺优化方法,若若干清洗装置和若干干燥装置的功能完全相同,则读取每个清洗装置和干燥装置中的处理时间,判断位置靠前的清洗装置和干燥装置的处理时间是否大于等于位置靠后的清洗装置和干燥装置的处理时间,若是则结束;否则将位置靠后的清洗装置和干燥装置的处理时间分配到功能完全相同的清洗装置和干燥装置以符合条件。
优选地,本发明的光伏硅片清洗工艺优化方法,以时间平均分配的方式分配处理时间。
本申请还提供一种光伏硅片清洗设备布置顺序调整方法,包括以下步骤:
S1:读取清洗装置和干燥装置的布置顺序和工艺要求中挂篮搬运装置的机械手搭载花篮输送到清洗装置和干燥装置的输送顺序,挂篮搬运装置包括具有多个输送段的输送轨和每个输送段上设置的机械手,相邻两个输送段之间的连接区域为过渡段,相邻两个输送段的机械手均能运动到过渡段,过渡段对应的一个或多个清洗装置或者一个或多个干燥装置;
S2:判断所有清洗装置是否均先于所有干燥装置,若是则进入S3步骤;若否则将干燥装置的布置位置调整到所有清洗装置之后再进入S3步骤;
S3:判断位置靠前的清洗装置和干燥装置在输送顺序中是否早于位置靠后的清洗装置和干燥装置,若是则进入步骤S4;若否则调整清洗装置和干燥装置的位置以符合清洗装置和干燥装置早于位置靠后的清洗装置和干燥装置后再进入S4步骤;
S4:判断所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置是否处于输送顺序中,若是则进入步骤S5,若否则将过渡段设置到对应的清洗装置和干燥装置处或者增加过渡段对应的清洗装置或干燥装置数量后再进入步骤S5;
S5:输出调整后的光伏硅片清洗设备的布置顺序。
优选地,本发明的光伏硅片清洗设备布置顺序调整方法,读取每个清洗装置和干燥装置中的处理时间,判断位置靠前的清洗装置和干燥装置的处理时间是否大于等于位置靠后的清洗装置和干燥装置的处理时间,若是则结束;否则新增功能完全相同的清洗装置和干燥装置,并将位置靠后的清洗装置和干燥装置的处理时间分配到功能完全相同的清洗装置和干燥装置以符合条件。
优选地,本发明的光伏硅片清洗设备布置顺序调整方法,以时间平均分配的方式分配处理时间。
本发明的有益效果是:本发明的光伏硅片清洗工艺优化方法,通过对所有清洗装置均先于所有干燥装置的判断保证了光伏硅片必须先清洗再干燥,对位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置的判断,保证了机械手在工作过程中的移动顺序只能是从前往后,避免了机械手前后往复运动,所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置均需要处于输送顺序中,使得所有的过渡段里的清洗装置或者干燥装置都有花篮进入,以便于整个挂篮搬运装置顺利地在过渡段里完成不同输送段机械手的交接。通过上述条件下的自动化调整,提高了在工艺设定时的效率。同时本申请还提供基于上述光伏硅片清洗工艺优化方法的面向设备设计的布置顺序调整方法。
下面结合附图和实施例对本申请的技术方案进一步说明。图1是本申请实施例的光伏硅片清洗工艺优化方法的逻辑框图。
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请的技术方案。
本实施例提供一种光伏硅片清洗工艺优化方法,
光伏硅片清洗工艺所基于的光伏硅片清洗设备包括挂篮搬运装置以及成排设置的若干清洗装置和若干干燥装置,其中清洗装置用于对光伏硅片进行清洗,干燥装置用于对经过清洗后的光伏硅片进行干燥,光伏硅片清洗控制系统用于控制挂篮搬运装置将带有光伏硅片的挂篮输送至清洗装置或者干燥装置,光伏硅片的挂篮输送至清洗装置或者干燥装置的顺序及下文中的输送顺序。挂篮搬运装置包括具有多个输送段的输送轨和每个输送段上设置的机械手的,相邻两个输送段之间的连接区域为过渡段,相邻两个输送段的机械手均能运动到过渡段,过渡段对应的一个或多个清洗装置或者一个或多个干燥装置。多个输送段对应多个机械手,这样机械手就可以同时在不同的输送段各抓取一个花篮,使得能够同时进行多个批次的硅片清洗,提高工作效率。
优化方法包括以下步骤:
S1:读取挂篮搬运装置中机械手搭载花篮输送到清洗装置和干燥装置的输送顺序;
S2:判断所有清洗装置是否均早于所有干燥装置,若是则进入S3步骤;若否则将输送顺序中干燥装置调整到所有清洗装置之后再进入S3步骤;
S3:判断位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置,若是则进入S4步骤;若否则将干燥装置调整先后顺序以符合位置靠前的清洗装置和干燥装置早于位置靠后的清洗装置和干燥装置后再进入S4步骤;
S4:判断所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置是否处于输送顺序中,若是则进入S5步骤,若否则将离过渡段对应的清洗装置和干燥装置中最近的清洗装置或干燥装置调整到过渡段对应的清洗装置和干燥装置再进入S5步骤;
S5:输出经过调整后的输送顺序。
也即优化方法需要遵循以下两个条件:
条件一:所有清洗装置均先于所有干燥装置;
条件二:位置靠前的清洗装置和干燥装置必须早于位置靠后的清洗装置和干燥装置;
条件三:所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置均需要处于输送顺序中,使得所有的过渡段里的清洗装置或者干燥装置都要有花篮进入,以便于整个挂篮搬运装置顺利地在过渡段里完成不同输送段机械手的交接。
本实施例的光伏硅片清洗工艺优化方法,通过对所有清洗装置均先于所有干燥装置的判断保证了光伏硅片必须先清洗再干燥,对位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置的判断,保证了机械手在工作过程中的移动顺序只能是从前往后,避免了机械手前后往复运动,所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置均需要处于输送顺序中,使得所有的过渡段里的清洗装置或者干燥装置都有花篮进入,以便于整个挂篮搬运装置顺利地在过渡段里完成不同输送段机械手的交接,提高了生产效率。
进一步地,调整后的清洗装置或干燥装置与调整前的清洗装置或干燥装置功能完全相同。以调整后的清洗装置或干燥装置的功能能够完全覆盖调整前的清洗装置或干燥装置为准。
进一步地,若若干清洗装置和若干干燥装置的功能完全相同,则读取每个清洗装置和干燥装置中的处理时间,判断位置靠前的清洗装置和干燥装置的处理时间是否大于等于位置靠后的清洗装置和干燥装置的处理时间,若是则结束;否则将位置靠后的清洗装置和干燥装置的处理时间分配到功能完全相同的清洗装置和干燥装置以符合条件。
进一步地,以时间平均分配的方式分配处理时间。
清洗装置和干燥装置中的清洗工艺参数和干燥工艺参数。清洗工艺参数通常包括,清洗时间、清洗液种类、清洗液温度、清洗液用量。干燥工艺参数包括,喷吹气体的问题和干燥时间。本申请仅限于处理时间的调整,其他工艺参数同步对清洗装置和干燥装置进行调整。
举例的光伏硅片清洗设备包括顺序排列的第一清洗槽、第二清洗槽、第三清洗槽、第四清洗槽、第五清洗槽、第六清洗槽以及第一干燥槽和第二干燥槽。
在设定输送顺序时,可以直接设定输送顺序为第一清洗槽-第二清洗槽-第三清洗槽、第四清洗槽-第五清洗槽-第六清洗槽-第一干燥槽-第二干燥槽,如下表的“依次输送”,这也是最常见的设置方式。当然,使用者也可以根据需要忽略其中的某个或多个清洗槽或者干燥槽。此时,产生了本申请中订制输送顺序的需求。
未优化前情况1则为不符合“所有清洗装置均先于所有干燥装置”的情形,此时,调整顺序形成“优化后情况1”。
未优化前情况2则为不符合“位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置”的情形,此时交换“第一清洗槽”和“第二清洗槽”的顺序,调整顺序形成“优化后情况2”。
其中的数字表示先后进入的顺序,没有数字的表示不进入。
又假设第一清洗槽与第二清洗槽的功能完全相同,第三清洗槽与第四清洗槽的功能完全相同,第五清洗槽与第六清洗槽的功能完全相同。第一机械手对应“第一清洗槽、第二清洗槽、第三清洗槽”,第二机械手对应“第三清洗槽、第四清洗槽、第五清洗槽”,第三机械手对应“第五清洗槽、第六清洗槽、第一干燥槽”,第四机械手对应“第六清洗槽、第一干燥槽、第二干燥槽”。
其中过渡段为“第三清洗槽”、“第六清洗槽”、“第一干燥槽。”
如未优化情况3,其中,第三清洗槽与第四清洗槽的功能完全相同,但是第三清洗槽作为过渡段不在输送顺序中,因此,将第四清洗槽调整为第三清洗槽,同样的将第五清洗槽调整为第六清洗槽。
以下为针对处理时间的优化,表格中的时间即为处理时间。
“未优化前情况4”中第三清洗槽的处理时间大于第一清洗槽的处理时间,因而不符合要求,可向“优化后情况4”和“优化后情况4’”进行优化。
第一批次进入第一清洗槽,0-10min为第一清洗槽工作时间,10-17.5min为第三清洗槽工作时间,17.5-25min为第四清洗槽工作时间,25-32min为第五清洗槽工作时间,32-39min为第五清洗槽工作时间,39-44min为第一干燥槽工作时间,44-49min为第二干燥槽工作时间。
第二批次应当于7.5min后进入第二清洗槽,7.5-17.5min为第二清洗槽工作时间,17.5min-25min为第三清洗槽工作时间,以此类推,避开第一批次的清洗时间。
当然,也可以不平均分配时间,形成如“优化后情况4’”的优化方式。此时,第二批次应当于后8min进入第二清洗槽,以此类推。
本实施例一种光伏硅片清洗设备布置顺序调整方法,本实施例用于光伏硅片清洗设备设计过程,用于对清洗装置和干燥装置的排列顺序进行规范,核心思想与实施例1中的相同,包括以下步骤:
S1:读取清洗装置和干燥装置的布置顺序和工艺要求中挂篮搬运装置的机械手搭载花篮输送到清洗装置和干燥装置的输送顺序,挂篮搬运装置包括具有多个输送段的输送轨和每个输送段上设置的机械手,相邻两个输送段之间的连接区域为过渡段,相邻两个输送段的机械手均能运动到过渡段,过渡段对应的一个或多个清洗装置或者一个或多个干燥装置;
S2:判断所有清洗装置是否均先于所有干燥装置,若是则进入S3步骤;若否则将干燥装置的布置位置调整到所有清洗装置之后再进入S3步骤;
S3:判断位置靠前的清洗装置和干燥装置在输送顺序中是否早于位置靠后的清洗装置和干燥装置,若是则进入步骤S4;若否则调整清洗装置和干燥装置的位置以符合清洗装置和干燥装置早于位置靠后的清洗装置和干燥装置后再进入S4步骤;
S4:判断所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置是否处于输送顺序中,若是则进入步骤S5,若否则将过渡段设置到对应的清洗装置和干燥装置处或者增加过渡段对应的清洗装置或干燥装置数量后再进入步骤S5(也即可以调整过渡段的设置位置或者对应数量);
S5:输出调整后的光伏硅片清洗设备的布置顺序。
进一步地,读取每个清洗装置和干燥装置中的处理时间,判断位置靠前的清洗装置和干燥装置的处理时间是否大于等于位置靠后的清洗装置和干燥装置的处理时间,若是则结束;否则新增功能完全相同的清洗装置和干燥装置,并将位置靠后的清洗装置和干燥装置的处理时间分配到功能完全相同的清洗装置和干燥装置以符合条件。
进一步地,以时间平均分配的方式分配处理时间。
通过上述设置,使得设备能够设计阶段符合更高工作效率的要求。
以上述依据本申请的理想实施例为启示,通过上述的说明内容,相关工作人员完全可以在不偏离本项申请技术思想的范围内,进行多样的变更以及修改。本项申请的技术性范围并不局限于说明书上的内容,必须要根据权利要求范围来确定其技术性范围。
本领域内的技术人员应明白,本申请的实施例可提供为方法、系统、或计算机程序产品。因此,本申请可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且,本申请可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质上实施的计算机程序产品的形式。
本申请是参照根据本申请实施例的方法、设备、和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其他可编程数据处理设备的处理器以产生一个机器,使得通过计算机或其他可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理设备以特定方式工作的计算机可读存储器中,使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品,该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理设备上,使得在计算机或其他可编程设备上执行一系列操作步骤以产生计算机实现的处理,从而在计算机或其他可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
Claims (7)
- 一种光伏硅片清洗工艺优化方法,其特征在于,包括以下步骤:S1:读取挂篮搬运装置中机械手搭载花篮输送到清洗装置和干燥装置的输送顺序,挂篮搬运装置包括具有多个输送段的输送轨和每个输送段上设置的机械手,相邻两个输送段之间的连接区域为过渡段,相邻两个输送段的机械手均能运动到过渡段,过渡段对应的一个或多个清洗装置或者一个或多个干燥装置;S2:判断所有清洗装置是否均早于所有干燥装置,若是则进入S3步骤;若否则将输送顺序中干燥装置调整到所有清洗装置之后再进入S3步骤;S3:判断位置靠前的清洗装置和干燥装置是否早于位置靠后的清洗装置和干燥装置,若是则进入S4步骤;若否则将干燥装置调整先后顺序以符合位置靠前的清洗装置和干燥装置早于位置靠后的清洗装置和干燥装置后再进入S4步骤;S4:判断所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置是否处于输送顺序中,若是则进入S5步骤,若否则将离过渡段对应的清洗装置和干燥装置中最近的清洗装置或干燥装置调整到过渡段对应的清洗装置和干燥装置再进入S5步骤;S5:输出经过调整后的输送顺序。
- 根据权利要求1所述的光伏硅片清洗工艺优化方法,其特征在于,S2、S3和S4步骤中调整后的清洗装置或干燥装置与调整前的清洗装置或干燥装置功能完全相同。
- 根据权利要求1所述的光伏硅片清洗工艺优化方法,其特征在于,若若干清洗装置和若干干燥装置的功能完全相同,则读取每个清洗装置和干燥装置中的处理时间,判断位置靠前的清洗装置和干燥装置的处理时间是否大于等于位置靠后的清洗装置和干燥装置的处理时间,若是则结束;否则将位置靠后的清洗装置和干燥装置的处理时间分配到功能完全相同的清洗装置和干燥装置以符合条件。
- 根据权利要求3所述的光伏硅片清洗工艺优化方法,其特征在于,以时间平均分配的方式分配处理时间。
- 一种光伏硅片清洗设备布置顺序调整方法,其特征在于,包括以下步骤:S1:读取清洗装置和干燥装置的布置顺序和工艺要求中挂篮搬运装置的机械手搭载花篮输送到清洗装置和干燥装置的输送顺序,挂篮搬运装置包括具有多个输送段的输送轨和每个输送段上设置的机械手,相邻两个输送段之间的连接区域为过渡段,相邻两个输送段的机械手均能运动到过渡段,过渡段对应的一个或多个清洗装置或者一个或多个干燥装置;S2:判断所有清洗装置是否均先于所有干燥装置,若是则进入S3步骤;若否则将干燥装置的布置位置调整到所有清洗装置之后再进入S3步骤;S3:判断位置靠前的清洗装置和干燥装置在输送顺序中是否早于位置靠后的清洗装置和干燥装置,若是则进入步骤S4;若否则调整清洗装置和干燥装置的位置以符合清洗装置和干燥装置早于位置靠后的清洗装置和干燥装置后再进入S4步骤;S4:判断所有过渡段对应的清洗装置和干燥装置中的至少一个清洗装置或干燥装置是否处于输送顺序中,若是则进入步骤S5,若否则将过渡段设置到对应的清洗装置和干燥装置处或者增加过渡段对应的清洗装置或干燥装置数量后再进入步骤S5;S5:输出调整后的光伏硅片清洗设备的布置顺序。
- 根据权利要求5所述的光伏硅片清洗设备布置顺序调整方法,其特征在于,读取每个清洗装置和干燥装置中的处理时间,判断位置靠前的清洗装置和干燥装置的处理时间是否大于等于位置靠后的清洗装置和干燥装置的处理时间,若是则结束;否则新增功能完全相同的清洗装置和干燥装置,并将位置靠后的清洗装置和干燥装置的处理时间分配到功能完全相同的清洗装置和干燥装置以符合条件。
- 根据权利要求6所述的光伏硅片清洗设备布置顺序调整方法,其特征在于,以时间平均分配的方式分配处理时间。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310114028.7 | 2023-02-15 | ||
CN202310114028.7A CN115815202B (zh) | 2023-02-15 | 2023-02-15 | 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2024169059A1 true WO2024169059A1 (zh) | 2024-08-22 |
Family
ID=85521416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2023/093364 WO2024169059A1 (zh) | 2023-02-15 | 2023-05-11 | 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115815202B (zh) |
WO (1) | WO2024169059A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115815202B (zh) * | 2023-02-15 | 2023-04-25 | 江苏亚电科技有限公司 | 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 |
CN116435230B (zh) * | 2023-06-15 | 2023-08-11 | 常州比太科技有限公司 | 一种硅片板输送清洗设备及工作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001162233A (ja) * | 1999-12-09 | 2001-06-19 | Systemseiko Co Ltd | 洗浄方法、洗浄乾燥方法およびワーク搬送装置 |
US20080202260A1 (en) * | 2007-02-26 | 2008-08-28 | Masahiro Yamamoto | Scheduling method and program for a substrate treating apparatus |
CN114256382A (zh) * | 2021-12-11 | 2022-03-29 | 通威太阳能(安徽)有限公司 | 硅片的制绒清洗方法及晶硅太阳能电池的制备方法 |
CN115815202A (zh) * | 2023-02-15 | 2023-03-21 | 江苏亚电科技有限公司 | 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 |
CN116344668A (zh) * | 2023-02-15 | 2023-06-27 | 江苏亚电科技有限公司 | 一种光伏硅片清洗控制系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07275810A (ja) * | 1994-04-12 | 1995-10-24 | Hitachi Home Tec Ltd | 洗浄装置 |
JPH08109487A (ja) * | 1994-10-11 | 1996-04-30 | Hitachi Home Tec Ltd | 洗浄装置 |
JPH11227931A (ja) * | 1998-02-10 | 1999-08-24 | Yaskawa Electric Corp | 搬送順序決定方法および装置 |
JP2004041860A (ja) * | 2002-07-09 | 2004-02-12 | Sansha Electric Mfg Co Ltd | 洗浄・乾燥連動システム |
JP5389478B2 (ja) * | 2009-03-06 | 2014-01-15 | オリンパス株式会社 | 洗浄乾燥方法及び洗浄乾燥装置 |
CN106694443B (zh) * | 2016-11-30 | 2019-04-05 | 北京七星华创电子股份有限公司 | 硅片清洗的调度方法及调度系统 |
CN107051966A (zh) * | 2017-03-08 | 2017-08-18 | 常州市科沛达超声工程设备有限公司 | 全自动硅片清洗线及其工作方法 |
JP7105066B2 (ja) * | 2018-01-15 | 2022-07-22 | 三井化学株式会社 | 工程間搬送の自動制御装置及び制御方法並びに該制御方法をコンピュータにより実行させるためのプログラム及びこれを記録したコンピュータ可読記録媒体 |
CN113510113A (zh) * | 2021-07-26 | 2021-10-19 | 鑫鑫直线精密机械(苏州)有限公司 | 全自动滑块清洗机 |
-
2023
- 2023-02-15 CN CN202310114028.7A patent/CN115815202B/zh active Active
- 2023-05-11 WO PCT/CN2023/093364 patent/WO2024169059A1/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001162233A (ja) * | 1999-12-09 | 2001-06-19 | Systemseiko Co Ltd | 洗浄方法、洗浄乾燥方法およびワーク搬送装置 |
US20080202260A1 (en) * | 2007-02-26 | 2008-08-28 | Masahiro Yamamoto | Scheduling method and program for a substrate treating apparatus |
CN114256382A (zh) * | 2021-12-11 | 2022-03-29 | 通威太阳能(安徽)有限公司 | 硅片的制绒清洗方法及晶硅太阳能电池的制备方法 |
CN115815202A (zh) * | 2023-02-15 | 2023-03-21 | 江苏亚电科技有限公司 | 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 |
CN116344668A (zh) * | 2023-02-15 | 2023-06-27 | 江苏亚电科技有限公司 | 一种光伏硅片清洗控制系统 |
Also Published As
Publication number | Publication date |
---|---|
CN115815202A (zh) | 2023-03-21 |
CN115815202B (zh) | 2023-04-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2024169059A1 (zh) | 光伏硅片清洗工艺优化方法及设备布置顺序调整方法 | |
TWI663568B (zh) | 基於半導體裝置即時狀態的物料調度方法及系統 | |
JP5736687B2 (ja) | 基板処理装置 | |
JP4149166B2 (ja) | 処理システム及び処理方法 | |
TWI668754B (zh) | 基板處理裝置及基板處理方法 | |
WO2024169058A1 (zh) | 一种光伏硅片清洗控制系统 | |
US10133264B2 (en) | Method of performing aging for a process chamber | |
KR20100129211A (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
CN116190277A (zh) | 半导体处理设备的调度方法和装置、半导体处理设备 | |
CN110299313B (zh) | 清洗装置和清洗方法 | |
JPH10135302A (ja) | 半導体装置製造ライン | |
CN210944941U (zh) | 一种凝结水精处理再生系统混脂二次输送设备 | |
JP3934275B2 (ja) | 基板処理装置、基板処理装置のシミュレート装置、及び基板処理装置のシミュレートプログラムを記録したコンピュータ読み取り可能な記録媒体 | |
TWI651756B (zh) | 半導體晶片濕法清洗設備 | |
TWI541624B (zh) | 電漿處理系統之整合與控制方法及設備 | |
JP4886669B2 (ja) | 基板処理装置 | |
CN115172225A (zh) | 一种晶圆清洗系统 | |
JP3254518B2 (ja) | 洗浄処理方法及び洗浄処理システム | |
TW200527236A (en) | Tank scheduling optimization for replicated chemical in a semiconductor manufacturing wet bench | |
CN110064440B (zh) | 一种凝结水精处理再生系统混脂二次输送方法及装置 | |
CN106694443A (zh) | 硅片清洗的调度方法及调度系统 | |
CN209000886U (zh) | 氧化设备中挡片自动清洁系统 | |
KR101842039B1 (ko) | 웨이퍼 처리 방법 | |
CN108227508B (zh) | 晶圆装卸台效率监控方法 | |
KR100885284B1 (ko) | 기판처리장치 및 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 23922187 Country of ref document: EP Kind code of ref document: A1 |