WO2024031833A1 - 显示面板、显示装置及显示面板的制备方法 - Google Patents

显示面板、显示装置及显示面板的制备方法 Download PDF

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Publication number
WO2024031833A1
WO2024031833A1 PCT/CN2022/126259 CN2022126259W WO2024031833A1 WO 2024031833 A1 WO2024031833 A1 WO 2024031833A1 CN 2022126259 W CN2022126259 W CN 2022126259W WO 2024031833 A1 WO2024031833 A1 WO 2024031833A1
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Prior art keywords
electrode
substrate
display panel
layer
orthographic projection
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Ceased
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PCT/CN2022/126259
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English (en)
French (fr)
Inventor
颜志敏
邢汝博
高思明
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Priority to KR1020247012858A priority Critical patent/KR102903417B1/ko
Priority to JP2024523811A priority patent/JP7729987B2/ja
Publication of WO2024031833A1 publication Critical patent/WO2024031833A1/zh
Priority to US18/650,406 priority patent/US20240284721A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present application relates to the field of display, and specifically to a display panel, a display device, and a method for preparing a display panel.
  • Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, so that at least part of the display panel can be light-transmissive and displayable, thereby facilitating the under-screen integration of photosensitive components.
  • a first embodiment of the present application provides a display panel.
  • the display panel includes: a substrate; a first electrode layer located on the substrate, the first electrode layer including a first electrode; and a pixel definition layer located on a side of the first electrode layer away from the substrate.
  • the pixel definition layer includes an isolation portion and a first opening surrounded by the isolation portion, and the first electrode is at least partially exposed through the first opening; a second electrode layer, at least a portion of the second electrode layer is located on a side of the pixel definition layer facing away from the substrate.
  • the second electrode layer includes a body part and a hollow part penetrating the body part, and the orthographic projection of the hollow part and the first electrode on the substrate is not arranged to overlap.
  • the pixel definition layer further includes a second opening provided through the pixel definition layer, and the orthographic projection of the hollow portion on the substrate is located within the orthographic projection of the second opening on the substrate. The distance between the second electrode layer and the first electrode layer can be further reduced.
  • At least part of the edge of the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the second opening on the substrate. Ensure that the edge of the body part and the first electrode are close to each other to better improve the problem of the body part turning up toward the edge of the hollow part.
  • the first electrode layer further includes a second electrode, the hollow portion and the second electrode, and the orthographic projection of the first electrode on the substrate are not arranged to overlap, and the second electrode is on the substrate. At least part of the edge of the orthographic projection is located within the orthographic projection of the second opening on the substrate.
  • the maximum distance between the second electrode and the body part in the thickness direction of the display panel is less than or equal to 0.8 ⁇ m.
  • a gap exists between the first electrode and the second electrode.
  • the first electrodes and the second electrodes are arranged in one-to-one correspondence, and each second electrode is arranged around each first electrode to form an annular gap on the peripheral side of each first electrode.
  • the width of the gap is 0.5 ⁇ m ⁇ 10 ⁇ m.
  • the isolation portion and the first electrode are arranged in one-to-one correspondence, and the isolation portion is annular, and the orthographic projection of each gap on the substrate is located within the orthographic projection of each isolation portion on the substrate. .
  • a second opening is formed between two adjacent isolation parts, and the edges of the orthographic projections of the second electrodes located on opposite sides of the second opening on the substrate are located in the second opening.
  • the edges of the orthographic projections of the second electrodes located on opposite sides of the second opening on the substrate are located in the second opening.
  • a metal shielding layer is also included, located on the side of the first electrode layer away from the pixel definition layer.
  • the metal shielding layer includes a shielding part, and the orthographic projection of the gap on the substrate is located on the shielding part on the substrate. Within the orthographic projection on the substrate, the orthographic projection of the hollow portion on the substrate and the orthographic projection of the shielding portion on the substrate are not arranged to overlap.
  • the shielding part of the metal shielding layer can shield the laser, so that the second conductive material corresponding to the gap can remain.
  • At least part of the orthographic projection of the second opening on the substrate is located within the orthographic projection of the shielding portion on the substrate.
  • the shielding part includes:
  • the first division extends in a strip shape along the second direction, and a plurality of first divisions are arranged side by side along the first direction;
  • the second subsection extends along the first direction and is connected to a plurality of first subsections, and the orthographic projection of at least part of the body part on the substrate is located within the orthographic projection of the first subsection on the substrate;
  • each gap and each second opening on the substrate is located within the orthographic projection of the same first segment on the substrate.
  • the body parts can be connected with each other to form a common electrode on the entire surface.
  • the display panel has a first area and a second area surrounding at least part of the first area, the first sub-section is located in the first area, and the second sub-section is located in the second area.
  • the distribution area of the body part in the first area can be further reduced and the light transmittance of the first area can be improved.
  • a second embodiment of the present application provides a display device, which includes the display panel of any of the above embodiments.
  • a third embodiment of the present application provides a method for manufacturing a display panel, including:
  • An insulating material layer is prepared on the side of the first electrode layer facing away from the substrate, and the insulating material layer is patterned to form a pixel definition layer.
  • the pixel definition layer includes an isolation portion and a first opening surrounded by the isolation portion. The first electrode at least partially exposed by the first opening;
  • the second conductive material layer is laser etched from the side of the substrate away from the first electrode layer to form a second electrode layer.
  • the second electrode layer includes a body part and a hollow part penetrating the body part.
  • the hollow part and the first electrode are on the substrate. Orthographic projection on non-overlap setting.
  • the display panel includes a substrate and a first electrode layer, a pixel definition layer and a second electrode layer provided on the substrate.
  • the first electrode layer includes a first electrode
  • the second electrode layer includes a body part and a hollow part
  • the orthographic projections of the hollow part and the first electrode on the substrate do not overlap.
  • the first electrode layer can be used as a mask, and a laser is emitted from the side of the substrate away from the first electrode layer toward the second electrode layer, thereby forming a hollow portion.
  • providing a hollow portion in the second electrode layer can reduce the distribution area of the body portion, thereby improving the light transmittance of the display panel, and integrating photosensitive components on the non-display side of the display panel.
  • one of the first electrode layer and the second electrode layer is disposed on one side of the pixel definition layer, and the other is disposed on the other side of the pixel definition layer, between the first electrode layer and the second electrode layer. The short distance can prevent the body part from being folded toward the edge of the hollow part caused by laser diffraction, thereby avoiding affecting the packaging effect of the subsequent packaging process.
  • the first electrode layer can be used as a mask, and a hollow portion can be formed on the second electrode layer to improve the light transmittance of the display panel and facilitate the under-screen integration of photosensitive components. Moreover, due to the short distance between the first electrode layer and the second electrode layer, it is possible to avoid the main body portion being folded toward the edge of the hollow portion caused by laser diffraction, thereby avoiding affecting the packaging effect of the subsequent packaging process.
  • Figure 1 is a schematic structural diagram of a display panel provided by the first embodiment of the present application.
  • Figure 2 is a cross-sectional view at A-A in Figure 1;
  • Figure 3 is a cross-sectional view of A-A in Figure 1 in another embodiment
  • Figure 4 is yet another cross-sectional view at A-A in Figure 1;
  • Figure 5 is a cross-sectional view of A-A in Figure 1 in yet another embodiment
  • Figure 6 is a partial enlarged structural diagram of Q in Figure 1;
  • Figure 7 is a cross-sectional view of A-A in Figure 1 in yet another embodiment
  • Figure 8 is a partial enlarged structural schematic diagram of Q in Figure 1 in yet another embodiment
  • FIG. 9 is a schematic flowchart of a method for manufacturing a display panel according to the third embodiment of the present application.
  • a light-transmitting display area can be provided on the above-mentioned electronic device, and the photosensitive component can be arranged on the back of the light-transmitting display area, so as to achieve a full-screen display of the electronic device while ensuring the normal operation of the photosensitive component.
  • the common electrode is patterned.
  • the common electrode is hollowed out in the light-transmitting area of the display panel to increase the light transmittance of the common electrode, thereby increasing the light transmittance of the light-transmitting area of the display panel.
  • methods such as laser ashing are generally used to achieve patterning of the common electrode.
  • the common electrode is patterned from the side of the substrate away from the array film layer.
  • Laser irradiation uses the light-shielding metal layer in the array film layer as a mask to achieve laser etching and patterning of the common electrode. After the common electrode is laser etched and patterned, the edge of the common electrode is easily folded, which affects subsequent thin film packaging and other processes, affecting the reliability of the packaging process.
  • embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel.
  • a display panel a display device, and a method for manufacturing a display panel.
  • An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.
  • a display panel which may be an organic light emitting diode (OLED) display panel.
  • FIG. 1 is a schematic structural diagram of a display panel 10 provided by the first embodiment of the present application.
  • FIG. 2 is a cross-sectional view along the line A-A in FIG. 1 .
  • the display panel 10 provided by the first embodiment of the present application includes: a substrate 100 , a first electrode layer 200 , a pixel definition layer 300 and a second electrode layer 400 , wherein the first electrode layer 200 Located on the substrate 100, the first electrode layer 200 includes the first electrode 210; the pixel definition layer 300 is located on the side of the first electrode layer 200 facing away from the substrate 100.
  • the pixel definition layer 300 includes an isolation portion 310 and a pixel surrounded by the isolation portion 310.
  • the first opening 320, the first electrode 210 is at least partially exposed through the first opening 320; at least part of the second electrode layer 400 is located on the side of the pixel definition layer 300 away from the substrate 100, and the second electrode layer 400 includes a body part 410 and a through-body part.
  • the hollow portion 420 of 410, the orthographic projection of the hollow portion 420 and the first electrode 210 on the substrate 100 are not arranged to overlap.
  • the embodiment of the present application provides a display panel 10.
  • the display panel 10 includes a substrate 100 and a first electrode layer 200, a pixel definition layer 300 and a second electrode layer 400 provided on the substrate 100.
  • the first electrode layer 200 includes a first electrode 210 .
  • the pixel definition layer 300 includes a first opening 320 and an isolation portion 310.
  • a light-emitting unit (not shown in the figure) can be disposed in the first opening 320, and the first electrode 210 is exposed through the first opening 320, so that the first electrode 210 can drive the first electrode 210.
  • a light-emitting unit in an opening 320 emits light.
  • the second electrode layer 400 includes a body part 410 and a hollow part 420, and the hollow part 420 and the orthographic projection of the first electrode 210 on the substrate 100 do not overlap. That is, the hollow part 420 and the first opening 320 are misaligned, which can avoid Affect the display effect of the display panel 10.
  • the first electrode layer 200 can be used as a shielding layer.
  • the first electrode 210 can be used as a mask plate, and a portion of the substrate 100 facing away from the first electrode layer 200 can be used.
  • the laser is emitted toward the second electrode layer 400 , and the second electrode layer 400 is laser etched to form the hollow portion 420 .
  • providing the hollow portion 420 in the second electrode layer 400 can reduce the distribution area of the body portion 410, thereby improving the light transmittance of the display panel 10, and integrating photosensitive components on the non-display side of the display panel 10.
  • one of the first electrode layer 200 and the second electrode layer 400 is disposed on one side of the pixel definition layer 300, and the other is disposed on the other side of the pixel definition layer 300.
  • the first electrode layer 200 and the second electrode layer 400 are disposed on one side of the pixel definition layer 300.
  • the short distance between the two electrode layers 400 can reduce or avoid the problem that the body part 410 caused by laser diffraction is folded toward the edge of the hollow part 420 and affects the packaging effect of the subsequent packaging process, thereby affecting the display effect of the display panel 10 .
  • the beneficial effects of the display panel 10 provided by the present application are: on the one hand, providing the hollow portion 420 in the second electrode layer 400 can reduce the distribution area of the body portion 410, thereby improving the light transmittance of the display panel 10, and enabling the display panel to 10 integrates a photosensitive component on the non-display side.
  • one of the first electrode layer 200 and the second electrode layer 400 is disposed on one side of the pixel definition layer 300, and the other is disposed on the other side of the pixel definition layer 300.
  • the first electrode layer 200 and the second electrode layer 400 are disposed on one side of the pixel definition layer 300.
  • the short distance between the two electrode layers 400 can prevent the body part 410 from being folded toward the edge of the hollow part 420 caused by laser diffraction, thereby avoiding affecting the packaging effect of the subsequent packaging process.
  • the substrate 100 can include a substrate and an array film layer arranged on the substrate; or the substrate 100 is the substrate; or the substrate 100 also includes a buffer layer and a support plate on the side facing away from the substrate. wait.
  • the first electrode layer 200 is, for example, an anode layer
  • the second electrode layer 400 is a cathode layer.
  • the first electrode 210 in the first electrode layer 200 serves as the anode
  • the body portion 410 of the second electrode layer 400 serves as the cathode.
  • the edge of the orthographic projection of the first electrode 210 on the substrate 100 is located within the orthographic projection of the isolation portion 310 on the substrate 100 , and the orthographic projection of each first opening 320 on the substrate 100 is located within the orthographic projection of each first electrode 210 .
  • the contact area between the first electrode 210 and the light-emitting unit can be increased, thereby improving the light-emitting effect.
  • the display panel 10 has a first display area AA1 , a second display area AA2 and a non-display area surrounding the first display area AA1 and the second display area AA2 , wherein, The first display area AA1 and the second display area AA2 are display areas, and the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2.
  • the light transmittance of the first display area AA1 is greater than or equal to 15%.
  • the transmittance of each functional film layer of the display panel 10 located in the first display area AA1 in this embodiment is The light transmittance is greater than 80%, and even the light transmittance of at least some functional film layers is greater than 90%.
  • the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2.
  • the photosensitive component can be integrated on the non-display side of the first display area AA1 of the display panel 10 to achieve
  • the photosensitive component of the camera is integrated under the screen, and at the same time, the first display area AA1 can display the image, which increases the display area of the display panel 10 and realizes a full-screen design of the display device.
  • the hollow portion 420 of the second electrode layer 400 can be located in the first display area AA1 to improve the light transmittance of the first display area AA1.
  • the hollow portion 420 of the second electrode layer 400 can also be located in the first display area AA1 and the second display area AA2 at the same time to improve the light transmittance of the entire display area. It can be understood that the embodiments provided in this application can be set in the first display area AA1 and/or the second display area AA2, and the settings are specifically set according to the actual situation.
  • FIG. 3 is a cross-sectional view of A-A in FIG. 1 in another embodiment.
  • the pixel definition layer 300 further includes a second opening 330 provided through the pixel definition layer 300 , and the orthographic projection of the hollow portion 420 on the substrate 100 is located in the second opening. 330 is within the orthographic projection on the substrate 100.
  • a second conductive material layer is first formed on the pixel definition layer 300, and then the second conductive material layer is patterned to form a second conductive material layer.
  • the second conductive material layer can be deposited directly within the second opening 330 to further reduce the distance between the second conductive material layer and the first electrode layer 200 .
  • the hollow portion 420 can be formed in the area corresponding to the second opening 330 , which can better improve the edge of the body portion 410 facing the hollow portion 420
  • the issue of turning up is specifically because the closer the distance, the smaller the diffraction and the better the laser focusing effect. Therefore, the impact of the edge turning up of the body part 410 on the subsequent packaging process can be better improved.
  • common layers such as a hole transport layer, a hole injection layer, an electron transport layer and an electron injection layer are prepared on the pixel definition layer 300, these common layers are also provided between the first electrode 210 and the second conductive material layer. layer.
  • Figure 4 is a partial enlarged structural diagram of Q in Figure 1.
  • FIG. 4 only illustrates the relative positional relationship between the first electrode layer 200 and the pixel definition layer 300 .
  • At least part of the edge of the orthographic projection of the first electrode 210 on the substrate 100 is located within the orthographic projection of the second opening 330 on the substrate 100 , that is, the third An electrode 210 at least partially extends from one side of the isolation portion 310 toward the substrate 100 into the second opening 330 .
  • the first electrode 210 When the first electrode 210 is used to pattern the second electrode layer 400 to form the body portion 410, due to the shielding effect of the first electrode 210, an unetched body portion 410 is formed in the area where the first electrode 210 is located. At least part of the edge of the orthographic projection of the first electrode 210 on the substrate 100 is located within the orthographic projection of the second opening 330 on the substrate 100, which can ensure that the edge of the body portion 410 facing the hollow portion 420 is located within the second opening 330, ensuring that the body The edge of the portion 410 is closer to the first electrode 210 , which better improves the problem of the body portion 410 turning up toward the edge of the hollow portion 420 .
  • the first electrode layer 200 also includes a second electrode 220 , and the hollow portion 420 does not overlap with the orthographic projections of the second electrode 220 and the first electrode 210 on the substrate 100 . .
  • the first electrode layer 200 can be better able to perform the process of laser ashing the second electrode layer 400 to form the hollow portion 420 without affecting the normal operation of the first electrode 210. Acts as a mask.
  • no common layer or other structure may be provided between the second electrode 220 and the second electrode layer 400 to further reduce the distance between the second electrode 220 and the second electrode layer 400 .
  • At least part of the edge of the orthographic projection of the second electrode 220 on the substrate 100 is located within the orthographic projection of the second opening 330 on the substrate 100 , that is, the second electrode 220 is at least A portion extends from the side of the isolation portion 310 toward the substrate 100 into the second opening 330 .
  • the second electrode 220 when the second electrode 220 is used to pattern the second electrode layer 400 to form the body part 410, due to the shielding effect of the second electrode 220, the area where the second electrode 220 is located forms an unetched body. Department 410. At least part of the edge of the orthographic projection of the second electrode 220 on the substrate 100 is located within the orthographic projection of the second opening 330 on the substrate 100, which can ensure that the edge of the body portion 410 facing the hollow portion 420 is located within the second opening 330, ensuring that the body The edge of the portion 410 is closer to the second electrode 220 , which better improves the problem of the body portion 410 turning up toward the edge of the hollow portion 420 .
  • the maximum distance between the second electrode 220 and the body part 410 in the thickness direction of the display panel 10 is less than or equal to 0.8 ⁇ m.
  • the maximum distance between the second electrode 220 and the main body 410 in the thickness direction of the display panel 10 is less than or equal to 0.8 ⁇ m.
  • the second electrode 220 and the main body 410 are in The distance in the thickness direction of the display panel 10 may be 200 nm, 500 nm, 800 nm, etc.
  • the second electrode 220 and the first opening 320 are disposed in an offset manner, that is, the orthographic projection of the second electrode 220 on the substrate 100 and the orthographic projection of the first opening 320 on the substrate 100 do not overlap. This prevents the second electrode 220 from affecting the light-emitting effect of the light-emitting unit in the first opening 320.
  • a gap 230 exists between the first electrode 210 and the second electrode 220 to avoid mutual interference between the second electrode 220 and the body portion 410 of the second electrode layer 400 .
  • the first electrode 210 is connected through the second electrode 220 and the body portion 410 of the second electrode layer 400 to be short-circuited, which can further improve the yield of the display panel 10 .
  • the laser heat can also be blocked from being transmitted to the light-emitting unit through the first electrode 210 to affect the display effect.
  • the optional width of the gap 230 is 0.5 ⁇ m to 10 ⁇ m. Specifically, the size of the gap 230 can be 0.5 ⁇ m, 1 ⁇ m, 5 ⁇ m, etc., which can improve the problem caused by the gap 230 being too small.
  • the short-circuit connection between the two electrodes 220 and the body part 410 can also improve the problem that the gap 230 is too large, resulting in the formation of vias on the second electrode layer 400 corresponding to the position of the gap 230 when the first electrode layer 200 is used as a mask.
  • the hole affects the overlapping area of the first electrode 210 and the second electrode layer 400 and affects the light-emitting effect of the light-emitting unit. It can be understood that the width of the gap 230 refers to the size in the first direction X.
  • the first electrode 210 and the second electrode 220 can be arranged in various ways.
  • a second electrode 220 can be arranged between two adjacent first electrodes 210 .
  • the first electrodes 210 and the second electrodes 220 are arranged in one-to-one correspondence, and each second electrode 220 is arranged around each first electrode 210 to form a gap between each first electrode 210 .
  • An annular gap 230 is formed on the peripheral side.
  • each first electrode 210 is provided with a corresponding second electrode 220, and a hollow portion 420 can be formed between two adjacent second electrodes 220, which can increase the distribution area of the hollow portion 420.
  • the distribution area of the main body part 410 is reduced and the light transmittance of the display panel 10 is improved.
  • the second electrode 220 is arranged around the first electrode 210 to ensure that the hollow portion 420 and the first electrode 210 do not overlap and prevent the hollow portion 420 from affecting the light emission of the light-emitting unit in the first opening 320 .
  • the annular gap 230 can ensure mutual insulation between the second electrode 220 and the first electrode 210 and prevent the first electrode 210 from being short-circuited through the second electrode 220 and the body portion 410 of the second electrode layer 400 .
  • the isolation portion 310 and the first electrode 210 are arranged in one-to-one correspondence, and the isolation portion 310 is annular, and the orthographic projection of each gap 230 on the substrate 100 is located at each isolation portion. 310 is within the orthographic projection on the substrate 100 .
  • the isolation portion 310 is annular, which can form a larger second opening 330 between adjacent isolation portions 310 and further increase the size of the closely spaced second electrode 200 and the third opening.
  • the distribution area of the two electrode layers 400 can better improve the problem of the edge of the body part 410 being turned up due to laser diffraction.
  • each gap 230 on the substrate 100 is located within the orthographic projection of each isolation portion 310 on the substrate 100 , and the body portion 410 of the second electrode layer 400 is located on the side of the isolation portion 310 away from the first electrode layer 200 , therefore the mutual insulation of the second electrode layer 400 and the first electrode 210 can be ensured.
  • a second opening 330 is formed between two adjacent isolation portions 310 , and the edges of the orthographic projections of the second electrodes 220 located on opposite sides of the second opening 330 on the substrate 100 are located there.
  • the second opening 330 is within the orthographic projection on the substrate 100 .
  • Second electrodes 220 are disposed on both sides in the second direction Y, and the edges of the orthographic projection of the second opening 330 on both sides of the second electrode 220 in the first direction X on the substrate 100 are located on the substrate 100 .
  • the edges of the second electrode 220 on both sides of the second opening 330 in the first direction X extend into the second opening 330 .
  • the edges of the second electrode 220 on both sides of the second opening 330 in the second direction Y can also extend into the second opening 330 to further increase the size of the second electrode layer 400 and the second electrode 220 that are close to each other.
  • the distribution area can better improve the problem of the edge of the body part 410 turning up due to laser diffraction.
  • FIG. 7 is a cross-sectional view at A-A in FIG. 1 in yet another embodiment.
  • FIG. 8 is a partially enlarged structural diagram of Q in FIG. 1 in yet another embodiment.
  • the display panel 10 further includes a metal shielding layer 500.
  • the metal shielding layer 500 is located on the side of the first electrode layer 200 away from the pixel definition layer 300.
  • the metal shielding layer 500 includes a shielding part 510 , the orthographic projection of the gap 230 on the substrate 100 is within the orthographic projection of the shielding part 510 on the substrate 100 , the orthographic projection of the hollow part 420 on the substrate 100 and the shielding part 510 on the substrate 100 Orthographic projection non-overlap setting.
  • the orthographic projection of the gap 230 on the substrate 100 is located within the orthographic projection of the shielding portion 510 on the substrate 100, it can effectively prevent the second conductive material layer corresponding to the position of the gap 230 from being etched by the laser. change.
  • the substrate 100 in this embodiment may include an array film layer, and the metal shielding layer 500 may be any metal film layer, as long as the above requirements are met.
  • FIG. 8 illustrates the relative positional relationship between the metal shielding layer 500, the first electrode layer 200 and the pixel definition layer 300.
  • the shielding portion 510 of the metal shielding layer 500 can block the laser. , so that the second electrode layer 400 corresponding to the gap 230 and at least part of the second opening 330 can be retained without being etched, so that the body portion 410 can be connected with each other to form a full-surface electrode. Therefore, due to the existence of the shielding portion 510, the area where the shielding portion 510 is located can form at least part of the body portion 410 of the second electrode layer 400, and the hollow portion 420 of the second electrode layer 400 can be formed in the area where the shielding portion 510 is not present.
  • the orthographic projection of at least part of the second openings 330 on the substrate 100 is located within the orthographic projection of the shielding part 510 on the substrate 100
  • the orthographic projection is located within the orthographic projection of the shielding portion 510 on the substrate 100 , or the orthographic projection of at least a portion of the same second opening 330 on the substrate 100 is located within the orthographic projection of the shielding portion 510 on the substrate 100 .
  • the orthographic projection of at least part of the second electrode 220 on the substrate 100 can also be located within the orthographic projection of the shielding portion 510 on the substrate 100. Through this arrangement, it can ensure that the main body portion 410 are interconnected.
  • the shielding part 510 includes: a first subsection 511 extending in a strip shape along the second direction Y, and a plurality of third subsections 511.
  • One branch 511 is arranged side by side along the first direction X; the second branch 512 extends along the first direction
  • the orthographic projection of 410 on the substrate 100 is located within the orthographic projection of the first subsection 511 on the substrate 100.
  • each gap 230 and the plurality of second openings 330 arranged side by side along the second direction Y is located within the orthographic projection of the same first segment 511 on the substrate 100 .
  • the first subsection 511 can be a regular strip-shaped structure, such as a rectangle, etc., or the first section 511 can also be an irregular strip-shaped structure, as long as the whole can extend along the second direction Y, in This does not specifically limit the specific shape of the first portion 511 .
  • the first portion 511 can cover at least a portion of each gap 230 in the plurality of gaps 230 located in the same row (when the second direction Y is the row direction), as well as each of the plurality of second openings. A portion of each second opening 330 in 330 .
  • the first subsection 511 can block at least a part of each gap 230 in the plurality of gaps 230 located in the same column (when the second direction Y is the column direction), and a part of each second opening 330 of the plurality of second openings 330 , so that the body parts 410 in the same row or column can communicate with each other.
  • the main body part 410 can be formed in the same distribution area and the same size as the second sub-part 512, so that the main part 410 at different positions can be connected to each other to form a common electrode on the entire surface.
  • the second sub-section 512 there are many ways to position the second sub-section 512.
  • the first sub-section 511 is located in the first area and the second sub-section 512 is located in the first area.
  • the distribution area of the body portion 410 in the first area can be further reduced and the light transmittance of the first area can be improved.
  • the second area may be a non-display area, or the second area may be the second display area AA2, which is not limited here.
  • a second embodiment of the present invention also provides a display device, including the display panel 10 of any of the above-mentioned first embodiments. Since the display device provided by the embodiment of the second aspect of the present invention includes the display panel 10 of any embodiment of the first aspect, the display device provided by the embodiment of the second aspect of the present invention has the display panel 10 of any embodiment of the first aspect. 10 has beneficial effects that will not be repeated here.
  • Display devices in embodiments of the present invention include but are not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control, smart landline phones, consoles and other devices with display functions. .
  • PDAs personal digital assistants
  • tablet computers e-books
  • televisions access control
  • smart landline phones consoles and other devices with display functions.
  • FIG. 9 is a schematic flowchart of a method for manufacturing a display panel 10 according to a third embodiment of the present application.
  • the display panel 10 may be the display panel 10 provided in any of the above-mentioned first aspect embodiments.
  • the preparation method of the display panel 10 includes:
  • Step S01 Coat and prepare a first conductive material layer on the substrate, and pattern the first conductive material to form a first electrode layer.
  • the first electrode layer includes a first electrode.
  • Step S02 Prepare an insulating material layer on the side of the first electrode layer facing away from the substrate, and pattern the insulating material layer to form a pixel definition layer.
  • the pixel definition layer includes an isolation portion and a first opening surrounded by the isolation portion.
  • the first electrode is at least partially exposed through the first opening.
  • step S02 layer structures such as a hole injection layer, a hole transport layer, a light-emitting unit, an electron transport layer, and an electron injection layer may also be provided on the pixel definition layer 300 .
  • Step S03 Prepare a second conductive material layer on the pixel definition layer.
  • Step S04 Laser etching the second conductive material layer from the side of the substrate away from the first electrode layer to form a second electrode layer.
  • the second electrode layer includes a body part and a hollow part penetrating the body part, and the hollow part and the first electrode layer The orthographic projections of the electrodes on the substrate are arranged without overlapping.
  • the first electrode 210 is first formed in step S01.
  • the first electrode 210 can be used as a mask for patterning the second conductive material layer in step S03.
  • the second conductive material layer in the area where an electrode 210 is located will not be etched away to form the body portion 410 of the second electrode layer 400 .
  • the pixel definition layer 300 is formed through step S02, so that the light-emitting unit can be disposed in the first opening 320, and the first electrode 210 and the body portion 410 of the second electrode layer 400 can drive the light-emitting unit to emit light.
  • the material of the second conductive material layer in the area where the first electrode 210 does not exist is etched away by laser. Therefore, the body portion 410 of the second electrode layer 400 at least partially overlaps with the orthographic projection of the first electrode 210 in the thickness direction, while the hollow portion 420 does not overlap with the orthographic projection of the first electrode 210 on the substrate 100 .
  • the insulating material layer may also be patterned to form the second opening 330 . Since the light-emitting unit will not be disposed in the second opening 330, when the pixel definition layer 300 is provided with common layers such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, these common layers will be disposed in the second opening 330. can be deposited directly on the first electrode 210.
  • the second conductive material layer is formed in step S03, a layer structure such as a common layer is provided between the second conductive material layer and the first electrode 210, without the isolation portion 310 and other structures, which can further reduce the second opening 330.
  • step S04 when the second conductive material layer is patterned using the first electrode 210 as a mask, diffraction can be improved and the edge of the body portion 410 can be avoided from turning up, which affects the yield of the subsequent packaging process.
  • the first electrode layer 200 further includes a second electrode 220 .
  • the hollow portion 420 and the orthographic projection of the second electrode 220 and the first electrode 210 on the substrate 100 are arranged without overlapping.
  • the second electrode 220 At least part of the edge of the orthographic projection on the substrate 100 is located within the orthographic projection of the second opening 330 on the substrate 100 .
  • a gap 230 is also provided between the second electrode 220 and the first electrode 210 to prevent the second electrode layer 400 from being
  • the main body part 410 is connected to each other by a short circuit through the second electrode 220 and the first electrode 210 .
  • a metal shielding layer 500 may also be formed first.
  • the metal shielding layer 500 includes a shielding part 510.
  • the orthographic projection of the gap 230 on the substrate 100 may be located at the shielding part 510. within the orthographic projection on the substrate 100.
  • the orthographic projection of the gap 230 and at least part of the second opening 330 on the substrate 100 may be located within the orthographic projection of the shielding part 510 on the substrate 100 . Due to the existence of the shielding part 510, when the second conductive material layer is patterned by laser in step S04, the shielding part 510 can block the laser, so that the second conductive material layer in the area where the shielding part 510 is located will not be etched. Therefore, the hollow portion 420 will not be formed in the area where the shielding portion 510 is located, and the orthographic projection of the hollow portion 420 on the substrate 100 and the orthographic projection of the shielding portion 510 on the substrate 100 will not overlap.
  • the shielding portion 510 can be arranged in various positions, as long as the main body portions 410 can communicate with each other due to the existence of the shielding portion 510 .
  • the shielding part 510 may include a first part 511 and a second part 512.

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Abstract

本申请公开了一种显示面板、显示装置及显示面板的制备方法，显示面板包括：基板；第一电极层，位于基板上，第一电极层包括第一电极；像素定义层，位于第一电极层背离基板的一侧，像素定义层包括隔离部和由隔离部围合形成的第一开口，第一电极至少部分由第一开口露出；第二电极层，至少部分第二电极层位于像素定义层背离基板的一侧，第二电极层包括本体部和贯穿本体部的镂空部，镂空部和第一电极在基板上的正投影不交叠设置。本申请的显示面板在制备过程中能够将第一电极层第一电极作为掩膜板，在第二电极层上形成镂空部而提高显示面板的透光率。

Description

显示面板、显示装置及显示面板的制备方法
相关申请的交叉引用
本申请要求享有于2022年08月09日提交的名称为“显示面板、显示装置及显示面板的制备方法”的中国专利申请第202210960550.2号的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及显示领域，具体涉及一种显示面板、显示装置及显示面板的制备方法。
背景技术
随着电子设备的快速发展，用户对屏占比的要求越来越高，使得电子设备的全面屏显示受到业界越来越多的关注。
传统的电子设备如手机、平板电脑等，由于需要集成诸如前置摄像头、听筒以及红外感应元件等。现有技术中，可通过在显示屏上开槽(Notch)或开孔，外界光线可通过屏幕上的开槽或开孔进入位于屏幕下方的感光元件。但是这些电子设备均不是真正意义上的全面屏，并不能在整个屏幕的各个区域均进行显示，例如其前置摄像头对应区域不能显示画面。
发明内容
本申请实施例提供一种显示面板、显示装置及显示面板的制备方法，实现显示面板的至少部分区域可透光且可显示，便于感光组件的屏下集成。
本申请第一方面实施例提供一种显示面板，显示面板包括：基板；第一电极层，位于基板上，第一电极层包括第一电极；像素定义层，位于第一电极层背离基板的一侧，像素定义层包括隔离部和由隔离部围合形成的第一开口，第一电极至少部分由第一开口露出；第二电极层，至少部分第 二电极层位于像素定义层背离基板的一侧，第二电极层包括本体部和贯穿本体部的镂空部，镂空部和第一电极在基板上的正投影不交叠设置。
根据本申请第一方面的实施方式，像素定义层还包括贯穿像素定义层设置的第二开口，镂空部在基板上的正投影位于第二开口在基板上的正投影之内。能够进一步减小第二电极层和第一电极层之间的距离。
根据本申请第一方面前述任一实施方式，第一电极在基板上的正投影的至少部分边缘位于第二开口在基板上的正投影之内。保证本体部的边缘和第一电极距离较近，更好地改善本体部朝向镂空部的边缘上翻的问题。
根据本申请第一方面前述任一实施方式，第一电极层还包括第二电极，镂空部和第二电极、第一电极在基板上的正投影不交叠设置，第二电极在基板上的正投影的至少部分边缘位于第二开口在基板上的正投影之内。通过设置第二电极能够在不影响第一电极正常工作的前提下，在对第二电极层进行激光灰化形成镂空部的过程中，使得第一电极层能够更好地起到掩膜的作用。
根据本申请第一方面前述任一实施方式，第二电极和本体部在显示面板厚度方向上的最大距离小于或等于0.8μm。使得第一电极层和第二电极层的距离较近，能够避免激光衍射导致的本体部朝向镂空部的边缘翻折而影响后续封装工艺的封装效果。
根据本申请第一方面前述任一实施方式，第一电极和第二电极之间存在间隙。避免由于第二电极和第二电极层的本体部相互连接，而导致的第一电极通过第二电极和第二电极层的本体部短路连接，能够进一步提高显示面板的良率。
根据本申请第一方面前述任一实施方式，第一电极和第二电极一一对应设置，各第二电极环绕各第一电极设置，以在各第一电极的周侧形成环状的间隙。
根据本申请第一方面前述任一实施方式，间隙的宽度为0.5μm～10μm。
根据本申请第一方面前述任一实施方式，隔离部和第一电极一一对应设置，且隔离部呈环状，各间隙在基板上的正投影位于各隔离部在基板上的正投影之内。更好地改善由于激光衍射导致的本体部边缘上翻的问题。
根据本申请第一方面前述任一实施方式，相邻的两个隔离部之间形成第二开口，位于第二开口相对两侧的第二电极在基板上的正投影的边缘位于该第二开口在基板上的正投影之内。
根据本申请第一方面前述任一实施方式，还包括金属遮挡层，位于第一电极层背离像素定义层的一侧，金属遮挡层包括遮挡部，间隙在基板上的正投影位于遮挡部在基板上的正投影之内，镂空部在基板上的正投影和遮挡部在基板上的正投影不交叠设置。金属遮挡层的遮挡部能够遮挡激光，使得与间隙对应的第二导电材料可以保留。
根据本申请第一方面前述任一实施方式，至少部分第二开口在基板上的正投影位于遮挡部在基板上的正投影之内。
根据本申请第一方面前述任一实施方式，遮挡部包括：
第一分部，沿第二方向延伸呈条状，多个第一分部沿第一方向并排设置；
第二分部，沿第一方向延伸并与多个第一分部连接，至少部分本体部在基板上的正投影位于第一分部在基板上的正投影之内；
其中，在沿第二方向并排设置的多个间隙和多个第二开口中，各间隙和各第二开口在基板上的至少部分正投影位于同一第一分部在基板上的正投影之内。使得本体部能够相互连通，形成整面的公共电极。
根据本申请第一方面前述任一实施方式，显示面板具有第一区和环绕至少部分第一区的第二区，第一分部位于第一区，第二分部位于第二区。能进一步减小第一区内本体部的分布面积，提高第一区的透光率。
本申请第二方面的实施例提供一种显示装置，其包括上述任一实施方式的显示面板。
本申请第三方面的实施例提供一种显示面板的制备方法，包括：
在基板上涂制备第一导电材料层，并对第一导电材料进行图案化处理形成第一电极层，第一电极层包括第一电极；
在第一电极层背离基板的一侧制备绝缘材料层，并对绝缘材料层进行图案化处理形成像素定义层，像素定义层包括隔离部和由隔离部围合形成的第一开口，第一电极至少部分由第一开口露出；
在像素定义层上制备第二导电材料层；
由基板背离第一电极层的一侧对第二导电材料层进行激光刻蚀处理形成第二电极层，第二电极层包括本体部和贯穿本体部的镂空部，镂空部和第一电极在基板上的正投影不交叠设置。
根据本申请实施例的显示面板，显示面板包括基板和设置于基板上的第一电极层、像素定义层和第二电极层。第一电极层包括第一电极，第二电极层包括本体部和镂空部，且镂空部和第一电极在基板上的正投影不交叠设置。在第二电极层的制备过程中，可以利用第一电极层作为掩膜板，由基板背离第一电极层的一侧朝向第二电极层出射激光，从而形成镂空部。一方面，在第二电极层设置镂空部，能够减小本体部的分布面积，进而提高显示面板的透光率，能够在显示面板的非显示侧集成感光组件。另一方面，第一电极层和第二电极层中的一者设置于像素定义层的一侧，另一者设置于像素定义层的另一侧，第一电极层和第二电极层之间的距离较近，能够避免激光衍射导致的本体部朝向镂空部的边缘翻折，从而避免影响后续封装工艺的封装效果。
因此，本申请实施例的显示面板在制备过程中能够将第一电极层作为掩膜板，在第二电极层上形成镂空部而提高显示面板的透光率，便于感光组件的屏下集成。且由于第一电极层和第二电极层之间的距离较近，能够避免激光衍射导致的本体部朝向镂空部的边缘翻折，从而避免影响后续封装工艺的封装效果。
附图说明
通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，其中，相同或相似的附图标记表示相同或相似的特征，附图并未按照实际的比例绘制。
图1是本申请第一方面实施例提供的一种显示面板的结构示意图；
图2是图1中A-A处的剖视图；
图3是另一实施例中图1中A-A处的剖视图；
图4是又一图1中A-A处的剖视图；
图5是再一实施例中图1中A-A处的剖视图；
图6是图1中Q处的局部放大结构示意图；
图7是还一实施例中图1中A-A处的剖视图；
图8是还一实施例中图1中Q处的局部放大结构示意图；
图9是本申请第三方面实施例提供的一种显示面板的制备方法流程示意图。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅被配置为解释本申请，并不被配置为限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
在诸如手机和平板电脑等电子设备上，需要在设置显示面板的一侧集成诸如前置摄像头、红外光传感器、接近光传感器等感光组件。在一些实施例中，可以在上述电子设备上设置透光显示区，将感光组件设置在透光显示区背面，在保证感光组件正常工作的情况下，实现电子设备的全面屏显示。
为了提高透光显示区的透光率，在一些相关技术中，对公共电极进行了图案化处理。令公共电极在显示面板的透光区域内形成镂空，以提高公共电极的透光率，进而能够提高显示面板的透光区域的透光率。相关技术中一般采用激光灰化等手段实现公共电极的图案化处理。
然而在相关技术中利用激光灰化对公共电极进行图案化处理时，通常是在衬底上形成阵列膜层、发光层和公共电极后，从衬底背离阵列膜层的一侧对公共电极进行激光照射，利用阵列膜层内的遮光金属层作为掩膜板，实现公共电极的激光刻蚀和图形化处理。在对公共电极进行激光刻蚀和图案化处理后，公共电极的边缘容易翻折，对后续的薄膜封装等工艺造成影响，影响封装工艺的可靠性。
为解决上述问题，本申请实施例提供了一种显示面板、显示装置及显示面板的制备方法，以下将结合附图对显示面板、显示装置及显示面板的制备方法的各实施例进行说明。
本申请实施例提供一种显示面板，该显示面板可以是有机发光二极管(Organic Light Emitting Diode，OLED)显示面板。
请一并参阅图1和图2，图1是本申请第一方面实施例提供的一种显示面板10的结构示意图，图2是图1中A-A处的剖视图。
如图1和图2所示，本申请第一方面实施例提供的显示面板10包括：基板100、第一电极层200、像素定义层300和第二电极层400，其中，第一电极层200位于基板100上，第一电极层200包括第一电极210；像素定义层300位于第一电极层200背离基板100的一侧，像素定义层300包括隔离部310和由隔离部310围合形成的第一开口320，第一电极210至少部分由第一开口320露出；至少部分第二电极层400位于像素定义层300背离基板100的一侧，第二电极层400包括本体部410和贯穿本体部410的镂空部420，镂空部420和第一电极210在基板100上的正投影不交叠设置。
本申请实施例提供了一种显示面板10，该显示面板10包括基板100和设置于基板100的第一电极层200、像素定义层300和第二电极层400。第一电极层200包括第一电极210。像素定义层300包括第一开口320和隔离部310，第一开口320内可以设置发光单元(图中未示出)，第一电极210由第一开口320露出，使得第一电极210可以驱动第一开口320内的发光单元发光。第二电极层400包括本体部410和镂空部420，且镂空部420和第一电极210在基板100上的正投影均不交叠设置，即镂空部420和第一开口320错位设置，能够避免影响显示面板10的显示效果。
在本申请提供的显示面板10中制备第二电极层400时，可以利用第一电极层200作为遮挡层，例如利用第一电极210作为掩膜板，由基板100背离第一电极层200的一侧朝向第二电极层400出射激光，对第二电极层400进行激光刻蚀从而形成镂空部420。一方面，在第二电极层400设置镂空部420，能够减小本体部410的分布面积，进而提高显示面板10的透光 率，能够在显示面板10的非显示侧集成感光组件。另一方面，第一电极层200和第二电极层400中的一者设置于像素定义层300的一侧，另一者设置于像素定义层300的另一侧，第一电极层200和第二电极层400之间的距离较近，能够减小或避免激光衍射导致的本体部410朝向镂空部420的边缘翻折而影响后续封装工艺的封装效果，进而影响显示面板10的显示效果的问题。
本申请提供的显示面板10的有益效果为：一方面，在第二电极层400设置镂空部420，能够减小本体部410的分布面积，进而提高显示面板10的透光率，能够在显示面板10的非显示侧集成感光组件。另一方面，第一电极层200和第二电极层400中的一者设置于像素定义层300的一侧，另一者设置于像素定义层300的另一侧，第一电极层200和第二电极层400之间的距离较近，能够避免激光衍射导致的本体部410朝向镂空部420的边缘翻折，从而避免影响后续封装工艺的封装效果。
基板100的设置方式还有多种，基板100例如可以包括衬底和设置于衬底的阵列膜层；或者基板100即衬底；或者基板100还包括背离衬底一侧的缓冲层和支撑板等。
第一电极层200例如为阳极层，第二电极层400为阴极层。在利用第一电极层200和第二电极层400驱动第一开口320内的发光单元发光时，第一电极层200中的第一电极210作为阳极，第二电极层400的本体部410作为阴极。
可选的，第一电极210在基板100上的正投影的边缘位于隔离部310在基板100上的正投影之内，各第一开口320在基板100上的正投影位于各第一电极210在基板100上的正投影之内，能够增大第一电极210和发光单元的接触面积，提高发光效果。
请继续参阅图1，在一些可选的实施例中，显示面板10具有第一显示区AA1、第二显示区AA2以及围绕第一显示区AA1、第二显示区AA2的非显示区，其中，第一显示区AA1和第二显示区AA2为显示区，第一显示区AA1的透光率大于第二显示区AA2的透光率。
在本申请中，可选的，第一显示区AA1的透光率大于或等于15％。为 确保第一显示区AA1的透光率大于15％，甚至大于40％，甚至具有更高的透光率，本实施例中位于第一显示区AA1的显示面板10的各个功能膜层的透光率均大于80％，甚至至少部分功能膜层的透光率均大于90％。
根据本申请实施例的显示面板10，第一显示区AA1的透光率大于第二显示区AA2的透光率，可以在显示面板10的第一显示区AA1的非显示侧集成感光组件，实现例如摄像头的感光组件的屏下集成，同时第一显示区AA1能够显示画面，提高了显示面板10的显示面积，实现显示装置的全面屏设计。
可选的，第二电极层400的镂空部420可以位于第一显示区AA1，以提高第一显示区AA1的透光率。在其他实施例中，第二电极层400的镂空部420还可以同时位于第一显示区AA1和第二显示区AA2，以提高整个显示区域的透光率。可以理解的是，本申请提供的实施例可以设置在第一显示区AA1，和/或第二显示区AA2，具体根据实际情况进行设置。
请一并参阅图1和图3，图3是另一实施例中图1中A-A处的剖视图。
如图1和图3所示，在一些可选的实施例中，像素定义层300还包括贯穿像素定义层300设置的第二开口330，镂空部420在基板100上的正投影位于第二开口330在基板100上的正投影之内。
在这些可选的实施例中，在像素定义层300上制备第二电极层400时，首先在像素定义层300上形成第二导电材料层，然后对第二导电材料层进行图案化处理形成第二电极层400。第二导电材料层能够直接沉积在第二开口330内，进一步减小第二导电材料层和第一电极层200之间的距离。
当利用第一电极210对第二导电材料层进行激光刻蚀灰化处理时，能够在第二开口330对应的区域内形成镂空部420，能够更好地改善本体部410朝向镂空部420的边缘上翻的问题，具体是由于距离越近衍射越小，激光聚焦效果更好，所以能够更好地改善由于本体部410边缘上翻对后续封装工艺的影响。
可选的，当像素定义层300上制备空穴传输层、空穴注入层、电子传输层和电子注入层等共通层时，第一电极210和第二导电材料层之间还设置有这些共通层。
请一并参阅图1、图3和图4，图4是图1中Q处的局部放大结构示意图。为了更好的展示本申请显示面板10的结构，图4中仅示意出了第一电极层200和像素定义层300的相对位置关系。
如图1和图3所示，在一些可选的实施例中，第一电极210在基板100上的正投影的至少部分边缘位于第二开口330在基板100上的正投影之内，即第一电极210至少部分由隔离部310朝向基板100的一侧延伸至第二开口330内。
在利用第一电极210对第二电极层400进行图案化处理形成本体部410时，由于第一电极210的遮挡所用，第一电极210所在区域形成未被刻蚀的本体部410。第一电极210在基板100上的正投影的至少部分边缘位于第二开口330在基板100上的正投影之内，能够保证本体部410朝向镂空部420的边缘位于第二开口330内，保证本体部410的边缘和第一电极210距离较近，更好地改善本体部410朝向镂空部420的边缘上翻的问题。
在一些可选的实施例中，请参阅图4，第一电极层200还包括第二电极220，镂空部420和第二电极220、第一电极210在基板100上的正投影不交叠设置。通过设置第二电极220，能够在不影响第一电极210正常工作的前提下，在对第二电极层400进行激光灰化形成镂空部420的过程中，使得第一电极层200能够更好地起到掩膜的作用。
可选的，第二电极220和第二电极层400之间可以不设置共通层等结构，以进一步减小第二电极220和第二电极层400之间的距离。
请参阅图5，在一些可选的实施例中，第二电极220在基板100上的正投影的至少部分边缘位于第二开口330在基板100上的正投影之内，即第二电极220至少部分由隔离部310朝向基板100的一侧延伸至第二开口330内。
在这些实施例中，在利用第二电极220对第二电极层400进行图案化处理形成本体部410时，由于第二电极220的遮挡作用，第二电极220所在区域形成未被刻蚀的本体部410。第二电极220在基板100上的正投影的至少部分边缘位于第二开口330在基板100上的正投影之内，能够保证本体部410朝向镂空部420的边缘位于第二开口330内，保证本体部410的 边缘和第二电极220距离较近，更好地改善本体部410朝向镂空部420的边缘上翻的问题。
可选的，第二电极220和本体部410在显示面板10厚度方向上的最大距离小于或等于0.8μm。使得第二电极220和本体部410的距离较近，更好地改善本体部410朝向镂空部420的边缘上翻的问题。
由于第一电极210和第二电极220同层设置，第二电极220和本体部410在显示面板10厚度方向上的最大距离小于或等于0.8μm，具体的，第二电极220和本体部410在显示面板10厚度方向上的距离可以是200nm、500nm、800nm等。使得第一电极层200和本体部410的距离较近，更好地改善本体部410朝向镂空部420的边缘上翻的问题。
在一些可选的实施例中，第二电极220和第一开口320错位设置，即第二电极220在基板100上的正投影和第一开口320在基板100上的正投影不交叠设置。避免第二电极220影响第一开口320内发光单元的发光效果。
如图4和图5所示，在一些可选的实施例中，第一电极210和第二电极220之间存在间隙230，避免由于第二电极220和第二电极层400的本体部410相互连接，而导致的第一电极210通过第二电极220和第二电极层400的本体部410短路连接，能够进一步提高显示面板10的良率。除此之外，通过设置第二电极220，还可以阻挡激光热量通过第一电极210传导至发光单元而影响显示效果。
间隙230的设置尺寸有多种，可选的，间隙230的宽度为0.5μm～10μm，具体的，间隙230的设置尺寸可以为0.5μm、1μm、5μm等，能够改善由于间隙230过小使得第二电极220和本体部410短路连接，也能够改善由于间隙230过大，导致在利用第一电极层200作为掩膜板使用时，在间隙230位置对应的第二电极层400上的部位形成通孔，影响第一电极210和第二电极层400的交叠面积，影响发光单元的发光效果。可以理解的是，间隙230的宽度指的是在第一方向X上的尺寸。
第一电极210和第二电极220的相互设置方式有多种，例如相邻的两个第一电极210之间可以设置有一个第二电极220。
在另一些可选的实施例中，请参阅图6，第一电极210和第二电极220一一对应设置，各第二电极220环绕各第一电极210设置，以在各第一电极210的周侧形成环状的间隙230。
在这些可选的实施例中，各第一电极210均对应设置有一第二电极220，相邻的两个第二电极220之间能够形成镂空部420，能够增大镂空部420的分布面积，减小本体部410的分布面积，提高显示面板10的透光率。此外，第二电极220环绕第一电极210设置，能够保证镂空部420和第一电极210不交叠，避免镂空部420影响第一开口320内发光单元的发光。环状的间隙230能够保证第二电极220和第一电极210之间相互绝缘，避免第一电极210通过第二电极220和第二电极层400的本体部410短路连接。
在一些可选的实施例中，如图6所示，隔离部310和第一电极210一一对应设置，且隔离部310呈环状，各间隙230在基板100上的正投影位于各隔离部310在基板100上的正投影之内。
在这些可选的实施例中，隔离部310呈环状，能够在相邻的隔离部310之间形成尺寸较大的第二开口330，能够进一步增大相距较近的第二电极200和第二电极层400的分布面积，更好地改善由于激光衍射导致的本体部410边缘上翻的问题。
此外，各间隙230在基板100上的正投影位于各隔离部310在基板100上的正投影之内，而第二电极层400的本体部410位于隔离部310背离第一电极层200的一侧，因此能够保证第二电极层400和第一电极210的相互绝缘。
可选的，请继续参阅图6，相邻的两个隔离部310之间形成第二开口330，位于第二开口330相对两侧的第二电极220在基板100上的正投影的边缘位于该第二开口330在基板100上的正投影之内。
例如，当第一电极210沿第一方向X(图6中的X方向)和第二方向Y(图6中的Y方向)阵列分布时，第二开口330在第一方向X的两侧和在第二方向Y上的两侧均设置有第二电极220，第二开口330在第一方向X两侧的第二电极220在基板100上的正投影的边缘位于该第二开口330在基板100上的正投影之内，即第二开口330在第一方向X两侧的第二电 极220边缘均延伸至第二开口330内。同样的，第二开口330在第二方向Y两侧的第二电极220的边缘也可以均延伸至第二开口330内，以进一步增大相距较近的第二电极层400和第二电极220的分布面积，更好地改善由于激光衍射导致的本体部410边缘上翻的问题。
请一并参阅图1、图7和图8，图7是又一实施例中图1中A-A处的剖视图，图8是又一实施例中图1中Q处的局部放大结构示意图。
如图1、图7和图8所示，在一些可选的实施例中，显示面板10还包括金属遮挡层500，金属遮挡层500位于第一电极层200背离像素定义层300的一侧，金属遮挡层500包括遮挡部510，间隙230在基板100上的正投影位于遮挡部510在基板100上的正投影之内，镂空部420在基板100上的正投影和遮挡部510在基板100上的正投影不交叠设置。
可以理解的是，由于间隙230在基板100上的正投影位于遮挡部510在基板100上的正投影之内，因此，可以有效避免与间隙230位置对应的第二导电材料层被激光刻蚀灰化。可以理解的是，本实施例中的基板100可以包括阵列膜层，金属遮挡层500可以为任一金属膜层，只要能满足上述需求即可。
在一可选的实施例中，至少部分第二开口330在基板100上的正投影位于遮挡部510在基板100上的正投影之内，以使本体部410相互连通。图8中示意出了金属遮挡层500、第一电极层200和像素定义层300的相对位置关系。
在这些可选的实施例中，通过设置金属遮挡层500，当在基板100背离第一电极层200的一侧朝向第二电极层400出射激光时，金属遮挡层500的遮挡部510能够遮挡激光，进而使得间隙230和至少部分第二开口330对应的第二电极层400能够不被刻蚀而保留下来，使得本体部410能够相互连通形成整面电极。因此，由于遮挡部510的存在，遮挡部510所在区域能够形成至少部分的第二电极层400的本体部410，第二电极层400的镂空部420可以形成于遮挡部510不在的区域。
在“至少部分第二开口330在基板100上的正投影位于遮挡部510在基板100上的正投影之内”中，既包括多个第二开口330中的部分第二开 口330在基板100上的正投影位于遮挡部510在基板100上的正投影之内，也可以包括同一个第二开口330的至少一部分在基板100上的正投影位于遮挡部510在基板100上的正投影之内。只要能够保证本体部410相互连通即可。
可以理解的是，在其他实施例中，至少部分第二电极220在基板100上的正投影还可以位于遮挡部510在基板100上的正投影之内，通过此种设置方式，能够保证本体部410相互连通。
遮挡部510的形状设置方式有多种，在一些可选的实施例中，请继续参阅图8，遮挡部510包括：第一分部511，沿第二方向Y延伸呈条状，多个第一分部511沿第一方向X并排设置；第二分部512，沿第一方向X延伸并与在第一方向X上并排设置的多个第一分部511连接；其中，至少部分本体部410在基板100上的正投影位于第一分部511在基板100上的正投影之内，在沿第二方向Y并排设置的多个间隙230和多个第二开口330中，各间隙230和各第二开口330在基板100上的至少部分正投影位于同一第一分部511在基板100上的正投影之内。
可以理解的是，第一分部511可以是规则的条状结构，例如矩形等，第一分部511也可以是不规则的条状结构，只要整体能够沿第二方向Y延伸即可，在此不具体限定第一分部511的具体形状。
在这些可选的实施例中，第一分部511能够遮挡位于同一行(当第二方向Y为行方向时)的多个间隙230中各间隙230的至少一部分，以及各多个第二开口330中各第二开口330的一部分。或者第一分部511能够遮挡位于同一列(当第二方向Y为列方向时)的多个间隙230中各间隙230的至少一部分，以及多个第二开口330中各第二开口330的一部分，使得同一行或者同一列的本体部410能够相互连通。通过第二分部512的遮挡作用，能形成与第二分部512同分布区域和同尺寸的本体部410，进而使得不同位置的本体部410能够相互连通，形成整面的公共电极。
第二分部512的位置设置方式有多种，例如当显示面板10具有第一区和环绕至少部分第一区的第二区，第一分部511位于第一区，第二分部512位于第二区，能进一步减小第一区内本体部410的分布面积，提高第一区 的透光率。第二区可以为非显示区，或者第二区为第二显示区AA2，在此不做限定。
本发明第二方面的实施例还提供一种显示装置，包括上述任一第一方面实施例的显示面板10。由于本发明第二方面实施例提供的显示装置包括上述第一方面任一实施例的显示面板10，因此本发明第二方面实施例提供的显示装置具有上述第一方面任一实施例的显示面板10具有的有益效果，在此不再赘述。
本发明实施例中的显示装置包括但不限于手机、个人数字助理(Personal Digital Assistant，简称：PDA)、平板电脑、电子书、电视机、门禁、智能固定电话、控制台等具有显示功能的设备。
请参阅图9，图9是本申请第三方面实施例提供的一种显示面板10的制备方法流程示意图。该显示面板10可以为上述任一第一方面实施例提供的显示面板10。
如图9并请一并参阅图1至图8所示的显示面板10，显示面板10的制备方法包括：
步骤S01：在基板上涂制备第一导电材料层，并对第一导电材料进行图案化处理形成第一电极层，第一电极层包括第一电极。
步骤S02：在第一电极层背离基板的一侧制备绝缘材料层，并对绝缘材料层进行图案化处理形成像素定义层，像素定义层包括隔离部和由隔离部围合形成的第一开口，第一电极至少部分由第一开口露出。
可选的，在步骤S02之后还可以在像素定义层300上设置空穴注入层、空穴传输层、发光单元、电子传输层和电子注入层等层结构。
步骤S03：在像素定义层上制备第二导电材料层。
步骤S04：由基板背离第一电极层的一侧对第二导电材料层进行激光刻蚀处理形成第二电极层，第二电极层包括本体部和贯穿本体部的镂空部，镂空部和第一电极在基板上的正投影不交叠设置。
在本申请实施例提供的显示面板10的制备方法中，首先通过步骤S01形成第一电极210，第一电极210可以作为对步骤S03中第二导电材料层进行图案化处理的掩膜板，第一电极210所在区域的第二导电材料层不会 被刻蚀掉而形成第二电极层400的本体部410。然后通过步骤S02形成像素定义层300，使得发光单元能够设置于第一开口320内，第一电极210和第二电极层400的本体部410能够驱动发光单元发光。由于第一电极210作为对第二导电材料层进行图案化处理的掩膜板，通过激光刻蚀掉第一电极210所不存在区域内的第二导电材料层的材料。因此第二电极层400的本体部410至少部分和第一电极210沿厚度方向上的正投影交叠设置，而镂空部420和第一电极210在基板100上的正投影不交叠设置。
在一些可选的实施例中，在步骤S02中，还可以对绝缘材料层进行图案化处理形成第二开口330。由于第二开口330内不会设置发光单元，当像素定义层300上设置有空穴注入层、空穴传输层、电子传输层和电子注入层等共通层时，这些共通层在第二开口330内能够直接沉积于第一电极210上。在步骤S03中形成第二导电材料层时，第二导电材料层和第一电极210之间设置有共通层等层结构，而不会有隔离部310等结构，能够进一步减小第二开口330所在区域内第二导电材料层和第一电极210之间的距离。在步骤S04中以第一电极210为掩膜板对第二导电材料层进行图案化处理时，能够改善衍射，避免本体部410的边缘上翻，影响后续封装工艺的良率。
在一些可选的实施例中，第一电极层200还包括第二电极220，镂空部420和第二电极220、第一电极210在基板100上的正投影不交叠设置，第二电极220在基板100上的正投影的至少部分边缘位于第二开口330在基板100上的正投影之内，第二电极220和第一电极210之间还设置有间隙230，避免第二电极层400的本体部410通过第二电极220和第一电极210相互短路连接。
在一些可选的实施例中，在步骤S01之前，还可以先形成金属遮挡层500，金属遮挡层500包括遮挡部510，具体的，可以是间隙230在基板100上的正投影位于遮挡部510在基板100上的正投影之内。可选的，还可以是间隙230和至少部分第二开口330在基板100上的正投影位于遮挡部510在基板100上的正投影之内。由于遮挡部510的存在，在步骤S04中通过激光对第二导电材料层进行图案化处理时，遮挡部510能够遮挡激光，使 得遮挡部510所在区域内的第二导电材料层不会被刻蚀掉，因此遮挡部510所在区域内不会形成镂空部420，镂空部420在基板100上的正投影和遮挡部510在基板100上的正投影不交叠设置。
遮挡部510的位置设置有多种，只要由于遮挡部510的存在，使得本体部410能够相互连通即可。如上所述，遮挡部510可以包括第一分部511和第二分部512。
依照本申请如上文所述的实施例，这些实施例并没有详尽叙述所有的细节，也不限制该发明仅为所述的具体实施例。显然，根据以上描述，可作很多的修改和变化。本说明书选取并具体描述这些实施例，是为了更好地解释本申请的原理和实际应用，从而使所属技术领域技术人员能很好地利用本申请以及在本申请基础上的修改使用。本申请仅受权利要求书及其全部范围和等效物的限制。

Claims (16)

  1. 一种显示面板，所述显示面板包括：
    基板；
    第一电极层，位于所述基板上，所述第一电极层包括第一电极；
    像素定义层，位于所述第一电极层背离所述基板的一侧，所述像素定义层包括隔离部和由所述隔离部围合形成的第一开口，所述第一电极至少部分由所述第一开口露出；
    第二电极层，至少部分所述第二电极层位于所述像素定义层背离所述基板的一侧，所述第二电极层包括本体部和贯穿所述本体部的镂空部，所述镂空部和所述第一电极在所述基板上的正投影不交叠设置。
  2. 根据权利要求1所述的显示面板，其中，所述像素定义层还包括贯穿所述像素定义层设置的第二开口，所述镂空部在所述基板上的正投影位于所述第二开口在所述基板上的正投影之内。
  3. 根据权利要求2所述的显示面板，其中，所述第一电极在所述基板上的正投影的至少部分边缘位于所述第二开口在所述基板上的正投影之内。
  4. 根据权利要求2所述的显示面板，其中，所述第一电极层还包括第二电极，所述镂空部和所述第二电极、所述第一电极在所述基板上的正投影不交叠设置，所述第二电极在所述基板上的正投影的至少部分边缘位于所述第二开口在所述基板上的正投影之内。
  5. 根据权利要求4所述的显示面板，其中，所述第二电极和所述本体部在所述显示面板厚度方向上的最大距离小于或等于0.8μm。
  6. 根据权利要求4所述的显示面板，其中，所述第一电极和所述第二电极之间存在间隙。
  7. 根据权利要求6所述的显示面板，其中，所述第一电极和所述第二电极一一对应设置，各所述第二电极环绕各所述第一电极设置，以在各所述第一电极的周侧形成环状的所述间隙。
  8. 根据权利要求6所述的显示面板，其中，所述间隙的宽度为0.5μm～10μm。
  9. 根据权利要求6所述的显示面板，其中，所述隔离部和所述第一电极一一对应设置，且所述隔离部呈环状，各所述间隙在所述基板上的正投影位于各所述隔离部在所述基板上的正投影之内。
  10. 根据权利要求4所述的显示面板，其中，相邻的两个所述隔离部之间形成所述第二开口，位于所述第二开口相对两侧的所述第二电极在所述基板上的正投影的边缘位于该所述第二开口在所述基板上的正投影之内。
  11. 根据权利要求6所述的显示面板，其中，所述显示面板还包括金属遮挡层，所述金属遮挡层位于所述第一电极层背离所述像素定义层的一侧，所述金属遮挡层包括遮挡部，所述间隙在所述基板上的正投影位于所述遮挡部在所述基板上的正投影之内，所述镂空部在所述基板上的正投影和所述遮挡部在所述基板上的正投影不交叠设置。
  12. 根据权利要求11所述的显示面板，其中，至少部分所述第二开口在所述基板上的正投影位于所述遮挡部在所述基板上的正投影之内。
  13. 根据权利要求11所述的显示面板，其中，所述遮挡部包括：
    第一分部，沿第二方向延伸呈条状，多个所述第一分部沿第一方向并排设置；
    第二分部，沿所述第一方向延伸并与多个所述第一分部连接，至少部分所述本体部在所述基板上的正投影位于所述第一分部在所述基板上的正投影之内；
    其中，在沿所述第二方向并排设置的多个所述间隙和多个所述第二开口中，各所述间隙和各所述第二开口在所述基板上的至少部分正投影位于同一所述第一分部在所述基板上的正投影之内。
  14. 根据权利要求13所述的显示面板，其中，所述显示面板具有第一区和环绕至少部分所述第一区的第二区，所述第一分部位于所述第一区，所述第二分部位于所述第二区。
  15. 一种显示装置，其中，所述显示装置包括权利要求1-14任一项所述的显示面板。
  16. 一种显示面板的制备方法，包括：
    在基板上涂制备第一导电材料层，并对所述第一导电材料进行图案化 处理形成第一电极层，所述第一电极层包括第一电极；
    在所述第一电极层背离所述基板的一侧制备绝缘材料层，并对所述绝缘材料层进行图案化处理形成像素定义层，所述像素定义层包括隔离部和由所述隔离部围合形成的第一开口，所述第一电极至少部分由所述第一开口露出；
    在所述像素定义层上制备第二导电材料层；
    由所述基板背离所述第一电极层的一侧对所述第二导电材料层进行激光刻蚀处理形成第二电极层，所述第二电极层包括本体部和贯穿所述本体部的镂空部，所述镂空部和所述第一电极在所述基板上的正投影不交叠设置。
PCT/CN2022/126259 2022-08-09 2022-10-19 显示面板、显示装置及显示面板的制备方法 Ceased WO2024031833A1 (zh)

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