WO2024043026A1 - 車両用導電回路の製造方法 - Google Patents

車両用導電回路の製造方法 Download PDF

Info

Publication number
WO2024043026A1
WO2024043026A1 PCT/JP2023/028337 JP2023028337W WO2024043026A1 WO 2024043026 A1 WO2024043026 A1 WO 2024043026A1 JP 2023028337 W JP2023028337 W JP 2023028337W WO 2024043026 A1 WO2024043026 A1 WO 2024043026A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive circuit
conductive
porous layer
manufacturing
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/028337
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
典子 内山
森 長山
真一郎 竹本
孝邦 岩瀬
紘敬 三輪
義貴 上原
透 小瀬村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP2024542711A priority Critical patent/JPWO2024043026A1/ja
Publication of WO2024043026A1 publication Critical patent/WO2024043026A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern

Definitions

  • the present invention relates to a method of manufacturing a conductive circuit for a vehicle.
  • Patent Document 1 discloses that after a copper fine particle layer made of copper fine particles is formed on a base material, electroless copper plating is applied, and copper crystals are uniformly grown on the copper fine particle layer to form wiring. discloses a technique for producing a conductive circuit.
  • An object of the present invention is to provide a method for manufacturing a conductive circuit for a vehicle, which allows wiring to be formed to have a large cross-sectional area on the order of square millimeters.
  • a method for manufacturing a conductive circuit for a vehicle is a method for manufacturing a conductive circuit for a vehicle by forming wiring made of a conductor on a base material, the method comprising: conductive particles, a binder, and a coating process of coating a conductive particle paste containing a liquid medium on the surface of a base material to form a film of the conductive particle paste on the base material, and curing the binder to form a film of the conductive particle paste on the base material.
  • the gist of the present invention is to include a plating step in which conductive particles dispersed inside the porous layer are connected to each other by a deposited metal to transform the porous layer into a wiring made of a conductor.
  • the method for manufacturing a conductive circuit for a vehicle according to the present invention allows wiring to be formed to have a large cross-sectional area on the order of square millimeters.
  • FIG. 3 is a schematic cross-sectional view illustrating each step of a method for manufacturing a conductive circuit for a vehicle according to an embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view illustrating the structure of a vehicle conductive circuit manufactured by a method for manufacturing a vehicle conductive circuit according to an embodiment of the present invention.
  • the method for manufacturing a conductive circuit for a vehicle is a method for manufacturing a conductive circuit for a vehicle by forming wiring 3 made of a conductor on a base material 1. , a coating process, a curing process, and a plating process.
  • the coating step is a step of applying a conductive particle paste containing conductive particles 11, a binder, and a liquid medium to the surface of the base material 1 to form a film 2 of conductive particle paste on the base material 1. It is.
  • the binder and liquid medium in the film 2 of the conductive particle paste are indicated by the reference numeral 21.
  • the liquid medium is volatilized from the film 2 of the conductive particle paste by heat or the like, and the binder is cured, so that the film 2 of the conductive particle paste is formed into a porous structure having the conductive particles 11 and the hardening reaction product 13 of the binder.
  • electroless plating is performed by impregnating the porous layer 22 with an electroless plating solution. This is a step in which the dispersed conductive particles 11 are connected to each other to transform the porous layer 22 into the wiring 3 made of a conductor.
  • the plating deposited metal is deposited in the voids inside the porous layer 22, and the conductive particles 11 are connected to each other by the precipitated plating deposited metal, so that the porous layer 22 can be modified into a wiring 3 made of a conductor. Therefore, according to the method for manufacturing a conductive circuit for a vehicle, the wiring 3 is formed so as to have a large cross-sectional area on the square millimeter level (for example, the cross-sectional area of the wiring of a wire harness is 0.05 mm 2 or more and 100 mm 2 or less). Is possible.
  • the electrical resistance of the vehicle conductive circuit will be low, so the vehicle conductive circuit manufactured by the above-mentioned method for manufacturing a vehicle conductive circuit cannot carry a large current. It is possible to flow.
  • the vehicular conductive circuit manufactured by the method for manufacturing a vehicular conductive circuit described above is suitable as a conductive circuit for vehicle parts through which a large current flows, and can be used as a substitute for wire harnesses in vehicle parts. be able to. Therefore, by using the method for manufacturing a conductive circuit for a vehicle according to the present embodiment, various vehicle parts can be manufactured depending on the type, model, specifications, etc. of the vehicle.
  • the wiring 3 can be formed on the base material 1 by using a method of applying and/or impregnating a plating solution without immersing it in a plating solution such as an electroless plating solution.
  • the conductive circuit for a vehicle can be manufactured easily and inexpensively. For example, it becomes possible to manufacture conductive circuits using robots, which leads to a reduction in the number of man-hours. Furthermore, since the degree of freedom in the layout of the conductive circuit is increased, a wire harness is no longer required, leading to a reduction in the weight of the conductive circuit.
  • the method for manufacturing a conductive circuit for a vehicle according to the present embodiment does not require heat treatment at high temperature when forming the wiring 3 on the base material 1, even if the base material 1 is made of resin, Problems are less likely to occur during heat treatment. If heat treatment at a high temperature (for example, 200° C.) is required when forming the wiring 3 on the base material 1, there is a risk that the resin base material 1 will thermally shrink during the heat treatment. For example, by applying a conductive particle paste containing conductive particles, a binder, and a liquid medium to the surface of a base material to form a film of the conductive particle paste on the base material, and then performing heat treatment.
  • the vehicle conductive circuit manufactured by the method for manufacturing a vehicle conductive circuit described above has the following structure. An example will be explained with reference to FIG. As shown in FIG. 2, the vehicular conductive circuit manufactured by the method for manufacturing a vehicular conductive circuit described above includes a base material 1 and wiring 3 formed on the base material 1.
  • the wiring 3 is made of a conductor.
  • the conductor includes conductive particles 11 that have an average particle size of, for example, 1 ⁇ m or more and 50 ⁇ m or less and are made of metal, and particles that have a smaller average particle size than the conductive particles 11 and are electroless.
  • the plated metal particles 12 are made of a plated metal deposited by plating.
  • a plurality of conductive particles 11 are arranged in a dispersed state within the conductor, and plated metal particles 12 are arranged between the conductive particles 11 to connect the conductive particles 11 to each other. Furthermore, the surface of the conductor is coated with a plating metal film 14 made of a plating deposited metal deposited by electroless plating, forming the wiring 3.
  • the plated metal film 14 is formed by the plated metal deposited from the electroless plating solution when the binder is completely cured (crosslinked) and/or when a catalyst application process is provided between the curing process and the plating process.
  • the conductivity of the plating metal film 14 is improved by allowing current to flow through the plating metal film 14 as well as contributing to maintaining the shape of the wiring 3. If the porous layer 22 is easily impregnated with the electroless plating solution, such as when the hardening reaction product 13 of the binder is in a semi-hardened state (details will be described later), the plated metal film 14 may not be formed. Note that the vehicular conductive circuit manufactured by the method for manufacturing a vehicular conductive circuit described above does not need to include the plated metal film 14.
  • the cross-sectional area of the wiring 3 means the cross-sectional area of a cross section that occurs when the wiring 3 is cut along a plane perpendicular to the direction in which the wiring 3 extends on the surface of the base material 1.
  • the "large area on the square millimeter level” may be, for example, 0.05 mm 2 or more and 100 mm 2 or less.
  • "low electrical resistance" of a conductive circuit for a vehicle means, for example, that the volume resistivity is approximately equivalent to the volume resistivity of pure copper, 1.6 ⁇ 10 ⁇ 8 ⁇ m.
  • the average particle diameter of the conductive particles 11 is preferably 1 ⁇ m or more and 50 ⁇ m or less, more preferably 3 ⁇ m or more and 45 ⁇ m or less.
  • the average particle diameter of the conductive particles 11 is preferably large. However, if the average particle diameter of the conductive particles 11 is too large, the connection between the particles becomes almost a point contact, which may increase the electrical resistance of the conductor. If the average particle diameter of the conductive particles 11 is within the above numerical range, the electrical resistance of the vehicular conductive circuit tends to be low. It becomes possible to flow current.
  • the plating deposited metal arranged between the conductive particles 11 and connecting the conductive particles 11 does not need to be particles.
  • the average particle diameter of the plating deposited metal particles 12 is preferably smaller than the average particle diameter of the conductive particles 11, more preferably 1 nm or more and 100 nm or less, It is more preferably 30 nm or more and 40 nm or less.
  • the conductive particles 11 can be more effectively connected to each other via the plated metal particles 12. Since the plurality of conductive particles 11 dispersed within the conductor are electrically connected by the plating deposited metal particles 12, the conductive circuit for a vehicle manufactured by the above method for manufacturing a conductive circuit for a vehicle has a low electrical resistance. It is possible to flow a low and large current.
  • the conductor of the vehicle conductive circuit manufactured by the above method for manufacturing a vehicle conductive circuit has a structure in which a plurality of dispersed conductive particles 11 are connected by plating deposited metal particles 12. Therefore, the conductor may have voids.
  • the metal constituting the conductive particles 11 and the metal constituting the plating deposited metal particles 12 may be the same kind of metal or may be different kinds of metals.
  • the type of metal constituting the conductive particles 11 and the type of metal constituting the plating deposited metal particles 12 are not particularly limited, but include copper (Cu), nickel (Ni), and silver (Ag). At least one of these may be used. Among these metals, copper is preferred because of its low cost.
  • the plated deposited metal particles 12 that electrically connect the conductive particles 11 are in contact with the surface of the conductive particles 11; Part or all of the surface may be coated.
  • the cross-sectional area of the conductive particles 11 appears to be larger than when the conductive particles 11 are not coated. resistance becomes lower.
  • the film covering the surface of the conductive particles 11 is a single layer. It may be a structure or a multi-layer structure such as a two-layer structure.
  • the method of obtaining a structure in which a part or all of the surface of the conductive particles 11 is covered with the plating deposited metal particles 12 is not particularly limited, but for example, a plurality of conductive particles 11 may be coated electrolessly.
  • a structure can be obtained in which a part or all of the surface of the conductive particles 11 is covered with a film formed by arranging a plurality of plated metal particles 12. That is, when electroless plating is applied to a plurality of conductive particles 11, plating precipitated metal particles 12 having an average particle diameter of, for example, several tens of nanometers are generated on the surface of the conductive particles 11, and the resulting plating precipitated metal particles 12 becomes an aggregate and covers part or all of the surface of the conductive particles 11.
  • the thickness of the wiring 3 formed on the base material 1 is not particularly limited, but is preferably equal to or greater than the average particle diameter of the conductive particles 11, more preferably equal to or greater than 50 ⁇ m, and preferably equal to or greater than 0.1 mm. It is more preferable that it is above. Further, the width of the wiring 3 formed on the base material 1 is not particularly limited, but is preferably 1 mm or more, and more preferably 3 mm or more.
  • the material of the base material is not particularly limited, but resin, steel plate, painted steel plate, and painted aluminum plate can be used.
  • resins include polypropylene, polyethylene, ABS resin (acrylonitrile-butadiene-styrene copolymer), polyethylene terephthalate, and polyurethane.
  • the surface of the base material may be provided with recesses for accommodating the conductive particle paste.
  • a processing step may be included in which a recessed portion for accommodating the conductive particle paste is formed on the surface of the base material.
  • binder The type of binder is not particularly limited as long as it has the property of being hardened by heat, light, etc., and for example, thermosetting resins such as epoxy resins and phenol resins can be used. Alternatively, those containing flux components (oleic acid, carboxylic acid, etc.) can also be used.
  • the type of liquid medium is not particularly limited as long as it is possible to disperse the conductive particles and the binder, and examples thereof include water and organic solvents.
  • An example of an organic solvent is ethylene glycol.
  • the coating process is a process of coating the surface of the base material with the conductive particle paste to form a film of the conductive particle paste on the base material.
  • the method for applying the conductive particle paste is not particularly limited, it can be applied using a dispenser device, an inkjet device, or the like. Coating conditions are not particularly limited, and coating can be performed in an environment of normal temperature and pressure.
  • the curing step is a step in which the binder is cured to modify the film of conductive particle paste into a porous layer having a curing reactant of the conductive particles and the binder.
  • the method for curing the binder is not particularly limited, curing by heat is preferred in view of simultaneously volatilizing the liquid medium.
  • the curing temperature varies depending on the type of binder, it is preferably below the heat resistance temperature of the resin constituting the base material, and can be, for example, 80°C or higher and 120°C or lower.
  • the curing time is not particularly limited and varies depending on the curing temperature, but can be, for example, 5 min or more and 120 min or less.
  • the degree of curing it is possible to complete the curing reaction and obtain a completely cured product, but in order to obtain a completely cured product, the electroless plating solution, the acidic processing solution described below, and the alkaline processing solution will be inside the porous layer. Since there is a risk that the material will not penetrate sufficiently, it is preferable to leave it in a semi-cured state. In addition, if the cross-sectional area of the conductive circuit wiring is large, on the order of square millimeters, there is a risk that regions with low density of conductive particles will be created in the conductor, but by making it in a semi-cured state, this can be avoided. It is possible to sufficiently connect conductive particles even in large areas.
  • the binder is a thermosetting resin
  • the curing reaction of the thermosetting resin is not allowed to proceed until the curing reaction product is completely cured (crosslinked), and a semi-cured state (gelling) is achieved.
  • the curing reaction product can be brought into a semi-cured state by stopping at this state).
  • Electroless plating is performed by impregnating the porous layer with an electroless plating solution, and the conductive particles dispersed inside the porous layer are connected by the plating deposit metal precipitated from the electroless plating solution. This is a step of converting the porous layer into wiring made of a conductor.
  • the method of impregnating the porous layer with the electroless plating solution is not particularly limited, but there is no need to immerse the base material having the porous layer in the electroless plating solution.
  • a method of applying the electroless plating solution to the surface, a method of spraying the electroless plating solution onto the surface of the porous layer, and a method of injecting the electroless plating solution into the inside of the porous layer can be adopted.
  • the method of injecting the electroless plating solution into the inside of the porous layer can be performed using a nozzle that discharges the electroless plating solution. If you insert the discharge port of the nozzle that discharges the electroless plating solution into the porous layer and inject the electroless plating solution into the porous layer from the nozzle discharge port (dispenser type), the inside of the porous layer The electroless plating solution easily soaks into the surface.
  • the material of the nozzle is not particularly limited, it is preferable that the part of the nozzle that comes into contact with the electroless plating solution is made of resin. If it is made of metal, the reaction in which the plating deposit metal is deposited from the electroless plating solution is promoted, so there is a risk that the nozzle will be clogged by the plating deposit metal.
  • the temperature conditions for the plating process are not particularly limited, and the plating process can be performed at room temperature or at a temperature higher than room temperature.
  • the temperature is preferably 25°C or more and 95°C or less, and more preferably 25°C or more and 50°C or less.
  • the operation of impregnating the porous layer with an electroless plating solution and performing electroless plating may be repeated multiple times. That is, the plating process may be performed one time, but may be performed multiple times. By repeating the process a plurality of times, the amount of plating deposited metal increases, so that the conductive particles can be sufficiently connected to each other.
  • the viscosity of the electroless plating solution is lower than that of the electroless plating solution used in the previous operation. It is preferable to use an electroless plating solution with a high . If the viscosity of the electroless plating solution used initially is low, the electroless plating solution will easily penetrate into the porous layer. On the other hand, by increasing the viscosity of the electroless plating solution, leakage of the electroless plating solution from the porous layer can be suppressed.
  • the method for increasing the viscosity of the electroless plating solution is not particularly limited, a method of adding a thickener to the electroless plating solution may be adopted.
  • thickeners include agar, gelatin, and starch.
  • the viscosity of the electroless plating solution at 25° C. may be 0.1 mPa ⁇ s or more and 10 5 mPa ⁇ s or less so that it can be coated with a dispenser device, an inkjet device, or the like.
  • the method for manufacturing a conductive circuit for a vehicle according to the present embodiment may include an alkali treatment step of impregnating the porous layer with an alkaline treatment liquid between the curing step and the plating step. If the alkaline treatment step is carried out, the binder such as the thermosetting resin can be dissolved by the alkaline treatment liquid, so that a porous layer having a sufficient porous structure can be obtained.
  • the type of alkaline treatment liquid is not particularly limited, it may be a strong alkaline aqueous solution. Specific examples of strong alkalis include sodium hydroxide, potassium hydroxide, lithium hydroxide, and calcium hydroxide.
  • the method for manufacturing a conductive circuit for a vehicle according to the present embodiment may include an acid treatment step of impregnating the porous layer with an acid treatment liquid between the curing step and the plating step.
  • an acid treatment step By carrying out the acid treatment step, the oxide film on the surface of the conductive particles can be removed, so that the catalyst described below can easily adhere to the surface of the conductive particles.
  • minute irregularities are formed on the surface of the conductive particles, so the surface of the conductive particles is activated and the plating deposit metal is easily deposited.
  • the type of acidic treatment liquid is not particularly limited, it can be an aqueous solution of a strong acid.
  • strong acids include nitric acid (HNO 3 ), sulfuric acid (H 2 SO 4 ), hydrochloric acid (HCl), sulfamic acid (NH 2 HSO 3 ), phosphoric acid (H 3 PO 4 ), and hydrofluoric acid (HF). ), oxalic acid ((COOH) 2 ), tartaric acid ((CH(OH)COOH) 2 ), citric acid (C(OH)(CH 2 COOH) 2 COOH), formic acid (HCOOH), glycolic acid (HOCH 2 COOH) ), acetic acid (CH 3 COOH).
  • Either one of the alkali treatment step and the acid treatment step may be carried out, or both may be carried out.
  • the electrical resistance of the conductive circuit can be lowered.
  • the surface of the conductive particles can be impregnated with the electroless plating solution in an activated state. The effect of increasing the amount is produced.
  • a catalyst application step of applying a catalyst to the porous layer to promote a reaction in which plating deposited metal is deposited from an electroless plating solution may be provided.
  • a catalyst application step of applying a catalyst to the porous layer to promote a reaction in which plating deposited metal is deposited from an electroless plating solution may be provided.
  • a plating metal film 14 is formed on the surface of the conductor, and when it is in a semi-cured state, a catalyst is applied to the porous layer, so that electroless The amount of plating metal deposited from the plating solution increases.
  • the method of applying the catalyst to the porous layer is not particularly limited; for example, the catalyst may be introduced inside the porous layer, or a conductive particle paste containing a catalyst may be applied to the base material.
  • a porous layer may also be obtained.
  • catalysts include colloidal solutions containing metals. Specific examples of metals include palladium (Pd), copper (Cu), nickel (Ni), cobalt (Co), gold (Au), silver (Ag), rhodium (Rh), platinum (Pt), and indium (In). ) and tin (Sn).
  • Example 1 A paste containing copper powder (corresponding to conductive particles) with an average particle size of 3 ⁇ m, a binder, and a solvent (water, ethylene glycol monophenyl ether, triethanolamine, etc.) (atmospheric hardening manufactured by Namics Co., Ltd.) Copper paste XCH9207) was prepared. This paste was applied to the surface of the resin plate-shaped member as a base material using a dispenser device to form a paste film on the surface of the resin plate-shaped member (coating step). Then, the resin plate member on which the paste film was formed was placed in an air atmosphere and heated at a temperature of 120° C. for 120 minutes to dry the paste. By this heat treatment during drying, the curing reaction of the binder in the paste progressed, and the curing reaction product was completely cured (crosslinked) (curing step).
  • a solvent water, ethylene glycol monophenyl ether, triethanolamine, etc.
  • the resin constituting the resin plate member is a mixed resin material of polypropylene and acrylonitrile-butadiene-styrene copolymer.
  • the shape of the resin plate member is rectangular, and its dimensions are 150 mm long, 75 mm wide, and 3 mm thick.
  • the shape of the paste film is linear, and its dimensions are 100 mm in length, 4 mm in width, and 0.3 mm in thickness.
  • an electroless copper plating solution OPC Copper HFS manufactured by Okuno Pharmaceutical Co., Ltd. was prepared. That is, an electroless copper plating solution was prepared by mixing OPC Copper HFS-M, OPC Copper HFS-A, and OPC Copper HFS-C manufactured by Okuno Pharmaceutical Co., Ltd. at a mixing ratio of 150:60:4. did. The viscosity of the obtained electroless copper plating solution at 25° C. was 0.89 mPa ⁇ s. This electroless copper plating solution was applied to the surface of the dried paste film using an inkjet device, impregnated into the inside of the dried paste film, and left in an air atmosphere at 25°C for 120 minutes. Electroless copper plating was performed (plating process).
  • volume resistivity ( ⁇ m) Electrical resistance value ( ⁇ ) ⁇ Cross-sectional area of conductive circuit wiring (m 2 ) / Length of conductive circuit wiring (m)
  • Example 2 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that the heat treatment conditions in the curing step were 120° C. and 20 minutes. As a result, the volume resistivity was 5.0 ⁇ 10 ⁇ 8 ⁇ m. Although the curing reaction of the binder in the paste progressed through the heat treatment in the curing step, the curing reaction product was not completely cured (not crosslinked) and was in a semi-cured state.
  • Example 3 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that the heat treatment conditions in the curing step were 100° C. and 20 minutes. As a result, the volume resistivity was 6.0 ⁇ 10 ⁇ 7 ⁇ m. Although the curing reaction of the binder in the paste progressed through the heat treatment in the curing step, the curing reaction product was not completely cured (not crosslinked) and was in a semi-cured state.
  • Example 4 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that the plating process conditions were 60° C. and 120 min. As a result, the volume resistivity was 3.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 5 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that the plating process was repeated twice. The contents of the two plating steps are the same. As a result, the volume resistivity was 4.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 6 In the plating process, the volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1, except that the electroless copper plating solution was applied as follows. In other words, the electroless copper plating solution is applied by inserting the discharge port of a nozzle that discharges the electroless plating solution into the inside of the dried paste film, and injecting the electroless copper plating solution from the discharge port of the nozzle into the inside of the dried paste film. I did it. As a result, the volume resistivity was 4.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 7 The plating process was repeated twice, and the viscosity at 25°C of the electroless copper plating solution used for the first time was 0.89 mPa ⁇ s, and the viscosity at 25°C of the electroless copper plating solution used for the second time was 2000 mPa ⁇ s.
  • the volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that.
  • the viscosity of the electroless copper plating solution was adjusted by adding gelatin as a thickener. As a result, the volume resistivity was 2.5 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 8 A recess for accommodating the paste was provided on the surface of the resin plate-like member that was the base material, and the paste was applied in the recess to form a paste film in the same manner as in Example 1.
  • the volume resistivity of the conductive circuit of the test specimen was obtained. As a result, the volume resistivity was 3.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 9 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that an acid treatment step was performed between the curing step and the plating step. That is, the dried paste film was coated with an acidic treatment liquid using a dispenser device, left to stand for 5 minutes at room temperature to be impregnated, and then washed with water and dried.
  • the acidic treatment liquid is nitric acid with a concentration of 60% by mass. As a result, the volume resistivity was 2.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 10 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that an alkali treatment step was performed between the curing step and the plating step. That is, an alkaline treatment liquid was applied to the dried paste film using a dispenser device, and the paste was left at room temperature for 5 minutes to be impregnated, and then washed with water and dried.
  • the alkaline treatment liquid is an aqueous sodium hydroxide solution with a pH of 12. As a result, the volume resistivity was 3.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 11 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1, except that the alkali treatment step and acid treatment step were carried out in the stated order between the curing step and the plating step.
  • the contents of the alkali treatment step and acid treatment step are the same as in Examples 9 and 10, respectively.
  • the volume resistivity was 1.5 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 12 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1, except that the alkali treatment step, acid treatment step, and catalyst application step were performed in the stated order between the curing step and the plating step. .
  • the contents of the alkali treatment step and acid treatment step are the same as in Examples 9 and 10, respectively.
  • the catalyst application process is a process of applying a catalyst that promotes the reaction in which copper is deposited from the electroless copper plating solution.
  • the catalyst-containing solution is applied to the dried paste film using a dispenser device, and then the catalyst is applied in an air atmosphere.
  • the catalyst was applied to the dried paste film by leaving it at room temperature for 5 minutes for impregnation, then washing with water and drying.
  • the catalyst-containing liquid is Metalloid ML-450LV2 manufactured by Iox Co., Ltd. As a result, the volume resistivity was 1.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 13 In the coating process, the volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1, except that the paste was coated on the surface of the resin plate member using an inkjet device. As a result, the volume resistivity was 6.0 ⁇ 10 ⁇ 8 ⁇ m.
  • Example 1 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1, except that the heat treatment conditions in the curing step were 150° C. and 120 min, and the plating step was not performed. As a result, the volume resistivity was 1.8 ⁇ 10 ⁇ 8 ⁇ m. Further, since the temperature of the heat treatment in the curing step was high, the resin plate member melted due to the heat treatment.
  • Example 2 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1 except that the plating process was not performed. As a result, the volume resistivity was 1.2 ⁇ 10 ⁇ 6 ⁇ m.
  • Example 3 The volume resistivity of the conductive circuit of the test piece was obtained in the same manner as in Example 1, except that the heat treatment conditions in the curing step were 100° C. and 120 min, and the plating step was not performed. As a result, the volume resistivity was 1.5 ⁇ 10 ⁇ 5 ⁇ m.
  • the results of Examples 1 to 13 and Comparative Examples 1 to 3 are summarized in Table 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
PCT/JP2023/028337 2022-08-25 2023-08-02 車両用導電回路の製造方法 Ceased WO2024043026A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024542711A JPWO2024043026A1 (https=) 2022-08-25 2023-08-02

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022134155 2022-08-25
JP2022-134155 2022-08-25

Publications (1)

Publication Number Publication Date
WO2024043026A1 true WO2024043026A1 (ja) 2024-02-29

Family

ID=90013033

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/028337 Ceased WO2024043026A1 (ja) 2022-08-25 2023-08-02 車両用導電回路の製造方法

Country Status (2)

Country Link
JP (1) JPWO2024043026A1 (https=)
WO (1) WO2024043026A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293952A (ja) * 1996-04-26 1997-11-11 Kyocera Corp 配線基板の製造方法
JP2001073157A (ja) * 1999-09-08 2001-03-21 Sony Corp 無電解めっき方法及びその装置
JP2005302842A (ja) * 2004-04-07 2005-10-27 Toshiba Corp 配線基板作成用トナー、及びこれを用いた配線基板の製造方法
WO2005102709A1 (en) * 2004-04-23 2005-11-03 Hewlett-Packard Development Company, L.P. Inkjet print cartridge
JP2006332553A (ja) * 2005-05-30 2006-12-07 Fujifilm Holdings Corp 配線基板製造方法及び吐出ヘッド並びに画像形成装置
JP2011012312A (ja) * 2009-07-02 2011-01-20 Toyota Motor Corp 無電解めっき処理方法及び無電解めっき材
WO2014132961A1 (ja) * 2013-03-01 2014-09-04 戸田工業株式会社 導電性塗膜の製造方法及び導電性塗膜
JP2016025329A (ja) * 2014-07-24 2016-02-08 学校法人福岡大学 プリント配線板及びその製造方法
WO2020004624A1 (ja) * 2018-06-29 2020-01-02 株式会社マテリアル・コンセプト 配線基板及びその製造方法、並びに電子部品及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293952A (ja) * 1996-04-26 1997-11-11 Kyocera Corp 配線基板の製造方法
JP2001073157A (ja) * 1999-09-08 2001-03-21 Sony Corp 無電解めっき方法及びその装置
JP2005302842A (ja) * 2004-04-07 2005-10-27 Toshiba Corp 配線基板作成用トナー、及びこれを用いた配線基板の製造方法
WO2005102709A1 (en) * 2004-04-23 2005-11-03 Hewlett-Packard Development Company, L.P. Inkjet print cartridge
JP2006332553A (ja) * 2005-05-30 2006-12-07 Fujifilm Holdings Corp 配線基板製造方法及び吐出ヘッド並びに画像形成装置
JP2011012312A (ja) * 2009-07-02 2011-01-20 Toyota Motor Corp 無電解めっき処理方法及び無電解めっき材
WO2014132961A1 (ja) * 2013-03-01 2014-09-04 戸田工業株式会社 導電性塗膜の製造方法及び導電性塗膜
JP2016025329A (ja) * 2014-07-24 2016-02-08 学校法人福岡大学 プリント配線板及びその製造方法
WO2020004624A1 (ja) * 2018-06-29 2020-01-02 株式会社マテリアル・コンセプト 配線基板及びその製造方法、並びに電子部品及びその製造方法

Also Published As

Publication number Publication date
JPWO2024043026A1 (https=) 2024-02-29

Similar Documents

Publication Publication Date Title
KR101247431B1 (ko) 구리 도체막 및 그 제조방법, 도전성 기판 및 그 제조방법, 구리 도체 배선 및 그 제조방법, 및 처리액
US9676969B2 (en) Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
US3099608A (en) Method of electroplating on a dielectric base
US10306774B2 (en) Laminate structure of metal coating
KR100678533B1 (ko) 도전성 분말 및 그 제조 방법
CN105121700B (zh) 立体导电图案结构体的制造方法及用于其的立体成型用材料
KR101520412B1 (ko) 레이저와 인쇄방식이 하이브리드된 플렉서블 기판 및 이의 제조 방법
CN103220884A (zh) 线路基板结构及其制作方法
JP2016199779A (ja) 修飾金属ナノ粒子，その製造方法，修飾金属ナノインク及び配線層形成方法
CN1282202C (zh) 导电糊膏及其生产方法以及用其制成的印刷线路板
KR900003158B1 (ko) 기판상의 전기회로 형성방법
KR101416579B1 (ko) 도금층을 구비한 도전성 페이스트 인쇄회로기판 및 이의 제조방법
WO2024043026A1 (ja) 車両用導電回路の製造方法
TWI425888B (zh) 線路基板結構及其製作方法
JP2006303368A (ja) 回路基板の製造方法
CN114231092A (zh) 一种铜导电油墨、柔性基底及柔性基底的制备方法
JP3784368B2 (ja) 回路基板およびその製造方法
WO2025013117A1 (ja) 導電回路及び導電回路の製造方法
JP2009123567A (ja) 導電回路を有する合成樹脂製のばね
JP2001026880A (ja) 導体パターン形成方法
KR102195144B1 (ko) 도전성 페이스트 및 도전막을 구비한 기재
JP2025102143A (ja) 導電回路の製造方法
JPH0480374A (ja) プリント配線板の製造方法
JPS62229601A (ja) 樹脂硬化型導電性ペ−ストおよび導電性回路板の製造方法
JP2004186630A (ja) 導電性塗布組成物、電子回路用導電体、その形成方法及び電子回路用品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23855855

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2024542711

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 23855855

Country of ref document: EP

Kind code of ref document: A1