WO2024021183A1 - 摄像头模组及其支架的制作方法 - Google Patents
摄像头模组及其支架的制作方法 Download PDFInfo
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- WO2024021183A1 WO2024021183A1 PCT/CN2022/112363 CN2022112363W WO2024021183A1 WO 2024021183 A1 WO2024021183 A1 WO 2024021183A1 CN 2022112363 W CN2022112363 W CN 2022112363W WO 2024021183 A1 WO2024021183 A1 WO 2024021183A1
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- Prior art keywords
- camera module
- circuit board
- optical axis
- bracket
- electronic components
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims description 33
- 239000004033 plastic Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 230000015654 memory Effects 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 230000002452 interceptive effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
Definitions
- the present invention relates to the field of camera technology, and in particular to a method of manufacturing a camera module and a bracket thereof.
- the purpose of the present invention is to provide a method for making a camera module and a bracket that meet the requirements of miniaturization, and aims to solve the problem that traditional camera modules usually need to reserve a large amount of space for electronic components in order to avoid the bracket from interfering with electronic components during assembly.
- gap which causes the size of the camera module in the xy direction to become larger, which in turn causes the overall volume of the camera module to become very large, which cannot meet the miniaturization requirements of the camera module.
- a first aspect of the present invention provides a camera module, which includes a lens unit arranged along an optical axis from the object side to the image side of the camera module, a bracket with a through hole, a photosensitive chip, and a photosensitive chip.
- the first circuit board that is electrically connected,
- the camera module also includes a second circuit board and electronic components, wherein the electronic components are attached to the second circuit board, and the electronic components and the second circuit board are integrated by embedded molding. molded into said bracket;
- the first circuit board and the second circuit board are electrically connected, and a connector is also provided on the first circuit board for connecting the camera module to an electronic device.
- the bracket includes an inner side close to the optical axis and an outer side opposite to the inner side.
- the outer side is provided with a groove
- the second circuit board is An electrical interface is provided, the electrical interface is exposed at the groove, and the first circuit board is welded to the electrical interface.
- the second circuit board includes a first main body portion disposed in the bracket along a direction perpendicular to the optical axis and facing the first main body portion from one side of the first main body portion.
- a second main body part is formed by bending in the direction of the first circuit board, and the electrical interface is provided on the second main body part.
- the inner side is provided with a first step and a second step connected to the first step, wherein the first step includes a first step along a direction perpendicular to the optical axis. surface and a second surface extending from the first surface along the optical axis direction toward the first circuit board, and the second step includes a third surface along the direction perpendicular to the optical axis and a second surface extending from the third surface along the optical axis direction. a fourth surface extending in the axial direction toward the first circuit board;
- the distance between the first surface and the first circuit board is greater than the distance between the third surface and the first circuit board, and the distance between the second surface and the optical axis is smaller than the distance between the fourth surface and the optical axis. distance.
- the photosensitive chip is spaced apart from the third surface and the fourth surface respectively.
- the camera module further includes a filter, and the filter is attached to the first surface.
- the camera module there are a plurality of electronic components, and a plurality of the electronic components are spaced apart on a side of the first body portion close to the first circuit board, and the electronic components are capacitor and/or memory.
- the material of the bracket is plastic, rubber or silicone.
- a second aspect of the present invention provides a manufacturing method for the stent as described above, including the following steps: attaching the electronic component to the second circuit board; burying the second circuit board into the mold; inject the molten polymer material into the mold, maintain it at the solidification temperature for a certain period of time, and then take it out to obtain the stent.
- the polymer material is plastic, rubber or silicone.
- the electronic components and the second circuit board in the above-mentioned camera module are integrally formed in the bracket by embedded molding. Therefore, there is no need to reserve a safety gap for the electronic components to prevent the bracket from interfering with the electronic components during assembly, which can make the above-mentioned camera module
- the smaller size in the xy direction can make the overall volume of the camera module smaller, which can meet the miniaturization requirements of the camera module.
- Figure 1 is a schematic three-dimensional structural diagram of a camera module according to an embodiment of the present invention.
- Figure 2 is an exploded view of the camera module shown in Figure 1 from a first perspective.
- Figure 3 is an exploded view of the camera module shown in Figure 1 from a second perspective.
- FIG. 4 is a cross-sectional view along the A-A direction of the camera module shown in FIG. 1 .
- FIG. 5 is a cross-sectional view of the camera module shown in FIG. 1 along the B-B direction.
- FIG. 6 is an enlarged view of the bracket of the camera module shown in FIG. 1 .
- FIG. 7 is an enlarged view of the second circuit board of the camera module shown in FIG. 1 .
- FIG. 8 is a cross-sectional view along the C-C direction of the bracket of the camera module shown in FIG. 6 .
- embodiments of the present invention provide a camera module, which includes a lens unit 60 arranged along the optical axis from the object side to the image side of the camera module.
- the camera module also includes a second circuit board 30 and electronic components 40, where the electronic components 40 are attached On the second circuit board 30 , the electronic components 40 and the second circuit board 30 are integrally formed in the bracket 50 by embedded molding.
- the first circuit board 10 and the second circuit board 30 are electrically connected.
- the first circuit board 10 A connector 80 is also provided on the camera module for connecting the camera module to the electronic device.
- the electronic component 40 and the second circuit board 30 are integrated into the bracket 50 by embedded molding. Therefore, there is no need to reserve a safety gap for the electronic component 40 to prevent the bracket 50 from interfering with the electronic component 40 during assembly.
- the size of the above-mentioned camera module in the xy direction can be reduced, thereby reducing the overall volume of the camera module, which can meet the miniaturization requirements of the camera module.
- Traditional camera modules usually need to reserve a large gap for the electronic components in order to prevent the bracket from interfering with the electronic components during assembly, resulting in an increase in the size of the camera module in the xy direction, which in turn results in an increase in the overall volume of the camera module. is too large to meet the miniaturization requirements of camera modules.
- the electronic components and the second circuit board in the camera module of this solution are integrally formed in the bracket by embedded molding. Therefore, there is no need to reserve a safety gap for the electronic components to avoid the bracket from interfering with the electronic components during assembly, which can make the above-mentioned camera
- the size of the module in the xy direction becomes smaller, which in turn can make the overall volume of the camera module smaller, which can meet the miniaturization requirements of the camera module.
- the above-mentioned electronic devices may be mobile phones, tablets, etc.
- the lens unit 60 receives external light to generate an optical image, and the generated optical image filters out infrared light through the filter 70. The remaining visible light is projected onto the photosensitive chip 20, and the photosensitive chip 20 converts the optical signal. The electrical signal is then transmitted to the connector 80 through the first circuit board 10, and then finally transmitted to the electronic device.
- the through hole 51 is located in the middle area of the bracket 50 , and the through hole 51 is a rectangular hole.
- the bracket 50 includes an inner side close to the optical axis and an outer side opposite to the inner side.
- the outer side is provided with a groove 53
- the second circuit board 30 is provided with an electrical interface 331 , the electrical interface 331 is exposed at the groove 53, and the first circuit board 10 and the electrical interface 331 are welded and connected.
- the electrical interface 331 the first circuit board 10 and the second circuit board 30 can be electrically connected.
- the electrical interface 331 is a gold finger.
- the second circuit board 30 includes a first main body part 31 disposed in the bracket 50 along a direction perpendicular to the optical axis and a first body part 31 from the first main body part 31 .
- the second main body part 33 is formed by bending its side toward the first circuit board 10, and the electrical interface 331 is provided on the second main body part 33. Specifically, by disposing the electrical interface 331 on the second main body part 33, it is convenient to The interface 331 is soldered to the first circuit board 10 .
- a first step 55 and a second step 57 connected to the first step 55 are provided on the inner side, where the first step 55 includes a vertical A first surface 551 in the direction of the optical axis and a second surface 553 extending from the first surface 551 in the direction of the optical axis toward the first circuit board 10.
- the second step 57 includes a third surface 571 in the direction perpendicular to the optical axis and a second surface 553 extending in the direction perpendicular to the optical axis.
- the third surface 571 is a fourth surface 573 extending toward the first circuit board 10 along the optical axis direction.
- the distance between the first surface 551 and the first circuit board 10 is greater than the distance between the third surface 571 and the first circuit board 10 , and the distance between the second surface 553 and the optical axis is smaller than the distance between the fourth surface 573 and the optical axis.
- the accommodation space formed by the bracket 50 and the first circuit board 10 is fully utilized.
- the photosensitive chip 20 is spaced apart from the third surface 571 and the fourth surface 573 respectively.
- the photosensitive chip 20 is spaced apart from the third surface 571 and the fourth surface 573 respectively, which has an avoidance effect and can prevent the photosensitive chip 20 from contacting the bracket 50 .
- the camera module further includes a filter 70 , and the filter 70 is attached to the first surface 551 .
- the camera module also includes a filter 70, which is attached to the first surface 551.
- the filter 70 can filter out infrared light.
- the filter 70 is attached to the first surface 551 through glue or adhesive tape. Of course, other methods can also be used to attach the filter 70 to the first surface. 551 on.
- the camera module there are multiple electronic components 40 , and the multiple electronic components 40 are spaced apart on a side of the first main body 31 close to the first circuit board 10 , and the electronic components 40 are capacitors and/or memories. .
- the electronic components 40 are capacitors and/or memories, and the capacitors can power the photosensitive chip 20 As well as storing electrical charges, memory can be used to temporarily store electrical signals.
- the memory is EEPROM (Electrically Erasable Programmable Read-Only Memory).
- the material of the bracket 50 is plastic, rubber or silicone.
- the material of the bracket 50 is plastic, rubber or silicone, which is convenient for placing the electronic components 40 and the second circuit board 30 in the bracket 50 and the material is relatively light.
- An embodiment of the present invention also provides a manufacturing method for the aforementioned bracket, which includes the following steps: S10, attach the electronic component 40 to the second circuit board 30; S20, bury the second circuit board 30 In the forming mold; S30, inject the molten polymer material into the mold, maintain it at the solidification temperature for a certain period of time, and then take it out to obtain the stent 50.
- the electronic component 40 and the second circuit board 30 are integrated into the bracket 50 by insert molding. Therefore, there is no need to reserve a safety gap for the electronic component 40 to prevent the bracket 50 from interfering with the electronic component 40 during assembly. , can make the size of the above-mentioned camera module in the xy direction smaller, thereby making the overall volume of the camera module smaller, and can meet the miniaturization requirements of the camera module.
- the polymer material is plastic, rubber or silicone.
- the polymer material is plastic, rubber or silicone, so that the electronic component 40 and the second circuit board 30 can be integrated into the bracket 50 by embedded molding.
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Abstract
本发明提供了一种摄像头模组及其支架的制作方法，其中电子元件贴设于第二电路板上，电子元件和第二电路板采用埋入成型的方式一体成型在支架中。传统的摄像头模组通常为了避免支架在组装时干涉电子元件，需要给电子元件预留较大的间隙，从而导致摄像头模组xy方向上的尺寸变大，进而导致摄像头模组的总体体积会变的很大，无法满足摄像头模组小型化要求。本方案的摄像头模组中电子元件和第二电路板采用埋入成型的方式一体成型在支架中，因此不需要为电子元件预留安全间隙以避免支架在组装时干涉电子元件，能够使得上述摄像头模组xy方向上的尺寸变小，进而能够使得摄像头模组的总体体积变小，可以满足摄像头模组小型化要求。
Description
本发明涉及摄像头技术领域，尤其涉及一种摄像头模组及其支架的制作方法。
随着人们生活水平的不断提高，各种电子设备，如手机、相机、平板电脑等，已经逐渐成为人们必不可少的日常用品。为了方便人们随时随地记录图片和视频，摄像头模组也已经成为各种电子设备的标配部件，并且对摄像头模组的成像品质需求也越来越高。在制造摄像头模组时，一般将电子元件安装在PCB板上，然后将支架贴附在PCB板上，以盖住电子元件。
传统的摄像头模组通常为了避免支架在组装时干涉电子元件，需要给电子元件预留较大的间隙，从而导致摄像头模组xy方向上的尺寸变大，进而导致摄像头模组的总体体积会变的很大，无法满足摄像头模组小型化要求。
本发明的目的在于提供一种满足小型化要求的摄像头模组及其支架的制作方法，旨在解决传统的摄像头模组通常为了避免支架在组装时干涉电子元件，需要给电子元件预留较大的间隙，从而导致摄像头模组xy方向上的尺寸变大，进而导致摄像头模组的总体体积会变的很大，无法满足摄像头模组小型化要求的问题。
为实现上述发明目的，本发明采用的技术方案如下：
本发明的第一方面，提供一种摄像头模组，其包括自所述摄像头模组的物侧至像侧沿光轴设置的镜头单元、具有通孔的支架、感光芯片以及与所述感光芯片电性连接的第一电路板，
所述摄像头模组还包括有第二电路板和电子元件，其中所述电子元件贴设于所述第二电路板上，所述电子元件和所述第二电路板采用埋入成型的方式一体成型在所述支架中；
所述第一电路板和所述第二电路板电性连接，所述第一电路板上还设置有一连接器用于将所述摄像头模组与电子设备连接。
在摄像头模组的一些优选的实施例中，所述支架包括靠近光轴的内侧面及与所述内侧面相对设置的外侧面，所述外侧面设置有一凹槽，所述第二电路板上设置有电接口，所述电接口暴露于所述凹槽处，所述第一电路板与所述电接口焊接连接。
在摄像头模组的一些优选的实施例中，所述第二电路板包括沿垂直于光轴方向设置在所述支架内的第一主体部以及自所述第一主体部的一侧朝向所述第一电路板方向弯折形成的第二主体部，所述电接口设置在所述第二主体部上。
在摄像头模组的一些优选的实施例中，所述内侧面设置有第一台阶以及与所述第一台阶相连的第二台阶，其中所述第一台阶包括沿垂直于光轴方向的第一表面和自所述第一表面沿光轴方向朝所述第一电路板延伸的第二表面，所述第二台阶包括沿垂直于光轴方向的第三表面和自所述第三表面沿光轴方向朝所述第一电路板延伸的第四表面；
其中所述第一表面与所述第一电路板的距离大于所述第三表面与所述第一电路板的距离，所述第二表面与光轴的距离小于所述第四表面与光轴的距离。
在摄像头模组的一些优选的实施例中，所述感光芯片分别与所述第三表面和所述第四表面间隔设置。
在摄像头模组的一些优选的实施例中，所述摄像头模组还包括滤光片，所述滤光片贴设于所述第一表面上。
在摄像头模组的一些优选的实施例中，所述电子元件为多个，多个所述电子元件间隔设置在所述第一主体部靠近所述第一电路板的一面，所述电子元件为电容和/或存储器。
在摄像头模组的一些优选的实施例中，所述支架的材料为塑胶、橡胶或硅胶。
本发明的第二方面，提供一种用于如前所述的支架的制造方法，包括如下步骤：将所述电子元件贴设于所述第二电路板上；将所述第二电路板埋入成型模具内；将熔融高分子材料注入模具内，在固化温度下保持一定的时间后取出，得到所述支架。
在支架的制造方法的一些优选的实施例中，所述高分子材料为塑胶、橡胶或硅胶。
实施本发明实施例，将具有如下有益效果：
上述摄像头模组中电子元件和第二电路板采用埋入成型的方式一体成型在支架中，因此不需要为电子元件预留安全间隙以避免支架在组装时干涉电子元件，能够使得上述摄像头模组xy方向上的尺寸变小，进而能够使得摄像头模组的总体体积变小，可以满足摄像头模组小型化要求。
图1为本发明实施例摄像头模组的立体结构示意图。
图2为如图1所示的摄像头模组的第一视角爆炸图。
图3为如图1所示的摄像头模组的第二视角爆炸图。
图4为如图1所示的摄像头模组的A-A向的剖视图。
图5为如图1所示的摄像头模组的B-B向的剖视图。
图6为如图1所示的摄像头模组的支架的放大图。
图7为如图1所示的摄像头模组的第二电路板的放大图。
图8为如图6所示的摄像头模组的支架的C-C向的剖视图。
下面结合附图和实施方式对本发明作进一步说明。
如图1、图2、图3、图4和图5所示，本发明实施例提供一种摄像头模组，其包括自摄像头模组的物侧至像侧沿光轴设置的镜头单元60、具有通孔51的支架50、感光芯片20以及与所述感光芯片20电性连接的第一电路板10，摄像头模组还包括有第二电路板30和电子元件40，其中电子元件40贴设于第二电路板30上，电子元件40和第二电路板30采用埋入成型的方式一体成型在支架50中，第一电路板10和第二电路板30电性连接，第一电路板10上还设置有一连接器80用于将摄像头模组与电子设备连接。
上述摄像头模组中电子元件40和第二电路板30采用埋入成型的方式一体成型在支架50中，因此不需要为电子元件40预留安全间隙以避免支架50在组装时干涉电子元件40，能够使得上述摄像头模组xy方向上的尺寸变小，进而能够使得摄像头模组的总体体积变小，可以满足摄像头模组小型化要求。
传统的摄像头模组通常为了避免支架在组装时干涉电子元件，需要给电子元件预留较大的间隙，从而导致摄像头模组xy方向上的尺寸变大，进而导致摄像头模组的总体体积会变的很大，无法满足摄像头模组小型化要求。本方案的摄像头模组中电子元件和第二电路板采用埋入成型的方式一体成型在支架中，因此不需要为电子元件预留安全间隙以避免支架在组装时干涉电子元件，能够使得上述摄像头模组xy方向上的尺寸变小，进而能够使得摄像头模组的总体体积变小，可以满足摄像头模组小型化要求。
上述电子设备可以为移动电话、平板等。
本申请的具体工作原理为：镜头单元60接收外界光线生成光学图像，生成的光学图像通过滤光片70滤除红外光，剩余的可见光会投射到感光芯片20上，感光芯片20将光信号转化为电信号，再通过第一电路板10传导至连接器80上，然后最终传导至电子设备上。
在摄像头模组的一些优选的实施例中，通孔51位于支架50的中间区域，通孔51为矩形孔。
在摄像头模组的一些优选的实施例中，支架50包括靠近光轴的内侧面及与内侧面相对设置的外侧面，外侧面设置有一凹槽53，第二电路板30上设置有电接口331，电接口331暴露于凹槽53处，第一电路板10与电接口331焊接连接，具体来说，通过设置电接口331，可以将第一电路板10和第二电路板30电性连接。
在摄像头组件的一些优选的实施例中，电接口331为金手指。
在摄像头模组的一些优选的实施例中，如图7所示，第二电路板30包括沿垂直于光轴方向设置在支架50内的第一主体部31以及自第一主体部31的一侧朝向第一电路板10方向弯折形成的第二主体部33，电接口331设置在第二主体部33上，具体来说，通过将电接口331设置在第二主体部33上，便于电接口331与第一电路板10焊接。
在摄像头模组的一些优选的实施例中，如图6和图8所示，内侧面设置有第一台阶55以及与第一台阶55相连的第二台阶57，其中第一台阶55包括沿垂直于光轴方向的第一表面551和自第一表面551沿光轴方向朝第一电路板10延伸的第二表面553，第二台阶57包括沿垂直于光轴方向的第三表面571和自第三表面571沿光轴方向朝第一电路板10延伸的第四表面573。
其中第一表面551与第一电路板10的距离大于第三表面571与第一电路板10的距离，第二表面553与光轴的距离小于第四表面573与光轴的距离。
具体来说，通过设置第一台阶55和第二台阶57，用于收容滤光片70和感光芯片20，充分利用了支架50和第一电路板10形成的收容空间。
在摄像头模组的一些优选的实施例中，感光芯片20分别与第三表面571和第四表面573间隔设置。
具体来说，感光芯片20分别与第三表面571和第四表面573间隔设置，具有避让的作用，可以避免感光芯片20与支架50接触。
在摄像头模组的一些优选的实施例中，摄像头模组还包括滤光片70，滤光片70贴设于第一表面551上。
具体来说，摄像头模组还包括滤光片70，滤光片70贴设于第一表面551上，滤光片70可以滤除红外光。
在摄像头组件的一些优选的实施例中，滤光片70通过胶水或者背胶的方式贴设于第一表面551上，当然，也可以采用其他的方式将滤光片70贴设于第一表面551上。
在摄像头模组的一些优选的实施例中，电子元件40为多个，多个电子元件40间隔设置在第一主体部31靠近第一电路板10的一面，电子元件40为电容和/或存储器。
具体来说，电子元件40为多个，多个电子元件40间隔设置在第一主体部31靠近第一电路板10的一面，电子元件40为电容和/或存储器，电容能够为感光芯片20供电以及存储电荷，存储器可以用来临时存储电信号。具体地，存储器为EEPROM（带电可擦可编程只读存储器）。
在摄像头模组的一些优选的实施例中，支架50的材料为塑胶、橡胶或硅胶。
具体来说，支架50的材料为塑胶、橡胶或硅胶，便于将电子元件40和第二电路板30放置在支架50内，并且材料较轻。
本发明实施例还提供一种用于如前所述的支架的制造方法，包括如下步骤：S10、将电子元件40贴设于第二电路板30上；S20、将第二电路板30埋入成型模具内；S30、将熔融高分子材料注入模具内，在固化温度下保持一定的时间后取出，得到支架50。
上述支架的制造方法中电子元件40和第二电路板30采用埋入成型的方式一体成型在支架50中，因此不需要为电子元件40预留安全间隙以避免支架50在组装时干涉电子元件40，能够使得上述摄像头模组xy方向上的尺寸变小，进而能够使得摄像头模组的总体体积变小，可以满足摄像头模组小型化要求。
在摄像头模组的一些优选的实施例中，高分子材料为塑胶、橡胶或硅胶。
具体来说，高分子材料为塑胶、橡胶或硅胶，便于电子元件40和第二电路板30采用埋入成型的方式一体成型在支架50中。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。
Claims (10)
- 一种摄像头模组，其包括自所述摄像头模组的物侧至像侧沿光轴设置的镜头单元、具有通孔的支架、感光芯片以及与所述感光芯片电性连接的第一电路板，其特征在于，所述摄像头模组还包括有第二电路板和电子元件，其中所述电子元件贴设于所述第二电路板上，所述电子元件和所述第二电路板采用埋入成型的方式一体成型在所述支架中；所述第一电路板和所述第二电路板电性连接，所述第一电路板上还设置有一连接器用于将所述摄像头模组与电子设备连接。
- 如权利要求1所述的摄像头模组，其特征在于，所述支架包括靠近光轴的内侧面及与所述内侧面相对设置的外侧面，所述外侧面设置有一凹槽，所述第二电路板上设置有电接口，所述电接口暴露于所述凹槽处，所述第一电路板与所述电接口焊接连接。
- 如权利要求2所述的摄像头模组，其特征在于，所述第二电路板包括沿垂直于光轴方向设置在所述支架内的第一主体部以及自所述第一主体部的一侧朝向所述第一电路板方向弯折形成的第二主体部，所述电接口设置在所述第二主体部上。
- 如权利要求2所述的摄像头模组，其特征在于，所述内侧面设置有第一台阶以及与所述第一台阶相连的第二台阶，其中所述第一台阶包括沿垂直于光轴方向的第一表面和自所述第一表面沿光轴方向朝所述第一电路板延伸的第二表面，所述第二台阶包括沿垂直于光轴方向的第三表面和自所述第三表面沿光轴方向朝所述第一电路板延伸的第四表面；其中所述第一表面与所述第一电路板的距离大于所述第三表面与所述第一电路板的距离，所述第二表面与光轴的距离小于所述第四表面与光轴的距离。
- 如权利要求4所述的摄像头模组，其特征在于，所述感光芯片分别与所述第三表面和所述第四表面间隔设置。
- 如权利要求4所述的摄像头模组，其特征在于，所述摄像头模组还包括滤光片，所述滤光片贴设于所述第一表面上。
- 如权利要求3所述的摄像头模组，其特征在于，所述电子元件为多个，多个所述电子元件间隔设置在所述第一主体部靠近所述第一电路板的一面，所述电子元件为电容和/或存储器。
- 如权利要求1所述的摄像头模组，其特征在于，所述支架的材料为塑胶、橡胶或硅胶。
- 一种用于如权利要求1-8中任意一项权利要求所述的支架的制造方法，其特征在于，包括如下步骤：将所述电子元件贴设于所述第二电路板上；将所述第二电路板埋入成型模具内；将熔融高分子材料注入模具内，在固化温度下保持一定的时间后取出，得到所述支架。
- 如权利要求9所述的制造方法，其特征在于，所述高分子材料为塑胶、橡胶或硅胶。
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| JP2005268963A (ja) * | 2004-03-16 | 2005-09-29 | Citizen Electronics Co Ltd | 撮像モジュールとマザーボードへのその実装方法およびその製造方法 |
| CN209299378U (zh) * | 2019-01-16 | 2019-08-23 | 昆山丘钛微电子科技有限公司 | 摄像头模组及移动终端 |
| CN110611753A (zh) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | 镜头模组及该镜头模组的组装方法 |
| CN110832835A (zh) * | 2017-08-05 | 2020-02-21 | 宁波舜宇光电信息有限公司 | 摄像模组和具有摄像模组的电子设备及摄像模组制备方法 |
| CN212413271U (zh) * | 2020-06-28 | 2021-01-26 | 江西联益光学有限公司 | 一种镜头支架及摄像头模组 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005268963A (ja) * | 2004-03-16 | 2005-09-29 | Citizen Electronics Co Ltd | 撮像モジュールとマザーボードへのその実装方法およびその製造方法 |
| CN110832835A (zh) * | 2017-08-05 | 2020-02-21 | 宁波舜宇光电信息有限公司 | 摄像模组和具有摄像模组的电子设备及摄像模组制备方法 |
| CN110611753A (zh) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | 镜头模组及该镜头模组的组装方法 |
| CN209299378U (zh) * | 2019-01-16 | 2019-08-23 | 昆山丘钛微电子科技有限公司 | 摄像头模组及移动终端 |
| CN212413271U (zh) * | 2020-06-28 | 2021-01-26 | 江西联益光学有限公司 | 一种镜头支架及摄像头模组 |
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