WO2024012068A1 - 清洗装置、烘干装置及晶圆存放盒的清洗烘干设备 - Google Patents

清洗装置、烘干装置及晶圆存放盒的清洗烘干设备 Download PDF

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Publication number
WO2024012068A1
WO2024012068A1 PCT/CN2023/096511 CN2023096511W WO2024012068A1 WO 2024012068 A1 WO2024012068 A1 WO 2024012068A1 CN 2023096511 W CN2023096511 W CN 2023096511W WO 2024012068 A1 WO2024012068 A1 WO 2024012068A1
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WO
WIPO (PCT)
Prior art keywords
cover
wafer storage
lid
storage box
box
Prior art date
Application number
PCT/CN2023/096511
Other languages
English (en)
French (fr)
Inventor
廖周芳
邵树宝
夏晓红
赖国繁
Original Assignee
江苏芯梦半导体设备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江苏芯梦半导体设备有限公司 filed Critical 江苏芯梦半导体设备有限公司
Publication of WO2024012068A1 publication Critical patent/WO2024012068A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B23/00—Heating arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present application relates to the technical field of post-processing devices for wafer storage boxes, and in particular to a cleaning device, a drying device and cleaning and drying equipment for wafer storage boxes.
  • the existing wafer storage box has a box body and a lid.
  • the lid is closed on the box body to form a sealed chamber. It needs to be rotated at a certain angle (usually 90 degrees) by a knob extending into the knob hole. °) to achieve locking or unlocking.
  • a certain angle usually 90 degrees
  • the cleaning machine is realized under the cooperation of the conveying line body, the cleaning station, the drying station and the air supply assembly.
  • the cleaning and drying of the wafer box ensures the cleanliness of the wafer box, and thus the particle cleanliness of the wafers.
  • the box body, and the method of locking the lid and the box body after cleaning and drying are completed.
  • the ideal operation method is to separate the lid from the box body before proceeding. Cleaning and drying can provide more comprehensive cleaning and drying with higher efficiency.
  • the purpose of the embodiments of the present application is to provide a cleaning device, a drying device and a cleaning and drying equipment for a wafer storage box, so as to solve the technical problems in the above background technology.
  • inventions of the present application provide a cleaning device used in cleaning and drying equipment for wafer storage boxes.
  • the cleaning device includes: a first positioning mechanism, a first unlocking mechanism and a cleaning device. Wash the cavity;
  • the first unlocking mechanism is configured to unlock the lid of the wafer storage box and separate the lid from the body of the wafer storage box;
  • the first positioning mechanism is configured to fix the cover after it is separated from the box body
  • the cleaning chamber is configured to place the box body after the lid is separated from the box body
  • the cleaning device is configured to clean the cover and the box body of the wafer storage box in a state where the cover and the box body are separated.
  • the cleaning device includes: a barrel and a first cover, the first cover being used to cover or open the barrel;
  • the first positioning mechanism and the first unlocking mechanism are provided on the first cover, and the first unlocking mechanism includes a first knob mechanism;
  • the first knob mechanism When the first lid opens the barrel, the first knob mechanism is configured to complete docking and unlocking of the lid of the wafer storage box, so that the lid is separated from the box of the wafer storage box;
  • the first positioning mechanism is configured to fix the cover after being separated from the box body;
  • the barrel includes the cleaning cavity, and the barrel is configured to place the box through the cleaning cavity after the lid is separated from the box;
  • the cleaning device cleans the lid and the box body of the wafer storage box.
  • the first positioning mechanism includes a positioning plate, and also includes a first vacuum nozzle and a first limiting block installed on the positioning plate, wherein the first vacuum nozzle is configured to complete all
  • the first limiting block is configured to ensure that the cover is in the correct position after being adsorbed by the first vacuum nozzle.
  • the first knob mechanism is configured to complete docking and unlocking of the lid of the wafer storage box, including: the first knob mechanism can extend into the knob hole of the lid of the wafer storage box and rotate to Unlock said cover.
  • the first knob mechanism includes a lifting cylinder, a rotating cylinder, a bearing seat, a bearing and a first knob.
  • the bearing seat is installed on the first cover, and the bearing is installed on the bearing seat.
  • the bearing is provided with a guide rod that can be lifted and lowered and rotated synchronously.
  • One end of the guide rod passes through the first cover and is connected to the first knob.
  • the other end of the guide rod is connected to the first knob.
  • the output end of the lifting cylinder is connected, and the output end of the rotating cylinder is equipped with a driving wheel.
  • the driving wheel is connected to the driven wheel fixed on the outer wall of the bearing through a synchronous belt.
  • the first positioning mechanism includes a positioning plate, the positioning plate is provided with a through hole; the first knob is driven through the through hole through the lifting cylinder.
  • embodiments of the present application also provide a drying device, which is used in cleaning and drying equipment for wafer storage boxes.
  • the drying device includes: a second positioning mechanism, a second unlocking mechanism and a drying chamber. ;
  • the second unlocking mechanism is configured to complete unlocking of the lid of the wafer storage box, so that the lid is separated from the body of the wafer storage box;
  • the second positioning mechanism is configured to fix the cover after it is separated from the box body
  • the drying cavity is configured to place the box after the lid is separated from the box
  • the drying device is configured to dry the lid and the box body of the wafer storage box in a state where the lid and the box body are separated.
  • the drying device includes: a housing and a second cover, the second cover being used to close or open the housing;
  • the second positioning mechanism and the second unlocking mechanism are provided on the second cover, and the second unlocking mechanism includes a second knob mechanism;
  • the second knob mechanism is configured to complete docking and unlocking of the lid of the wafer storage box, so that the lid is separated from the box of the wafer storage box;
  • the second positioning mechanism is configured to fix the cover after it is separated from the box body;
  • the housing includes the drying cavity, and the housing is configured to place the box through the drying cavity after the lid is separated from the box;
  • the drying device dries the cover and the box body of the wafer storage box.
  • the second positioning mechanism includes a clamping claw provided on the second cover and a second vacuum nozzle, and the clamping claw is connected to the output end of the positioning cylinder on the second cover. ;
  • the second vacuum nozzle is used to adsorb and fix the lid of the wafer storage box; in the state where the second cover covers the housing and evacuates the drying chamber, the The clamping jaw is configured to clamp the cover driven by the positioning cylinder, and is used to replace the second vacuum nozzle, and then Continue to fix the cover on the second cover body.
  • the second knob mechanism is configured to complete docking and unlocking of the lid of the wafer storage box, including: the second knob mechanism can extend into the knob hole on the lid of the wafer storage box and rotate, to unlock the cover.
  • inventions of the present application provide a drying device, which is used in cleaning and drying equipment for wafer storage boxes.
  • the drying device includes: a housing and a second cover, wherein,
  • the second cover is used to cover or open the housing
  • the second cover is provided with a second positioning mechanism
  • the second positioning mechanism includes a clamping claw and a second vacuum nozzle provided on the second cover body, the clamping claw is connected to the output end of the positioning cylinder on the second cover body; the second The vacuum nozzle is used to adsorb and fix the lid of the wafer storage box; in a state where the second cover covers the housing and evacuates the drying chamber, the clamping jaw is configured to pass through The positioning cylinder drives and clamps the lid of the wafer storage box to replace the second vacuum nozzle to continue fixing the lid to the second lid body.
  • embodiments of the present application provide a cleaning and drying equipment for a wafer storage box, including the cleaning device as described in any one of the first aspects, and/or including the cleaning device as described in any one of the second to third aspects.
  • the cleaning and drying equipment of the wafer storage box also includes:
  • Unloading device used for unloading wafer storage boxes
  • the unloading device includes a second front bracket and a second rear bracket
  • the second rear bracket is provided with a nitrogen filling mechanism for injecting nitrogen into the wafer storage box.
  • the lid and the box body of the wafer storage box can be separated when cleaning and drying the wafer storage box, making the two relatively independent.
  • the box body and lid can be fully cleaned and dried to ensure cleanliness and optimize the wafer storage environment; and the lid of the wafer storage box is separated from the box body at the cleaning device or drying device. It is then directly fixed by the positioning mechanism. There is no need to occupy additional unlocking and storage space in the cleaning and drying equipment of the wafer storage box, and there is no need to move it to the cleaning device or drying device again, so it is conducive to a smoother cleaning and drying process. Proceed, more efficiently.
  • Figure 1 is a structural diagram of the cleaning and drying equipment of the wafer storage box according to the embodiment of the present application.
  • FIG. 2 is a structural diagram of the loading device according to the embodiment of the present application.
  • Figure 3 is a structural diagram of the cleaning device according to the embodiment of the present application with the first cover opened.
  • Figure 4 is a structural diagram from another side of Figure 3.
  • Figure 5 is a structural diagram of the first knob mechanism according to the embodiment of the present application.
  • Figure 6 is a structural diagram of the drying device according to the embodiment of the present application with the second cover opened.
  • FIG. 7 is a structural diagram from another side of FIG. 6 .
  • Figure 8 is a structural diagram of the unloading device according to the embodiment of the present application.
  • Figure 9 is a structural diagram of a wafer storage box according to an embodiment of the present application.
  • FIG. 10 is a structural diagram of the wafer storage box from another side according to the embodiment of the present application.
  • the embodiment of the present application provides a cleaning and drying equipment for a wafer storage box, including a frame and a robot, and also includes: a loading device for loading the wafer storage box, and moving the material to the cleaning via the robot Device; cleaning device, including a barrel and a first cover.
  • the barrel is provided with a spray pipe.
  • the lower part of the barrel is provided with a material tray.
  • the first cover is hinged to the barrel.
  • the first cover is hinged to the barrel.
  • the cover is provided with a first positioning mechanism and a first knob mechanism.
  • the first knob mechanism extends into the knob hole of the lid of the wafer storage box held by the robot hand and rotates to unlock the lid and separate the lid from the box.
  • the drying device includes a shell and a second cover, and there is a heater, the housing is provided with an air inlet and an air outlet, the second cover is hinged to the housing, the second cover is provided with a second positioning mechanism and a second knob mechanism, the The second knob mechanism extends into the knob hole on the lid of the wafer storage box held by the robot arm and rotates to unlock the lid and separate the lid from the box body.
  • the second positioning mechanism fixes the lid, and the robot arm moves the box body placed in the shell;
  • the unloading device is used to unload the wafer storage box removed from the drying device by the robot.
  • the first positioning mechanism includes a positioning plate and a first vacuum nozzle.
  • the first vacuum nozzle is installed on the positioning plate; a first limiting block is installed on the positioning plate.
  • the material tray and the positioning tray are rotatably installed on the barrel and the first cover respectively, and a first rotating motor and a second rotating motor are respectively provided outside the barrel and the first cover.
  • the output shaft of the first rotating motor is connected to the material tray, and the output shaft of the second rotating motor is connected to the positioning plate.
  • the first knob mechanism includes a lifting cylinder, a rotating cylinder, a bearing seat, a bearing and a first knob.
  • the bearing seat is installed on the first cover, and the bearing is installed in the bearing seat.
  • There is a guide rod in the bearing that can be lifted and lowered and rotated synchronously.
  • One end of the guide rod passes through the first cover and is connected to a first knob.
  • the other end of the guide rod is connected to the output end of the lifting cylinder.
  • the rotating cylinder The output end is provided with a driving wheel, and the driving wheel is connected to the driven wheel fixed on the outer wall of the bearing through a synchronous belt.
  • the positioning plate is provided with a through hole, and the first knob is driven through the through hole by a lifting cylinder.
  • the second positioning mechanism includes a clamping claw and a second vacuum nozzle provided on the second cover body, and the clamping claw is connected to the output end of the positioning cylinder on the second cover body;
  • a second limiting block is installed on the second cover body.
  • the loading device includes a first front bracket and a first rear bracket, a first electric cylinder is provided below the first front bracket and the first rear bracket, and a first electric cylinder is provided on the first electric cylinder.
  • a first lifting cylinder, a first bracket is provided on the first lifting cylinder; a weighing sensor is installed on the first rear bracket.
  • the unloading device includes a second front bracket and a second rear bracket, a second electric cylinder is provided below the second front bracket and the second rear bracket, and a second electric cylinder is provided on the second electric cylinder.
  • the second lifting cylinder is provided with a second bracket; the second rear bracket is provided with a nitrogen inflating mechanism for injecting nitrogen into the wafer storage box.
  • embodiments of the present application provide a cleaning and drying method for a wafer storage box, which includes the following steps: S1.
  • the wafer storage box is loaded through a loading device and moved to the cleaning device by a robot;
  • S2. First
  • the first knob mechanism on the cover extends into the knob hole of the cover and then rotates to unlock the cover.
  • the box is detached from the box, the first positioning mechanism fixes the lid after it is detached from the box, the robot holds the box upside down on the material tray, the first lid closes the barrel, and the spray pipe cleans and dries the box and lid;
  • the first cover body is opened, the robot clamps the box body and abuts it against the cover.
  • the first knob mechanism on the first cover body extends into the knob hole of the cover and then rotates so that the cover is locked on the box body.
  • the first knob The mechanism is reset, the first positioning mechanism releases the cover, and the manipulator clamps the wafer storage box to the drying device; S4.
  • the second knob mechanism on the second cover extends into the knob hole of the cover and rotates to unlock and position the cover.
  • the positioning mechanism fixes the lid, and the manipulator places the box body in the housing.
  • the second lid body closes the housing, evacuates and vents nitrogen, and the heater heats the box body and lid until the box body and lid are dry; S5, second The cover is opened, the robot clamps the box and contacts the box with the lid.
  • the second knob mechanism extends into the knob hole of the lid and rotates so that the lid is locked on the box.
  • the second positioning mechanism releases the lid and the robot clamps the lid.
  • step S4 after the second cover closes the shell, the air is evacuated until the pressure inside the shell is maintained at 500-1800Pa, and nitrogen is filled into the shell at a flow rate of 2-5 liters/min.
  • the humidity sensor detects the dryness of the box and lid; after it is completely dry, stop pumping and fill the case with nitrogen at a flow rate of 50-100 liters/min to restore the pressure in the case to standard atmospheric pressure.
  • a cleaning and drying equipment for a wafer storage box includes a frame 50, a robot 60, a loading device 10, a cleaning device 20, a drying device 30 and an unloading device 40.
  • the loading device 10 There can be multiple cleaning devices 20 , drying devices 30 and unloading devices 40 , forming multiple workstations. Cooperating with each other can improve the cleaning and drying efficiency of the wafer storage box 100 .
  • the loading device 10 is used for wafer storage.
  • the box 100 is loaded with materials and transferred to the cleaning device 20 via the robot 60.
  • the specific structure of the loading device 10 includes a first front bracket 11 located outside the shell of the cleaning and drying equipment and a first front bracket 11 located outside the cleaning and drying equipment casing.
  • a first electric cylinder 13 is provided below the first rear bracket 12, the first front bracket 11 and the first rear bracket 12 in the housing.
  • the first electric cylinder 13 is provided with a first lifting cylinder 14.
  • the first lifting cylinder 14 is provided with a first bracket 15, the wafer storage box 100 is placed on the first front bracket 11, the first lifting cylinder 14 drives the first bracket 15 to lift the wafer storage box 100 upward, and then The first electric cylinder 13 drives the translation to the top of the first rear bracket 12, and the wafer storage box 100 enters the cleaning and drying equipment casing.
  • the first lifting cylinder 14 drives down and resets, and the wafer storage box 100 falls on the first On the rear support 12, the robot 60 picks up the wafer storage box 100 from the first rear support 12 and carries it to the cleaning device 20 for cleaning and drying.
  • a weighing sensor 16 can also be installed on the first rear bracket 12 for weighing the wafer storage box 100 before cleaning and drying.
  • the cleaning device 20 includes a barrel 211 and a first cover 212.
  • the barrel 211 is provided with a spray pipe.
  • the spray pipe may include a vertical spray pipe for cleaning the inner wall of the box 101. 221 and a horizontal spray pipe 222 for cleaning the bottom wall of the lid 102.
  • a material tray (not shown) is provided in the lower part of the barrel 211 for the box 101 to be turned upside down.
  • the first cover 212 is hinged to the barrel 211 and the first door motor 26 drives the lid to close or open the barrel 211.
  • the first lid 212 is provided with a first positioning mechanism 25a and a first knob mechanism 24a. The first knob mechanism 24a is used to extend into the quilt.
  • the lid 102 and the box body 101 are unlocked so that they can be separated.
  • the lid 102 is located at the first knob mechanism 24a and maintain the vertical state
  • the first positioning mechanism 25a operates to fix the cover 102
  • the manipulator 60 flips the box body 101 of the wafer storage box 100 onto the material tray.
  • the box body 101 is flipped upside down to the vertical position.
  • the first knob mechanism 24a is used to complete the docking and unlocking of the lid 102 of the wafer storage box 100, and then the first positioning mechanism 25a is used to fix the lid 102, and the box body 101 is
  • the manipulator 60 is placed in the cleaning cavity 200 of the barrel 211.
  • the box can be cleaned through the vertical spray pipe 221 and the horizontal spray pipe 222 respectively.
  • the inner wall of 101 and the bottom wall of cover 102 are cleaned.
  • blowing and drying are performed. Therefore, all sides in the space of wafer storage box 100 are effectively cleaned and dried to ensure that the wafer storage environment is free of impurities. Residue.
  • the wafer storage box can be cleaned when the wafer storage box is cleaned.
  • the lid of the round storage box is separated from the box body, so that the two are relatively independent and not closed.
  • the box body and lid can be fully cleaned to ensure cleanliness and optimize the wafer storage environment; and the lid of the wafer storage box is It is detached from the box body at the cleaning device and then directly fixed by the positioning mechanism, eliminating the need for additional unlocking and storage in the cleaning and drying equipment of the wafer storage box. There is no need to move to the cleaning device again, which makes the cleaning and drying process smoother and more efficient.
  • the lid and the box body of the wafer storage box are cleaned in a separate state, they are not cleaned separately.
  • the lid is fixed on the first lid body of the cleaning device through the first positioning mechanism, and the box body is not cleaned separately.
  • the body is placed in the barrel of the cleaning device, so that when the first cover is closed with the barrel, the lid and the box can be cleaned together, thereby further ensuring the cleaning efficiency.
  • the first positioning mechanism 25a includes a positioning plate 252 and a first vacuum nozzle 253.
  • the first vacuum nozzle 253 is installed on the positioning plate 252 to complete the adsorption and fixation of the cover 102.
  • the positioning plate 252 can
  • a first limit block 254 is installed to ensure that the cover 102 is in the correct position after being adsorbed by the first vacuum nozzle 253.
  • a pair of first vacuum nozzles 253 are arranged oppositely. After the cover 102 is adsorbed, The adsorption stability of the cover 102 is ensured by a pair of oppositely arranged first limiting blocks 254 for support and positioning.
  • the material tray and the positioning tray 252 can also be rotatably installed on the barrel 211 and the first cover 212 respectively.
  • a first rotary motor 23 and a second rotary motor 251 are respectively provided on the top.
  • the output shaft of the first rotary motor 23 is connected to the material tray, and the output shaft of the second rotary motor 251 is connected to the positioning plate 252, thereby realizing the material tray and the positioning plate.
  • the rotation of the box body 101 and the lid 102 can also be used for spin drying , combined with the blow-drying action, further improves the drying efficiency after cleaning and can reduce the working pressure of the subsequent drying device.
  • the positioning plate 252 has a rotatable function, that is, it realizes the rotation function of the cover 102, and the cover 102 is positioned and maintained in a vertical state by the first knob mechanism 24a and then is adsorbed and fixed on the positioning plate 252, so the first knob After the cover 102 abuts the first vacuum nozzle 253 on the positioning plate 252, the mechanism 24a must be separated from the cover 102 to avoid affecting the rotation of the positioning plate. Therefore, the specific structure of the first knob mechanism 24a can be as shown in Figure 5 , including a lifting cylinder 2411, a rotating cylinder 2421, a bearing seat 2424, a bearing 2425 and a first knob 2414.
  • the bearing seat 2424 is fixed on the first cover 212, and the bearing 2425 is installed in the bearing seat 2424.
  • the bearing 2425 can be lifted and lowered.
  • the guide rod 2413 is provided with a guide rod 2413 that can rotate synchronously (the matching surface is a non-circular surface to achieve synchronous rotation).
  • One end of the guide rod 2413 passes through the bearing 2425 and the first cover 212 and is connected to the first knob 2414.
  • the other end of the guide rod 2413 is connected to the first knob 2414.
  • One end is connected to the mounting plate 2412 at the output end of the lifting cylinder 2411.
  • the output end of the rotating cylinder 2421 is provided with a driving wheel 2422.
  • the driving wheel 2422 is connected to the driven wheel 2426 fixed on the outer wall of the bearing 2425 through a synchronous belt 2423. At the same time, it is on the positioning plate 252 A through hole 250 is provided, and the first knob 2414 is driven through the through hole 250 by the lifting cylinder 2411. To ensure stability, a pair of first knobs 2414 are provided to match the knob holes 1020 on both sides of the cover 102, so the through hole 250 is also Has a pair.
  • the lifting cylinder 2411 drives the guide rod 2413 to drive the first knob 2414 to move toward the lid 102 of the wafer storage box 100, and the first knob 2414 goes deep into the knob hole 1020 of the lid 102.
  • the rotating cylinder 2421 drives the bearing 2425 to rotate in the bearing seat 2424, and then the guide rod 2413 drives the first knob 2414 to rotate, thus realizing the misalignment of the first knob 2414 and the knob hole 1020, and keeping the cover 102 in a vertical state.
  • the cover 102 is then adsorbed and fixed by the first vacuum nozzle 253, and the rotating cylinder 2421 is reset.
  • the guide rod 2413 drives the first knob 2414 to pass through the through hole 250 in the opposite direction. Since there is no gap in the through hole 250 at this time, There is the guide rod 2413 or the first knob 2414. In this state, the positioning plate 252 can be rotated driven by the second rotating motor 251, thereby achieving no interference between the first knob mechanism 24a and the first positioning mechanism 25a. Influence.
  • the first door motor 26 drives the first lid 212 to open the barrel 211, and the manipulator 60 clamps the inverted box 101 and adjusts the angle to position it toward the first lid.
  • the lid 102 of the wafer storage box 100 on the body 212 moves in the direction, and the box body 101 is docked with the lid 102.
  • the lifting cylinder 2411 drives the guide rod 2413 to drive the first knob 2414 through the through hole 250 and then extends into the knob hole.
  • the rotating cylinder 2421 drives the first knob 2414 to rotate to lock the lid 102 on the box body 101, completing the closing action of the lid 102 and the box body 101, the first vacuum nozzle 253 desorbs, the rotating cylinder 2421 and the lifting cylinder 2411 can be reset in sequence.
  • the robot 60 delivers the cleaned and integrated wafer storage box 100 to the drying device 30.
  • the drying device 30 includes a housing 311 and a second cover. Body 312.
  • a heater 33 is provided in the drying cavity 300 of the housing 311.
  • the housing 311 is provided with an air inlet 321 and an air outlet 322.
  • the air outlet 322 is used for air extraction and cooperates with the air inlet 321 to pass through.
  • a nitrogen environment is formed after the nitrogen gas.
  • the second cover 312 is hinged on the housing 311 and can be driven to close or open the housing 311 by the second door motor 36.
  • the second cover 312 is provided with a second positioning mechanism 34a and a second positioning mechanism 34a.
  • the second knob mechanism 35a extends into the crystal clamped by the robot 60.
  • the knob hole 1020 on the lid 102 of the round storage box 100 is rotated to unlock and position the lid 102.
  • the second positioning mechanism 34a fixes the lid 102.
  • the robot 60 places the box 101 in the housing 311.
  • the two knob mechanism 35a completes the docking and unlocking of the lid 102 of the wafer storage box 100, and ensures the vertical state of the lid 102.
  • the lid 102 is fixed through the second positioning mechanism 34a, and the box 101 is placed in the drying cavity of the housing 311. Within 300, therefore, all surfaces in the space of the wafer storage box 100 (the inner wall of the box body 101 and the bottom wall of the lid 102) are effectively dried, ensuring that the wafer storage box 100 is completely dried, and the drying efficiency is improved.
  • the second knob mechanism 35a and the second positioning mechanism 34a cooperate to complete the fixing of the cover 102 on the second cover 312.
  • the robot 60 clamps the cleaned wafer storage box 100 to the second cover 312, the wafer is stored.
  • the knob hole 1020 on the lid 102 of the box 100 is aligned with the second knob 352 of the second knob mechanism 35a.
  • the robot 60 moves so that the knob hole 1020 is sleeved on the second knob 352.
  • the cylinder 351 drives the second knob 352 to rotate so that the lid 102 is unlocked from the box 101 and maintained in the correct state.
  • the second positioning mechanism 34a includes a clamp 343 and a second vacuum nozzle 341 provided on the second cover 312.
  • the clamp 343 and the positioning cylinder on the second cover 312 The output end of 342 is connected. Initially, the cover 102 is adsorbed and fixed by the second vacuum nozzle 341. When the second cover 312 closes the housing 311 and evacuates the drying chamber 300, the clamp is driven by the positioning cylinder 342. The claws 343 clamp the cover 102 up and down, and are used to replace the failure of the second vacuum nozzle 341 in the near-vacuum state, thereby continuing to fix the cover 102 to the second cover body 312.
  • the lid 102 when a pair of opposite vacuum nozzles is arranged When the second vacuum nozzle 341 absorbs and fixes the lid 102, the lid 102 can be supported by another pair of oppositely arranged second limiting blocks 344 to ensure the stability of the fixing of the lid 102.
  • the second door motor 36 drives the second lid body 312 to open the housing 311.
  • the manipulator 60 clamps the box body 101 and docks the lid 102.
  • the second positioning mechanism 34a and the second knob Just reset the mechanism 35a.
  • the robot 60 removes the wafer storage box 100 from the drying device 30 to the unloading device 40 for unloading.
  • the unloading device 40 includes a second front bracket 41 located outside the cleaning and drying equipment casing and a second rear bracket 42 located within the cleaning and drying equipment casing.
  • the second front bracket 41 and the second rear bracket 42 A second electric cylinder 43 is provided below.
  • a second lifting cylinder 44 is provided on the second electric cylinder 43.
  • a second bracket 45 is provided on the second lifting cylinder 44.
  • the dried wafer storage box 100 is provided below.
  • the second lifting cylinder 44 drives the second bracket 45 to lift the wafer storage box 100 upward, and then is driven by the second electric cylinder 43 Translate to the top of the second front bracket 41, the wafer storage box 100 moves outside the cleaning and drying equipment casing, the second lifting cylinder 44 is reset, and the wafer storage box 100 falls on the second front bracket 41, and the unloading is completed.
  • a nitrogen filling mechanism 46 can also be provided on the second rear bracket 42.
  • the nitrogen filling mechanism 46 includes at least one inflation hole 461 and at least one exhaust hole 462.
  • the wafer storage box 100 can be clamped by the clamping mechanism 467 so that the four air holes on the wafer storage box 100 correspond to the inflation hole 461 and the air extraction hole 462, and nitrogen gas can be poured into the wafer storage box 100.
  • the gas in the storage box 100 reaches a nitrogen concentration of 95-97% when the pressure remains basically unchanged (since the pressure inside and outside the wafer storage box 100 is almost equal, the first air hole 1011 and the second air hole 1012 will not leak.
  • the gas causes nitrogen to leak out of the wafer storage box 100), forming a nitrogen environment.
  • the wafer storage box 100 can be placed in the overall nitrogen environment, and then the wafer is placed into the wafer storage box 100 to avoid Wafer oxidation; elastic pads can be provided at the upper ends of the inflation hole 461 and the exhaust hole 462 to ensure sealing during inflation by interference contact with the wafer storage box 100. In addition, elastic pads can also be placed between the inflation hole 461 and the exhaust hole 462.
  • a spring structure is provided at the lower end. After the inflation hole 461 and the exhaust hole 462 contact the first air hole 1011 and the second air hole 1012 respectively, the upward reaction force formed by the spring when the spring is compressed enhances the contact effect and further enhances the sealing performance during inflation.
  • the cleaning and drying method of the wafer storage box 100 includes the following steps:
  • the wafer storage box 100 is loaded through the loading device 10 and moved to the cleaning device 20 by the robot 60;
  • the first knob mechanism 24a on the first cover 212 extends into the knob hole 1020 of the cover 102 and then rotates to unlock the cover 102 so that it can be separated from the box 101.
  • the first positioning mechanism 25a fixes the cover 102 after being separated from the box 101.
  • the manipulator 60 places the box 101 upside down on the material tray, the first cover 212 closes the barrel 211, and the spray pipe cleans and dries the box 101 and the cover 102;
  • the first cover 212 is opened, the manipulator 60 clamps the box 101 and abuts it against the cover 102.
  • the first knob mechanism 24a on the first cover 212 extends into the knob hole 1020 of the cover 102 and then rotates to lock the cover 102.
  • the first knob mechanism 24a is reset, the first positioning mechanism 25a releases the cover 102, and the robot 60 moves the wafer storage box 100 to the drying device 30;
  • the second knob mechanism 35a on the second cover 312 extends into the knob hole 1020 of the cover 102 and then rotates to unlock and position the cover 102.
  • the second positioning mechanism 34a fixes the cover 102, and the robot 60 places the box 101 on the housing.
  • the second cover 312 closes the shell 311, exhausts the air and passes nitrogen, and the heater 33 heats the box 101 and the cover 102 until the box 101 and the cover 102 are dry.
  • the second cover 312 covers the box 101 and the cover 102.
  • evacuate until the pressure inside the shell 311 is maintained at 500-1800Pa fill the shell 311 with nitrogen at a flow rate of 2-5 liters/min, and detect the box 101 and lid through the temperature and humidity sensor.
  • 102 degree of dryness after thorough drying, stop pumping, and fill nitrogen into the shell 311 at a flow rate of 50-100 liters/min to restore the pressure in the shell 311 to standard atmospheric pressure.
  • the second cover 312 is opened, the manipulator 60 clamps the box 101 and contacts the box 101 with the cover 102.
  • the second knob mechanism 35a extends into the knob hole 1020 of the cover 102 and rotates, so that the cover 102 is locked.
  • the robot 60 clamps the wafer storage box 100 to the unloading device 40;
  • the unloading device 40 injects nitrogen into the wafer storage box 100 through the box body 101 and unloads the material.
  • nitrogen can come from a nitrogen generator or a nitrogen storage device.
  • the heated nitrogen reaches about 60°C.
  • the air in the wafer storage box 100 can be squeezed out, and the temperature in the drying chamber 300 can be increased at the same time to achieve the purpose of heating the moisture in the drying chamber 300.
  • the flow rate is 5 Liter/minute, it can achieve the ideal nitrogen filling effect without wasting nitrogen, which can effectively control the cost of nitrogen gas.
  • the drying principle is: when the vacuum degree is 1000Pa, the boiling point of water is only 7°C. In a near-vacuum state, water is vaporized by heating with heated nitrogen and the heater 33 located around the wafer storage box 100 Provide enough energy. When the drying chamber 300 is pumping, the water vaporization quickly overcomes the force between water molecules, allowing the water to fully absorb the energy, so as to quickly dry the wafer storage box 100 and avoid moisture from forming in the wafer storage box 100. ice. Compared with the existing technology, the drying time is only 1/3-1/2 of the existing technology, which improves the drying efficiency of the wafer storage box 100. After drying, there will be no moisture remaining in the gaps 1010 of the wafer storage box 100. , achieving ideal drying effects and eliminating hidden dangers in subsequent wafer storage and manufacturing processes.

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  • Microelectronics & Electronic Packaging (AREA)
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  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
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Abstract

本申请实施例公开了一种清洗装置、烘干装置及晶圆存放盒的清洗烘干设备，清洗装置包括：第一定位机构、第一解锁机构和清洗腔；第一解锁机构配置为完成对晶圆存放盒的盖子的解锁，使盖子脱离晶圆存放盒的盒体；第一定位机构配置为固定脱离盒体后的盖子；清洗腔配置为在盖子脱离盒体后，放置盒体；清洗装置配置为在晶圆存放盒的盖子和盒体分开的状态下，对盖子和盒体进行清洗。

Description

清洗装置、烘干装置及晶圆存放盒的清洗烘干设备
相关申请
本申请要求于2022年07月15日申请的，申请号为202210828946.1，名称为“一种晶圆存放盒的清洗烘干设备及清洗烘干方法”的中国专利申请的优先权，在此将其全文引入作为参考。
技术领域
本申请涉及晶圆存放盒后处理装置技术领域，尤其涉及一种清洗装置、烘干装置及晶圆存放盒的清洗烘干设备。
背景技术
随着半导体制程技术的不断发展，晶圆制程和存储过程中对环境洁净度的要求越来越高，需要对晶圆的洁净度进行控制，而晶圆的洁净度很大程度上取决于FOUP(前开式晶圆存放盒)内的环境，因此需要对晶圆存放盒进行清洗以保证清洁度。
如图9至10所示，现有的晶圆存放盒具有盒体和盖子，盖子盖合于盒体上形成密封腔室，需要通过伸入旋钮孔内的旋钮转动一定的角度(一般旋转90°)实现锁合或解锁。但现有技术中，如公开号为CN113578900A的一种料盒清洗机及其使用方法，公开了在输送线体、清洗工位、吹干工位以及供气组件的配合作用下，实现了对晶圆料盒的清洗与吹干，保证了晶圆料盒的清洁度，进而保证了晶圆的颗粒洁净度，但其并没有公开如何在清洗、烘干的过程中如何解锁并分离盖子与盒体、以及清洗、烘干完成后再锁合盖子和盒体的方法，而在对晶圆存放盒进行清洗、烘干时，比较理想的操作方法是将盖子与盒体分开后，再进行清洗和烘干，这样可以更加全方位的清洗烘干，效率更高。
发明内容
本申请实施例的目的在于提供一种清洗装置、烘干装置及晶圆存放盒的清洗烘干设备，以解决上述背景技术中的技术问题。
为达到上述目的，本申请实施例采用的技术方案是：
第一方面，本申请实施例提供了一种清洗装置，应用于晶圆存放盒的清洗烘干设备中，所述清洗装置包括：第一定位机构、第一解锁机构和清 洗腔；
所述第一解锁机构配置为完成对晶圆存放盒的盖子的解锁，使所述盖子脱离晶圆存放盒的盒体；
所述第一定位机构配置为固定脱离盒体后的盖子；
所述清洗腔配置为在所述盖子脱离所述盒体后，放置所述盒体；
所述清洗装置配置为在晶圆存放盒的所述盖子和所述盒体分开的状态下，对所述盖子和所述盒体进行清洗。
作为进一步的优化，所述清洗装置包括：桶体和第一盖体，所述第一盖体用于盖合或打开所述桶体；
所述第一盖体上设有所述第一定位机构和所述第一解锁机构，所述第一解锁机构包括第一旋钮机构；
在所述第一盖体打开所述桶体的状态下，所述第一旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，使盖子脱离晶圆存放盒的盒体；所述第一定位机构配置为固定脱离盒体后的盖子；
所述桶体包括所述清洗腔，所述桶体配置为在所述盖子脱离盒体后，通过所述清洗腔放置所述盒体；
在所述第一盖体盖合所述桶体的状态下，所述清洗装置对晶圆存放盒的盖子和盒体进行清洗。
作为进一步的优化，所述第一定位机构包括定位盘，还包括安装于所述定位盘上的第一真空吸嘴和第一限位块，其中所述第一真空吸嘴配置为完成对所述盖子的吸附固定，所述第一限位块配置为保证所述盖子被所述第一真空吸嘴吸附后处于正确的位置。
作为进一步的优化，所述第一旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，包括：所述第一旋钮机构能够伸入晶圆存放盒的盖子的旋钮孔内旋转，以解锁所述盖子。
作为进一步的优化，所述第一旋钮机构包括升降气缸、旋转气缸、轴承座、轴承和第一旋钮，所述轴承座安装于所述第一盖体上，所述轴承安装于所述轴承座内，所述轴承内可升降且可同步转动地设有导杆，所述导杆一端穿过所述第一盖体后连接有所述第一旋钮，所述导杆另一端与所述 升降气缸输出端相连，所述旋转气缸的输出端设有主动轮，所述主动轮通过同步带与固定于所述轴承外壁的从动轮传动相连。
作为进一步的优化，所述第一定位机构包括定位盘，所述定位盘上设有通孔；所述第一旋钮经所述升降气缸驱动穿过所述通孔。
第二方面，本申请实施例还提供了一种烘干装置，应用于晶圆存放盒的清洗烘干设备中，所述烘干装置包括：第二定位机构、第二解锁机构和烘干腔；
所述第二解锁机构配置为完成对晶圆存放盒的盖子的解锁，使所述盖子脱离晶圆存放盒的盒体；
所述第二定位机构配置为固定脱离盒体后的盖子；
所述烘干腔配置为在所述盖子脱离所述盒体后，放置所述盒体；
所述烘干装置配置为在晶圆存放盒的所述盖子和所述盒体分开的状态下，对所述盖子和所述盒体进行烘干。
作为进一步的优化，所述烘干装置包括：壳体和第二盖体，所述第二盖体用于闭合或打开所述壳体；
所述第二盖体上设有所述第二定位机构和所述第二解锁机构，所述第二解锁机构包括第二旋钮机构；
在所述第二盖体打开所述壳体的状态下，所述第二旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，使盖子脱离晶圆存放盒的盒体；所述第二定位机构配置为固定脱离盒体后的盖子；
所述壳体包括所述烘干腔，所述壳体配置为在盖子脱离盒体后，通过所述烘干腔放置所述盒体；
在所述第二盖体盖合所述壳体的状态下，所述烘干装置对晶圆存放盒的盖子和盒体进行烘干。
作为进一步的优化，所述第二定位机构包括设置于所述第二盖体上的夹爪和第二真空吸嘴，所述夹爪与所述第二盖体上的定位气缸的输出端相连；所述第二真空吸嘴用于对晶圆存放盒的盖子进行吸附固定；在所述第二盖体盖合所述壳体且对所述烘干腔进行抽气的状态下，所述夹爪配置为通过所述定位气缸驱动夹紧所述盖子，用于替代所述第二真空吸嘴，以继 续将所述盖子固定于所述第二盖体上。
作为进一步的优化，所述第二旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，包括：所述第二旋钮机构能够伸入晶圆存放盒的盖子上的旋钮孔内旋转，以解锁所述盖子。
第三方面，本申请实施例提供了一种烘干装置，应用于晶圆存放盒的清洗烘干设备中，所述烘干装置包括：壳体和第二盖体，其中，
所述第二盖体用于盖合或打开所述壳体；
所述第二盖体上设有第二定位机构；
所述第二定位机构包括设置于所述第二盖体上的夹爪和第二真空吸嘴，所述夹爪与所述第二盖体上的定位气缸的输出端相连；所述第二真空吸嘴用于对晶圆存放盒的盖子进行吸附固定；在所述第二盖体盖合所述壳体且对所述烘干腔进行抽气的状态下，所述夹爪配置为通过所述定位气缸驱动夹紧晶圆存放盒的盖子，用于替代所述第二真空吸嘴，以继续将所述盖子固定于所述第二盖体上。
第四方面，本申请实施例提供了一种晶圆存放盒的清洗烘干设备，包括如第一方面中任意一项所述的清洗装置，和/或包括如第二方面至第三方面中任意一项所述的烘干装置。
作为进一步的优化，所述晶圆存放盒的清洗烘干设备还包括：
下料装置，用于晶圆存放盒的下料；
所述下料装置包括第二前支架和第二后支架；
所述第二后支架上设有氮气充气机构用于对晶圆存放盒内冲入氮气。
与已有技术相比，本申请实施例的有益效果体现在：
通过在清洗装置和烘干装置上分别设置相应的解锁机构和定位机构，可以在对晶圆存放盒进行清洗和烘干时，将晶圆存放盒的盖子和盒体分开，使二者相对独立、不盖合，可以对盒体和盖子进行充分的清洗和烘干，保证清洁程度，优化晶圆的存放环境；并且晶圆存放盒的盖子是在清洗装置或烘干装置处脱离盒体，而后直接由定位机构固定，无需在晶圆存放盒的清洗烘干设备中占用额外的解锁和存放空间，也无需再次移动至清洗装置或烘干装置处，因此有利于清洗烘干过程更顺畅地进行，效率更高。
附图说明
图1为本申请实施例的晶圆存放盒的清洗烘干设备结构图。
图2为本申请实施例的上料装置的结构图。
图3为本申请实施例的清洗装置打开第一盖体的结构图。
图4为图3另一侧视角的结构图。
图5为本申请实施例的第一旋钮机构的结构图。
图6为本申请实施例的烘干装置打开第二盖体的结构图。
图7为图6另一侧视角的结构图。
图8为本申请实施例的下料装置的结构图。
图9为本申请实施例的晶圆存放盒的结构图。
图10为本申请实施例的晶圆存放盒另一侧视角的结构图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
首先，本申请实施例提供了一种晶圆存放盒的清洗烘干设备，包括机架和机械手，还包括：上料装置，用于晶圆存放盒的上料，并经机械手移料至清洗装置；清洗装置，包括桶体和第一盖体，所述桶体内设有喷淋管，所述桶体内的下部设有料盘，所述第一盖体铰接于桶体上，所述第一盖体上设有第一定位机构和第一旋钮机构，所述第一旋钮机构伸入被所述机械手夹持的晶圆存放盒的盖子的旋钮孔内旋转，用于解锁盖子使盖子脱离盒体，所述第一定位机构固定脱离盒体后的盖子，所述机械手将盒体倒扣于所述料盘上；烘干装置，包括壳体和第二盖体，所述壳体内设有加热器，所述壳体上设有进气口和出气口，所述第二盖体铰接于壳体上，所述第二盖体上设有第二定位机构和第二旋钮机构，所述第二旋钮机构伸入被所述机械手夹持的晶圆存放盒的盖子上的旋钮孔内旋转用于解锁盖子使盖子脱离盒体，所述第二定位机构固定盖子，所述机械手将盒体放置于壳体内； 下料装置，用于将经机械手从烘干装置移取的晶圆存放盒下料。
作为进一步的优化，所述第一定位机构包括定位盘和第一真空吸嘴，所述第一真空吸嘴安装于定位盘上；所述定位盘上安装有第一限位块。
作为进一步的优化，所述料盘和定位盘分别可转动的安装于桶体和第一盖体上，所述桶体外和第一盖体上分别设有第一旋转电机和第二旋转电机，所述第一旋转电机的输出轴与所述料盘相连，所述第二旋转电机的输出轴与所述定位盘相连。
作为进一步的优化，所述第一旋钮机构包括升降气缸、旋转气缸、轴承座、轴承和第一旋钮，所述轴承座安装于第一盖体上，所述轴承安装于轴承座内，所述轴承内可升降且可同步转动的设有导杆，所述导杆一端穿过第一盖体后连接有第一旋钮，所述导杆另一端与升降气缸输出端相连，所述旋转气缸的输出端设有主动轮，所述主动轮通过同步带与固定于轴承外壁的从动轮传动相连。
作为进一步的优化，所述定位盘上设有通孔，所述第一旋钮经升降气缸驱动穿过所述通孔。
作为进一步的优化，所述第二定位机构包括设置于第二盖体上的夹爪和第二真空吸嘴，所述夹爪与第二盖体上的定位气缸的输出端相连；所述第二盖体上安装有第二限位块。
作为进一步的优化，所述上料装置包括第一前支架和第一后支架，所述第一前支架和第一后支架的下方设有第一电缸，所述第一电缸上设有第一顶升气缸，所述第一顶升气缸上设有第一托架；所述第一后支架上安装有称重感应器。
作为进一步的优化，所述下料装置包括第二前支架和第二后支架，所述第二前支架和第二后支架的下方设有第二电缸，所述第二电缸上设有第二顶升气缸，所述第二顶升气缸上设有第二托架；所述第二后支架上设有氮气充气机构用于对晶圆存放盒内冲入氮气。
其次，本申请实施例提供了一种晶圆存放盒的清洗烘干方法，包括如下步骤：S1、晶圆存放盒经上料装置上料，并被机械手移料至清洗装置；S2、第一盖体上的第一旋钮机构伸入盖子的旋钮孔后旋转，解锁盖子使盖 子脱离盒体，第一定位机构固定脱离盒体后的盖子，机械手将盒体倒扣于料盘上，第一盖体闭合桶体，喷淋管对盒体和盖子进行清洗和吹干；S3、第一盖体打开，机械手夹取盒体抵接于盖子上，第一盖体上的第一旋钮机构伸入盖子的旋钮孔后旋转，使盖子锁合于盒体上，第一旋钮机构复位，第一定位机构释放盖子，机械手夹取晶圆存放盒至烘干装置；S4、第二盖体上的第二旋钮机构伸入盖子的旋钮孔后旋转，解锁并定位盖子，第二定位机构固定盖子，机械手将盒体放置于壳体内，第二盖体盖合壳体，抽气并通氮气，加热器对盒体和盖子进行加热，直至盒体和盖子干燥；S5、第二盖体打开，机械手夹取盒体并将盒体抵接于盖子上，第二旋钮机构伸入盖子的旋钮孔内旋转，使盖子锁合于盒体上，第二定位机构释放盖子，机械手夹取晶圆存放盒至下料装置；S6、下料装置对晶圆存放盒内冲入氮气，并下料。
作为进一步的优化，步骤S4中第二盖体盖合壳体后进行抽气，直到壳体内压力维持在500-1800Pa，并以2-5升/分的流速向壳体内充入氮气，通过温湿度传感器检测盒体和盖子的干燥程度；彻底干燥后，停止抽气，并以50-100升/分的流速向壳体内充入氮气，使壳体内的压力恢复到标准大气压。
接下来，将结合附图对本申请各实施例的技术方案以及有益效果作进一步的描述，但本申请并不限于这些实施例。
如图1所示，一种晶圆存放盒的清洗烘干设备，包括机架50、机械手60、上料装置10、清洗装置20、烘干装置30和下料装置40，上料装置10、清洗装置20、烘干装置30和下料装置40可以具有多个，形成多工位，相互配合，可以提高晶圆存放盒100的清洗烘干效率，其中，上料装置10用于晶圆存放盒100的上料，并经机械手60移料至清洗装置20，如图2所示，上料装置10的具体结构包括位于清洗烘干设备壳体外的第一前支架11和位于清洗烘干设备壳体内的第一后支架12，第一前支架11和第一后支架12的下方设有第一电缸13，第一电缸13上设有第一顶升气缸14，第一顶升气缸14上设有第一托架15，将晶圆存放盒100放置于第一前支架11上，第一顶升气缸14驱动第一托架15向上举升晶圆存放盒100，然后 通过第一电缸13带动平移至第一后支架12的上方，晶圆存放盒100进入清洗烘干设备壳体内，第一顶升气缸14驱动下降后复位，晶圆存放盒100落于第一后支架12上，由机械手60从第一后支架12上夹取晶圆存放盒100至清洗装置20中进行清洗和吹干。在本申请实施例中，还可以在第一后支架12上安装称重感应器16，用于对清洗烘干前的晶圆存放盒100进行称重。
如图3至5所示，清洗装置20包括桶体211和第一盖体212，桶体211内设有喷淋管，喷淋管可以包括用于清洗盒体101内壁的竖直喷淋管221和用于清洗盖子102底壁的水平喷淋管222，该桶体211内下部设有料盘(未示出)用于盒体101倒扣其上，第一盖体212铰接于桶体211上，且通过第一门体电机26驱动盖合或打开桶体211，该第一盖体212上设有第一定位机构25a和第一旋钮机构24a，第一旋钮机构24a用于伸入被机械手60夹持的晶圆存放盒100的盖子102的旋钮孔1020内，第一旋钮机构24a经旋转后，盖子102与盒体101解锁使二者可以脱离，此时盖子102位于第一旋钮机构24a上并保持竖直状态，第一定位机构25a动作，用于固定盖子102，机械手60将晶圆存放盒100的盒体101倒扣于料盘上，此时盒体101倒扣于竖直喷淋管221的外侧，综上所述，即通过第一旋钮机构24a完成对晶圆存放盒100的盖子102的对接和解锁，然后通过第一定位机构25a将盖子102固定，盒体101由机械手60放置于桶体211的清洗腔200内，第一门体电机26驱动第一盖体212闭合桶体211后，即可通过竖直喷淋管221和水平喷淋管222分别对盒体101内壁、以及盖子102底壁进行清洗，喷淋管清洗动作完成后，进行吹风干燥，因此将晶圆存放盒100空间内的各面进行有效的清洗和吹干，保证晶圆存放环境无杂质残留。
可以理解地，本实施例通过在清洗装置上设置解锁机构(请参考第一旋钮机构24a)和定位机构(请参考第一定位机构25a)，可以在对晶圆存放盒进行清洗时，将晶圆存放盒的盖子和盒体分开，使二者相对独立、不盖合，可以对盒体和盖子进行充分的清洗，保证清洁程度，优化晶圆的存放环境；并且晶圆存放盒的盖子是在清洗装置处脱离盒体，而后直接由定位机构固定，无需在晶圆存放盒的清洗烘干设备中占用额外的解锁和存放 空间，也无需再次移动至清洗装置处，因此有利于清洗烘干过程更顺畅地进行，效率更高。
此外，本实施例中晶圆存放盒的盖子和盒体虽然是在分开的状态下被清洗的，但并非分开进行清洗，盖子经由第一定位机构固定在清洗装置的第一盖体上，盒体放置在清洗装置的桶体内，从而在第一盖体盖合桶体的状态下，实现对盖子和盒体的一并清洗，进而进一步保证了清洗效率。
本申请实施例中，第一定位机构25a包括定位盘252和第一真空吸嘴253，第一真空吸嘴253安装于定位盘252上，完成对盖子102的吸附固定，同时定位盘252上可以安装有第一限位块254，用于保证盖子102被第一真空吸嘴253吸附后处于正确的位置，如图3所示，一对第一真空吸嘴253相对设置，在吸附盖子102后通过一对相对设置的第一限位块254进行支撑定位，保证盖子102的吸附稳定性。
在本申请实施例中，还可以将料盘和定位盘252分别可转动的安装于桶体211和第一盖体212上，与之相匹配的，在桶体211外和第一盖体212上分别设置第一旋转电机23和第二旋转电机251，第一旋转电机23的输出轴与料盘相连，第二旋转电机251的输出轴与定位盘252相连，由此实现料盘和定位盘252的转动，从而带动盒体101和盖子102的转动，可以做到全方位清洗和吹干，保证清洗无死角，提高清洗洁净度；同时，盒体101和盖子102的转动还可以进行甩干，配合吹干动作，进一步提高了清洗后的烘干效率，可减轻后续干燥装置的工作压力。
由于定位盘252实现了可转动的功能，即实现了盖子102的转动功能，而盖子102又是由第一旋钮机构24a定位保持竖直状态后吸附固定于定位盘252上的，因此第一旋钮机构24a在盖子102抵接于定位盘252上的第一真空吸嘴253后，为避免影响定位盘的转动，必须要脱离盖子102，因此第一旋钮机构24a的具体结构可为图5所示，包括升降气缸2411、旋转气缸2421、轴承座2424、轴承2425和第一旋钮2414，轴承座2424固定于第一盖体212上，轴承2425安装于轴承座2424内，该轴承2425内可升降且可同步转动(匹配面为非圆形面即可实现同步转动)的设有导杆2413，导杆2413一端穿过轴承2425和第一盖体212后连接有第一旋钮2414，另 一端与升降气缸2411输出端的安装板2412相连，旋转气缸2421的输出端设有主动轮2422，主动轮2422通过同步带2423与固定于轴承2425外壁的从动轮2426传动相连，同时在定位盘252上设置通孔250，第一旋钮2414经升降气缸2411驱动穿过通孔250，为保证稳定性，第一旋钮2414设有一对，与盖子102两侧的旋钮孔1020相配合，因此通孔250也具有一对。
基于上述设置，当需要吸附固定盖子102时，升降气缸2411驱动导杆2413带动第一旋钮2414向晶圆存放盒100的盖子102方向移动，并将第一旋钮2414深入盖子102的旋钮孔1020中，通过旋转气缸2421带动轴承2425在轴承座2424内转动，进而使得导杆2413带动第一旋钮2414转动，因此实现第一旋钮2414和旋钮孔1020的错位卡合，保持盖子102呈竖直状态，盖子102随即通过第一真空吸嘴253吸附固定，旋转气缸2421复位，在升降气缸2411复位过程中，导杆2413带动第一旋钮2414反向穿过通孔250，由于此时通孔250中不存在导杆2413或第一旋钮2414，在此状态下，定位盘252便可以在第二旋转电机251驱动下进行旋转，以此实现第一旋钮机构24a和第一定位机构25a之间动作不干涉影响。
当清洗完毕盖子102需要盖合于盒体101上时，第一门体电机26驱动第一盖体212打开桶体211，机械手60夹持倒扣的盒体101调整角度后向位于第一盖体212上的晶圆存放盒100的盖子102方向移动，并将盒体101对接于盖子102上，先由升降气缸2411驱动导杆2413带动第一旋钮2414穿过通孔250后伸入旋钮孔1020内，然后旋转气缸2421驱动第一旋钮2414转动将盖子102锁合于盒体101上，完成盖子102和盒体101的盖合动作，第一真空吸嘴253解吸，旋转气缸2421和升降气缸2411依次复位即可。
在完成清洗工序后，由机械手60将清洗后并组装于一体的晶圆存放盒100送料至烘干装置30处，如图6至7所示，烘干装置30包括壳体311和第二盖体312，壳体311的烘干腔300内设有加热器33，该壳体311上设有进气口321和出气口322，出气口322用于抽气，并配合进气口321通入氮气后形成氮气环境，第二盖体312铰接于壳体311上，可通过第二门体电机36驱动闭合或打开壳体311，该第二盖体312上设有第二定位机构34a和第二旋钮机构35a，第二旋钮机构35a伸入被机械手60夹持的晶 圆存放盒100的盖子102上的旋钮孔1020后旋转解锁并定位盖子102，第二定位机构34a固定盖子102，机械手60将盒体101放置于壳体311内，综上所述，即通过第二旋钮机构35a完成对晶圆存放盒100盖子102的对接和解锁，并保证盖子102的竖直状态，通过第二定位机构34a将盖子102固定，盒体101放置于壳体311的烘干腔300内，因此将晶圆存放盒100空间内的各面(盒体101内壁和盖子102底壁)进行有效的烘干，保证晶圆存放盒100完全烘干，且提高了烘干效率。
可以理解地，本实施例通过在烘干装置上设置解锁机构(请参考第二旋钮机构35a)和定位机构(请参考第二定位机构34a)，可以在对晶圆存放盒进行烘干时，将晶圆存放盒的盖子和盒体分开，使二者相对独立、不盖合，可以对盒体和盖子进行充分的烘干，保证清洁程度，优化晶圆的存放环境；并且晶圆存放盒的盖子是在烘干装置处脱离盒体，而后直接由定位机构固定，无需在晶圆存放盒的清洗烘干设备中占用额外的解锁和存放空间，也无需再次移动至烘干装置处，因此有利于清洗烘干过程更顺畅地进行，效率更高。
第二旋钮机构35a与第二定位机构34a协同作用，完成盖子102固定于第二盖体312上，当机械手60夹取经清洗的晶圆存放盒100至第二盖体312处时，晶圆存放盒100的盖子102上的旋钮孔1020对准第二旋钮机构35a的第二旋钮352，经机械手60移动使得旋钮孔1020套设于第二旋钮352上，气缸351驱动第二旋钮352转动使得盖子102解锁于盒体101并保持正确状态，第二定位机构34a包括设置于第二盖体312上的夹爪343和第二真空吸嘴341，夹爪343与第二盖体312上的定位气缸342的输出端相连，初始时，盖子102通过第二真空吸嘴341进行吸附固定，当第二盖体312闭合壳体311后，对烘干腔300进行抽气时，通过定位气缸342驱动夹爪343上下夹紧盖子102，用于替代第二真空吸嘴341在近真空状态下的失效，从而继续将盖子102固定于第二盖体312上，如图6所示，当一对相对设置的第二真空吸嘴341吸附固定盖子102时，可以通过另外一对相对设置的第二限位块344对盖子102进行支撑，保证盖子102固定的稳定性。
当盒体101与盖子102烘干完毕后，第二门体电机36驱动第二盖体312打开壳体311，机械手60夹取盒体101与盖子102对接，第二定位机构34a和第二旋钮机构35a复位即可。
在晶圆存放盒100烘干完毕后，经机械手60从烘干装置30移取晶圆存放盒100至下料装置40进行下料。
如图8所示，下料装置40包括位于清洗烘干设备壳体外的第二前支架41和位于清洗烘干设备壳体内的第二后支架42，第二前支架41和第二后支架42的下方设有第二电缸43，第二电缸43上设有第二顶升气缸44，第二顶升气缸44上设有第二托架45，烘干后的晶圆存放盒100在下料时，通过机械手60将晶圆存放盒100放置于第二后支架42上，第二顶升气缸44驱动第二托架45向上举升晶圆存放盒100，然后通过第二电缸43带动平移至第二前支架41的上方，晶圆存放盒100移至清洗烘干设备壳体外，第二顶升气缸44复位，晶圆存放盒100落于第二前支架41上，完成下料。
在本申请实施例中，还可在第二后支架42上设置氮气充气机构46，氮气充气机构46包括至少一个充气孔461与至少一个抽气孔462，在晶圆存放盒100放置于第二后支架42上时，可以通过夹持机构467夹紧晶圆存放盒100，使得晶圆存放盒100上的四个气孔与充气孔461和抽气孔462对应，往晶圆存放盒100内冲入氮气，即三个充气孔461对准晶圆存放盒100上的三个第一气孔1011进行充气，一个抽气孔462对准晶圆存放盒100上的一个第二气孔1012进行抽气，使得晶圆存放盒100内的气体在压强基本保持不变的情况下达到氮气浓度为95-97％(由于晶圆存放盒100内外压强几近相等，所以第一气孔1011和第二气孔1012并不会漏气导致氮气泄露出晶圆存放盒100)，形成一个氮气环境，在后道工序中可以将晶圆存放盒100置于整体氮气环境下，然后将晶圆放入晶圆存放盒100内，避免晶圆氧化；充气孔461和抽气孔462的上端可以设置弹性垫，通过与晶圆存放盒100过盈抵接，保证充气时的密封性，另外，亦可在充气孔461和抽气孔462的下端设置弹簧结构，通过充气孔461和抽气孔462分别与第一气孔1011和第二气孔1012抵接后对弹簧压缩时弹簧向上形成的反作用力增强抵接效果，进一步增强充气时的密封性。
可以理解地，在本实施例中，晶圆存放盒烘干过程中通过提高氮气环境，并在低真空环境下，可以降低液体沸点，提高烘干效率，还可避免缝隙中水分残留，具有优异的烘干效果。
在本申请实施例中，晶圆存放盒100的清洗烘干方法包括如下步骤：
S1、晶圆存放盒100经上料装置10上料，并被机械手60移料至清洗装置20；
S2、第一盖体212上的第一旋钮机构24a伸入盖子102的旋钮孔1020后旋转，解锁盖子102使其可脱离盒体101，第一定位机构25a固定脱离盒体101后的盖子102，机械手60将盒体101倒置于料盘上，第一盖体212闭合桶体211，喷淋管对盒体101和盖子102进行清洗和吹干；
S3、第一盖体212打开，机械手60夹取盒体101抵接于盖子102上，第一盖体212上的第一旋钮机构24a伸入盖子102的旋钮孔1020后旋转，使盖子102锁合于盒体101上，第一旋钮机构24a复位，第一定位机构25a释放盖子102，机械手60移取晶圆存放盒100至烘干装置30；
S4、第二盖体312上的第二旋钮机构35a伸入盖子102的旋钮孔1020后旋转，解锁并定位盖子102，第二定位机构34a固定盖子102，机械手60将盒体101放置于壳体311内，第二盖体312盖合壳体311，抽气并通氮气，加热器33对盒体101和盖子102进行加热，直至盒体101和盖子102干燥，具体为第二盖体312盖合壳体311后进行抽气，直到壳体311内压力维持在500-1800Pa，并以2-5升/分的流速向壳体311内充入氮气，通过温湿度传感器检测盒体101和盖子102的干燥程度；彻底干燥后，停止抽气，并以50-100升/分的流速向壳体311内充入氮气，使壳体311内的压力恢复到标准大气压。
S5、第二盖体312打开，机械手60夹取盒体101并将盒体101抵接于盖子102上，第二旋钮机构35a伸入盖子102的旋钮孔1020内旋转，使盖子102锁合于盒体101上，机械手60夹取晶圆存放盒100至下料装置40；
S6、下料装置40通过盒体101对晶圆存放盒100内冲入氮气，并下料。
晶圆存放盒100在烘干装置30内烘干过程中，氮气可以来源于氮气发生器或者氮气储存装置，加热后的氮气达到60℃左右，通过往烘干腔300内充入加热的氮气，可以将晶圆存放盒100内的空气挤出，同时可以提高烘干腔300内的温度，达到加热烘干腔300内水分的目的，氮气持续往烘干腔300内充入时的流速为5升/分，可以在达到理想的氮气填充效果的同时而不会浪费氮气，进而可以非常有效控制氮气的用气成本。
烘干原理为：在真空度为1000Pa的时候，水的沸点仅为7℃，在近真空状态下，通过加热后的氮气、以及位于晶圆存放盒100周围的加热器33加热，为水汽化提供足够的能量，烘干腔300进行抽气时水汽化快速克服水分子之间的作用力，让水分充分吸收能量，达到快速干燥晶圆存放盒100，避免水分在晶圆存放盒100内结冰。相较于现有技术，干燥时间仅为现有技术的1/3-1/2，提升了晶圆存放盒100的干燥效率，干燥后晶圆存放盒100的缝隙1010里不会有水分残留，取得了理想的干燥效果，消除了后续晶圆储存和制程的隐患。
本文中所描述的具体实施例仅仅是对本申请精神作举例说明。本申请所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，但并不会偏离本申请的精神或者超越所附权利要求书所定义的范围。

Claims (13)

  1. 一种清洗装置，应用于晶圆存放盒的清洗烘干设备中，所述清洗装置包括：第一定位机构、第一解锁机构和清洗腔；
    所述第一解锁机构配置为完成对晶圆存放盒的盖子的解锁，使所述盖子脱离晶圆存放盒的盒体；
    所述第一定位机构配置为固定脱离盒体后的盖子；
    所述清洗腔配置为在所述盖子脱离所述盒体后，放置所述盒体；
    所述清洗装置配置为在晶圆存放盒的所述盖子和所述盒体分开的状态下，对所述盖子和所述盒体进行清洗。
  2. 根据权利要求1所述的清洗装置，其中，所述清洗装置包括：桶体和第一盖体，所述第一盖体用于盖合或打开所述桶体；
    所述第一盖体上设有所述第一定位机构和所述第一解锁机构，所述第一解锁机构包括第一旋钮机构；
    在所述第一盖体打开所述桶体的状态下，所述第一旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，使盖子脱离晶圆存放盒的盒体；所述第一定位机构配置为固定脱离盒体后的盖子；
    所述桶体包括所述清洗腔，所述桶体配置为在所述盖子脱离盒体后，通过所述清洗腔放置所述盒体；
    在所述第一盖体盖合所述桶体的状态下，所述清洗装置对晶圆存放盒的盖子和盒体进行清洗。
  3. 根据权利要求1或2所述的清洗装置，其中，所述第一定位机构包括定位盘，还包括安装于所述定位盘上的第一真空吸嘴和第一限位块，其中所述第一真空吸嘴配置为完成对所述盖子的吸附固定，所述第一限位块配置为保证所述盖子被所述第一真空吸嘴吸附后处于正确的位置。
  4. 根据权利要求2所述的清洗装置，其中，所述第一旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，包括：所述第一旋钮机构能够伸入晶圆存放盒的盖子的旋钮孔内旋转，以解锁所述盖子。
  5. 根据权利要求2所述的清洗装置，其中，所述第一旋钮机构包括升降气缸、旋转气缸、轴承座、轴承和第一旋钮，所述轴承座安装于所述第一盖体上，所述轴承安装于所述轴承座内，所述轴承内可升降且可同步转 动地设有导杆，所述导杆一端穿过所述第一盖体后连接有所述第一旋钮，所述导杆另一端与所述升降气缸输出端相连，所述旋转气缸的输出端设有主动轮，所述主动轮通过同步带与固定于所述轴承外壁的从动轮传动相连。
  6. 根据权利要求5所述的清洗装置，其中，所述第一定位机构包括定位盘，所述定位盘上设有通孔；所述第一旋钮经所述升降气缸驱动穿过所述通孔。
  7. 一种烘干装置，应用于晶圆存放盒的清洗烘干设备中，所述烘干装置包括：第二定位机构、第二解锁机构和烘干腔；
    所述第二解锁机构配置为完成对晶圆存放盒的盖子的解锁，使所述盖子脱离晶圆存放盒的盒体；
    所述第二定位机构配置为固定脱离盒体后的盖子；
    所述烘干腔配置为在所述盖子脱离所述盒体后，放置所述盒体；
    所述烘干装置配置为在晶圆存放盒的所述盖子和所述盒体分开的状态下，对所述盖子和所述盒体进行烘干。
  8. 根据权利要求7所述的烘干装置，其中，所述烘干装置包括：壳体和第二盖体，所述第二盖体用于闭合或打开所述壳体；
    所述第二盖体上设有所述第二定位机构和所述第二解锁机构，所述第二解锁机构包括第二旋钮机构；
    在所述第二盖体打开所述壳体的状态下，所述第二旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，使盖子脱离晶圆存放盒的盒体；所述第二定位机构配置为固定脱离盒体后的盖子；
    所述壳体包括所述烘干腔，所述壳体配置为在盖子脱离盒体后，通过所述烘干腔放置所述盒体；
    在所述第二盖体盖合所述壳体的状态下，所述烘干装置对晶圆存放盒的盖子和盒体进行烘干。
  9. 根据权利要求7或8所述的烘干装置，其中，所述第二定位机构包括设置于所述第二盖体上的夹爪和第二真空吸嘴，所述夹爪与所述第二盖体上的定位气缸的输出端相连；所述第二真空吸嘴用于对晶圆存放盒的盖子进行吸附固定；在所述第二盖体盖合所述壳体且对所述烘干腔进行抽气 的状态下，所述夹爪配置为通过所述定位气缸驱动夹紧所述盖子，用于替代所述第二真空吸嘴，以继续将所述盖子固定于所述第二盖体上。
  10. 根据权利要求8所述的烘干装置，其中，所述第二旋钮机构配置为完成对晶圆存放盒的盖子的对接和解锁，包括：所述第二旋钮机构能够伸入晶圆存放盒的盖子上的旋钮孔内旋转，以解锁所述盖子。
  11. 一种烘干装置，应用于晶圆存放盒的清洗烘干设备中，所述烘干装置包括：壳体和第二盖体，其中，
    所述第二盖体用于盖合或打开所述壳体；
    所述第二盖体上设有第二定位机构；
    所述第二定位机构包括设置于所述第二盖体上的夹爪和第二真空吸嘴，所述夹爪与所述第二盖体上的定位气缸的输出端相连；所述第二真空吸嘴用于对晶圆存放盒的盖子进行吸附固定；在所述第二盖体盖合所述壳体且对所述烘干腔进行抽气的状态下，所述夹爪配置为通过所述定位气缸驱动夹紧晶圆存放盒的盖子，用于替代所述第二真空吸嘴，以继续将所述盖子固定于所述第二盖体上。
  12. 一种晶圆存放盒的清洗烘干设备，包括如权利要求1至6中任意一项所述的清洗装置，和/或包括如权利要求7至11中任意一项所述的烘干装置。
  13. 根据权利要求12所述的晶圆存放盒的清洗烘干设备，其中，所述晶圆存放盒的清洗烘干设备还包括：
    下料装置，用于晶圆存放盒的下料；
    所述下料装置包括第二前支架和第二后支架；
    所述第二后支架上设有氮气充气机构用于对晶圆存放盒内冲入氮气。
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