JPWO2024043026A1 - - Google Patents
Info
- Publication number
- JPWO2024043026A1 JPWO2024043026A1 JP2024542711A JP2024542711A JPWO2024043026A1 JP WO2024043026 A1 JPWO2024043026 A1 JP WO2024043026A1 JP 2024542711 A JP2024542711 A JP 2024542711A JP 2024542711 A JP2024542711 A JP 2024542711A JP WO2024043026 A1 JPWO2024043026 A1 JP WO2024043026A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022134155 | 2022-08-25 | ||
| PCT/JP2023/028337 WO2024043026A1 (ja) | 2022-08-25 | 2023-08-02 | 車両用導電回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024043026A1 true JPWO2024043026A1 (https=) | 2024-02-29 |
| JPWO2024043026A5 JPWO2024043026A5 (https=) | 2025-06-03 |
Family
ID=90013033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024542711A Pending JPWO2024043026A1 (https=) | 2022-08-25 | 2023-08-02 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024043026A1 (https=) |
| WO (1) | WO2024043026A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293952A (ja) * | 1996-04-26 | 1997-11-11 | Kyocera Corp | 配線基板の製造方法 |
| JP2001073157A (ja) * | 1999-09-08 | 2001-03-21 | Sony Corp | 無電解めっき方法及びその装置 |
| JP2005302842A (ja) * | 2004-04-07 | 2005-10-27 | Toshiba Corp | 配線基板作成用トナー、及びこれを用いた配線基板の製造方法 |
| WO2005102709A1 (en) * | 2004-04-23 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Inkjet print cartridge |
| JP2006332553A (ja) * | 2005-05-30 | 2006-12-07 | Fujifilm Holdings Corp | 配線基板製造方法及び吐出ヘッド並びに画像形成装置 |
| JP2011012312A (ja) * | 2009-07-02 | 2011-01-20 | Toyota Motor Corp | 無電解めっき処理方法及び無電解めっき材 |
| WO2014132961A1 (ja) * | 2013-03-01 | 2014-09-04 | 戸田工業株式会社 | 導電性塗膜の製造方法及び導電性塗膜 |
| JP2016025329A (ja) * | 2014-07-24 | 2016-02-08 | 学校法人福岡大学 | プリント配線板及びその製造方法 |
| WO2020004624A1 (ja) * | 2018-06-29 | 2020-01-02 | 株式会社マテリアル・コンセプト | 配線基板及びその製造方法、並びに電子部品及びその製造方法 |
-
2023
- 2023-08-02 JP JP2024542711A patent/JPWO2024043026A1/ja active Pending
- 2023-08-02 WO PCT/JP2023/028337 patent/WO2024043026A1/ja not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293952A (ja) * | 1996-04-26 | 1997-11-11 | Kyocera Corp | 配線基板の製造方法 |
| JP2001073157A (ja) * | 1999-09-08 | 2001-03-21 | Sony Corp | 無電解めっき方法及びその装置 |
| JP2005302842A (ja) * | 2004-04-07 | 2005-10-27 | Toshiba Corp | 配線基板作成用トナー、及びこれを用いた配線基板の製造方法 |
| WO2005102709A1 (en) * | 2004-04-23 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Inkjet print cartridge |
| JP2006332553A (ja) * | 2005-05-30 | 2006-12-07 | Fujifilm Holdings Corp | 配線基板製造方法及び吐出ヘッド並びに画像形成装置 |
| JP2011012312A (ja) * | 2009-07-02 | 2011-01-20 | Toyota Motor Corp | 無電解めっき処理方法及び無電解めっき材 |
| WO2014132961A1 (ja) * | 2013-03-01 | 2014-09-04 | 戸田工業株式会社 | 導電性塗膜の製造方法及び導電性塗膜 |
| JP2016025329A (ja) * | 2014-07-24 | 2016-02-08 | 学校法人福岡大学 | プリント配線板及びその製造方法 |
| WO2020004624A1 (ja) * | 2018-06-29 | 2020-01-02 | 株式会社マテリアル・コンセプト | 配線基板及びその製造方法、並びに電子部品及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024043026A1 (ja) | 2024-02-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
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| A621 | Written request for application examination |
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