WO2024070628A1 - 接合構造体とその製造方法、はんだ接合用導電性部材、およびはんだ接合用構造体 - Google Patents

接合構造体とその製造方法、はんだ接合用導電性部材、およびはんだ接合用構造体 Download PDF

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Publication number
WO2024070628A1
WO2024070628A1 PCT/JP2023/033022 JP2023033022W WO2024070628A1 WO 2024070628 A1 WO2024070628 A1 WO 2024070628A1 JP 2023033022 W JP2023033022 W JP 2023033022W WO 2024070628 A1 WO2024070628 A1 WO 2024070628A1
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Prior art keywords
conductive member
metal
group
conductive
less
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PCT/JP2023/033022
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English (en)
French (fr)
Japanese (ja)
Inventor
泰典 日置
一存 佐々木
麻友子 西原
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to CN202380067534.3A priority Critical patent/CN119907723A/zh
Priority to JP2024550009A priority patent/JPWO2024070628A1/ja
Publication of WO2024070628A1 publication Critical patent/WO2024070628A1/ja
Priority to US19/089,465 priority patent/US20250222533A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • B22F2003/1051—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding by electric discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F2005/002—Tools other than cutting tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00—Treatment under specific atmosphere
    • B22F2201/10—Inert gases
    • B22F2201/11—Argon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds

Definitions

  • This disclosure relates to a joint structure and a manufacturing method thereof, a conductive member for solder bonding, and a structure for solder bonding.
  • electronic components include a component body and external electrodes provided on its surface.
  • the external electrodes can be soldered to electrode portions (e.g., lands) formed on the substrate (the joints formed in this manner are also referred to as “solder joints” in this specification).
  • the metal constituting the external electrodes can diffuse excessively when in contact with the solder material, resulting in so-called “solder erosion.”
  • One way to prevent this "solder erosion” is to, for example, provide a process for forming a barrier layer such as nickel plating on the surfaces of the wiring and electrodes.
  • pretreatment with chemicals such as acids and alkalis reduces the adhesive strength of the conductor to the substrate, and also brings about problems such as increased costs due to the addition of a plating process.
  • the metal constituting the external electrodes is silver
  • a silver/palladium conductor or a silver/platinum conductor with added palladium or platinum which are highly heat-resistant
  • a conductive paste made of silver/palladium with added manganese oxide, chromium oxide, and glass frit can be used as a technique for forming surface wiring in post-fire using the thick-film method.
  • post-fire using the thick-film method requires more labor, which makes it more costly.
  • the glass frit softens during firing and accumulates between the conductor particles. Therefore, if solder erosion occurs on the conductor surface, the layer formed by the remaining glass becomes exposed, causing the problem of repelling the solder material. Furthermore, the silver/palladium conductor has a high conductor resistance, which causes a problem of large conductor loss of electrical signals in the surface wiring.
  • Patent Document 1 shows a conductive paste that contains 0.2 to 1 part by weight of manganese dioxide, 0.2 to 1 part by weight of copper oxide, 0.3 to 1 part by weight of silicon dioxide, and 3 to 5.6 parts by weight of molybdenum and tungsten metal powders per 100 parts by weight of silver/platinum.
  • Patent Document 1 For example, electrodes or wiring that make up electronic components are required to exhibit high conductivity while preventing solder erosion.
  • the structure shown in Patent Document 1 also has the problem of increased labor and high costs.
  • This disclosure has been made in consideration of the above circumstances, and its purpose is to provide a joint structure that prevents solder erosion and has excellent conductivity, a method for manufacturing this joint structure at low cost, a conductive member for solder bonding, and a structure for solder bonding.
  • a joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, A bonded structure is provided, wherein at least one of the first conductive member and the second conductive member comprises a metal and particles of a layered material comprising one or more layers.
  • a joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • M is at least one Group 3, 4, 5, 6, or 7 metal
  • X is a carbon atom, a nitrogen atom, or a combination thereof
  • A is at least one Group 12, 13, 14, 15, or 16 element
  • n is 1 or more and 4 or less
  • m is greater than
  • a joint structure having a first conductive member, a second conductive member, and a solder joint that joins the first conductive member and the second conductive member, in which at least one of the first conductive member and the second conductive member contains metal and particles of a layered material that includes one or more layers, preferably one or more conductive particles selected from a predetermined first conductive particle and a predetermined second conductive particle, and which is prevented from solder erosion and exhibits high conductivity.
  • FIG. 11 is a schematic cross-sectional view showing a part of a conventional joint structure.
  • FIG. 2 is a schematic cross-sectional view showing a part of a joint structure according to the present embodiment.
  • FIG. 1 is a schematic cross-sectional view showing MXene, a layered material that can be used in the bonded structure according to this embodiment.
  • 1 is a schematic cross-sectional view of a mounting structure in which an electronic component is mounted on a substrate, shown as an example of a joint structure according to the present embodiment.
  • 11 is a graph showing the relationship between the immersion time in a solder bath and the mass of a conductive member sample, which is the result of a solder erosion test in an example.
  • 4 is a micrograph showing the appearance of a sample before and after a solder erosion test in an embodiment.
  • one joint structure is A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is a bonded structure that includes a metal and particles of a layered material that includes one or more layers.
  • Examples of the particles of the layered material including one or more layers in the bonded structure include, for example, MXene particles, MAX particles, graphene, graphene oxide, silicene, black phosphorus, borophene, titanium oxide nanosheets, transition metal dichalcogenides, boron nitride, etc., and one or more particles of these may be included.
  • MXene particles MAX particles
  • graphene graphene oxide
  • silicene black phosphorus
  • borophene titanium oxide nanosheets
  • transition metal dichalcogenides boron nitride, etc.
  • the particles of the layered material including one or more layers in the bonded structure preferably include one or more particles of MXene particles and MAX particles, and/or one or more particles of graphene and graphene oxide.
  • the particles of the layered material including one or more layers in the bonded structure may be one or more particles of MXene particles and MAX particles.
  • the particles of the layered material including one or more layers in the bonded structure may be one or more particles of graphene and graphene oxide.
  • the particles of layered material comprising one or more layers in the bonded structure are more preferably particles of layered material comprising one or more layers, said layers being one or more of MXene, represented by the formula MmXn as described below, and MAX , represented by the formula MmAXn as described below.
  • a preferred joint structure in this embodiment is A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • M is at least one Group 3, 4, 5, 6, or 7 metal
  • X is a carbon atom, a nitrogen atom, or a combination thereof
  • A is at least one Group 12, 13, 14, 15, or 16 element
  • n is 1 or more and 4 or less
  • m is greater than
  • [Conductive member] One or more conductive particles of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) contained in the conductive member]
  • at least one of the first conductive member and the second conductive member may contain one or more of the first conductive particles and the second conductive particles together with a metal.
  • the first conductive particles may be referred to as "MXene particles” or "MXene powder”
  • the layered material constituting the first conductive particles may be referred to as "MXene”.
  • the second conductive particles may be referred to as "MAX particles”
  • the layered material constituting the second conductive particles may be referred to as "MAX”.
  • the joint structure of this embodiment can prevent solder erosion even if the metal is silver, copper, or the like, which is likely to diffuse into the solder metal (e.g., tin, etc.) during soldering.
  • solder metal e.g., tin, etc.
  • This embodiment is not bound by any theory, but the reason why the joint structure of this embodiment can prevent solder erosion is speculated as follows, using the schematic cross-sectional views of Figures 1 and 2.
  • Figures 1 and 2 are merely conceptual diagrams used for convenience of explanation, and the thickness of the solder joint, the size and arrangement of one or more conductive particles of MXene particles and MAX particles in Figures 1 and 2 may differ from the actual ones, and the joint structure of this embodiment is not limited to the form shown in Figure 2.
  • FIG. 1 is a schematic cross-sectional view showing a portion of a conventional joint structure
  • FIG. 2 is a schematic cross-sectional view showing a portion of the joint structure according to this embodiment.
  • the diffusion 39 of the metal 36 such as silver constituting the conductive member 35B is hindered by the conductive member 35B containing one or more conductive particles 37 selected from the first conductive particles (MXene particles) and the second conductive particles (MAX particles) together with the metal 36.
  • the conductive particles (MXene particles) and one or more conductive particles selected from the second conductive particles (MAX particles) can prevent solder erosion and exhibit high conductivity.
  • the first conductive particles and the second conductive particles are described below.
  • the layered material constituting the first conductive particles can be understood as a layered compound and can also be represented as " MmXnTs ", where s is an arbitrary number, and x or z may be used instead of s as is conventional. Typically, n can be 1, 2, 3 or 4, but is not limited thereto.
  • M is preferably at least one selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and Mn, and more preferably at least one selected from the group consisting of Ti, V, Cr and Mo.
  • M can be titanium or vanadium
  • X can be a carbon or nitrogen atom
  • the MAX phase is Ti3AlC2
  • MXene is Ti3C2Ts (in other words, M is Ti, X is C, n is 2, and m is 3 ).
  • MXene may contain a relatively small amount of residual A atoms, for example, 10% by mass or less of the original A atoms.
  • the amount of residual A atoms may be preferably 8% by mass or less, and more preferably 6% by mass or less. However, even if the amount of residual A atoms exceeds 10% by mass, there may be cases where this does not pose a problem depending on the application and use conditions of the conductive member.
  • the MXene particle is an aggregate containing one layer of MXene 10a (single layer MXene) as illustrated in Fig. 3. More specifically, MXene 10a is an MXene layer 7a having a layer body ( MmXn layer) 1a represented by MmXn and modifications or terminations T3a, 5a present on the surface of the layer body 1a (more specifically, on at least one of the two opposing surfaces of each layer). Thus, the MXene layer 7a is also represented as " MmXnTs ", where s is any number.
  • the MXene particles may contain multiple layers of MXene along with one layer of MXene.
  • multiple layers of MXene include, but are not limited to, two layers of MXene 10b, as shown in FIG. 3(b). 1b, 3b, 5b, and 7b in FIG. 3(b) are the same as 1a, 3a, 5a, and 7a in FIG. 3(a).
  • two adjacent MXene layers e.g., 7a and 7b do not necessarily have to be completely separated, and may be partially in contact.
  • the MXene 10a is present as a single layer in which the multilayer MXene 10b is individually separated, and may contain unseparated multilayer MXene 10b remaining, and may be a mixture of the single layer MXene 10a and multilayer MXene 10b.
  • the thickness of each layer of MXene is, for example, 0.8 nm to 5 nm, particularly 0.8 nm to 3 nm (which may vary mainly depending on the number of M atomic layers contained in each layer).
  • the interlayer distance (or gap dimension, shown as ⁇ d in FIG. 3(b)) may be, for example, 0.8 nm to 10 nm, particularly 0.8 nm to 5 nm, more particularly about 1 nm, and the total number of layers may be 2 to 20,000.
  • the MXene particles may be MXene with a small number of layers, obtained by subjecting the multi-layer MXene to a delamination process (sometimes called a delamination process).
  • the "small number of layers” refers to, for example, 6 or fewer stacked layers of MXene.
  • the thickness in the stacking direction of multi-layer MXene with a small number of layers may be 10 nm or less.
  • this "multi-layer MXene with a small number of layers” may be referred to as "small-layer MXene.”
  • single-layer MXene and small-layer MXene may be collectively referred to as "single-layer/small-layer MXene.”
  • the MXene particles may contain single-layer MXene and few-layer MXene, i.e., single-layer and few-layer MXene.
  • the proportion of single-layer and few-layer MXene with a thickness of 10 nm or less in the entire MXene particles may be 10 volume % or more when the MXene particles are used in a conductive member that does not contain resin, and may be 1 volume % or more when the MXene particles are used in a conductive member that contains resin. When used in either conductive member, the proportion of the single-layer and few-layer MXene may be higher.
  • the ratio of one or more conductive particles, MXene particles and MAX particles (hereinafter referred to as "MXene particles/MAX particles” or simply “conductive particles”) contained in at least one of the first conductive member and the second conductive member can be, for example, in the following range. That is, when the ratio of conductive particles is expressed as (mass of conductive particles)/(mass of conductive particles + mass of metal constituting the conductive member), it can be, for example, 0.1 mass% or more and 20 mass% or less. However, it is not limited to this, and the ratio of the conductive particles may exceed 20 mass%. On the other hand, from the viewpoint of forming an intermetallic compound between the metal contained in the conductive member and the solder and achieving good solder bonding, it is preferable that the ratio of the conductive particles is 20 mass% or less.
  • the metal contained in at least one of the first conductive member and the second conductive member may be one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium. These metals are easily diffused in the solder metal, such as tin, constituting the solder material, and when these metals are soldered as the joined object, solder erosion is likely to occur.
  • the metals may be each pure metal, or may be an alloy containing each of them in a mass ratio of 50% or more.
  • the metal may be, in particular, one or more of silver and copper, and may be silver.
  • the above metal may be contained in at least one of the first conductive member and the second conductive member in an amount of 80% or more by mass.
  • solder joint refers to a joint formed between the first conductive member and the second conductive member so as to be in contact with them by soldering the first conductive member and the second conductive member via a solder material including a solder metal.
  • solder metal means a metal for brazing.
  • solder metals include lead-free solder metals.
  • Solder metals may contain at least tin.
  • solder metals containing tin (Sn) include simple Sn or Sn-based alloys.
  • Sn-based alloys include Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-In, Sn-Ag-In, Sn-Cu-In, Sn-Ag-Cu-In, Sn-Ag-Cu-In, Sn-Bi, Sn-Bi-In, Sn-Ag-Bi, Sn-Cu-Bi, Sn-Ag-Cu-Bi-In, Sn-Ag-Cu-Bi-In, Sn-Ag-Cu-Bi-In, Sn-Ag-Cu-Bi-In, Sn-Au, Sn-Sb, and Sn-Zn.
  • the solder joint may contain a resin depending on the raw material of the solder joint and the conditions of the joint.
  • the resin contained in the solder joint is not limited, and may be a thermosetting resin or a thermoplastic resin.
  • the resin include acrylic resin, fluororesin such as polytetrafluoroethylene, vinyl resin such as polyvinyl chloride, epoxy resin, polyurethane, melamine resin, phenolic resin, polyester such as polyethylene terephthalate, polyamide, polyimide, polyether, etc.
  • the ratio of the resin contained in the solder joint may be appropriately determined depending on the application.
  • the joint structure according to this embodiment is obtained by soldering the first conductive member and the second conductive member.
  • At least one of the first conductive member and the second conductive member may be, for example, an electrode or a wiring.
  • the "electrode” may be an internal electrode, an external electrode, a pad electrode, a wiring-like electrode, a ground (reference potential) electrode, a shield pattern, etc. in an electronic component or a circuit board, which may cause the above-mentioned solder erosion.
  • the "wiring” may be a signal line, a coil pattern, an interlayer connection conductor (via conductor), etc. that forms a circuit pattern.
  • FIG. 4 shows a schematic cross-sectional view of a mounting structure obtained by mounting an electronic component to a substrate using a solder material.
  • mounting structure 20 has an electronic component and solder joints 29a, 29b.
  • the electronic component includes component body 21 and external electrodes 27a, 27b provided on the surface of the component body.
  • two external electrodes are shown as the external electrodes, but the number of external electrodes is not particularly limited.
  • Solder joints 29a, 29b join substrate 23 and the electronic component, and specifically, they are directly joined to electrode portion 25 provided on the surface of substrate 23.
  • the method for manufacturing the joint structure of this embodiment includes the steps of: (a) providing a first conductive member and a second conductive member; At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • M is at least one Group 3, 4, 5, 6, or 7 metal
  • X is a carbon atom, a nitrogen atom, or a combination thereof
  • A is at least one Group 12, 13, 14, 15, or 16 element
  • n is 1 or more and 4 or less
  • m is greater than
  • Step (a) A first conductive member and a second conductive member, At least one of the first conductive member and the second conductive member is Metal and A conductive particle including one or more of (i) the first conductive particles and (ii) the second conductive particles is provided.
  • the following method can be used to prepare at least one of the first conductive member and the second conductive member, which contains the metal and the conductive particles.
  • At least one of the first conductive member and the second conductive member is (a11)(i) Particles of layered material comprising one or more layers,
  • the layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • first step (a) providing one or more second conductive particles represented by: (a12) mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member and the conductive particles to obtain a conductive member-forming mixture; and (a13) molding the conductive member-forming mixture and firing it at a sinterable temperature (sometimes referred to as "first step (a)").
  • Another method for preparing a conductive material is as follows:
  • At least one of the first conductive member and the second conductive member is (a21)(i) Particles of layered material comprising one or more layers,
  • the layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • second conductive particles represented by: (a22) mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin to obtain a conductive member-forming mixture; and (a23) molding and drying the conductive member-forming mixture (sometimes referred to as the "second step (a)").
  • Step (a11) The first conductive particles and the second conductive particles can be prepared as follows.
  • MAX constituting the second conductive particle is The formula: M m AX n (wherein M, X, n and m are as defined above, and A is at least one Group 12, 13, 14, 15, 16 element, usually a Group A element, typically Group IIIA and Group IVA, and more particularly may include at least one element selected from the group consisting of Al, Ga, In, Tl, Si, Ge, Sn, Pb, P, As, S and Cd, and is preferably Al). and has a crystal structure in which a layer composed of A atoms is located between two layers represented by MmXn (each X may have a crystal lattice located in the octahedral array of M).
  • the above-mentioned MAX phase can be manufactured by a known method. For example, TiC powder, Ti powder, and Al powder are mixed in a ball mill, and the resulting mixed powder is sintered in an Ar atmosphere to obtain a sintered body (block-shaped MAX phase). The resulting sintered body can then be pulverized with an end mill to obtain MAX particles.
  • the first conductive particles can be synthesized by selectively etching (removing and optionally layer-separating) A atoms (and optionally some of the M atoms) from the MAX.
  • the A atoms (and sometimes a part of the M atoms) are selectively etched (removed and sometimes layer separated) from MAX, whereby the A atom layer (and sometimes a part of the M atoms) is removed , and the surface of the exposed MmXn layer is modified with hydroxyl groups, fluorine atoms, chlorine atoms, oxygen atoms, hydrogen atoms, and the like present in the etching solution (usually, an aqueous solution of a fluorine-containing acid is used, but is not limited to this) to terminate the surface.
  • the etching solution usually, an aqueous solution of a fluorine-containing acid is used, but is not limited to this
  • the etching can be performed using an etching solution containing F - , for example, a method using a mixed solution of lithium fluoride and hydrochloric acid, a method using hydrofluoric acid, etc.
  • the etching solution may contain a metal compound containing a monovalent metal ion, and an intercalation treatment of the monovalent metal ion may be performed simultaneously with the etching.
  • layer separation of MXene may be promoted by any suitable post-treatment (e.g., ultrasonic treatment, hand shaking, automatic shaker, etc.).
  • a monovalent metal ion intercalation treatment may be performed, which includes a step of mixing the etched product obtained by the above etching treatment with a metal compound containing a monovalent metal ion.
  • ultrasonic treatment may destroy MXene due to excessive shear force, so if it is desired to obtain MXene with a two-dimensional shape having a larger aspect ratio (preferably single-layer MXene), it is preferable to apply an appropriate shear force by hand shaking or an automatic shaker, etc.
  • Step (a12) A conductive member forming composition containing the metal constituting at least one of the first conductive member and the second conductive member and the conductive particles is mixed to obtain a conductive member forming mixture.
  • the metal is as described in [Metal contained in the conductive member] above.
  • the metal may be, for example, a metal powder.
  • a metal paste containing the metal powder may be used.
  • the metal paste may be a metal paste obtained by mixing, for example, Ag powder with a varnish prepared by mixing conductive particles, a solvent, and a resin (organic component).
  • the conductive member forming composition may contain a resin.
  • the method of mixing is not particularly limited, and examples include stirring with a centrifugal stirrer, kneading and dispersion processing using a three-roll mill.
  • kneading if the fluidity is reduced, an organic solvent that can be removed in a subsequent drying process, such as diethylene glycol monobutyl ether acetate used in the examples, may be added.
  • Step (a13) The conductive member-forming mixture is molded and fired at a sinterable temperature to obtain a conductive member containing conductive particles.
  • the molding method is not particularly limited, and may be, for example, a method of applying the mixture to a coating object such as a substrate.
  • the coating method is not limited, and may be, for example, a method of spray coating using a nozzle such as a one-fluid nozzle, a two-fluid nozzle, or an airbrush, a coating method using a table coater, a comma coater, or a bar coater, slit coating, screen printing, metal mask printing, spin coating, dip coating, or dripping.
  • the coating object may be a printed circuit board, a metal substrate, a resin substrate, a laminated electronic component, a metal pin, a metal wire, or the like, as appropriate, depending on the application.
  • the mixture may be molded, and may be dried, for example, to obtain a molded product, and then fired.
  • drying conditions may vary depending on the shape and size of the molded product, but may be, for example, 60°C or higher and 200°C or lower, and 10 minutes or longer and 120 minutes or shorter. As shown in the examples described later, molding and firing may be performed simultaneously.
  • the molded product is fired at a sinterable temperature.
  • the sinterable temperature may be determined according to the metal type, for example, within the range of approximately 150°C or higher and 1450°C or lower.
  • the firing time may be determined according to the shape and size of the molded product.
  • the atmosphere during firing may be appropriately adjusted to an inert atmosphere, an oxidizing atmosphere, or a reducing atmosphere.
  • Step (a) The same parts as those in the first step (a) will be omitted.
  • Step (a21) The first conductive particles and the second conductive particles can be prepared in the same manner as in the above step (a11).
  • Step (a22) A conductive member forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin is mixed to obtain a conductive member forming mixture.
  • the metal is as described above in [Metal contained in the conductive member] and in step (a12).
  • the resin is not limited, and the resins described in [Resin contained in the solder joint] above can be used. That is, it may be a thermosetting resin or a thermoplastic resin. Examples include acrylic resin, fluororesin such as polytetrafluoroethylene, vinyl resin such as polyvinyl chloride, epoxy resin, polyurethane, melamine resin, phenolic resin, polyester such as polyethylene terephthalate, polyamide, polyimide, polyether, etc.
  • the proportion of the resin is preferably more than 0 mass%, preferably 2 mass% or more, in order to function as a binder, while it is preferably 25 mass% or less, and more preferably 12 mass% or less, in order to ensure electrical conductivity.
  • a metal paste in which the metal and resin are mixed in advance can be used.
  • the proportion of conductive particles contained in the conductive member forming composition can be adjusted so that the proportion of conductive particles in the resulting conductive member is within the range of 0.1 mass % or more and 20 mass % or less, as shown in [One or more conductive particles of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) contained in the conductive member] above.
  • Step (a23) The conductive member-forming mixture is molded and dried to obtain a conductive member.
  • the mixture can be molded into a molded product in the shape of an electrode or wiring before drying, but the molding method is not particularly limited.
  • the mixture may be applied to an object to be coated such as a substrate.
  • the application method is not limited, and examples thereof include a method of spray coating using a nozzle such as a one-fluid nozzle, a two-fluid nozzle, or an airbrush, a coating method using a table coater, a comma coater, or a bar coater, screen printing, metal mask printing, spin coating, dip coating, dripping, etc.
  • the above-mentioned object to be coated may be appropriately selected from a printed circuit board, a metal substrate, a resin substrate, a laminated electronic component, a metal pin, a metal wire, etc., depending on the application.
  • drying is carried out.
  • the drying conditions vary depending on the shape and size of the molded mixture, but can be, for example, at a temperature of 60°C or higher and 200°C or lower, for 10 minutes or longer and 120 minutes or shorter.
  • the above coating and drying steps may be repeated multiple times as necessary until a film of the desired thickness is obtained.
  • Step (b) The first conductive member and the second conductive member are soldered together.
  • solder material The solder metal contained in the solder material is as described above.
  • the solder metal may be, for example, in powder form.
  • the solder material may contain flux in addition to the solder metal. Examples of the flux include rosin, a solvent, an activator, and a thickener.
  • the rosin may be naturally derived rosin or modified rosin.
  • Modified rosin may be, for example, rosin obtained by reducing naturally derived rosin (reduced rosin), polymerized rosin (polymerized rosin), disproportionated rosin (disproportionated rosin), or a rosin derivative obtained by introducing a substituent into naturally derived rosin.
  • the rosin may contain one of the above rosins and rosin derivatives alone, or may contain a combination of two or more of them.
  • the activator may be an amine halogen salt (for example, the amine is cyclohexylamine and the halogen is bromine), an amino acid such as glutamic acid, or an organic acid such as adipic acid.
  • an amine halogen salt for example, the amine is cyclohexylamine and the halogen is bromine
  • an amino acid such as glutamic acid
  • an organic acid such as adipic acid.
  • the thickening agents include, for example, those soluble in organic solvents such as high molecular weight polyethylene glycol, polypropylene glycol, and ethyl cellulose, oils and fats such as hydrogenated castor oil and coconut oil, waxes of higher alcohols and higher fatty acids, saturated higher fatty acids or alcohols, esters of polyhydric alcohols and higher fatty acids, amides or bisamides of higher fatty acids, natural or semi-synthetic gums such as carnauba wax, acacia gum, tragacanth gum, guar gum, locust bean gum, arabinogalactone, karaya gum, iris moss, gelatin, sodium alginate, and propylene glycol alginate ester, and synthetic resins such as low molecular weight phenol formaldehyde resin and low molecular weight polyethylene wax.
  • oils and fats such as hydrogenated castor oil and coconut oil, waxes of higher alcohols and higher fatty acids, saturated higher fatty acids or
  • the solder material may contain a solvent.
  • the solvent include glycols such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol, their mono- or di-ethers or mono- or di-esters with lower alcohols, cyclic ethers, particularly crown ethers, glycerin, pentaerythritol, trimethylolpropane, and their esters.
  • the specific soldering method is not particularly limited.
  • the first conductive member and the second conductive member may be soldered by contacting an electronic circuit board and an electronic component with a solder material melted by using a soldering iron, or by arranging an electronic component on a printed wiring board on which a solder paste or the like made by mixing a solder alloy powder and a flux is printed, and then melting the solder paste or the like in a reflow furnace to solder the electronic components.
  • the conductive member for solder bonding of this embodiment is A conductive member that is brought into contact with a solder material in a solder joint, Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • M is at least one Group 3, 4, 5, 6, or 7 metal
  • X is a carbon atom, a nitrogen atom, or a combination thereof
  • A is at least one Group 12, 13, 14, 15, or 16 element
  • n is 1 or more and 4 or less
  • m is greater than
  • the conductive member for solder joints may further contain a resin. Details of the resin are as described above in [Resin contained in the solder joint].
  • the conductive member for soldering of this embodiment may use a solder material containing tin for soldering.
  • the conductive member for soldering of this embodiment can prevent solder erosion even when it comes into contact with a solder material containing tin during soldering.
  • the conductive member for soldering includes, for example, electrodes or wiring that are used for soldering.
  • the "electrodes” include internal electrodes, external electrodes, pad electrodes, wire-like electrodes, ground (reference potential) electrodes, shield patterns, etc. in electronic components and circuit boards where solder erosion may occur.
  • the "wiring” includes signal lines, coil patterns, interlayer connection conductors (via conductors), etc. that form circuit patterns.
  • the solder joint structure of this embodiment includes the conductive member for solder joint and a solder material in contact with the conductive member for solder joint.
  • the details of the conductive member for solder joint and the solder material are as described above.
  • the conductive member for solder joint and the solder material have a form in which, for example, at least a part of the surface of the conductive member for solder joint is covered with the solder material.
  • Example 1 In Example 1, the conductive member sample was produced by firing. In Example 1-1 below, MXene powder was used to form the conductive member sample, and in Example 1-2 below, MAX particles were used to form the conductive member sample.
  • Example 1-1 (1) Preparation of MAX particles TiC powder, Ti powder and Al powder (all manufactured by Kojundo Chemical Laboratory Co., Ltd.) were mixed in a molar ratio of 2:1:1 for 24 hours in a ball mill containing zirconia balls. The mixed powder was sintered for 2 hours at 1350°C in an Ar atmosphere. The sintered body (block-shaped MAX phase) was pulverized with an end mill to a maximum dimension of 40 ⁇ m or less. As a result, Ti3AlC2 particles were obtained as MAX particles.
  • Ti 3 C 2 T x -water dispersion clay was obtained as MXene clay.
  • the Ti 3 C 2 T x -water dispersion clay was freeze-dried and pulverized using an IKA mill to obtain MXene powder.
  • the MXene powder and Ag powder (size: 1 ⁇ m) were mixed to a ratio of 14.8% by mass and 85.2% by mass, respectively.
  • the mixed powder was placed in a poly container, and then several ZrO2 balls with a diameter of 5 mm were added and mixed on a pot rack.
  • the mixing conditions were 60 rpm and 24 hours.
  • the ZrO2 balls were then removed to obtain a mixed powder.
  • the mixed powder was placed in a graphite die of an SPS (Spark Plasma Sintering) device, and molded by pressurization and heating to obtain a disk-shaped conductive member sample with a diameter of 10.4 mm and a thickness of 2 mm to 3 mm as a molded product.
  • the pressurization and heating conditions were a temperature rise rate of 100° C./min, a TOP temperature of 750° C., a keeping time of 15 min, an Ar atmosphere, and a maximum pressure of 40 MPa.
  • Example 1-2 A conductive member sample was obtained in the same manner as in Example 1-1(3) above, except that the MAX particles obtained in the same manner as in Example 1(1) above were used instead of the MXene powder.
  • Example 1 A conductive member sample was obtained in the same manner as in Example 1-1(3) above, except that no MAX particles or MXene powder was added.
  • solder erosion test The conductive member samples obtained in the above-mentioned Examples 1-1, 1-2, and Comparative Example 1 at room temperature were put into a solder bath (SAC305 composition) heated to 350° C. and immersed for 120 seconds. During the immersion, the mass was measured for each elapsed time of immersion. In the measurement, for one conductive member sample, after a predetermined time of immersion, the sample was taken out and the mass was measured, and the sample was again taken out after a predetermined time of immersion and the mass was measured. The results are shown in FIG. 5 as a graph showing the relationship between the immersion time and the mass of the conductive member sample. Note that in FIG.
  • the graph in Figure 5 shows that the comparative conductive material sample made only of silver lost mass, and this graph also shows that solder erosion occurred, as indicated by the results of the above appearance observation.
  • the conductive material samples containing MAX or MXene showed almost no change in mass, and did not experience solder erosion, as indicated by the results of the above appearance observation.
  • the conductive member samples containing MAX or MXene did not suffer from solder erosion. This is presumably because the presence of MAX or MXene along with the silver constituting the conductive member inhibits excessive diffusion of silver to the tin side. In addition, since MAX and MXene have high electrical conductivity, problems such as high conductor resistance of the conductive member do not occur.
  • the conductive member samples were obtained by a method of manufacture by sintering, but this is not limited to this.
  • one or more of the conductive particles (MXene particles) and the second conductive particles (MAX particles) are useful for manufacturing conductive members and joint structures, and joint structures in which the conductive particles are included in the conductive member do not suffer from solder erosion and can exhibit high conductivity.
  • the joining structure of the present disclosure may be used in any suitable application, and may be particularly preferably used, for example, as an electrode in an electronic component.
  • a joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • ⁇ 2> The bonded structure according to ⁇ 1>, wherein the metal contained in at least one of the first conductive member and the second conductive member is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium.
  • ⁇ 3> The joint structure according to ⁇ 1> or ⁇ 2>, wherein the solder joint contains tin.
  • ⁇ 4> The joint structure according to any one of ⁇ 1> to ⁇ 3>, wherein the solder joint portion contains a resin.
  • ⁇ 5> (a) preparing a first conductive member and a second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • the step (a) at least one of the first conductive member and the second conductive member is (a11)(i) Particles of layered material comprising one or more layers,
  • the layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • the method for producing a joined structure described in ⁇ 5> comprising the steps of: (a12) mixing a composition for forming a conductive member, the composition including a metal constituting at least one of the first conductive member and the second conductive member, and the conductive particles, to obtain a mixture for forming a conductive member; and (a13) molding the mixture for forming a conductive member and firing it at a sinterable temperature.
  • At least one of the first conductive member and the second conductive member is (a21)(i) Particles of layered material comprising one or more layers,
  • the layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • the method for manufacturing a joint structure described in ⁇ 5> comprising the steps of: (a22) mixing a composition for forming a conductive member, the composition including a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin, to obtain a mixture for forming a conductive member; and (a23) molding and drying the mixture for forming a conductive member.
  • the layer has the following formula: M m X n wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5.
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom
  • ⁇ 10> The conductive member for solder bonding according to ⁇ 9>, further comprising a resin.
  • ⁇ 11> The conductive member for soldering according to ⁇ 9> or ⁇ 10>, wherein the metal is at least one selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium.
  • ⁇ 12> The conductive member for soldering according to any one of ⁇ 9> to ⁇ 11>, wherein a solder material containing tin is used for the soldering.
  • a structure for soldering comprising the conductive member for soldering according to any one of ⁇ 9> to ⁇ 12> and a solder material to be brought into contact with the conductive member for soldering.

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PCT/JP2023/033022 2022-09-29 2023-09-11 接合構造体とその製造方法、はんだ接合用導電性部材、およびはんだ接合用構造体 Ceased WO2024070628A1 (ja)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180338352A1 (en) * 2017-05-16 2018-11-22 Murata Manufacturing Co., Ltd. Heater device and method for producing the same
JP2020093971A (ja) * 2018-10-02 2020-06-18 コリア・インスティテュート・オブ・サイエンス・アンド・テクノロジー 飽和または不飽和炭化水素を含む官能基で表面改質された２次元マキシン（ＭＸｅｎｅ）粒子及びその製造方法及び用途
CN111505065A (zh) * 2020-04-20 2020-08-07 河北工业大学 一种基于超级电容传感原理的叉指型对电极式柔性触觉传感器及其制备方法
JP2022519403A (ja) * 2018-12-25 2022-03-24 ナショナル ユニバーシティ オブ サイエンス アンド テクノロジー エムアイエスアイエス ＭＸｅｎｅ改質ハイブリッド光変換器
JP2022122629A (ja) * 2021-02-10 2022-08-23 株式会社村田製作所 Ｏｖｄ形成媒体およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180338352A1 (en) * 2017-05-16 2018-11-22 Murata Manufacturing Co., Ltd. Heater device and method for producing the same
JP2020093971A (ja) * 2018-10-02 2020-06-18 コリア・インスティテュート・オブ・サイエンス・アンド・テクノロジー 飽和または不飽和炭化水素を含む官能基で表面改質された２次元マキシン（ＭＸｅｎｅ）粒子及びその製造方法及び用途
JP2022519403A (ja) * 2018-12-25 2022-03-24 ナショナル ユニバーシティ オブ サイエンス アンド テクノロジー エムアイエスアイエス ＭＸｅｎｅ改質ハイブリッド光変換器
CN111505065A (zh) * 2020-04-20 2020-08-07 河北工业大学 一种基于超级电容传感原理的叉指型对电极式柔性触觉传感器及其制备方法
JP2022122629A (ja) * 2021-02-10 2022-08-23 株式会社村田製作所 Ｏｖｄ形成媒体およびその製造方法

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