WO2024075588A1 - Film multicouche - Google Patents
Film multicouche Download PDFInfo
- Publication number
- WO2024075588A1 WO2024075588A1 PCT/JP2023/034853 JP2023034853W WO2024075588A1 WO 2024075588 A1 WO2024075588 A1 WO 2024075588A1 JP 2023034853 W JP2023034853 W JP 2023034853W WO 2024075588 A1 WO2024075588 A1 WO 2024075588A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- aluminum oxide
- oxide layer
- laminate
- laminated
- Prior art date
Links
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 71
- -1 polypropylene Polymers 0.000 claims abstract description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 150000002500 ions Chemical class 0.000 claims abstract description 21
- 230000035699 permeability Effects 0.000 claims abstract description 19
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 claims abstract description 12
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 claims abstract description 12
- 239000012634 fragment Substances 0.000 claims abstract description 11
- 229920006284 nylon film Polymers 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000004743 Polypropylene Substances 0.000 claims abstract description 7
- 229920001155 polypropylene Polymers 0.000 claims abstract description 7
- 229920002635 polyurethane Polymers 0.000 claims abstract description 6
- 239000004814 polyurethane Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 98
- 239000011241 protective layer Substances 0.000 claims description 58
- 230000004888 barrier function Effects 0.000 claims description 47
- 239000005001 laminate film Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 9
- 238000009820 dry lamination Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052593 corundum Inorganic materials 0.000 abstract description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 103
- 239000007789 gas Substances 0.000 description 51
- 238000011282 treatment Methods 0.000 description 22
- 238000000576 coating method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 19
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 238000000151 deposition Methods 0.000 description 15
- 230000008021 deposition Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 229920000728 polyester Polymers 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 239000005056 polyisocyanate Substances 0.000 description 12
- 229920001228 polyisocyanate Polymers 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 238000007639 printing Methods 0.000 description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 238000009832 plasma treatment Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000005022 packaging material Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 235000013305 food Nutrition 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- 150000003077 polyols Chemical class 0.000 description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 5
- 239000000976 ink Substances 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 229920001225 polyester resin Polymers 0.000 description 5
- 239000004645 polyester resin Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 229910001882 dioxygen Inorganic materials 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 229940079593 drug Drugs 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 229910052809 inorganic oxide Inorganic materials 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229940090181 propyl acetate Drugs 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- QXRRAZIZHCWBQY-UHFFFAOYSA-N 1,1-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1(CN=C=O)CCCCC1 QXRRAZIZHCWBQY-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- WVWYODXLKONLEM-UHFFFAOYSA-N 1,2-diisocyanatobutane Chemical compound O=C=NC(CC)CN=C=O WVWYODXLKONLEM-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- UFXYYTWJETZVHG-UHFFFAOYSA-N 1,3-diisocyanatobutane Chemical compound O=C=NC(C)CCN=C=O UFXYYTWJETZVHG-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- CBWJHIXSVFDERH-UHFFFAOYSA-N 1-isothiocyanato-2-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1N=C=S CBWJHIXSVFDERH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- LHNAURKRXGPVDW-UHFFFAOYSA-N 2,3-diisocyanatobutane Chemical compound O=C=NC(C)C(C)N=C=O LHNAURKRXGPVDW-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- IKBFHCBHLOZDKH-UHFFFAOYSA-N 2-chloroethyl(triethoxy)silane Chemical compound CCO[Si](CCCl)(OCC)OCC IKBFHCBHLOZDKH-UHFFFAOYSA-N 0.000 description 1
- CASYTJWXPQRCFF-UHFFFAOYSA-N 2-chloroethyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCl CASYTJWXPQRCFF-UHFFFAOYSA-N 0.000 description 1
- QHQNYHZHLAAHRW-UHFFFAOYSA-N 2-trimethoxysilylethanamine Chemical compound CO[Si](OC)(OC)CCN QHQNYHZHLAAHRW-UHFFFAOYSA-N 0.000 description 1
- LOSLJXKHQKRRFN-UHFFFAOYSA-N 2-trimethoxysilylethanethiol Chemical compound CO[Si](OC)(OC)CCS LOSLJXKHQKRRFN-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000002028 Biomass Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
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- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
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- 229910004530 SIMS 5 Inorganic materials 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 241000546339 Trioxys Species 0.000 description 1
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- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- FNGGVJIEWDRLFV-UHFFFAOYSA-N anthracene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=CC3=C(C(O)=O)C(C(=O)O)=CC=C3C=C21 FNGGVJIEWDRLFV-UHFFFAOYSA-N 0.000 description 1
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- 238000007607 die coating method Methods 0.000 description 1
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- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
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- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
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- MHIBEGOZTWERHF-UHFFFAOYSA-N heptane-1,1-diol Chemical compound CCCCCCC(O)O MHIBEGOZTWERHF-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
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- 238000007733 ion plating Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 150000004692 metal hydroxides Chemical class 0.000 description 1
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- FPFKERZHIGFTEI-UHFFFAOYSA-N n'-(2-trimethoxysilylethyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCNCCN FPFKERZHIGFTEI-UHFFFAOYSA-N 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- KHARCSTZAGNHOT-UHFFFAOYSA-N naphthalene-2,3-dicarboxylic acid Chemical compound C1=CC=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 KHARCSTZAGNHOT-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
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- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
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- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
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- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
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- 238000002203 pretreatment Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
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- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- RWJUTPORTOUFDY-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CCO[Si](OCC)(OCC)CCOCC1CO1 RWJUTPORTOUFDY-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- ZNXDCSVNCSSUNB-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](OC)(OC)CCOCC1CO1 ZNXDCSVNCSSUNB-UHFFFAOYSA-N 0.000 description 1
- DBUFXGVMAMMWSD-UHFFFAOYSA-N trimethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OC)(OC)OC)CCC2OC21 DBUFXGVMAMMWSD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
Definitions
- the present invention relates to a laminate film used in the packaging fields of foods, medicines, industrial products, etc. More specifically, the present invention relates to a gas barrier laminate film having an aluminum oxide layer and a protective layer, which, by controlling the physical properties of the film, can ultimately exhibit good gas barrier properties and adhesion.
- Packaging materials used for food, medicines, etc. are required to have gas barrier properties, that is, properties that block gases such as oxygen and water vapor, in order to inhibit oxidation of proteins and fats and oils, preserve flavor and freshness, and maintain the efficacy of medicines.
- gas barrier materials used for electronic devices and electronic components such as solar cells and organic electroluminescence (EL) devices require even higher gas barrier properties than packaging materials for food, etc.
- gas barrier laminate films which have a thin metal film made of aluminum or a thin inorganic film made of inorganic oxides such as silicon oxide or aluminum oxide formed on the surface of a plastic base film.
- inorganic oxides such as silicon oxide, aluminum oxide, or mixtures of these are widely used because they are transparent and allow the contents to be checked.
- Silica Silicon oxide (hereafter referred to as silica) and aluminum oxide (hereafter sometimes referred to as alumina) are often used as materials for inorganic thin films.
- silica which has good gas barrier properties, has a slightly brown color and is insufficient as a transparent gas barrier film.
- the evaporation temperature of the raw material for alumina is high, and the evaporation rate during the deposition process is slow.
- the film formation time is long, which reduces production efficiency and increases costs.
- Patent Document 1 proposes a technology that suppresses the production of alumina hydroxide and improves hot water resistance by removing moisture contained in the reaction space where the oxidation reaction between evaporated aluminum and oxygen gas occurs during deposition.
- Patent Document 1 proposes a technology that suppresses the production of alumina hydroxide and improves hot water resistance by removing moisture contained in the reaction space where the oxidation reaction between evaporated aluminum and oxygen gas occurs during deposition.
- Patent Document 2 also proposes a technology that allows the gas barrier properties to be maintained even after bending by specifying the depth ratio of SiOH and Si in the inorganic layer.
- the inventors have found that alumina hydroxide is formed near the interface between the plastic film and the alumina vapor deposition, resulting in a problem of reduced moist heat resistance.
- the present invention aims to provide a gas barrier film having an alumina layer with excellent moist heat resistance.
- the inventors discovered that by carefully examining the plasma treatment and thin film thickness during the formation of the aluminum oxide layer, it is possible to provide a gas barrier film with moisture and heat resistance.
- the present invention comprises the following: (1) A laminate film having gas barrier properties, comprising a base film and an aluminum oxide layer laminated on at least one side of the base film, and characterized in that the laminate film satisfies the following requirements (A) and (B): (A) When the aluminum oxide layer is etched from the surface side by time-of-flight secondary ion mass spectrometry (TOF-SIMS), the position at which the intensity of the fragment ion of mass number 102 (Al 2 O 3 ) is 80% of the maximum intensity is defined as the interface with the substrate film, and at that interface, the ratio b/a of the intensity a of mass number 102 (derived from Al 2 O 3 ) to the intensity b of mass number 119 (derived from Al 2 O 4 H) is 0.10 or less.
- TOF-SIMS time-of-flight secondary ion mass spectrometry
- a 15 ⁇ m biaxially oriented nylon film and a 70 ⁇ m unoriented polypropylene film are laminated by a dry lamination method using a polyurethane-based two-component curing adhesive applied to the surface of the aluminum oxide layer of the laminated film so that the thickness after drying is 4 ⁇ m, and the film is aged at a temperature of 40° C. for 4 days and then subjected to a wet heat treatment at 130° C. for 30 minutes. After this, the water-exposed laminate strength is 1.5 N/15 mm or more and the water vapor permeability is 2.5 g/ m2 ⁇ day or less.
- the present invention regardless of the surface condition of the substrate, by introducing oxygen gas when forming the aluminum oxide layer or by making the thin film layer thicker and increasing the energy of the thin film itself, it is possible to provide a gas barrier film with excellent resistance to moist heat without forming aluminum hydroxide near the substrate film interface.
- the laminated film of the present invention is a laminated film comprising a substrate film and an aluminum oxide layer laminated on at least one side of the substrate film, and when etching is performed from the surface side of the aluminum oxide layer by time-of-flight secondary ion mass spectrometry (TOF-SIMS), the position at which the intensity of the fragment ion of mass number 102 (Al 2 O 3 ) is 80% of the maximum intensity is defined as the interface with the substrate film, and at the interface, the intensity a of the fragment ion of mass number 102 (derived from Al 2 O 3 ) and the intensity b of the fragment ion of mass number 119 (derived from Al 2 O 4 and the ratio b/a of the strength b of the aluminum oxide layer of the laminated film to the strength b of the aluminum oxide layer of the laminated film (derived from H) is 0.10 or less, and a 15 ⁇ m biaxially oriented nylon film and a 70 ⁇ m unoriented polypropylene film are laminated by a dry
- the plastic substrate film will be described, and then the aluminum oxide layer and protective layer, and other layers to be laminated thereon will be described.
- the substrate film used in the present invention may be, for example, a stretched film obtained by melt-extruding a plastic and, if necessary, stretching the plastic in the longitudinal direction (MD direction) and/or the transverse direction (TD direction), cooling, and heat setting.
- MD direction longitudinal direction
- TD direction transverse direction
- a biaxially stretched film stretched in the longitudinal direction and the transverse direction is preferred.
- plastics examples include polyamides such as nylon 4.6, nylon 6, nylon 6.6, and nylon 12; polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene-2,6-naphthalate; polyolefins such as polyethylene, polypropylene, and polybutene; as well as polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, wholly aromatic polyamide, polyamideimide, polyimide, polyetherimide, polysulfone, polystyrene, and polylactic acid.
- polyesters are preferred in terms of heat resistance, dimensional stability, and transparency, and in particular polyethylene terephthalate and copolymers obtained by copolymerizing polyethylene terephthalate with other components are preferred.
- Plastic resins may be made from biomass-derived or recycled materials.
- the base film can be of any thickness depending on the desired purpose and application, such as mechanical strength and transparency. There are no particular limitations on the thickness, but a thickness of 5 to 250 ⁇ m is usually recommended, and when used as a packaging material, a thickness of 10 to 60 ⁇ m is desirable. From the viewpoints of handling during processing, post-processing, and machine costs, the width of the base film is preferably 1000 mm or more and 5,000 mm or less, more preferably 3,000 mm or less, and even more preferably 2,000 mm or less. There are no particular limitations on the transparency of the base film, but when used as a packaging material requiring transparency, it is desirable for the film to have a light transmittance of 50% or more.
- the base film may be a monolayer film made of one type of plastic, or a laminated film in which two or more types of plastic films are laminated.
- the type of laminated film, the number of layers, the lamination method, etc. are not particularly limited, and can be arbitrarily selected from known methods depending on the purpose.
- the base film may be subjected to surface treatments such as corona discharge treatment, glow discharge, flame treatment, surface roughening treatment, etc., as long as they do not impair the purpose of the present invention, and may also be subjected to known anchor coat treatment, printing, decoration, etc.
- the laminate film of the present invention has an aluminum oxide layer on the substrate film.
- the thickness of the aluminum oxide layer is usually 1 to 100 nm, preferably 3 to 50 nm, and more preferably 5 to 30 nm. If the thickness of the aluminum oxide layer is less than 1 nm, it may be difficult to obtain satisfactory gas barrier properties. On the other hand, even if the thickness is made excessively thick, exceeding 100 nm, the corresponding improvement in gas barrier properties cannot be obtained, and it is actually disadvantageous in terms of flex resistance and manufacturing costs.
- any known deposition method may be used, such as physical deposition methods (PVD methods) such as vacuum deposition, sputtering, and ion plating, or chemical deposition (CVD).
- PVD methods physical deposition methods
- CVD chemical deposition
- a typical method for forming an aluminum oxide layer is described below.
- PVD methods physical deposition methods
- aluminum is preferably used as the deposition raw material.
- Particles are usually used as these deposition raw materials, and in this case, it is desirable that the size of each particle is large enough that the pressure during deposition does not change, and the preferred particle diameter is 1 mm to 5 mm.
- Heating can be performed by resistance heating, high-frequency induction heating, electron beam heating, laser heating, or other methods.
- oxygen is preferable as a reactive gas, and it is also possible to introduce nitrogen, hydrogen, argon, carbon dioxide, water vapor, etc., or to use means such as adding ozone or ion assist.
- the film formation conditions can be changed arbitrarily, such as applying a bias to the deposition target (laminated film to be subjected to deposition) or heating or cooling the deposition target.
- the deposition material, reaction gas, bias of the deposition target, heating/cooling, etc. can be changed in the same way when using sputtering or CVD methods.
- a plasma treatment may be carried out before forming the thin film layer.
- Known pretreatment methods such as bipolar sputtering, magnetron sputtering, DC (direct current) sputtering, RF (radio frequency) sputtering, dual magnetron, hollow cathode, hollow anode, etc. may be appropriately adopted.
- an atmospheric gas is required for discharging, and oxygen is most preferable, but nitrogen, hydrogen, carbon dioxide, etc. may also be introduced.
- the amount of the introduced gas is preferably 500 sccm or more, more preferably 750 sccm or more, and even more preferably 1000 sccm or more. If it is less than 500 sccm, plasma discharge does not occur.
- the plasma output is preferably 15 A or more, more preferably 20 A or more, and even more preferably 25 A or more. If it is less than 15 A, plasma discharge does not occur. It is preferable to combine all of the above-mentioned preferable types of gases to be introduced, amounts of gases to be introduced, and plasma output.
- Time-of-flight secondary ion mass spectrometry is one method for analyzing aluminum oxide layers.
- the surface of the aluminum oxide layer on the substrate film is etched with sputtered ions, and primary ions are irradiated onto the area, and secondary ions generated by collisions between the ions and the solid surface are detected by a mass spectrometer. By repeating etching and detection, information on the depth direction can be obtained.
- fragment ions with mass numbers of 86 (Al 2 O 2 ), 102 (Al 2 O 3 ), 118 (Al 2 O 4 ), and 145 (Al 3 O 4 ) that can be assumed to be derived from Al oxide are detected.
- fragment ions with mass numbers of 103 (Al 2 O 3 H) and 119 (Al 2 O 4 H) that can be assumed to be derived from Al hydroxide are detected.
- the fragment ions derived from the complete oxide of Al detected near the surface of the aluminum oxide layer attenuate as they approach the interface with the substrate film.
- the inventors have found that the position where the maximum intensity of the fragment ion with mass number 102 (Al 2 O 3 ), which is representative of the complete oxide of Al, becomes 80% when etching is performed from the thin film surface is defined as the interface with the substrate film, and that the intensity ratio between the Al hydroxide and the Al oxide, which have a mass number difference of 17, at that portion can be correlated with the moist heat resistance.
- the ratio b/a of the intensity a of mass number 102 ( derived from Al2O3 ) to the intensity b of mass number 119 (derived from Al2O4H ) is preferably 0.10 or less, more preferably 0.80 or less, and even more preferably 0.60 or less. If it is 0.10 or less, there is almost no Al hydroxide in the vicinity of the interface, and water cannot be present at the interface when a wet heat treatment is performed, improving adhesion.
- a protective layer on the aluminum oxide layer.
- the aluminum oxide layer laminated on the plastic film is not a completely dense film, but has minute defects scattered therein.
- a protective layer by applying a specific resin composition for protective layer, which will be described later, on the aluminum oxide layer, the resin in the resin composition for protective layer penetrates into the defective parts of the aluminum oxide layer, resulting in an effect of stabilizing the gas barrier properties.
- the gas barrier performance of the laminated film is also greatly improved.
- the coating amount of the protective layer is preferably 0.05 to 0.60 g/m 2. This reduces unevenness and defects in the coating due to uniformity, while enhancing adhesion due to the anchor effect. In addition, the cohesive force of the protective layer itself is improved, and the adhesion between the aluminum oxide layer and the protective layer is strengthened, and water resistance can also be enhanced.
- the coating amount of the protective layer is preferably 0.08 g/m 2 or more, more preferably 0.10 g/m 2 or more, and even more preferably 0.15 g/m 2 or more, and is preferably 0.50 g/m 2 or less, more preferably 0.45 g/m 2 or less, and even more preferably 0.40 g/m 2 or less.
- the coating amount of the protective layer exceeds 0.60 g/m 2 , the gas barrier property is improved, but the cohesive force inside the protective layer becomes insufficient, and adhesion may decrease. In addition, unevenness or defects may occur in the appearance of the coat, and gas barrier property and adhesion after wet heat treatment may not be fully exhibited. On the other hand, if the thickness of the protective layer is less than 0.10 g/m 2 , sufficient gas barrier properties, interlayer adhesion, and ink permeability may not be obtained.
- a solvent-dispersed resin As the component of the protective layer, either a solvent-dispersed resin or a water-dispersed resin may be used.
- a solvent-dispersed resin is preferred for improving adhesion to the aluminum oxide layer.
- a resin composed of a polyester polyol component obtained by reacting a dicarboxylic acid with a polyhydric alcohol, and a polyisocyanate component is preferred.
- polyester component is obtained by reacting a polyvalent carboxylic acid with a polyhydric alcohol.
- Polycarboxylic acids include aromatic polycarboxylic acids, alicyclic polycarboxylic acids, aliphatic polycarboxylic acids, etc. From the viewpoint of gas barrier properties, aromatic polycarboxylic acids are preferred. Examples include orthophthalic acid, isophthalic acid, terephthalic acid, 1,2-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, anthracene-1,2-dicarboxylic acid, and anthraquinone-2,3-dicarboxylic acid.
- glycols ranging from low molecular weight to high molecular weight can be used, but from the standpoint of gas barrier properties and flexibility due to the amorphous portion, low molecular weight glycols such as alkylene glycols (e.g., linear or branched C2-10 alkylene glycols such as ethylene glycol, propylene glycol, trimethylene glycol, 1,3-butanediol, 1,4-butanediol, pentanediol, hexanediol, neopentyl glycol, heptanediol, octanediol, etc.), (poly)oxy C2-4 alkylene glycols (diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, etc.) are used.
- alkylene glycols e.g., linear or branched C2-10 alkylene glycols such as ethylene glycol, propylene glyco
- Preferred glycol components are C2-8 polyol components [e.g., C2-6 alkylene glycol (particularly, ethylene glycol, 1,2- or 1,3-propylene glycol, 1,4-butanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol), etc.], di- or trioxy C2-3 alkylene glycol (diethylene glycol, triethylene glycol, dipropylene glycol, etc.), and particularly preferred diol components are C2-8 alkylene glycol (particularly, C2-6 alkylene glycol).
- C2-8 polyol components e.g., C2-6 alkylene glycol (particularly, ethylene glycol, 1,2- or 1,3-propylene glycol, 1,4-butanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol), etc.
- di- or trioxy C2-3 alkylene glycol diethylene glycol,
- diol components can be used alone or in combination of two or more.
- low molecular weight diol components such as aromatic diols (e.g., bisphenol A, bishydroxyethyl terephthalate, catechol, resorcinol, hydroquinone, 1,3- or 1,4-xylylenediol or mixtures thereof, etc.) and alicyclic diols (e.g., hydrogenated bisphenol A, xylylenediol, cyclohexanediol, cyclohexanedimethanol, etc.) may be used in combination.
- aromatic diols e.g., bisphenol A, bishydroxyethyl terephthalate, catechol, resorcinol, hydroquinone, 1,3- or 1,4-xylylenediol or mixtures thereof, etc.
- alicyclic diols e.g., hydrogenated bisphenol A, xylylenediol
- trifunctional or higher polyol components such as glycerin, trimethylolethane, trimethylolpropane, polyester polyol, polycarbonate polyol, and polyether polyol may also be used in combination.
- the polyol component preferably contains at least a C2-8 polyol component (especially a C2-6 alkylene glycol).
- the polyisocyanate component includes aromatic polyisocyanates, alicyclic polyisocyanates, aliphatic polyisocyanates, etc.
- a diisocyanate compound is usually used as the polyisocyanate compound.
- aromatic diisocyanates include tolylene diisocyanate (2,4- or 2,6-tolylene diisocyanate or a mixture thereof) (TDI), phenylene diisocyanate (m-, p-phenylene diisocyanate or a mixture thereof), 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate (NDI), diphenylmethane diisocyanate (4,4'-, 2,4'-, or 2,2'-diphenylmethane diisocyanate or a mixture thereof) (MDI), 4,4'-toluidine diisocyanate (TODI), 4,4'-diphenyl ether diisocyanate, etc.
- TDI tolylene diisocyanate (2,4- or 2,6-tolylene diisocyanate or a mixture thereof)
- NDI 1,5-naphthalene diisocyanate
- MDI 4,4'-toluidine diiso
- aromatic aliphatic diisocyanates examples include xylylene diisocyanate (1,3- or 1,4-xylylene diisocyanate or a mixture thereof) (XDI), tetramethyl xylylene diisocyanate (1,3- or 1,4-tetramethyl xylylene diisocyanate or a mixture thereof) (TMXDI), ⁇ , ⁇ '-diisocyanate-1,4-diethylbenzene, etc.
- XDI xylylene diisocyanate (1,3- or 1,4-xylylene diisocyanate or a mixture thereof)
- TXDI tetramethyl xylylene diisocyanate
- ⁇ , ⁇ '-diisocyanate-1,4-diethylbenzene etc.
- alicyclic diisocyanates examples include 1,3-cyclopentene diisocyanate, cyclohexane diisocyanate (1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate), 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate (isophorodiisocyanate, IPDI), methylene bis(cyclohexyl isocyanate) (4,4'-, 2,4'-, or 2,2'-methylene bis(cyclohexyl isocyanate)) (hydrogenated MDI), methylcyclohexane diisocyanate (methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate), bis(isocyanatomethyl)cyclohexane (1,3- or 1,4-bis(isocyanatomethyl)cyclohexane or a mixture thereof)
- aliphatic diisocyanates examples include trimethylene diisocyanate, 1,2-propylene diisocyanate, butylene diisocyanate (tetramethylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate), hexamethylene diisocyanate, pendanthemethylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl caferate, etc.
- trimethylene diisocyanate 1,2-propylene diisocyanate
- butylene diisocyanate tetramethylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate
- hexamethylene diisocyanate pendanthemethylene diisocyanate
- a urethane resin is obtained by reacting the polyester component (A) with the polyisocyanate component (B).
- the weight ratio of the polyester component to the polyisocyanate component is 9:1 to 1:9 on a solids basis. It is preferably 8:2 to 2:8, and more preferably 6:4 to 4:6.
- the resin composition for the protective layer of the present invention preferably contains a silane coupling agent as described below, but various additives may be added as necessary to the extent that the gas barrier properties are not impaired.
- additives include layered inorganic compounds, stabilizers (antioxidants, heat stabilizers, ultraviolet absorbers, etc.), plasticizers, antistatic agents, lubricants, antiblocking agents, colorants, fillers, crystal nucleating agents, etc.
- Silane coupling agents are effective in improving the adhesion of the protective layer to the aluminum oxide layer.
- silane coupling agents include hydrolyzable alkoxysilane compounds, such as halogen-containing alkoxysilanes (chloro C2-4 alkyl tri C1-4 alkoxysilanes such as 2-chloroethyl trimethoxysilane, 2-chloroethyl triethoxysilane, 3-chloropropyl trimethoxysilane, and 3-chloropropyl triethoxysilane), alkoxysilanes having epoxy groups [glycidyloxy C2-4 alkyl tri C1-4 alkoxysilanes such as 2-glycidyloxyethyl trimethoxysilane, 2-glycidyloxyethyl triethoxysilane, 3-glycidyloxypropyl trimethoxysilane, and 3-glycidyloxypropyl triethoxysilane, glycid
- alkoxy silanes having amino groups [amino C2-4 alkyl tri C1-4 alkoxy silanes such as 2-aminoethyl trimethoxy silane, 3-aminopropyl trimethoxy silane, 3-aminopropyl triethoxy silane, etc., amino di C2-4 alkyl di C1-4 alkoxy silanes such as 3-aminopropyl methyl dimethoxy silane, 3-aminopropyl methyl diethoxy silane, etc., 2-
- the content of the silane coupling agent in the protective layer is 5.0% by weight or less, preferably 2.0 to 4.5% by weight, and more preferably about 3.0 to 4.0% by weight.
- a coating liquid (applied liquid) consisting of the composition and an organic solvent is prepared, applied to a substrate film, and dried.
- the organic solvent may be a single or mixed solvent selected from alcohols such as methanol, ethanol, isopropyl alcohol (IPA), etc.; ketones such as acetone and methyl ethyl ketone, etc.; ethers such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, etc.; and esters such as ethyl acetate and propyl acetate, and from the viewpoints of coating film processing and odor, methyl ethyl ketone and ethyl acetate are preferred.
- the coating method for the resin composition for the protective layer is not particularly limited as long as it is a method that coats the film surface to form a layer.
- conventional coating methods such as gravure coating, reverse roll coating, wire bar coating, and die coating can be used. From the viewpoints of productivity and coating stability, wire bar coating and gravure coating are preferably used.
- the resin composition for the protective layer When forming the protective layer, it is preferable to apply the resin composition for the protective layer and then heat-dry it.
- the drying temperature is preferably 110 to 210°C, more preferably 115 to 205°C, and even more preferably 120 to 200°C. If the drying temperature is less than 110°C, the protective layer may not be sufficiently dried or may not be sufficiently cohesive due to heat, and the surface hardness may be outside the specified range. As a result, the adhesion and water resistance of the protective layer when subjected to boiling treatment or retort treatment may decrease. On the other hand, if the drying temperature exceeds 210°C, the protective layer may be too cohesive, the film may become hard, the barrier layer may be destroyed, and the barrier performance may decrease.
- the film itself which is the base material, may be too heated, making the film brittle or shrinking, resulting in poor processability.
- adding an additional heat treatment for example, 150 to 190°C is also effective in promoting the drying of the protective layer.
- the drying time for the protective layer is preferably within 30 seconds. If the drying time exceeds 30 seconds, not only will the protective layer not dry, but the base film will shrink, causing cracks in the gas barrier layer and reducing the gas barrier performance. On the other hand, if the drying time is shorter than 5 seconds, the protective layer will not harden, resulting in reduced adhesion and barrier properties. From the viewpoint of productivity, it is more preferably 5 to 25 seconds, and more preferably 10 to 20 seconds. If the film is heated suddenly, it will shrink significantly, causing compressive stress in the gas barrier layer and reducing the barrier performance. It is preferable to increase the temperature at a rate of 50°C/sec or less. It is more preferably 30°C/sec or less, and more preferably 20°C/sec or less.
- the surface temperature during heating in the process of forming the protective layer is preferably 100 to 150°C, more preferably 105 to 145°C, and even more preferably 110 to 140°C.
- the film tension during heating in the process of forming the protective layer is preferably 30 to 90 N/m. More preferably, it is 40 to 80 N/m, and even more preferably, it is 50 to 70 N/m. If it is less than 20 N/m, winding defects will occur, and if it exceeds 100 N/m, tensile stress will be generated in the gas barrier layer, reducing the barrier performance.
- Heat seal layer When the gas barrier laminate film having an inorganic thin film layer is used as a packaging material, it is preferable to form a heat seal layer called a sealant.
- the heat seal layer is usually provided on the aluminum oxide layer, but may also be provided on the outside of the base film (the surface opposite to the surface on which the protective layer is formed).
- the heat seal layer may be laminated on the surface of the protective layer.
- the heat sealable resin is usually formed by extrusion lamination or dry lamination.
- the thermoplastic polymer forming the heat sealable resin layer may be any polymer capable of sufficiently exhibiting sealant adhesiveness, and may be polyethylene resins such as HDPE, LDPE, and LLDPE, polypropylene resin, ethylene-vinyl acetate copolymer, ethylene- ⁇ -olefin random copolymer, ionomer resin, or the like.
- a moist heat treatment such as retort treatment is to be performed, it is preferable to form the heat sealable resin by the dry lamination method using a polypropylene resin.
- the heat seal layer is usually recommended to be 20 to 250 ⁇ m, and when used as a packaging material, it is desirable to be 40 to 100 ⁇ m.
- polyurethane resin, polyisocyanate resin, polyester resin, ether resin, etc. are used for bonding the protective layer and the heat seal layer.
- a reaction product of polyurethane resin and polyisocyanate resin is used as an adhesive.
- the amount of application varies depending on the material of the film to be laminated, but is preferably 1 to 20 g/ m2 , more preferably 2 to 10 g/ m2 , and more preferably 3 to 6 g/ m2 .
- the adhesion temperature is set depending on the thickness of the heat seal layer and the thickness of the adhesive, but is preferably 50 to 120°C, more preferably 55 to 100°C, and more preferably 60 to 80°C.
- the laminate film of the present invention has excellent water vapor barrier properties and appearance both in its normal state and after retort treatment, and has good adhesion even when processed by printing, lamination, etc., and is a gas barrier laminate film (laminate film) that is easy to manufacture and has excellent economical properties.
- gas barrier laminate film having an aluminum oxide layer formed by using the laminate film of the present invention in addition to the above-mentioned base film, aluminum oxide layer, and protective layer, various layers that are provided in known gas barrier laminate films can be provided as necessary.
- a polyamide resin can be provided as an intermediate layer between the gas barrier laminate film and the heat seal layer to improve the adhesion and flexibility of the laminate.
- a coating layer may be provided to react with oxygen-deficient parts of inorganic oxides and metal hydroxides generated during the formation of the aluminum oxide layer to improve adhesion.
- the gas barrier laminate film having an aluminum oxide layer may have at least one or more layers of a printed layer, other plastic substrate, and/or paper substrate laminated between or on the outside of the aluminum oxide layer or substrate film and the heat sealable resin layer.
- the printing ink for forming the printing layer water-based and solvent-based resin-containing printing inks can be preferably used.
- resins used in the printing ink include acrylic resins, urethane resins, polyester resins, vinyl chloride resins, vinyl acetate copolymer resins, and mixtures thereof.
- the printing ink may contain known additives such as antistatic agents, light blocking agents, ultraviolet absorbers, plasticizers, lubricants, fillers, colorants, stabilizers, lubricants, defoamers, crosslinking agents, anti-blocking agents, and antioxidants.
- known printing methods such as offset printing, gravure printing, and screen printing can be used.
- known drying methods such as hot air drying, hot roll drying, and infrared drying can be used.
- plastic and paper substrates from the viewpoint of obtaining sufficient rigidity and strength of the laminated film, paper, polyester resin, polyamide resin, biodegradable resin, etc. are preferably used. Also, in order to obtain a film with excellent mechanical strength, oriented films such as biaxially oriented polyester film and biaxially oriented nylon film are preferred.
- a gas barrier laminate film with an aluminum oxide layer when used as a packaging material, it is preferable to laminate a nylon film between the aluminum oxide layer and the heat sealable resin layer in order to improve mechanical properties such as pinhole resistance and puncture strength.
- the types of nylon typically used here include nylon 6, nylon 66, and metaxylene adipamide.
- the thickness of the nylon film is usually 10 to 30 ⁇ m, preferably 15 to 25 ⁇ m. If the nylon film is thinner than 10 ⁇ m, it may lack strength, while if it exceeds 30 ⁇ m, it may be too stiff and unsuitable for processing.
- a biaxially oriented film with a stretch ratio in both the length and width directions is usually 2 times or more, preferably about 2.5 to 4 times.
- the laminated film of the present invention also includes embodiments having the above-mentioned layers other than the substrate layer, aluminum oxide layer, and protective layer.
- the water vapor permeability of the laminated film of the present invention is preferably 2.5 g/ m2 ⁇ day or less, more preferably 2.0 g/ m2 ⁇ day or less, and even more preferably 1.5 g/ m2 ⁇ day or less.
- the water vapor permeability after retort treatment is preferably 2.5 g/ m2 ⁇ day or less, more preferably 2.0 g/ m2 ⁇ day or less, and even more preferably 1.5 g/ m2 ⁇ day or less.
- a wavelength dispersive small-sized fluorescent X-ray analyzer (Rigaku Corporation, "Supermini 200") was used to measure the film thickness of the aluminum oxide layer.
- the density of the aluminum oxide layer was calculated as 0.74 times (2.94/cm 3 ) the bulk density (3.97 g/cm 3 ). The reason for using 0.74 times is that it closely matches the actual film thickness calculated by TEM or the like.
- the sample used for creating the fluorescent X-ray calibration curve was one in which the amount of aluminum attached per unit area was identified by inductively coupled plasma emission spectroscopy, and the film thickness was measured by converting the density of the aluminum oxide layer into a film thickness.
- Time-of-flight secondary ion mass spectrometry (TOF-SIMS) measurement conditions
- TOF.SIMS5 manufactured by ION-TOF was used.
- the surface of aluminum oxide was the measurement target.
- the conditions were as follows: Primary ion: Bi3 ++ approx. 0.2 pA (100 ⁇ sec.)
- polyester resin having a number average molecular weight of 450 to 3,000 polyester resin having a number average molecular weight of 450 to 3,000 (polyester mainly composed of a polyvalent carboxylic acid component containing at least one of ortho-oriented aromatic dicarboxylic acid or its anhydride, and a polyhydric alcohol component) was dissolved in 70% methyl ethyl ketone (polyester solution).
- a solution of a silane coupling agent ("KBM-603" manufactured by Shin-Etsu Chemical Co., Ltd.) dissolved in acetone and a trimethylolpropane adduct of meta-xylylene diisocyanate ("Takenate D-110N” manufactured by Mitsui Chemical Co., Ltd.: solid content concentration 75%) were mixed and stirred for 10 minutes using a magnetic stirrer.
- the obtained mixture was diluted with methyl ethyl ketone, and the polyester solution was further added to obtain polyester urethane coating solution a having a solid content concentration of 5%.
- a polyester resin having a weight average molecular weight of 35,000 a polyester mainly composed of terephthalic acid, isophthalic acid, ethylene glycol, and propylene glycol
- Example 1 A 12 ⁇ m thick biaxially oriented polyester film was used, and the roll was set in an electron gun heating type deposition apparatus having a roll-to-roll type film running system so that deposition was performed on the corona-treated surface, to prepare a barrier film.
- a pre-deposition treatment a plasma treatment was performed in a vacuum system. During the treatment, oxygen gas was introduced at 1000 sccm, the current was set to 30 A, and plasma was generated. Thereafter, aluminum was evaporated by electron gun heating, oxygen gas was introduced, and deposition of an aluminum oxide layer was performed.
- the deposited plastic film (a laminated film of "substrate film/aluminum oxide layer") was moved to an optical film thickness meter in the deposition machine, and the total light transmittance was measured. After the measurement, the laminated film was wound up on a take-up roll. After the vacuum was released, the film thickness of the aluminum oxide layer and the fragment ion intensity in the depth direction were measured by TOF-SIMS. The results were as shown in Table 1.
- a laminated laminate was prepared from the obtained laminated film as described in (3) above. The laminated body was subjected to a retort treatment at 130°C for 30 minutes, and the laminate strength, water vapor permeability, and oxygen permeability after the treatment were evaluated.
- the obtained plastic film on which the aluminum oxide layer was formed (laminated film of "substrate film/aluminum oxide layer") was used to apply the coating liquid a by a roll method, and the temperature was raised and lowered at a temperature rise rate of 20°C/sec or less so that the residence time in the oven was 10 seconds, and the film was dried so that the film surface temperature reached 130°C, thereby obtaining a protective layer.
- the coating amount after drying was 0.3 g/ m2 .
- the tension after passing through the dryer was set to 50 N/m by adjusting the rotation speed ratio of the rolls before and after the oven. In this manner, a laminated film having a substrate film/aluminum oxide layer/protective layer was produced.
- a laminated film having the obtained laminated film (laminated film having a substrate film/aluminum oxide layer/protective layer) was produced as described in (3) above.
- the laminate was subjected to a retort treatment at 130° C. for 30 minutes, and the laminate strength, water vapor permeability, and oxygen permeability after the treatment were evaluated.
- Example 3 A laminate was produced and evaluated in the same manner as in Example 1, except that the amount of gas introduced and the output during the plasma treatment were changed and the thickness of the aluminum oxide layer was changed as shown in Table 1.
- Example 4 A laminate was produced and evaluated in the same manner as in Example 1, except that a biaxially oriented polyester film that had not been subjected to corona treatment was used and the amount of gas introduced and the output during the plasma treatment were changed as shown in Table 1.
- Example 5 A laminate was produced and evaluated in the same manner as in Example 21, except that the amount of gas introduced and the output during the plasma treatment and the coating material of the protective layer were changed as shown in Table 1.
- Example 1 A laminate was produced and evaluated in the same manner as in Example 1, except that Ar gas was introduced during the plasma treatment.
- Example 4 A laminate was produced and evaluated in the same manner as in Example 1, except that the thickness of the aluminum oxide layer was changed as shown in Table 1.
- the present invention has made it possible to provide a laminate film that has excellent adhesiveness not only under normal conditions but also after retort treatment. Therefore, the gas barrier laminate film of the present invention can be widely used not only for food packaging for retort treatment, but also for packaging various foods, pharmaceuticals, industrial products, etc., as well as industrial applications such as solar cells, electronic paper, organic EL elements, and semiconductor elements.
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Abstract
L'invention concerne un film multicouche qui comprend un film de base et une couche d'oxyde d'aluminium disposée sur au moins un côté du film de base et qui satisfait aux exigences (A) et (B) suivantes. (A) Lorsque le film multicouche est gravé à partir de la surface de la couche d'oxyde d'aluminium par spectrométrie de masse d'ions secondaires à temps de vol et lorsqu'une position au niveau de laquelle l'intensité pour un ion fragment ayant un nombre de masse de 102 est de 80 % d'une intensité maximale est prise comme limite entre la couche d'oxyde d'aluminium et le film de base, alors le rapport entre l'intensité a pour le nombre de masse 102 (dérivé d'Al2O3) et l'intensité b pour le nombre de masse 119 (dérivé d'Al2O4H), b/a, est inférieur ou égal à 0,10. (B) Lorsqu'un film de nylon étiré biaxialement de 15 µm et qu'un film de polypropylène non étiré de 70 µm sont liés à la surface de la couche d'oxyde d'aluminium avec un adhésif durcissable à deux composants à base de polyuréthane appliqué sur une épaisseur sèche de 4 µm et le stratifié est vieilli à une température de 40 °C pendant 4 jours et ensuite soumis à un traitement thermique humide à 130 °C pendant 30 minutes, alors le stratifié humide ainsi obtenu a une résistance supérieure ou égale à 1,5 N/15 mm et une perméabilité à la vapeur d'eau inférieure ou égale à 2,5 g/m2.
Applications Claiming Priority (2)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010201628A (ja) * | 2009-02-27 | 2010-09-16 | Dainippon Printing Co Ltd | ガスバリア性積層フィルム及びその製造方法 |
JP2017100392A (ja) * | 2015-12-03 | 2017-06-08 | 東洋紡株式会社 | 積層フィルム |
JP2020044708A (ja) * | 2018-09-19 | 2020-03-26 | 大日本印刷株式会社 | ガスバリア性蒸着フィルム、ガスバリア性積層体、ガスバリア性包装材料及びガスバリア性包装体。 |
JP2020075480A (ja) * | 2018-11-09 | 2020-05-21 | 大日本印刷株式会社 | バリアフィルム |
JP2022142333A (ja) * | 2021-03-16 | 2022-09-30 | 大日本印刷株式会社 | 積層体、及びそれを用いた反射型表示装置 |
-
2023
- 2023-09-26 WO PCT/JP2023/034853 patent/WO2024075588A1/fr unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010201628A (ja) * | 2009-02-27 | 2010-09-16 | Dainippon Printing Co Ltd | ガスバリア性積層フィルム及びその製造方法 |
JP2017100392A (ja) * | 2015-12-03 | 2017-06-08 | 東洋紡株式会社 | 積層フィルム |
JP2020044708A (ja) * | 2018-09-19 | 2020-03-26 | 大日本印刷株式会社 | ガスバリア性蒸着フィルム、ガスバリア性積層体、ガスバリア性包装材料及びガスバリア性包装体。 |
JP2020075480A (ja) * | 2018-11-09 | 2020-05-21 | 大日本印刷株式会社 | バリアフィルム |
JP2022142333A (ja) * | 2021-03-16 | 2022-09-30 | 大日本印刷株式会社 | 積層体、及びそれを用いた反射型表示装置 |
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