WO2024122541A1 - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法 Download PDF

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Publication number
WO2024122541A1
WO2024122541A1 PCT/JP2023/043470 JP2023043470W WO2024122541A1 WO 2024122541 A1 WO2024122541 A1 WO 2024122541A1 JP 2023043470 W JP2023043470 W JP 2023043470W WO 2024122541 A1 WO2024122541 A1 WO 2024122541A1
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Prior art keywords
concentration
semiconductor substrate
region
donors
donor
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English (en)
French (fr)
Japanese (ja)
Inventor
英徳 辻
信也 高島
勝典 上野
尚 吉村
竣太郎 谷口
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Priority to JP2024562945A priority Critical patent/JP7827170B2/ja
Priority to DE112023002227.5T priority patent/DE112023002227T5/de
Priority to CN202380049578.3A priority patent/CN119452752A/zh
Publication of WO2024122541A1 publication Critical patent/WO2024122541A1/ja
Priority to US19/000,267 priority patent/US20250126863A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/038—Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/129—Cathode regions of diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60—Impurity distributions or concentrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/111—Field plates
    • H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/422—PN diodes having the PN junctions in mesas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/161—IGBT having built-in components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/208—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically inactive species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/417—Insulated-gate bipolar transistors [IGBT] having a drift region having a doping concentration that is higher at the collector side relative to other parts of the drift region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/418—Insulated-gate bipolar transistors [IGBT] having a drift region having a doping concentration that is higher at the emitter side relative to other parts of the drift region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs

Definitions

  • the present invention relates to a semiconductor device and a method for manufacturing a semiconductor device.
  • Patent Document 1 U.S. Patent Application Publication No. 2020/0194550
  • Patent Document 2 U.S. Patent Application Publication No. 2016/0329401
  • the one or more doping concentration peaks may include a deepest peak disposed furthest from the lower surface of the semiconductor substrate.
  • the increased donor may include the thermal donor.
  • the concentration of the thermal donors may be 10% or less of the concentration of the increased donors at the same depth position over an entire first range from the lower end of the buffer region to the deepest peak.
  • the increased donor may include a CIOi-H donor.
  • the concentration of the thermal donor may be 1% or more of the concentration of the enhanced donor at the same depth position throughout the first range.
  • the semiconductor substrate may have an oxygen chemical concentration of not less than 1 ⁇ 10 17 atoms/cm 3 and not more than 5 ⁇ 10 17 atoms/cm 3 .
  • the concentration of the thermal donors in the drift region may be 0.0001 times or less the oxygen chemical concentration.
  • the doping concentration of the drift region may be 1.5 times or less than the concentration of the bulk donor.
  • the buffer region may include a maximum peak where the doping concentration is maximum among the doping concentration peaks other than the deepest peak.
  • the concentration of the thermal donor may be 0.01 times or less the doping concentration at the apex position of the maximum peak.
  • the buffer region may include a shallowest peak closest to the bottom surface of the semiconductor substrate.
  • the concentration of the thermal donor at the apex position of the shallowest peak may be 0.001 times or less the doping concentration.
  • the concentration distribution of the thermal donors may have a decreasing portion that decreases toward the upper surface of the semiconductor substrate.
  • the reduction portion may have a region in which the logarithmic gradient of the thermal donor concentration toward the top surface side of the semiconductor substrate is 0.5 to 10 times the logarithmic gradient of the oxygen chemical concentration.
  • a method for manufacturing a semiconductor device using a semiconductor substrate having an upper surface and a lower surface, including a bulk donor, and having an oxygen chemical concentration of 1 ⁇ 10 16 atoms/cm 3 or more may include a drift region of a first conductivity type provided in the semiconductor substrate, the drift region including the bulk donor and the thermal donor.
  • the semiconductor device may include a buffer region of a first conductivity type provided between the drift region and the lower surface of the semiconductor substrate, the buffer region including the bulk donor and an increased donor, and having a doping concentration higher than that of the drift region.
  • the buffer region may have one or more doping concentration peaks in a depth direction of the semiconductor substrate.
  • the one or more doping concentration peaks may include a deepest peak disposed furthest from the lower surface of the semiconductor substrate.
  • the increased donor may include the thermal donor.
  • the manufacturing method may include annealing the semiconductor substrate so that the concentration of the thermal donor is 10% or less of the concentration of the enhanced donor at the same depth position throughout a first range from the bottom end of the buffer region to the deepest peak.
  • the time for the temperature of the semiconductor substrate to pass through a temperature zone of 400°C or more and 500°C or less may be 20 minutes or less per pass.
  • the cumulative time during which the temperature of the semiconductor substrate passes through a temperature zone of 425°C or more and 475°C or less may be 60 minutes or less.
  • Any of the above manufacturing methods may form a metal electrode above the top surface of the semiconductor substrate. Any of the above manufacturing methods may perform a process after forming the metal electrode at a temperature of less than 400°C.
  • FIG. 1 is a top view illustrating an example of a semiconductor device 100 according to an embodiment of the present invention.
  • FIG. 2 is an enlarged view of an area D in FIG.
  • FIG. 3 is a diagram showing an example of a cross section taken along the line ee in FIG. 2.
  • FIG. 4 is a diagram showing a reference example of a doping concentration distribution 210 along the line ff in FIG.
  • FIG. 2 is a diagram showing a doping concentration distribution 210 according to an embodiment.
  • 13 is a diagram showing an example of an oxygen chemical concentration distribution and a thermal donor concentration distribution in a region (region from depth position Zb to depth position Zu) on the upper surface 21 side of the buffer region 20.
  • FIG. 2 is a flowchart illustrating an example of a method for manufacturing the semiconductor device 100.
  • FIG. 2 is a flowchart illustrating an example of a method for manufacturing the semiconductor device 100.
  • FIG. 1 is a top view illustrating an example of a semiconductor device 100 according to an embodiment
  • 10A and 10B are diagrams showing examples of changes in temperature of the semiconductor substrate 10 over time in each annealing stage.
  • 10 is a flowchart showing a more specific example of the method for manufacturing the semiconductor device 100.
  • FIG. FIG. 10 is a flowchart showing steps subsequent to the steps in FIG. 9 .
  • one side in a direction parallel to the depth direction of the semiconductor substrate is referred to as "upper” and the other side as “lower.”
  • the upper surface is referred to as the upper surface and the other surface is referred to as the lower surface.
  • the directions of "upper” and “lower” are not limited to the direction of gravity or the directions when the semiconductor device is mounted.
  • the orthogonal coordinate axes merely identify the relative positions of components, and do not limit a specific direction.
  • the Z-axis does not limit the height direction relative to the ground.
  • the +Z-axis direction and the -Z-axis direction are opposite directions.
  • the Z-axis direction is described without indicating positive or negative, it means the direction parallel to the +Z-axis and -Z-axis.
  • the orthogonal axes parallel to the top and bottom surfaces of the semiconductor substrate are referred to as the X-axis and Y-axis.
  • the axis perpendicular to the top and bottom surfaces of the semiconductor substrate is referred to as the Z-axis.
  • the direction of the Z-axis may be referred to as the depth direction.
  • the direction parallel to the top and bottom surfaces of the semiconductor substrate, including the X-axis and Y-axis may be referred to as the horizontal direction.
  • the region from the center of the semiconductor substrate in the depth direction to the top surface of the semiconductor substrate may be referred to as the top side.
  • the region from the center of the semiconductor substrate in the depth direction to the bottom surface of the semiconductor substrate may be referred to as the bottom side.
  • the conductivity type of a doped region doped with impurities is described as P type or N type.
  • impurities may particularly mean either N type donors or P type acceptors, and may be described as dopants.
  • doping means introducing donors or acceptors into a semiconductor substrate to make it a semiconductor that exhibits N type conductivity or P type conductivity.
  • the doping concentration means the concentration of the donor or the concentration of the acceptor in a thermal equilibrium state.
  • the net doping concentration means the net concentration obtained by adding up the donor concentration as the concentration of positive ions and the acceptor concentration as the concentration of negative ions, including the polarity of the charge.
  • the donor concentration is N D and the acceptor concentration is N A
  • the net doping concentration at any position is N D -N A.
  • the net doping concentration may be simply referred to as the doping concentration.
  • Donors have the function of supplying electrons to a semiconductor. Acceptors have the function of receiving electrons from a semiconductor. Donors and acceptors are not limited to impurities themselves.
  • VOH defects in semiconductors which are formed by combining vacancies (V), oxygen (O), and hydrogen (H) function as donors that supply electrons.
  • Hydrogen donors may be donors that are formed by combining at least vacancies (V) and hydrogen (H).
  • interstitial Si-H which is formed by combining interstitial silicon (Si-i) and hydrogen in a silicon semiconductor
  • CiOi-H which is formed by combining interstitial carbon (Ci), interstitial oxygen (Oi), and hydrogen, also function as donors that supply electrons.
  • VOH defects, CiOi-H, or interstitial Si-H may be referred to as hydrogen donors.
  • the semiconductor substrate has N-type bulk donors distributed throughout.
  • the bulk donors are donors due to dopants contained substantially uniformly in the ingot during the manufacture of the ingot that is the basis of the semiconductor substrate.
  • the bulk donors in this example are elements other than hydrogen.
  • the dopants of the bulk donors are, for example, phosphorus, antimony, arsenic, selenium, or sulfur, but are not limited thereto.
  • the bulk donors in this example are phosphorus.
  • the bulk donors are also contained in the P-type region.
  • the semiconductor substrate may be a wafer cut from a semiconductor ingot, or may be a chip obtained by dividing the wafer.
  • the semiconductor ingot may be manufactured by any of the Czochralski method (CZ method), the magnetic field-applied Czochralski method (MCZ method), and the float zone method (FZ method).
  • the ingot in this example is manufactured by the MCZ method.
  • the oxygen concentration contained in the substrate manufactured by the MCZ method is 1 ⁇ 10 17 to 7 ⁇ 10 17 /cm 3 .
  • the oxygen concentration contained in the substrate manufactured by the FZ method is 1 ⁇ 10 15 to 5 ⁇ 10 16 /cm 3. The higher the oxygen concentration, the easier it is to generate hydrogen donors.
  • the bulk donor concentration may be the chemical concentration of the bulk donor distributed throughout the semiconductor substrate, and may be between 90% and 100% of the chemical concentration.
  • the semiconductor substrate may be a non-doped substrate that does not contain a dopant such as phosphorus.
  • the bulk donor concentration (D0) of the non-doped substrate is, for example, 1 ⁇ 10 10 /cm 3 or more and 5 ⁇ 10 12 /cm 3 or less.
  • the bulk donor concentration (D0) of the non-doped substrate is preferably 1 ⁇ 10 11 /cm 3 or more.
  • the bulk donor concentration (D0) of the non-doped substrate is preferably 5 ⁇ 10 12 /cm 3 or less.
  • each concentration may be a value at room temperature.
  • a value at 300 K (Kelvin) (approximately 26.9° C.) may be used.
  • chemical concentration refers to the atomic density of an impurity measured regardless of the state of electrical activation.
  • the chemical concentration can be measured, for example, by secondary ion mass spectrometry (SIMS).
  • the above-mentioned net doping concentration can be measured by a voltage-capacitance measurement method (CV method).
  • the carrier concentration measured by a spreading resistance measurement method (SR method) may be the net doping concentration.
  • the carrier concentration measured by the CV method or the SR method may be a value in a thermal equilibrium state.
  • the donor concentration is sufficiently larger than the acceptor concentration in an N-type region, the carrier concentration in that region may be the donor concentration.
  • the carrier concentration in that region may be the acceptor concentration.
  • the doping concentration in an N-type region may be referred to as the donor concentration
  • the doping concentration in a P-type region may be referred to as the acceptor concentration.
  • the peak value may be taken as the concentration of the donor, acceptor or net doping in the region.
  • the concentration of the donor, acceptor or net doping is almost uniform, the average value of the concentration of the donor, acceptor or net doping in the region may be taken as the concentration of the donor, acceptor or net doping.
  • atoms/cm 3 or /cm 3 is used to express concentration per unit volume. This unit is used for donor or acceptor concentration or chemical concentration in a semiconductor substrate. The notation of atoms may be omitted.
  • the carrier concentration measured by the SR method may be lower than the donor or acceptor concentration.
  • the carrier mobility of the semiconductor substrate may be lower than the value in the crystalline state. The reduction in carrier mobility occurs when the carriers are scattered due to disorder in the crystal structure caused by lattice defects, etc.
  • the donor or acceptor concentration calculated from the carrier concentration measured by the CV method or the SR method may be lower than the chemical concentration of the element representing the donor or acceptor.
  • the donor concentration of phosphorus or arsenic, which acts as a donor in a silicon semiconductor, or the acceptor concentration of boron, which acts as an acceptor is about 99% of the chemical concentration.
  • the donor concentration of hydrogen, which acts as a donor in a silicon semiconductor is about 0.1% to 10% of the chemical concentration of hydrogen.
  • FIG. 1 is a top view showing an example of a semiconductor device 100 according to one embodiment of the present invention.
  • FIG. 1 the positions of each component projected onto the top surface of a semiconductor substrate 10 are shown.
  • FIG. 1 only some of the components of the semiconductor device 100 are shown, and some components are omitted.
  • the semiconductor device 100 includes a semiconductor substrate 10.
  • the semiconductor substrate 10 is a substrate formed of a semiconductor material.
  • the semiconductor substrate 10 is a silicon substrate.
  • the semiconductor substrate 10 has edges 162 when viewed from above. When simply referred to as a top view in this specification, it means that the semiconductor substrate 10 is viewed from the top side.
  • the semiconductor substrate 10 has two sets of edges 162 that face each other when viewed from above. In FIG. 1, the X-axis and Y-axis are parallel to one of the edges 162. The Z-axis is perpendicular to the top surface of the semiconductor substrate 10.
  • the semiconductor substrate 10 has an active portion 160.
  • the active portion 160 is a region through which a main current flows in the depth direction between the upper and lower surfaces of the semiconductor substrate 10 when the semiconductor device 100 is in operation.
  • An emitter electrode is provided above the active portion 160, but is omitted in FIG. 1.
  • the active portion 160 may refer to the region that overlaps with the emitter electrode when viewed from above.
  • the active portion 160 may also include the region sandwiched between the active portions 160 when viewed from above.
  • the active section 160 is provided with at least one of a transistor section 70 including a transistor element such as an IGBT (Insulated Gate Bipolar Transistor) and a diode section 80 including a diode element such as a free wheel diode (FWD).
  • IGBT Insulated Gate Bipolar Transistor
  • FWD free wheel diode
  • the transistor sections 70 and the diode sections 80 are alternately arranged along a predetermined arrangement direction (the X-axis direction in this example) on the upper surface of the semiconductor substrate 10.
  • the semiconductor device 100 in this example is a reverse conducting IGBT (RC-IGBT).
  • the region in which the transistor section 70 is arranged is marked with the symbol "I”
  • the region in which the diode section 80 is arranged is marked with the symbol "F”.
  • the direction perpendicular to the arrangement direction in a top view may be referred to as the extension direction (the Y-axis direction in FIG. 1).
  • the transistor section 70 and the diode section 80 may each have a longitudinal direction in the extension direction.
  • the length of the transistor section 70 in the Y-axis direction is greater than its width in the X-axis direction.
  • the length of the diode section 80 in the Y-axis direction is greater than its width in the X-axis direction.
  • the extension direction of the transistor section 70 and the diode section 80 may be the same as the longitudinal direction of each trench section described later.
  • the diode section 80 has an N+ type cathode region in a region that contacts the lower surface of the semiconductor substrate 10.
  • the region in which the cathode region is provided is referred to as the diode section 80.
  • the diode section 80 is a region that overlaps with the cathode region when viewed from above.
  • a P+ type collector region may be provided in a region other than the cathode region on the lower surface of the semiconductor substrate 10.
  • an extension region 81 that extends the diode section 80 in the Y-axis direction to the gate wiring described below may also be included in the diode section 80.
  • a collector region is provided on the lower surface of the extension region 81.
  • the transistor section 70 has a P+ type collector region in a region that contacts the bottom surface of the semiconductor substrate 10.
  • the transistor section 70 has a gate structure that has an N type emitter region, a P type base region, a gate conductive portion, and a gate insulating film periodically arranged on the top surface side of the semiconductor substrate 10.
  • the semiconductor device 100 may have one or more pads above the semiconductor substrate 10.
  • the semiconductor device 100 in this example has a gate pad 164.
  • the semiconductor device 100 may also have pads such as an anode pad, a cathode pad, and a current detection pad.
  • Each pad is disposed near an edge 162.
  • the vicinity of the edge 162 refers to the area between the edge 162 and the emitter electrode in a top view.
  • each pad may be connected to an external circuit via wiring such as a wire.
  • a gate potential is applied to the gate pad 164.
  • the gate pad 164 is electrically connected to the conductive portion of the gate trench portion of the active portion 160.
  • the semiconductor device 100 includes a gate wiring that connects the gate pad 164 and the gate trench portion. In FIG. 1, the gate wiring is hatched with diagonal lines.
  • the gate wiring in this example has a peripheral gate wiring 130 and an active side gate wiring 131.
  • the peripheral gate wiring 130 is disposed between the active portion 160 and an edge 162 of the semiconductor substrate 10 in a top view.
  • the peripheral gate wiring 130 in this example surrounds the active portion 160 in a top view.
  • the region surrounded by the peripheral gate wiring 130 in a top view may be the active portion 160.
  • a well region is formed below the gate wiring.
  • the well region is a P-type region with a higher concentration than the base region described below, and is formed from the top surface of the semiconductor substrate 10 to a position deeper than the base region.
  • the region surrounded by the well region in a top view may be the active portion 160.
  • the peripheral gate wiring 130 is connected to the gate pad 164.
  • the peripheral gate wiring 130 is disposed above the semiconductor substrate 10.
  • the peripheral gate wiring 130 may be a metal wiring containing aluminum or the like.
  • the active side gate wiring 131 is provided in the active section 160. By providing the active side gate wiring 131 in the active section 160, the variation in wiring length from the gate pad 164 can be reduced for each region of the semiconductor substrate 10.
  • the peripheral gate wiring 130 and the active side gate wiring 131 are connected to the gate trench portion of the active portion 160.
  • the peripheral gate wiring 130 and the active side gate wiring 131 are disposed above the semiconductor substrate 10.
  • the peripheral gate wiring 130 and the active side gate wiring 131 may be wiring formed of a semiconductor such as polysilicon doped with impurities.
  • the active side gate wiring 131 may be connected to the peripheral gate wiring 130.
  • the active side gate wiring 131 is provided extending in the X-axis direction from one peripheral gate wiring 130 to the other peripheral gate wiring 130 sandwiching the active section 160, so as to cross the active section 160 at approximately the center in the Y-axis direction.
  • the transistor section 70 and the diode section 80 may be arranged alternately in the X-axis direction in each divided region.
  • the semiconductor device 100 may also include a temperature sensor (not shown) that is a PN junction diode formed of polysilicon or the like, and a current detector (not shown) that simulates the operation of a transistor section provided in the active section 160.
  • a temperature sensor not shown
  • a current detector not shown
  • the semiconductor device 100 includes an edge termination structure 90 between the active portion 160 and the edge 162 when viewed from above.
  • the edge termination structure 90 in this example is disposed between the peripheral gate wiring 130 and the edge 162.
  • the edge termination structure 90 reduces electric field concentration on the upper surface side of the semiconductor substrate 10.
  • the edge termination structure 90 may include at least one of a guard ring, a field plate, and a resurf that are arranged in a ring shape surrounding the active portion 160.
  • Region D includes transistor section 70, diode section 80, and active side gate wiring 131.
  • the semiconductor device 100 of this example includes a gate trench section 40, a dummy trench section 30, a well region 11, an emitter region 12, a base region 14, and a contact region 15 provided inside the upper surface side of the semiconductor substrate 10.
  • the gate trench section 40 and the dummy trench section 30 are each an example of a trench section.
  • the semiconductor device 100 of this example also includes an emitter electrode 52 and an active side gate wiring 131 provided above the upper surface of the semiconductor substrate 10.
  • the emitter electrode 52 and the active side gate wiring 131 are provided separately from each other.
  • An interlayer insulating film is provided between the emitter electrode 52 and the active gate wiring 131 and the upper surface of the semiconductor substrate 10, but is omitted in FIG. 2.
  • contact holes 54 are provided in the interlayer insulating film, penetrating the interlayer insulating film. In FIG. 2, each contact hole 54 is hatched with diagonal lines.
  • the emitter electrode 52 is provided above the gate trench portion 40, the dummy trench portion 30, the well region 11, the emitter region 12, the base region 14, and the contact region 15.
  • the emitter electrode 52 contacts the emitter region 12, the contact region 15, and the base region 14 on the upper surface of the semiconductor substrate 10 through a contact hole 54.
  • the emitter electrode 52 is also connected to the dummy conductive portion in the dummy trench portion 30 through a contact hole provided in the interlayer insulating film.
  • the emitter electrode 52 may be connected to the dummy conductive portion of the dummy trench portion 30 at the tip of the dummy trench portion 30 in the Y-axis direction.
  • the dummy conductive portion of the dummy trench portion 30 does not need to be connected to the emitter electrode 52 and the gate conductive portion, and may be controlled to a potential different from the potential of the emitter electrode 52 and the potential of the gate conductive portion.
  • the active side gate wiring 131 is connected to the gate trench portion 40 through a contact hole provided in the interlayer insulating film.
  • the active side gate wiring 131 may be connected to the gate conductive portion of the gate trench portion 40 at the tip portion 41 of the gate trench portion 40 in the Y-axis direction.
  • the active side gate wiring 131 is not connected to the dummy conductive portion in the dummy trench portion 30.
  • the emitter electrode 52 is formed of a material containing metal.
  • FIG. 2 shows the range in which the emitter electrode 52 is provided.
  • the emitter electrode 52 is formed of aluminum or an aluminum-silicon alloy, such as a metal alloy such as AlSi or AlSiCu.
  • the emitter electrode 52 may have a barrier metal formed of titanium or a titanium compound under the region formed of aluminum or the like.
  • the emitter electrode 52 may have a plug formed by embedding tungsten or the like in the contact hole so as to contact the barrier metal and aluminum or the like.
  • the well region 11 is provided so as to overlap with the active side gate wiring 131.
  • the well region 11 is also provided so as to extend by a predetermined width into an area where it does not overlap with the active side gate wiring 131.
  • the well region 11 is provided away from the end of the contact hole 54 in the Y-axis direction toward the active side gate wiring 131.
  • the well region 11 is a region of a second conductivity type having a higher doping concentration than the base region 14.
  • the base region 14 is P- type
  • the well region 11 is P+ type.
  • Each of the transistor section 70 and the diode section 80 has multiple trench sections arranged in the arrangement direction.
  • one or more gate trench sections 40 and one or more dummy trench sections 30 are alternately provided along the arrangement direction.
  • the diode section 80 of this example multiple dummy trench sections 30 are provided along the arrangement direction.
  • no gate trench section 40 is provided in the diode section 80 of this example.
  • the gate trench portion 40 in this example may have two straight portions 39 (portions of the trench that are straight along the extension direction) that extend along an extension direction perpendicular to the arrangement direction, and a tip portion 41 that connects the two straight portions 39.
  • the extension direction in FIG. 2 is the Y-axis direction.
  • the tip 41 is curved when viewed from above.
  • the tip 41 connects the ends of the two straight portions 39 in the Y-axis direction, thereby reducing electric field concentration at the ends of the straight portions 39.
  • the dummy trench portion 30 is provided between each straight portion 39 of the gate trench portion 40.
  • One dummy trench portion 30 may be provided between each straight portion 39, or multiple dummy trench portions 30 may be provided.
  • the dummy trench portion 30 may have a straight line shape extending in the extension direction, and may have a straight line portion 29 and a tip portion 31, similar to the gate trench portion 40.
  • the semiconductor device 100 shown in FIG. 2 includes both a straight line dummy trench portion 30 without a tip portion 31 and a dummy trench portion 30 with a tip portion 31.
  • the diffusion depth of the well region 11 may be deeper than the depth of the gate trench portion 40 and the dummy trench portion 30.
  • the ends in the Y-axis direction of the gate trench portion 40 and the dummy trench portion 30 are provided in the well region 11 when viewed from above. In other words, at the ends in the Y-axis direction of each trench portion, the bottoms in the depth direction of each trench portion are covered by the well region 11. This makes it possible to reduce electric field concentration at the bottoms of each trench portion.
  • the mesa portion refers to the region inside the semiconductor substrate 10 that is sandwiched between the trench portions.
  • the upper end of the mesa portion is the upper surface of the semiconductor substrate 10.
  • the depth position of the lower end of the mesa portion is the same as the depth position of the lower end of the trench portion.
  • the mesa portion is provided on the upper surface of the semiconductor substrate 10, extending in the extension direction (Y-axis direction) along the trench.
  • the transistor portion 70 is provided with a mesa portion 60
  • the diode portion 80 is provided with a mesa portion 61.
  • the term "mesa portion” refers to both the mesa portion 60 and the mesa portion 61.
  • a base region 14 is provided in each mesa portion. Of the base regions 14 exposed on the upper surface of the semiconductor substrate 10 in the mesa portion, the region closest to the active side gate wiring 131 is referred to as the base region 14-e. In FIG. 2, the base region 14-e is shown at one end in the extension direction of each mesa portion, but a base region 14-e is also provided at the other end of each mesa portion.
  • at least one of a first conductive type emitter region 12 and a second conductive type contact region 15 may be provided in a region sandwiched between the base regions 14-e in a top view.
  • the emitter region 12 is N+ type
  • the contact region 15 is P+ type.
  • the emitter region 12 and the contact region 15 may be provided between the base region 14 and the upper surface of the semiconductor substrate 10 in the depth direction.
  • the mesa portion 60 of the transistor portion 70 has an emitter region 12 exposed on the upper surface of the semiconductor substrate 10.
  • the emitter region 12 is provided in contact with the gate trench portion 40.
  • the mesa portion 60 in contact with the gate trench portion 40 may have a contact region 15 exposed on the upper surface of the semiconductor substrate 10.
  • the contact regions 15 and emitter regions 12 in the mesa portion 60 are each provided from one trench portion to the other trench portion in the X-axis direction. As an example, the contact regions 15 and emitter regions 12 in the mesa portion 60 are alternately arranged along the extension direction of the trench portion (Y-axis direction).
  • the contact region 15 and emitter region 12 of the mesa portion 60 may be provided in a stripe shape along the extension direction (Y-axis direction) of the trench portion.
  • the emitter region 12 is provided in a region that contacts the trench portion, and the contact region 15 is provided in a region sandwiched between the emitter regions 12.
  • the mesa portion 61 of the diode portion 80 does not have an emitter region 12.
  • a base region 14 and a contact region 15 may be provided on the upper surface of the mesa portion 61.
  • a contact region 15 may be provided in contact with each of the base regions 14-e.
  • a base region 14 may be provided in the region sandwiched between the contact regions 15 on the upper surface of the mesa portion 61.
  • the base region 14 may be disposed in the entire region sandwiched between the contact regions 15.
  • a contact hole 54 is provided above each mesa portion.
  • the contact hole 54 is located in a region sandwiched between the base regions 14-e.
  • the contact holes 54 are provided above the contact region 15, the base region 14, and the emitter region 12.
  • the contact holes 54 are not provided in the regions corresponding to the base region 14-e and the well region 11.
  • the contact holes 54 may be located in the center of the arrangement direction (X-axis direction) of the mesa portions 60.
  • an N+ type cathode region 82 is provided in a region adjacent to the underside of the semiconductor substrate 10.
  • a P+ type collector region 22 may be provided in the region of the underside of the semiconductor substrate 10 where the cathode region 82 is not provided.
  • the cathode region 82 and the collector region 22 are provided between the underside 23 of the semiconductor substrate 10 and the buffer region 20.
  • the boundary between the cathode region 82 and the collector region 22 is indicated by a dotted line.
  • the cathode region 82 is disposed away from the well region 11 in the Y-axis direction. This ensures a distance between the cathode region 82 and the P-type region (well region 11), which has a relatively high doping concentration and is formed deep, and improves the breakdown voltage.
  • the end of the cathode region 82 in the Y-axis direction is disposed farther from the well region 11 than the end of the contact hole 54 in the Y-axis direction.
  • the end of the cathode region 82 in the Y-axis direction may be disposed between the well region 11 and the contact hole 54.
  • FIG. 3 is a diagram showing an example of the e-e cross section in FIG. 2.
  • the e-e cross section is an XZ plane passing through the emitter region 12 and the cathode region 82.
  • the semiconductor device 100 of this example has a semiconductor substrate 10, an interlayer insulating film 38, an emitter electrode 52, and a collector electrode 24.
  • the interlayer insulating film 38 is provided on the upper surface of the semiconductor substrate 10.
  • the interlayer insulating film 38 is a film that includes at least one layer of an insulating film such as silicate glass doped with impurities such as boron or phosphorus, a thermal oxide film, and other insulating films.
  • the interlayer insulating film 38 is provided with the contact hole 54 described in FIG. 2.
  • the emitter electrode 52 is provided above the interlayer insulating film 38.
  • the emitter electrode 52 is in contact with the upper surface 21 of the semiconductor substrate 10 through a contact hole 54 in the interlayer insulating film 38.
  • the collector electrode 24 is provided on the lower surface 23 of the semiconductor substrate 10.
  • the emitter electrode 52 and the collector electrode 24 are made of a metal material such as aluminum.
  • the direction connecting the emitter electrode 52 and the collector electrode 24 (the Z-axis direction) is referred to as the depth direction.
  • the semiconductor substrate 10 has an N-type or N-type drift region 18.
  • the drift region 18 is provided in each of the transistor portion 70 and the diode portion 80.
  • an N+ type emitter region 12 and a P- type base region 14 are provided in this order from the upper surface 21 side of the semiconductor substrate 10.
  • a drift region 18 is provided below the base region 14.
  • An N+ type accumulation region 16 may be provided in the mesa portion 60. The accumulation region 16 is disposed between the base region 14 and the drift region 18.
  • the emitter region 12 is exposed on the upper surface 21 of the semiconductor substrate 10 and is provided in contact with the gate trench portion 40.
  • the emitter region 12 may be in contact with the trench portions on both sides of the mesa portion 60.
  • the emitter region 12 has a higher doping concentration than the drift region 18.
  • the base region 14 is provided below the emitter region 12. In this example, the base region 14 is provided in contact with the emitter region 12. The base region 14 may be in contact with the trench portions on both sides of the mesa portion 60.
  • the accumulation region 16 is provided below the base region 14.
  • the accumulation region 16 is an N+ type region with a higher doping concentration than the drift region 18. In other words, the accumulation region 16 has a higher donor concentration than the drift region 18.
  • the carrier injection enhancement effect IE effect
  • the accumulation region 16 may be provided so as to cover the entire lower surface of the base region 14 in each mesa portion 60.
  • the mesa portion 61 of the diode section 80 has a P-type base region 14 in contact with the upper surface 21 of the semiconductor substrate 10.
  • a drift region 18 is provided below the base region 14.
  • an accumulation region 16 may be provided below the base region 14.
  • an N+ type buffer region 20 may be provided below the drift region 18.
  • the doping concentration of the buffer region 20 is higher than the doping concentration of the drift region 18.
  • the buffer region 20 may have a concentration peak with a higher doping concentration than the drift region 18.
  • the doping concentration of the concentration peak refers to the doping concentration at the apex of the concentration peak.
  • the doping concentration of the drift region 18 may be the average value of the doping concentration in a region where the doping concentration distribution is approximately flat.
  • the buffer region 20 may have two or more concentration peaks in the depth direction (Z-axis direction) of the semiconductor substrate 10.
  • the concentration peak of the buffer region 20 may be located at the same depth as the chemical concentration peak of hydrogen (protons) or phosphorus, for example.
  • the buffer region 20 may function as a field stop layer that prevents the depletion layer spreading from the lower end of the base region 14 from reaching the P+ type collector region 22 and the N+ type cathode region 82.
  • a P+ type collector region 22 is provided below the buffer region 20.
  • the acceptor concentration of the collector region 22 is higher than the acceptor concentration of the base region 14.
  • the collector region 22 may contain the same acceptor as the base region 14, or may contain a different acceptor.
  • the acceptor of the collector region 22 is, for example, boron.
  • an N+ type cathode region 82 is provided below the buffer region 20.
  • the donor concentration of the cathode region 82 is higher than the donor concentration of the drift region 18.
  • the donor of the cathode region 82 is, for example, hydrogen or phosphorus.
  • the elements that serve as the donor and acceptor of each region are not limited to the above-mentioned examples.
  • the collector region 22 and the cathode region 82 are exposed to the lower surface 23 of the semiconductor substrate 10 and are connected to the collector electrode 24.
  • the collector electrode 24 may be in contact with the entire lower surface 23 of the semiconductor substrate 10.
  • the emitter electrode 52 and the collector electrode 24 are formed of a metal material such as aluminum.
  • each trench portion is provided from the upper surface 21 of the semiconductor substrate 10, penetrating the base region 14, to below the base region 14. In regions where at least one of the emitter region 12, the contact region 15, and the accumulation region 16 is provided, each trench portion also penetrates these doped regions.
  • the trench portion penetrating the doped region is not limited to being manufactured in the order of forming the doped region and then the trench portion.
  • the trench portion penetrating the doped region also includes a trench portion formed after the trench portion is formed.
  • the transistor section 70 has a gate trench section 40 and a dummy trench section 30.
  • the diode section 80 has a dummy trench section 30, but does not have a gate trench section 40.
  • the boundary between the diode section 80 and the transistor section 70 in the X-axis direction is the boundary between the cathode region 82 and the collector region 22.
  • the gate trench portion 40 has a gate trench provided on the upper surface 21 of the semiconductor substrate 10, a gate insulating film 42, and a gate conductive portion 44.
  • the gate insulating film 42 is provided to cover the inner wall of the gate trench.
  • the gate insulating film 42 may be formed by oxidizing or nitriding the semiconductor on the inner wall of the gate trench.
  • the gate conductive portion 44 is provided inside the gate insulating film 42 inside the gate trench. In other words, the gate insulating film 42 insulates the gate conductive portion 44 from the semiconductor substrate 10.
  • the gate conductive portion 44 is formed of a conductive material such as polysilicon.
  • the gate conductive portion 44 may be provided longer than the base region 14 in the depth direction.
  • the gate trench portion 40 in this cross section is covered by the interlayer insulating film 38 on the upper surface 21 of the semiconductor substrate 10.
  • the gate conductive portion 44 is electrically connected to the gate wiring. When a predetermined gate voltage is applied to the gate conductive portion 44, a channel is formed by an electron inversion layer in the surface layer of the interface of the base region 14 that contacts the gate trench portion 40.
  • the dummy trench portion 30 may have the same structure as the gate trench portion 40 in the cross section.
  • the dummy trench portion 30 has a dummy trench, a dummy insulating film 32, and a dummy conductive portion 34 provided on the upper surface 21 of the semiconductor substrate 10.
  • the dummy conductive portion 34 is electrically connected to the emitter electrode 52.
  • the dummy insulating film 32 is provided to cover the inner wall of the dummy trench.
  • the dummy conductive portion 34 is provided inside the dummy trench and is provided on the inside of the dummy insulating film 32.
  • the dummy insulating film 32 insulates the dummy conductive portion 34 from the semiconductor substrate 10.
  • the dummy conductive portion 34 may be formed of the same material as the gate conductive portion 44.
  • the dummy conductive portion 34 is formed of a conductive material such as polysilicon.
  • the dummy conductive portion 34 may have the same length in the depth direction as the gate conductive portion 44.
  • the gate trench portion 40 and the dummy trench portion 30 are covered by an interlayer insulating film 38 on the upper surface 21 of the semiconductor substrate 10.
  • the bottoms of the dummy trench portion 30 and the gate trench portion 40 may be curved and convex downward (curved in cross section).
  • FIG. 4 is a diagram showing a reference example of the doping concentration distribution 210 on the line ff in FIG. 3.
  • the carrier concentration measured by the SR method or the like is taken as the doping concentration.
  • the line ff is a line parallel to the Z axis that passes through the buffer region 20.
  • the horizontal axis in FIG. 4 indicates the depth position (position in the Z axis direction) in the semiconductor substrate 10.
  • the bottom end position of the buffer region 20 is taken as the reference position (0) in the Z axis direction, and the distance from the reference position is taken as the position in the Z axis direction.
  • At the bottom end position of the buffer region 20 there is a valley in the doping concentration distribution due to the PN junction between the collector region 22 and the buffer region 20, but this valley is omitted in FIG. 4 and the like.
  • FIG. 4 shows a distribution 210 when the semiconductor device 100 is formed on two semiconductor substrates 10 having different oxygen chemical concentrations.
  • the distribution of the dashed line is an example where the oxygen chemical concentration in the semiconductor substrate 10 is relatively high (e.g., 4 ⁇ 10 17 atoms/cm 3 ), and the distribution of the solid line is an example where the oxygen chemical concentration in the semiconductor substrate 10 is relatively low (e.g., 1 ⁇ 10 17 atoms/cm 3 ).
  • the oxygen chemical concentration of the semiconductor substrate 10 may be compared by the average value or maximum value of the oxygen chemical concentration of the entire substrate.
  • the dose amount and acceleration energy of the dopant locally implanted in the buffer region 20 are the same.
  • the dopant implanted in the buffer region 20 is, for example, protons, but is not limited thereto.
  • one or more doping concentration peaks 201 are provided in the buffer region 20.
  • five doping concentration peaks 201-1 to 201-5 are provided in the buffer region 20.
  • the doping concentration peak 201 (doping concentration peak 201-5 in FIG. 4) of the doping concentration peaks 201 in the buffer region 20 that is farthest from the lower surface 23 of the semiconductor substrate 10 may be referred to as the deepest peak
  • the doping concentration peak 201 (doping concentration peak 201-1 in FIG. 4) that is closest to the lower surface 23 may be referred to as the shallowest peak.
  • the depth position of the apex of the doping concentration peak 201-1 is Z1
  • the depth position of the apex of the doping concentration peak 201-5 is Z5.
  • an inter-peak region 301 is provided between adjacent doping concentration peaks 201.
  • a plurality of inter-peak regions 301 may be provided.
  • the inter-peak region 301 farthest from the bottom surface 23 of the semiconductor substrate 10 (inter-peak region 301-4 in FIG. 4) may be referred to as the deepest inter-peak region
  • the inter-peak region 301 closest to the bottom surface 23 (doping concentration peak 301-1 in FIG. 4) may be referred to as the shallowest inter-peak region.
  • the drift region 18 is provided above the buffer region 20.
  • the depth position of the boundary between the buffer region 20 and the drift region 18 is Zb.
  • the depth position Zb is the position where the doping concentration first coincides with the doping concentration (Dd1 or Dd2) of the drift region 18 in the direction from the buffer region 20 toward the drift region 18.
  • No local dopant is implanted into the drift region 18.
  • the doping concentration of the drift region 18 may be approximately constant.
  • Thermal donors are formed throughout the semiconductor substrate 10 due to the effect of heat applied to the semiconductor substrate 10. The distribution of the thermal donors is approximately uniform throughout the semiconductor substrate 10. Therefore, the doping concentration of the drift region 18 is slightly higher than the bulk donor concentration BD.
  • the oxygen contained in the semiconductor substrate 10 forms an unstable oxygen complex during the process of increasing or decreasing the temperature of the semiconductor substrate 10.
  • the oxygen complex acts as a dopant in the semiconductor substrate 10. In this specification, the oxygen complex is referred to as a thermal donor.
  • the concentration of thermal donors formed at each location of the semiconductor substrate 10 varies depending on the concentration of oxygen contained in the semiconductor substrate 10 and the conditions for raising and lowering the temperature of the semiconductor substrate 10. As shown in FIG. 4, in two examples in which the oxygen chemical concentration of the semiconductor substrate 10 is different, the concentration of thermal donors formed is different, and the doping concentration varies throughout the semiconductor substrate 10.
  • the doping concentration of the drift region 18 in the solid line distribution 210 where the oxygen chemical concentration of the semiconductor substrate 10 is relatively low is Dd1
  • the doping concentration of the drift region 18 in the dashed line distribution 210 where the oxygen chemical concentration of the semiconductor substrate 10 is relatively high is Dd2.
  • the doping concentration of each drift region 18 may be the average value for the entire drift region 18, or the minimum value.
  • the thermal donor concentration in the solid line distribution 210 where the oxygen chemical concentration of the semiconductor substrate 10 is relatively low is Nth1
  • the thermal donor concentration in the dashed line distribution 210 where the oxygen chemical concentration of the semiconductor substrate 10 is relatively high is Nth2.
  • the difference (Dd1-BD or Dd2-BD) between the doping concentration of the drift region 18 and the bulk donor concentration BD corresponds to the concentration (Nth1 or Nth2) of the thermal donor formed in each semiconductor substrate 10.
  • the difference between the doping concentration of the drift region 18 and the bulk donor concentration BD is the thermal donor concentration.
  • the thermal donor concentration may be the same throughout the semiconductor substrate 10.
  • the bulk donor concentration BD may be the minimum value of the bulk donor chemical concentration in the semiconductor substrate 10, the bulk donor chemical concentration at the center position in the depth direction of the semiconductor substrate 10, or the average value of the bulk donor chemical concentration in the drift region 18.
  • the bulk donor is a dopant other than oxygen that is distributed throughout the semiconductor substrate 10.
  • the bulk donor may be, for example, phosphorus, arsenic, or antimony, but is not limited to these.
  • the bulk donor concentration BD is the net concentration determined by the difference between the bulk donor concentration and the bulk acceptor concentration.
  • the bulk donor and bulk acceptor concentrations may be values measured by the SIMS method or the like.
  • the buffer region 20 includes increased donors in addition to bulk donors. Increased donors are donors other than bulk donors. Increased donors include implanted donors formed by locally implanting ions into the buffer region 20, and the thermal donors described above. When hydrogen ions are locally implanted into the buffer region 20, the implanted donors are hydrogen donors. When phosphorus or the like is locally implanted into the buffer region 20, the implanted donors are phosphorus donors.
  • the concentration of thermal donors varies depending on the oxygen concentration of the semiconductor substrate 10. Therefore, if the concentration ratio of thermal donors contained in the increased donors is high, the concentration of the increased donors varies depending on the oxygen concentration of the semiconductor substrate 10. Therefore, as shown by the distribution 210 of the dashed and solid lines in Figure 4, the doping concentration of the buffer region 20 varies depending on the oxygen concentration of the semiconductor substrate 10.
  • the range from the bottom end of the buffer region 20 to the deepest peak is the first range 200.
  • the minimum value of the doping concentration in the first range 200 is Nmin1, and the concentration of the increased donor at that depth position is ID1.
  • the minimum value Nmin1 of the doping concentration in the first range 200 is the doping concentration Nmin1 in the deepest inter-peak region (in this example, the inter-peak region 301-4).
  • the concentration ID1 of the increased donor is the difference (Nmin1-BD) between the doping concentration Nmin1 and the bulk donor concentration BD.
  • the minimum value of the doping concentration in the first range 200 is Nmin2, and the concentration of the increased donor at that depth position is ID2.
  • the depth position where the doping concentration is Nmin1 in the solid line distribution 210 is almost the same as the depth position where the doping concentration is Nnmin2 in the dashed line distribution 210.
  • the concentration ID2 of the increased donor is the difference (Nmin2-BD) between the doping concentration Nmin2 and the bulk donor concentration BD.
  • a part of the inter-peak region 301 may have a doping concentration smaller than the bulk donor concentration BD. In such a case, the doping concentration of the inter-peak region 301 where the doping concentration is higher than the bulk donor concentration BD and where the doping concentration is the smallest may be set as Nmin1.
  • the increased donor concentrations ID1 and ID2 may indicate the minimum value of the increased donor concentration in the first range 200. Since the thermal donor concentrations Nth1 and Nth2 are approximately constant at each depth position of the buffer region 20, the ratio of the thermal donor concentrations Nth1 and Nth2 to the increased donor concentrations ID1 and ID2 indicates the maximum value of the thermal donor/increased donor ratio in the first range 200.
  • the average value of the thermal donor concentration in the drift region 18 may be the thermal donor concentration in the buffer region 20
  • the maximum value of the thermal donor concentration in the drift region 18 may be the thermal donor concentration in the buffer region 20
  • the thermal donor concentration at the depth position Zb may be the thermal donor concentration in the buffer region 20.
  • the concentration ID1 of the increased donors is 7 ⁇ 10 13 /cm 3
  • the concentration Nth1 of the thermal donors is 2 ⁇ 10 13 /cm 3.
  • the ratio Nth1/ID1 of the increased donors is 29%.
  • the concentration ID2 of the increased donors is 1 ⁇ 10 14 /cm 3
  • the concentration Nth2 of the thermal donors is 5 ⁇ 10 13 /cm 3.
  • the ratio NTh2/ND2 of the increased donors is 50%. In this way, if the ratio of the thermal donors to the increased donors is large, the concentration of the increased donors varies greatly depending on the oxygen concentration of the semiconductor substrate 10. This causes the characteristics such as the breakdown voltage of the semiconductor device 100 to fluctuate.
  • the breakdown voltage of the example of the solid line distribution 210 is normalized to 1, the breakdown voltage of the example of the dashed line distribution 210 is 1.15.
  • FIG. 5 is a diagram showing a distribution 210 of the doping concentration according to the embodiment.
  • the concentration of the thermal donor formed in the semiconductor substrate 10 is lower than that in the example of FIG. 4. Therefore, the doping concentration and the concentration of the increased donor at each depth position are also different from those in the example of FIG. 4.
  • the other structures are the same as those in the example of FIG. 4. In FIG.
  • the distribution 210 of an example in which the oxygen chemical concentration in the semiconductor substrate 10 is relatively high (e.g., 4 ⁇ 10 17 atoms/cm 3 ) is shown by a dashed line
  • the distribution 210 of an example in which the oxygen chemical concentration in the semiconductor substrate 10 is relatively low (e.g., 1 ⁇ 10 17 atoms/cm 3 ) is shown by a solid line.
  • the oxygen chemical concentration contained in the semiconductor substrate 10 is the same as that in the example of FIG. 4, but the concentration of the thermal donor is controlled to be low by controlling the thermal history of the semiconductor substrate 10.
  • the semiconductor substrate 10 includes bulk donors and thermal donors.
  • the bulk donors and thermal donors may be distributed throughout the semiconductor substrate 10.
  • the drift region 18 includes bulk donors and thermal donors. There may be no other donors distributed in the drift region 18.
  • the buffer region 20 includes bulk donors and augmented donors.
  • the augmented donors include injected donors and thermal donors.
  • the injected donors may be hydrogen donors, phosphorus donors, or other donors.
  • the hydrogen donors may include CIOi-H donors.
  • the hydrogen donors may include VOH defects or interstitial Si-H.
  • the thermal donor concentration Nth is 10% or less of the increased donor concentration ID at the same depth position throughout the first range 200.
  • the minimum doping concentration in the first range 200 is Nmin1, and the increased donor concentration at that depth position is ID1.
  • the increased donor concentration ID1 is the difference (Nmin1-BD) between the doping concentration Nmin1 and the bulk donor concentration BD.
  • the minimum doping concentration in the first range 200 is Nmin2, and the increased donor concentration at that depth position is ID2.
  • the concentration ID1 of the increased donors is 5 ⁇ 10 13 /cm 3
  • the concentration Nth1 of the thermal donors is 3 ⁇ 10 12 /cm 3.
  • the proportion Nth1/ID1 of the increased donors is 6%.
  • the concentration ID2 of the increased donors is 5 ⁇ 10 13 /cm 3
  • the concentration Nth2 of the thermal donors is 5 ⁇ 10 12 /cm 3.
  • the proportion NTh2/ND2 of the increased donors is 10%. That is, in all examples, the concentration Nth of the thermal donors is 10% or less of the concentration ID of the increased donors at the same depth position throughout the entire first range 200.
  • the breakdown voltage of the example of the solid line distribution 210 is set to 1
  • the breakdown voltage of the example of the dashed line distribution 210 is 1.02.
  • the concentration Nth of the thermal donor may be 10% or less, 8% or less, 6% or less, or 5% or less of the concentration ID of the increased donor at the same depth position.
  • the concentration Nth of the thermal donor may be 0.1% or more, 0.5% or more, 1% or more, 2% or more, 3% or more, or 5% or more of the concentration ID of the increased donor at the same depth position.
  • the oxygen chemical concentration of the semiconductor substrate 10 is 1 ⁇ 10 16 atoms/cm 3 or more.
  • the generation of thermal donors can be suppressed, thereby suppressing fluctuations in the characteristics of the semiconductor device 100, such as the breakdown voltage. Therefore, it is not necessary to prepare a substrate with a low oxygen chemical concentration, so that the manufacturing cost of the semiconductor device 100 can be reduced.
  • a semiconductor substrate 10 with a high oxygen chemical concentration it is easy to form hydrogen donors, and it is easy to increase the doping concentration of the buffer region 20.
  • the oxygen chemical concentration of the semiconductor substrate 10 may be 3 ⁇ 10 16 atoms/cm 3 or more, 5 ⁇ 10 16 atoms/cm 3 or more, or 1 ⁇ 10 17 atoms/cm 3 or more.
  • the oxygen chemical concentration of the semiconductor substrate 10 may be 1 ⁇ 10 18 atoms/cm 3 or less, or 5 ⁇ 10 17 atoms/cm 3 or less.
  • the concentration of thermal donors (Nth1 or Nth2) in the drift region 18 may be 0.0001 times (1 ⁇ 10 ⁇ 4 times) or less of the oxygen chemical concentration in the drift region 18.
  • the oxygen chemical concentration in the drift region 18 may be an average value in the drift region 18, a minimum value, or a value at the center in the depth direction of the drift region 18. This reduces the ratio of thermal donors to the increased donors in the buffer region 20, thereby suppressing the characteristic fluctuation of the semiconductor device 100.
  • the concentration of thermal donors (Nth1 or Nth2) in the drift region 18 may be 0.00005 times (5 ⁇ 10 ⁇ 5 times) or less of the oxygen chemical concentration in the drift region 18, or may be 0.00001 times (1 ⁇ 10 ⁇ 5 times) or less.
  • the concentration of thermal donors (Nth1 or Nth2) in the drift region 18 may be 1 ⁇ 10 ⁇ 8 times or more, 5 ⁇ 10 ⁇ 8 times or more, or 1 ⁇ 10 ⁇ 7 times or more, of the oxygen chemical concentration in the drift region 18 .
  • the doping concentration (Dd1 or Dd2) of the drift region 18 may be 1.5 times or less the bulk donor concentration BD. This reduces the proportion of thermal donors among the increased donors in the buffer region 20, thereby suppressing fluctuations in the characteristics of the semiconductor device 100.
  • the doping concentration (Dd1 or Dd2) of the drift region 18 may be 1.3 times or less the bulk donor concentration BD, or may be 1.1 times or less.
  • the doping concentration (Dd1 or Dd2) of the drift region 18 is greater than the bulk donor concentration BD.
  • the thermal donor concentration (Nth1 or Nth2) in the drift region 18 may be 0.5 times or less the bulk donor concentration BD. This reduces the proportion of thermal donors in the increased donors in the buffer region 20, thereby suppressing fluctuations in the characteristics of the semiconductor device 100.
  • the thermal donor concentration (Nth1 or Nth2) in the drift region 18 may be 0.3 times or less the bulk donor concentration BD, or may be 0.1 times or less.
  • the thermal donor concentration (Nth1 or Nth2) in the drift region 18 is greater than 0.
  • the thermal donor concentration Nth may be 0.1 times or less the doping concentration Np5.
  • the values of the doping concentration Np5 are almost the same. This reduces the proportion of thermal donors in the increased donors of the deepest peak of the buffer region 20, thereby suppressing the characteristic fluctuation of the semiconductor device 100. For example, when the semiconductor substrate 10 is turned off, etc., the variation in the vibration of the voltage waveform when the space charge region (or depletion layer) spreading from the upper surface 21 side reaches the buffer region 20 can be suppressed.
  • the thermal donor concentration Nth may be 0.05 times or less the doping concentration Np5, or may be 0.01 times or less.
  • the buffer region 20 includes a maximum peak (doping concentration peak 201-1 in this example) where the doping concentration is maximum among the doping concentration peaks 201 other than the deepest peak.
  • a peak other than the doping concentration 201-1 may be the maximum peak.
  • the doping concentration peak 201-2 may be the maximum peak.
  • the concentration of thermal donors may be 0.01 times or less the doping concentration Np1. This reduces the proportion of thermal donors in the increased donors of the maximum peak of the buffer region 20, thereby suppressing the characteristic fluctuation of the semiconductor device 100.
  • the concentration of thermal donors may be 0.005 times or less the doping concentration Np1, or may be 0.001 times or less.
  • the buffer region 20 includes a shallowest peak (in this example, doping concentration peak 201-1) closest to the bottom surface 23 of the semiconductor substrate 10.
  • concentration of thermal donors may be 0.001 times or less the doping concentration Np1. This reduces the proportion of thermal donors among the increased donors of the shallowest peak of the buffer region 20, thereby suppressing fluctuations in the characteristics of the semiconductor device 100.
  • concentration of thermal donors may be 0.0005 times or less the doping concentration Np1, or may be 0.0001 times or less.
  • FIG. 6 shows an example of the oxygen chemical concentration distribution and the thermal donor concentration distribution in the region on the upper surface 21 side of the buffer region 20 (the region from depth position Zb to depth position Zu).
  • the oxygen chemical concentration may be a value measured by a SIMS method or the like.
  • depth position Zb is the boundary position between the buffer region 20 and the drift region 18, and depth position Zu is the upper end position of the drift region 18.
  • the concentration of the thermal donor is not constant in the depth direction.
  • the concentration of the thermal donor at each depth position in the drift region 18 can be calculated from the difference between the doping concentration and the bulk donor concentration BD.
  • the concentration of the thermal donor in the buffer region 20 described in FIG. 5 etc. may be the average value of the thermal donor in the drift region 18 as shown in FIG. 6, or the value of the thermal donor at the depth position Zb.
  • the oxygen chemical concentration distribution in this example has a decreasing portion 220 in which the oxygen chemical concentration decreases toward the upper surface 21 of the semiconductor substrate 10 in the region from depth position Zb to depth position Zu.
  • the oxygen chemical concentration decreases as the distance from the upper surface 21 decreases.
  • the decreasing portion 220 does not have a region in which the oxygen chemical concentration increases as the distance from the upper surface 21 decreases.
  • Oxygen inside the semiconductor substrate 10 may be released to the outside of the semiconductor substrate 10 during the manufacturing process of the semiconductor substrate 100.
  • the oxygen chemical concentration decreases significantly near the surface of the semiconductor substrate 10, and even at positions away from the surface of the semiconductor substrate 10, the oxygen chemical concentration may decrease gradually toward the substrate surface.
  • the region where the oxygen chemical concentration decreases toward the underside 23 is ground during the manufacturing process.
  • the decreasing portion 220 may be provided in the entire region from depth position Zb to depth position Zu.
  • the thermal donor concentration at each depth position varies depending on the oxygen chemical concentration at each depth position.
  • the thermal donor concentration distribution in this example has a decreasing portion 230 in which the thermal donor concentration decreases toward the upper surface 21 of the semiconductor substrate 10 in the region from depth position Zb to depth position Zu.
  • the thermal donor concentration decreases as the distance from the upper surface 21 decreases.
  • the decreasing portion 230 does not have a region in which the thermal donor concentration increases as the distance from the upper surface 21 decreases.
  • the decreasing portion 230 may be provided in a part or the entire region from depth position Zb to depth position Zu.
  • the thermal donor concentration at depth position Zu may decrease to less than half of the thermal donor concentration at depth position Zb, may decrease to less than 1/4, may decrease to less than 1/10, or may decrease to 0.
  • the reduction portion 230 has a region 240 in which the logarithmic gradient ⁇ th of the concentration of thermal donors toward the upper surface 21 of the semiconductor substrate 10 is 0.5 to 10 times the logarithmic gradient ⁇ ox of the oxygen chemical concentration. This reduces the proportion of thermal donors in the doping concentration of the drift region 18 and the buffer region 20, thereby suppressing the characteristic fluctuation of the semiconductor device 100.
  • the depth position of the lower end of the region 240 is Xa
  • the depth position of the upper end is Xb.
  • the center position in the depth direction of the semiconductor substrate 10 is Zc.
  • the depth position Xa may be located in the range from the depth position Zc to Zb.
  • the depth position Xa may coincide with the depth position Zb.
  • the depth position Xb may be located in the range from the depth position Zc to Zb, or may be located in the range from the depth position Zc to Zu.
  • the depth position Xb may be located on the lower surface 23 side of the region where the oxygen chemical concentration changes sharply.
  • Depth position Xb may be 10 ⁇ m or more, 20 ⁇ m or more, or 30 ⁇ m or more away from upper surface 21 of semiconductor substrate 10.
  • Region 240 may have a length in the depth direction of 10 ⁇ m or more, or 20 ⁇ m or more.
  • the oxygen chemical concentration at the depth position Xa is Noxa, and the thermal donor concentration is Ntha.
  • the oxygen chemical concentration at the depth position Xb is Noxb, and the thermal donor concentration is Nthb.
  • ⁇ ox
  • the logarithmic gradient ⁇ th of the thermal donor concentration may be 0.8 times or more, or may be 1 time or more, of the logarithmic gradient ⁇ ox of the oxygen chemical concentration. In region 240, the logarithmic gradient ⁇ th of the thermal donor concentration may be 7 times or less, or may be 4 times or less, of the logarithmic gradient ⁇ ox of the oxygen chemical concentration.
  • FIG. 7 is a chart illustrating an example of a method for manufacturing the semiconductor device 100.
  • the manufacturing method includes one or more steps of annealing the semiconductor substrate 10.
  • the manufacturing method includes steps from cutting a semiconductor wafer from a semiconductor ingot to completing the semiconductor device 100.
  • the manufacturing method in the example of FIG. 7 has a first annealing step S701 and a second annealing step S702, but the manufacturing method may have one annealing step or three or more annealing steps.
  • the semiconductor substrate 10 is heated to a temperature equal to or higher than room temperature (25° C.).
  • room temperature 25° C.
  • the semiconductor substrate 10 may be heated to a temperature equal to or higher than 400° C.
  • the concentration of thermal donors formed in the semiconductor substrate 10 can be controlled by the thermal history of the semiconductor substrate 10.
  • the semiconductor substrate 10 is annealed so that the concentration Nth of the thermal donors is 10% or less of the concentration ID of the increased donors at the same depth position throughout the entire first range 200 shown in FIG. 5.
  • FIG. 8 is a diagram showing an example of the change in temperature of the semiconductor substrate 10 over time in each annealing stage.
  • the horizontal axis in FIG. 8 indicates time, and the vertical axis indicates the temperature (°C) of the semiconductor substrate 10.
  • the semiconductor substrate 10 is heated to 500°C or higher.
  • the temperature of the semiconductor substrate 10 when the temperature of the semiconductor substrate 10 is near 450°C, thermal donors are likely to be formed. For this reason, by controlling the time that the semiconductor substrate 10 passes through a predetermined first temperature zone in each annealing stage, the formation of thermal donors can be suppressed.
  • the lower limit temperature of the first temperature zone is 400°C
  • the upper limit temperature is 500°C.
  • the time that the temperature of the semiconductor substrate 10 passes through the first temperature zone of 400°C or more and 500°C or less may be 20 minutes or less per pass. In the example of FIG.
  • the time that the first temperature zone is passed through in the temperature rise process of the first annealing stage S701 is T11
  • the time that the first temperature zone is passed through in the temperature drop process is T21
  • the time that the first temperature zone is passed through in the temperature rise process of the second annealing stage S702 is T31
  • the time that the first temperature zone is passed through in the temperature drop process is T41.
  • T11, T21, T31, and T41 may be 20 minutes or less. This can suppress the formation of thermal donors in the semiconductor substrate 10 when passing through the first temperature zone.
  • Each of T11, T21, T31, and T41 may be 10 minutes or less, or may be 5 minutes or less.
  • the average time of T11, T21, T31, and T41 may be 10 minutes or less, or may be 5 minutes or less.
  • the cumulative time for the temperature of the semiconductor substrate 10 to pass through the first temperature zone (400°C or more and 500°C or less) throughout all processes from the start to the end of the manufacturing process of the semiconductor device 100 may be 120 minutes or less.
  • the total of T11, T21, T31, and T41 is 120 minutes or less. This makes it possible to suppress the total amount of thermal donors formed in the semiconductor substrate 10.
  • the cumulative time for passing through the first temperature zone may be 60 minutes or less, or may be 40 minutes or less.
  • the second temperature zone is a temperature zone of 425°C or more and 475°C or less.
  • thermal donors are more likely to be formed in the semiconductor substrate 10.
  • the time for the temperature of the semiconductor substrate 10 to pass through the second temperature zone of 425°C or more and 475°C or less may be 10 minutes or less per pass.
  • the time for passing through the second temperature zone in the temperature rise process of the first annealing step S701 is T12
  • the time for passing through the second temperature zone in the temperature drop process is T22
  • the time for passing through the second temperature zone in the temperature rise process of the second annealing step S702 is T32
  • the time for passing through the second temperature zone in the temperature drop process is T42.
  • T12, T22, T32, and T42 may be 10 minutes or less. This makes it possible to suppress the formation of thermal donors in the semiconductor substrate 10 when passing through the second temperature zone.
  • Each of T12, T22, T32, and T42 may be 5 minutes or less, or may be 3 minutes or less.
  • the average time of T12, T22, T32, and T42 may be 5 minutes or less, or may be 3 minutes or less.
  • the cumulative time for the temperature of the semiconductor substrate 10 to pass through the second temperature zone (425°C or higher and 475°C or lower) throughout all processes from the start to the end of the manufacturing process of the semiconductor device 100 may be 60 minutes or less.
  • the total of T12, T22, T32, and T42 is 60 minutes or less. This makes it possible to suppress the total amount of thermal donors formed in the semiconductor substrate 10.
  • the cumulative time for passing through the second temperature zone may be 30 minutes or less, or may be 20 minutes or less.
  • FIG. 9 is a chart showing a more specific example of a method for manufacturing a semiconductor device 100.
  • some steps of the manufacturing method are omitted.
  • an interlayer insulating film 38 is formed on the upper surface 21 of the semiconductor substrate 10 (S901).
  • the semiconductor substrate 10 In the steps prior to S901, there may be multiple steps in which the semiconductor substrate 10 is heated to a temperature higher than room temperature (25° C.). In S901, the semiconductor substrate 10 may be heated to a temperature of 400° C. or higher and 900° C. or lower.
  • the time during which the temperature of the semiconductor substrate 10 passes through the first temperature zone and the second temperature zone includes the time in all steps in which the temperature of the semiconductor substrate 10 passes through the first temperature zone and the second temperature zone.
  • a contact hole 54 is formed in the interlayer insulating film 38.
  • a barrier metal may be formed inside the contact hole 54 (S902).
  • the semiconductor substrate 10 may be heated to a temperature of 400° C. or more and 700° C. or less.
  • the barrier metal may have at least one of a titanium film and a titanium nitride film.
  • a metal electrode (emitter electrode 52 in this example) is formed above the upper surface 21 of the semiconductor substrate 10 by sputtering (S903). After forming the emitter electrode 52, the semiconductor substrate 10 is placed in an annealing furnace or the like and annealed (S904). Unless otherwise stated, when the semiconductor substrate 10 is heated, the entire semiconductor substrate 10 is heated by an annealing furnace or the like. In S904, the semiconductor substrate 10 may be heated to a temperature of less than 400°C.
  • a protective film is formed on the emitter electrode 52 (S905).
  • the protective film is made of, for example, polyimide.
  • the semiconductor substrate 10 is heated to the cure temperature of the protective film (S906). In S906, the semiconductor substrate 10 may be heated to a temperature of less than 400°C.
  • the semiconductor substrate 10 is thinned according to the breakdown voltage that the semiconductor device 100 should have (S907).
  • the thickness of the semiconductor substrate 10 is adjusted by grinding the lower surface 23 of the semiconductor substrate 10.
  • a collector region 22 is formed on the lower surface 23 of the semiconductor substrate 10 (S908), and a cathode region 82 is formed (S909). Either S908 or S909 may be performed first. In S908 and S909, dopant ions are implanted into the respective regions.
  • the semiconductor substrate 10 is annealed to activate the dopants (S910).
  • the semiconductor substrate 10 may be locally heated by laser annealing or the like.
  • FIG. 10 is a flow chart showing a process subsequent to the process of FIG. 9.
  • the buffer region 20 is formed (S911).
  • dopant ions such as protons are implanted into the buffer region 20.
  • the semiconductor substrate 10 is annealed to activate the dopants (S912).
  • the semiconductor substrate 10 may be heated to a temperature less than 400° C.
  • the semiconductor substrate 10 may be irradiated with charged particles such as helium to form a lifetime killer (S913).
  • a lifetime killer is a recombination center such as a lattice defect, and shortens the lifetime of the carrier by combining with the carrier in the semiconductor substrate 10.
  • the top surface 21 side of the diode section 80 may be irradiated with charged particles such as helium.
  • the semiconductor substrate 10 is annealed (S914). In S914, the semiconductor substrate 10 may be heated to a temperature of less than 400°C.
  • the collector electrode 24 is formed by sputtering (S915). After forming the collector electrode 24, the semiconductor substrate 10 is annealed (S916). In S916, the semiconductor substrate 10 may be heated to a temperature less than 300° C. After forming the collector electrode 24, the semiconductor wafer may be diced to separate into semiconductor chips.
  • the annealing conditions in the manufacturing method may be determined based on the oxygen chemical concentration of the semiconductor substrate 10 used. For each oxygen chemical concentration of the semiconductor substrate 10, the change in thermal donor concentration when at least one of the annealing time, heating rate, heating rate, and annealing temperature is changed may be measured in advance. Based on the measurement results, at least one of the annealing time, heating rate, heating rate, and annealing temperature in each annealing stage can be adjusted to control the concentration of thermal donors formed in the semiconductor substrate 10.

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JP2019062189A (ja) * 2017-08-18 2019-04-18 インフィネオン テクノロジーズ アーゲーＩｎｆｉｎｅｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ａｇ Ｃｚ半導体ボディを含む半導体装置およびｃｚ半導体ボディを含む半導体装置を製造する方法
WO2020217683A1 (ja) * 2019-04-26 2020-10-29 富士電機株式会社 半導体装置および製造方法
WO2021166980A1 (ja) * 2020-02-18 2021-08-26 富士電機株式会社 半導体装置

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US9887125B2 (en) * 2014-06-06 2018-02-06 Infineon Technologies Ag Method of manufacturing a semiconductor device comprising field stop zone
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JP2019062189A (ja) * 2017-08-18 2019-04-18 インフィネオン テクノロジーズ アーゲーＩｎｆｉｎｅｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ａｇ Ｃｚ半導体ボディを含む半導体装置およびｃｚ半導体ボディを含む半導体装置を製造する方法
WO2020217683A1 (ja) * 2019-04-26 2020-10-29 富士電機株式会社 半導体装置および製造方法
WO2021166980A1 (ja) * 2020-02-18 2021-08-26 富士電機株式会社 半導体装置

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