WO2024004248A1 - Capteur de pression - Google Patents

Capteur de pression Download PDF

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Publication number
WO2024004248A1
WO2024004248A1 PCT/JP2023/003469 JP2023003469W WO2024004248A1 WO 2024004248 A1 WO2024004248 A1 WO 2024004248A1 JP 2023003469 W JP2023003469 W JP 2023003469W WO 2024004248 A1 WO2024004248 A1 WO 2024004248A1
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WO
WIPO (PCT)
Prior art keywords
board
section
pressure
conversion board
adhesive
Prior art date
Application number
PCT/JP2023/003469
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English (en)
Japanese (ja)
Inventor
和哉 滝本
智紀 板垣
大空 瀬戸川
Original Assignee
株式会社鷺宮製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 株式会社鷺宮製作所 filed Critical 株式会社鷺宮製作所
Publication of WO2024004248A1 publication Critical patent/WO2024004248A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings

Definitions

  • the present invention relates to a pressure sensor provided with a conversion board inside.
  • a conversion board equipped with a conversion circuit that converts both the drive voltage and pressure detection signal is externally connected between the control circuit and the pressure sensor. There is a pressure sensor to connect.
  • the cable is omitted and the conversion board is placed inside the pressure sensor in order to solve problems such as the possibility of poor connections caused by external shocks or vibrations. .
  • the conversion board generates heat by itself due to the transformation of the drive voltage. Therefore, when the conversion board is placed inside the pressure sensor, it is desirable to efficiently dissipate the heat generated in the conversion board and to suppress the heat transmitted to the conversion board. If these are not carried out effectively, problems such as electronic components in the conversion board exceeding the heat resistant temperature and being damaged will occur.
  • FIG. 10 of Patent Document 1 As a configuration for suppressing heat transmitted to the conversion board, in FIG. 10 of Patent Document 1, a heat-generating component such as a transistor, which is placed near the conversion board, is surrounded by an adhesive having thermal conductivity. It is described that the heat from the converter is efficiently radiated to the outside and the influence of heat on the conversion board is suppressed.
  • An object of the present invention is to provide a pressure sensor that can prevent a heat dissipating adhesive from coming into contact with a conversion board.
  • a pressure sensor includes a pressure chamber, a semiconductor sensor chip that detects the pressure of a fluid introduced into the pressure chamber, and an external input/output of the semiconductor sensor chip that is connected to the semiconductor sensor chip.
  • a pressure detecting section having a lead pin constituting a terminal; a board accommodating section adjacent to the pressure detecting section, a connector connecting section, and a partition wall section between the board accommodating section and the connector connecting section. Adjustment of signals between the connector housing, a connection terminal for making a signal connection with the outside, and the pressure detection section housed in the board accommodating section and via the lead pin, and communication with the outside via the connection terminal.
  • a signal sending unit having a conversion board that adjusts signals between the converter board and a heat-generating component mounted on the conversion board and fixed to the connector housing with a heat-dissipating adhesive; is characterized in that the signal sending section is disposed over an adhesive reservoir region that extends in a direction perpendicular to a direction adjacent to the pressure detecting section.
  • the conversion board may have a chamfered portion on the outer periphery of the conversion board, and the connector housing may have a board rotation stopper so as to correspond to the chamfered portion.
  • the heat dissipating adhesive swells and spreads in a direction perpendicular to a direction in which the signal sending section is adjacent to the pressure detecting section.
  • the conversion board may have a notch that extends to the vicinity of the land on the conversion board to prevent it from adhering to the land on the conversion board.
  • FIG. 1 is a sectional view showing a pressure sensor according to an embodiment of the invention.
  • FIG. 2 is a schematic diagram showing a pressure sensor main body according to an embodiment of the present invention
  • FIG. 2(a) is a perspective view showing the pressure sensor main body before installing a board
  • FIG. FIG. 3 is a plan view showing the pressure sensor main body after applying an adhesive before installation.
  • FIG. 3 is a partially enlarged cross-sectional view showing the adhesive reservoir area of the pressure sensor main body according to the embodiment of the present invention
  • FIG. 3(a) is an enlarged view of section IIIa in FIG. 2(b).
  • FIG. 3(b) is a top view of the adhesive pool area before inserting the heat generating component
  • FIG. 3(b) is a top view of the adhesive pool area before inserting the heat generating component
  • FIG. 3(c) is a cross-sectional view of the adhesive pool area before inserting the heat generating component
  • FIG. FIG. 3 is a cross-sectional view of a drug reservoir area.
  • FIG. 4 is a schematic diagram showing the pressure sensor main body according to the embodiment of the present invention
  • FIG. 4(a) is a perspective view showing the pressure sensor main body after installing the board
  • FIG. It is a top view which shows the pressure sensor main body after installation.
  • FIG. 5(a) is a cross-sectional view showing a pressure sensor according to another embodiment of the present invention
  • FIG. 5(b) is a cross-sectional view showing a pressure sensor according to still another embodiment of the present invention.
  • FIG. 6 is a sectional view showing a pressure sensor according to yet another embodiment of the present invention.
  • Embodiments of the present invention will be described in detail with reference to FIGS. 1 to 6. However, the present invention is not limited to the aspects of this embodiment.
  • the pressure sensor 100 includes heat dissipation means from the conversion substrate 133 and means for suppressing heat transfer to the conversion substrate 133, thereby dissipating the heat generated in the conversion substrate 133 to the external environment. This can effectively radiate heat and suppress heat transfer from the fluid whose pressure is to be detected to the conversion board 133.
  • the heat dissipation means of the conversion board brings the conversion board 133 (including heat-generating components) into indirect thermal contact with the connector housing 131. Therefore, a case will be described in which the conversion board 133 is brought into indirect thermal contact with the connector housing 131 as a heat dissipation means for the conversion board 133.
  • a pressure sensor 100 according to an embodiment of the present invention will be described using FIG. 1.
  • the pressure sensor 100 includes a fluid introducing section 110, a pressure detecting section 120, a signal sending section (main body) 130, and a connecting member 140.
  • a fluid introducing section 110 a pressure detecting section 120
  • a signal sending section main body 130
  • a connecting member 140 connects the fluid introduction section 110 and the pressure detection section 120.
  • the section 120 and the signal sending section 130 can be integrally assembled.
  • the fluid introduction part 110 introduces a fluid whose pressure is detected into a pressure chamber 112A described later, and includes a metal joint member 111 and a metal base plate connected to the other end of the joint member 111 by welding or the like. 112.
  • the joint member 111 includes a female threaded portion 111a that is connected to a pipe (not shown) that introduces the fluid whose pressure is to be detected, and a port 111b that guides the fluid introduced from the pipe to the pressure chamber 112A.
  • the open end of the port 111b is connected to an opening provided in the center of the base plate 112 by welding or the like.
  • the joint member 111 is provided with the female threaded portion 111a, but is not limited to this.
  • the joint member 111 may be provided with a male threaded portion, or may be connected with a copper connecting pipe instead of the joint member 111. You can also use it as
  • the base plate 112 has a bowl shape whose diameter increases in the radial direction with respect to the central axis C of the pressure sensor 100 from one end to the other, and forms a pressure chamber 112A between it and a diaphragm 122, which will be described later.
  • the pressure detection unit 120 detects the pressure of the fluid in the pressure chamber 112A, and includes a housing 121 having a through hole, a diaphragm 122 that partitions the pressure chamber 112A described above and a liquid seal chamber 124A described later, and a diaphragm 122. and a protective cover 123 disposed on the pressure chamber 112A side.
  • the pressure detection unit 120 also includes a hermetic glass 124 sealed inside the through hole of the housing 121, and a liquid seal chamber in which sealed oil is filled between the recess of the hermetic glass 124 on the pressure chamber 112A side and the diaphragm 122.
  • the pressure detection unit 120 includes a semiconductor sensor chip 126 supported by a support column 125 and placed inside the liquid seal chamber 124A, a potential adjustment member 127 placed around the liquid seal chamber 124A, and a semiconductor sensor chip 126 fixed to the hermetic glass 124.
  • a plurality of lead pins 128 and an oil filling pipe 129 fixed to the hermetic glass 124 are provided.
  • the housing 121 is made of a metal material such as an Fe/Ni alloy or stainless steel in order to maintain the strength around the hermetic glass 124.
  • the diaphragm 122 and the protective cover 123 are both made of a metal material, and are welded together at the outer peripheral edge of the through hole of the housing 121 on the pressure chamber 112A side.
  • the protective cover 123 is provided inside the pressure chamber 112A to protect the diaphragm 122, and is provided with a plurality of communication holes 123a through which the fluid introduced from the fluid introduction part 110 passes.
  • the hermetic glass 124 protects the liquid sealing chamber 124A in which the semiconductor sensor chip 126 is liquid-sealed from ambient environmental conditions such as humidity, dust, and heat in the air, holds the plurality of lead pins 128, and holds the plurality of lead pins 128. It is provided to insulate from the housing 121.
  • a semiconductor sensor chip 126 is supported by an adhesive or the like on the liquid seal chamber 124A side of a column 125 arranged at the center of the hermetic glass 124.
  • the support column 125 is made of a Fe-Ni alloy, but the present invention is not limited to this. For example, it may be made of other metal materials such as stainless steel, or it may be configured to be directly supported by the flat surface forming the recess of the hermetic glass 124 without providing the support 125.
  • the semiconductor sensor chip 126 Inside the semiconductor sensor chip 126, there is a diaphragm made of a material having a piezoresistance effect (for example, single crystal silicon, etc.), a plurality of semiconductor strain gauges formed on the diaphragm, and a bridge in which these semiconductor strain gauges are bridge-connected. It includes an amplifier circuit that processes outputs from the circuit and the bridge circuit, and an integrated circuit such as an arithmetic processing circuit. Further, the semiconductor sensor chip 126 is connected to a plurality of lead pins 128 by bonding wires 126a made of gold or aluminum, for example, and the plurality of lead pins 128 constitute external input/output terminals of the semiconductor sensor chip 126.
  • a diaphragm made of a material having a piezoresistance effect (for example, single crystal silicon, etc.)
  • a plurality of semiconductor strain gauges formed on the diaphragm
  • a bridge in which these semiconductor strain gauges are bridge-connected. It includes an amplifier circuit that
  • the potential adjustment member 127 is used to place the semiconductor sensor chip 126 in a no-electric field (zero potential) so that the circuits inside the chip are not adversely affected by the potential generated between the frame ground and the secondary power source. established in The potential adjustment member 127 is arranged between the semiconductor sensor chip 126 and the diaphragm 122 in the liquid seal chamber 124A, is made of a conductive material such as metal, and is connected to a terminal connected to the zero potential of the semiconductor sensor chip 126. Connected.
  • a plurality of lead pins 128 and an oil filling pipe 129 are fixed through the hermetic glass 124 by hermetic processing.
  • a total of eight lead pins 128 are provided as the lead pins 128. That is, three lead pins 128 are provided for external output (Vout), drive voltage supply (Vcc), and ground (GND), and five lead pins 128 are provided as terminals for adjusting the semiconductor sensor chip 126. . Note that in FIG. 1, four of the eight lead pins 128 are shown.
  • the oil filling pipe 129 is provided to fill the inside of the liquid sealing chamber 124A with sealed oil (for example, silicone oil, fluorine-based inert liquid, etc.). Note that the other end of the oil filling pipe 129 is crushed and closed off as shown in FIG. 1 after being filled with oil.
  • sealed oil for example, silicone oil, fluorine-based inert liquid, etc.
  • ⁇ Operation of pressure detection section The operation of the pressure detection section 120 will be explained.
  • the diaphragm 122 is pressed by the fluid introduced from the joint member 111 into the pressure chamber 112A.
  • the pressure in the pressure chamber 112A applied to the diaphragm 122 is transmitted to the semiconductor sensor chip 126 via the sealed oil in the liquid seal chamber 124A.
  • This transmitted pressure causes the silicon diaphragm of the semiconductor sensor chip 126 to deform, and a bridge circuit using a piezoresistive element converts the pressure into an electrical signal.
  • the signal is outputted to the signal sending section 130 via.
  • the signal sending section (main body) 130 sends out the pressure signal detected by the pressure detecting section 120, and includes a connector housing 131 for external connection disposed adjacent to the other end side of the pressure detecting section 120. and a flexible connecting member 132 whose one end is connected to the plurality of lead pins 128. Further, the signal sending unit 130 includes a conversion board 133 fixed to the connector housing 131 via three connection terminals, and the connection terminals 134a to 134c, each of which has one end connected through the conversion board 133. Note that an opening 133f is formed in this conversion board 133 in order to avoid interference with the oil filling pipe 129.
  • the connector housing 131 is made of an insulating resin or the like with relatively high thermal conductivity, and has a board accommodating portion 131a having a concave shape at one end, a concave shape at the other end, and an external connector ( (not shown); and a partition wall 131c disposed between the board accommodating part 131a and the connector connection part 131b.
  • a plurality of lead pins 128 extending from the hermetic glass 124, an oil filling pipe 129, a flexible wire connection material 132, a conversion board 133, and the like are arranged in the internal space S defined by the substrate housing portion 131a.
  • the conversion board 133 includes a conversion circuit (not shown) that converts both the drive voltage and the pressure detection signal in order to correspond to the signal system of the drive voltage and pressure detection signal.
  • This conversion circuit converts the drive voltage (for example, 8V to 36V) of a control circuit (not shown) connected to the outside of the pressure sensor 100 via the connection terminals 134a to 134c to the drive voltage (for example, 8V to 36V) of the semiconductor sensor chip 126. , 5.0V), and a step-down circuit unit (not shown) that converts the pressure detection signal (for example, 0.5V to 4.5V) of the pressure sensor 100 to the pressure detection signal (for example, 1V to 5V) of the control circuit. and a voltage shift circuit section (not shown) that boosts the voltage.
  • the pressure detection unit 120 By appropriately selecting the conversion board 133 provided in the pressure sensor 100 in accordance with the driving voltage and the signal system of the pressure detection signal, the pressure detection unit 120, especially the semiconductor sensor chip 126, and the liquid seal chamber 124A can be controlled.
  • the difference between the drive voltage and the pressure detection signal can be absorbed without changing the design of the surrounding structure.
  • connection terminals 134a to 134c are provided, one for external output (Vout), one for drive voltage supply (Vcc), and one for ground (GND).
  • the connecting terminals 134a to 134c are made by inserting one end 134d of the connecting terminal 134a into a through hole provided in the conversion board 133, and soldering this through hole. By attaching it, the connection terminal 134a is connected to the conversion board 133.
  • a land portion 133n is formed at the connection portion of this conversion board 133, and is electrically connected to the electrode 135 through a conductive pattern.
  • the other end side of the connection terminal 134a extends to the connector connection part 131b through the partition wall part 131c. The penetration portions of the partition wall portion 131c through which the connection terminals 134a to 134c pass are sealed with a connection terminal fixing adhesive 134g.
  • the connecting member 140 includes a caulking plate 141 that connects and fixes the fluid introducing section 110, the pressure detecting section 120, and the signal transmitting section 130 by caulking, and an adhesive disposed between the pressure detecting section 120 and the signal transmitting section 130.
  • a sheet 142 is provided.
  • the caulking plate 141 is made of metal such as copper and has a cylindrical shape.
  • the caulking plate 141 is arranged around the fluid introduction section 110, the pressure detection section 120, and the signal transmission section 130, and is fixed to the fluid introduction section 110 and the signal transmission section 130 by caulking.
  • the adhesive sheet 142 is sandwiched between the pressure detection section 120 and the signal transmission section 130 in order to perform waterproof and dustproof functions.
  • a non-metallic resin sheet 151 having heat radiation and an adhesive 152 having heat radiation may be sandwiched between the adhesive sheet 142 and the housing 121 as means for suppressing heat transfer to the conversion board 133.
  • the conversion board 133 includes the other end surface 133b on which various electronic components are mounted and spaced apart from the connector housing 131, and one end surface 133a to which connection terminals 134a to 134c and the like are soldered.
  • the heat generating component 133h (for example, a transistor, a regulator, etc.) in this embodiment is of a lead type and is mounted on the other end surface 133b.
  • This converter board 133 generates heat by itself due to the transformation of the drive voltage, so if no measures are taken against this, there is a risk that the electronic components on the converter board will exceed the heat resistant temperature and be damaged.
  • various heat dissipation means for the conversion board 133 are employed so that the electronic components of the conversion board 133 do not exceed the allowable temperature limit.
  • the heat generated in the conversion board 133 can be efficiently radiated to the external environment, so that the margin for the heat resistance temperature of the conversion board 133 can be improved.
  • the heat dissipation means of the conversion board 133 in this embodiment will be specifically explained.
  • Heat dissipation means of conversion board (lead type heat generating parts)>
  • a lead type heat generating component 133h is used so as to constitute a heat dissipation path indicated by a broken line (1) in FIG.
  • the lead type heat generating component 133h is provided on the board facing surface 131a1 side. Since the area around this heat generating component 133h is filled with a heat dissipating adhesive 133g having thermal conductivity, in order to prevent this heat dissipating adhesive 133g from spreading onto the conversion board, the outer periphery of the connector housing 131 and An adhesive reservoir wall surface 131w is provided that defines an adhesive reservoir region 131e between the two.
  • the adhesive reservoir area 131e is defined by the adhesive reservoir wall surface 131w, the substrate accommodating portion 131a of the main body 130, and the partition wall portion 131c.
  • a lead-type heat-generating component 133h is accommodated in the adhesive reservoir region 131e, and a heat dissipating adhesive 133g having thermal conductivity is filled only between the adhesive reservoir region 131e and the lead-type heat-generating component 133h. ing.
  • the heat is transferred via the connector housing 131. Heat can be radiated more efficiently to the external environment.
  • the adhesive reservoir area 131e which is surrounded by the adhesive reservoir wall surface 131w and the inner wall of the connector housing 131 in a plan view, extends in the insertion direction of the lead type heat generating component 133h, as shown in FIG. 2(b). It is desirable that they are formed in a direction perpendicular to the other direction (front direction, rear direction, left direction, right direction in plan view of FIG. 2(b)). This is better than a shape that connects the intersection of the adhesive reservoir wall surface 131w and the inner wall of the connector housing 131 with the shortest distance, or a shape that connects both ends of the adhesive reservoir wall surface 131w with a gentle curve (for example, an arc shape).
  • the surface area of the adhesive reservoir region 131e can be increased by making it rectangular in plan view as in this embodiment.
  • the amount of heat generated in the heat generating component 133h transferred to the heat dissipating adhesive 133g having thermal conductivity surrounding the heat generating component 133h can be increased.
  • the space can be used effectively by being formed into a rectangular shape in plan view so as to avoid the connection terminals 134b and 134c. Since the lead type heat generating component 133h is mounted on the conversion board 133 via the lead 133l, the heat generating part of the heat generating component 133h is physically separated from the conversion board 133, thereby causing the conversion board It is possible to prevent the electronic components No. 133 from exceeding the allowable temperature limit.
  • the lead type heat generating component 133h is provided on the outer diameter side of the connector housing 131 so as to be close to the outside air. This makes it easier for the heat dissipating adhesive 133g filled around the lead type heat generating component 133h to dissipate heat to the outside of the connector housing 131.
  • Heat transfer suppression means> A fluid whose pressure is to be detected is introduced into the pressure chamber 112A, but depending on the conditions of use of the fluid, a very high temperature fluid (for example, about 130 (° C.)) may be introduced and become a heat source.
  • a very high temperature fluid for example, about 130 (° C.)
  • the heat on the pressure detection unit 120 side (such as the heat of the high temperature fluid introduced into the pressure chamber 112A) is transferred to the conversion board 133 (heat transfer from one end side to the other end side in FIG. Due to heat conduction and heat radiation (radiation), there is a possibility that the heat radiation effect using the heat radiation means (lead type heat generating component) may be canceled out.
  • various heat transfer suppressing means are employed to prevent the heat on the pressure detection unit 120 side (such as the heat of the high-temperature fluid introduced into the pressure chamber 112A) from transferring to the conversion board 133. It is something to do. As a result, in this embodiment, it is possible to suppress the heat on the pressure detection unit 120 side from transferring to the conversion board 133, so that the heat dissipation effect using the heat dissipation means (lead type heat generating component) can be sufficiently exhibited. That will happen. Below, the means for suppressing heat transfer to the conversion substrate 133 in this embodiment will be specifically explained.
  • the internal space S is used as a first heat transfer suppressing means to the conversion substrate 133.
  • the internal space S is used as a first heat transfer suppressing means to the conversion substrate 133.
  • the distance L in the direction of the central axis C between the conversion board 133 and the housing 121 on the pressure detection part 120 side in the internal space S can be reduced. , can be set as large as possible.
  • the heat on the pressure detection unit 120 side is suppressed from being transferred to the conversion board 133 because the heat transfer path is long and the heat is transmitted through the internal space S of air with low thermal conductivity. can do.
  • the conversion board 133 and the other end of the board accommodating portion 131a are not in direct contact as described in the next section.
  • the conversion board 133 is provided apart from the other end and outer periphery of the board accommodating portion 131a so as not to come into direct contact with the connector housing 131. Instead of being directly supported by the connector housing 131, the conversion board 133 is supported at three points by three connection terminals 134a to 134c, as shown in FIGS. 4(a) and 4(b). These three connection terminals 134a to 134c are provided so as to be located toward the center of the conversion board 133, where a particular load is applied when the connection terminals 134a to 134c are soldered to the conversion board 133. Further, as shown in FIG.
  • the three connection terminals 134a to 134c do not have a linear structure but have a structure with a step 134f, and the conversion board 133 can be received at the step 134f.
  • the position of this step 134f is set at a height that does not make contact with the connector housing 131 so that when the conversion board 133 is housed in the connector housing 131, the conversion board 133 is supported at three points as described above.
  • connection terminals 134a to 134c themselves are fixed to the connector housing 131 with a connection terminal fixing adhesive 134g, and the lead type heat generating component 133h mounted on the conversion board 133 is By being fixed to the connector housing 131 with the heat dissipating adhesive 133g, the conversion board 133 is indirectly fixed to the connector housing 131. In this way, since the conversion board 133 is provided apart from the other end of the board accommodating part 131a so as not to come into direct contact with the connector housing 131, the surrounding heat dissipating adhesive can be removed from the lead type heat generating component 133h. The heat transmitted to 133g can be suppressed from being transmitted to the conversion board 133.
  • the conversion board 133 is provided so that its side portion is spaced apart from the outer periphery of the board accommodating portion 131a, the difference in linear expansion coefficient due to heat between the conversion board 133 and the connector housing 131 causes It is possible to prevent stress from being applied from the connector housing 131 to the conversion board 133. This can prevent damage to the conversion board 133 due to stress applied from the connector housing 131 to the conversion board 133 due to the difference in linear expansion coefficients.
  • the flexible wire connection material 132 described above is used as a third heat transfer suppressing means to the conversion board 133.
  • the flexible connection material 132 is formed from, for example, a flexible printed circuit board (FPC), a thin plate-like conductive member, a single lead wire, a collection of lead wires, etc.
  • FPC flexible printed circuit board
  • the plurality of lead pins 128 and the electrode 135 are connected in a curved or bent state. Therefore, the connection distance between the plurality of lead pins 128 and the electrode 135 can be set to be relatively large.
  • the flexible wire connection material 132 is thinner and has a smaller cross-sectional area than a normal wiring material.
  • the heat on the semiconductor sensor chip 126 side is conducted to the conversion board 133 through the flexible connecting material 132 which has a long heat transfer path, and because the cross-sectional area is made small. It is possible to prevent this from happening.
  • FIG. 2A shows the state before the conversion board 133 is installed on the main body 130, before the connection terminal fixing adhesive 134g is applied, and when the heat dissipating adhesive 133g is filled into the adhesive reservoir area 131e.
  • FIG. 2(b) shows a perspective view of the previous main body 130
  • FIG. FIG. 7 shows a plan view of the main body 130 after the adhesive reservoir region 131e is filled with adhesive 133g. Note that FIG. 2(a) shows a part of the connector housing 131 cut away so that the inside of the main body can be seen, and this is also the case in FIG. 4(a).
  • connection terminals 134a to 134c are inserted into the main body 130.
  • a connecting terminal fixing adhesive 134g is applied around the connecting terminals 134a to 134c so that the inserted connecting terminals 134a to 134c are fixed to the main body 130. filling).
  • the applied thickness is determined so that the connection terminal fixing adhesive 134g does not adhere to the conversion board 133.
  • the adhesive reservoir area 131e of the main body 130 is filled with a heat dissipating adhesive 133g.
  • the heat dissipating adhesive 133g is filled to about half to 80% of the fillable space volume of the adhesive reservoir region 131e, and is not filled to the limit of the fillable volume. Then, the conversion board 133 is inserted into the main body 130. At this time, since the lead type heat generating component 133h has been assembled in advance on the conversion board 133 and protrudes toward the board facing surface 131a1, the heat dissipating adhesive filled in the adhesive reservoir area 131e of the main body 130 It is inserted into 133g. Next, the main body 130 with the conversion board 133 inserted therein is placed in an oven and heated to harden the heat dissipating adhesive 133g and the connection terminal fixing adhesive 134g.
  • This heating also has the purpose of drying the conversion substrate 133 in order to prevent migration due to absorption of moisture by the conversion substrate 133. Then, the connection terminals 134a to 134c and the lead type heat generating component 133h are soldered to the conversion board 133. Finally, a solder inspection is performed to confirm that the soldering is done properly.
  • 3(a) is an enlarged view of a section IIIa surrounded by a square in FIG. 2(b), and FIG. 3(b) shows a lead type heat generating component 133h in the insertion area 133i of FIG. 3(a).
  • FIG. 3C is a side cross-sectional view showing how the heat dissipating adhesive 133g bulges after the lead-type heat generating component 133h is inserted into the insertion region 133i. .
  • FIG. 4(a) is a perspective view of the main body 130 after the conversion board 133 is installed in the main body 130
  • FIG. 4(b) is a plan view of the main body of FIG. 4(a) as seen from the conversion board 133 side. It is.
  • the lead type heat generating component 133h is inserted into the insertion region 133i of the heat dissipating adhesive 133g filled in the adhesive reservoir region 131e of the main body 130, as shown in FIG. 3(a).
  • the heat dissipating adhesive 133g bulges along each surface of the lead type heat generating component 133h, as shown in FIG. 3(c). If no measures are taken to prevent this, the raised heat dissipating adhesive 133g will creep up along the adhesive pool wall surface 131w due to surface tension (in the direction of arrow A shown in FIG. 2(a)) and directly attach to the conversion board. 133 or may drip onto the conversion board 133.
  • the heat dissipating adhesive 133g is disposed over an adhesive reservoir region 131e expanded in a direction perpendicular to the direction in which the signal sending section 130 and the pressure detecting section 120 of the lead type heat generating component 133h are adjacent.
  • the heat dissipating adhesive 133g which has swelled and spread in the direction orthogonal to the direction in which the signal transmitting section 130 and the pressure detecting section 120 are adjacent is sufficiently absorbed. This is to prevent the heat dissipating adhesive 133g from adhering to the conversion board 133.
  • a notch 133k is provided in a portion of the conversion board 133 where the heat dissipating adhesive 133g may creep up along the adhesive reservoir wall surface 131w in the direction of arrow A shown in FIG. 2(a) due to surface tension. There is.
  • the distance between the conversion board 133 and the inner wall of the main body 130 can be widened, and the heat dissipating adhesive 133g, which has swelled and spread in the direction perpendicular to the direction in which the signal sending section 130 and the pressure detecting section 120 are adjacent, can be bonded. It is possible to prevent the agent from creeping up along the wall surface 131w of the agent reservoir due to surface tension. Furthermore, by providing the cutout portion 133k near the land portion 133n of the conversion board 133, the heat dissipating adhesive 133g overflowing in the direction perpendicular to the direction in which the signal sending unit 130 and the pressure detection unit 120 are adjacent to each other can be applied to the board.
  • the heat dissipating adhesive 133g can be prevented from adhering to the land portion 133n.
  • the direction in which the signal sending section 130 and the pressure detecting section 120 are adjacent to each other coincides with the direction in which the lead type heat generating component 133h is attached to the conversion board 133.
  • two opposing portions of the outer periphery of the conversion board 133 are circular in plan view.
  • Chamfered portions 131m are provided in some places, and two substrate rotation stops 136 are provided on the inner wall of the main body 130, which is circular in plan view, to correspond to the chamfered portions 131m.
  • the circular inner wall of the main body 130 and the circular outer periphery of the conversion board 133 serve as guides, and the centers of the conversion board 133 and the main body 130 in plan view match.
  • the conversion board 133 is positioned and oriented by the chamfered portion 131m and the board rotation stopper 136. In order to prevent the heat dissipating adhesive 133g from dripping onto the conversion board 133, this is done so that the conversion board 133 does not touch the main body 130 when the conversion board 133 is inserted into the main body 130, and even after the conversion board 133 is inserted into the main body 130. This is to prevent it from rotating. As shown in FIGS.
  • the chamfered portion 131m and the board rotation stopper 136 engage with each other, thereby serving as a guide when the conversion board 133 is inserted into the connector housing 131, and serving as a guide for the connecting terminal 134a.
  • the heat dissipating adhesive 133g can be prevented from spreading over the entire conversion board 133.
  • the chamfered portion 131m and the substrate rotation stopper 136 are configured linearly, but are not limited to this.
  • they may be configured to have a concave shape and a convex shape and engage with each other.
  • one side may have a notch and the other side may have a shape corresponding to the notch so that the same effect as the chamfered portion 131m and the board rotation stopper 136 described above can be obtained.
  • two chamfers 131m and two board rotation stops 136 are provided, one or three or more may be provided. Note that when the outer periphery of the conversion board 133 in a plan view and the inner wall of the main body 130 in a plan view are rectangular, it is sufficient that they each have a shape that allows them to fit or engage with each other.
  • the insertion region 133i of the lead-type heat generating component 133h into the heat dissipating adhesive 133g is placed away from the outer peripheral wall surface of the main body 130. This arrangement can also prevent the raised heat dissipating adhesive 133g from coming into contact with the conversion board 133.
  • the assembly process of the pressure sensor 100 will be explained.
  • the pressure detection section 120 and the signal transmission section (main body) 130 are assembled as described above.
  • the sealed oil is filled into the liquid seal chamber 124A via the oil filling pipe 129, and the oil filling pipe 129 is closed.
  • the fluid introduction section 110 is fixed to the pressure detection section 120 by welding or the like.
  • the plurality of lead pins 128 of the pressure detection section 120 and the conversion board 133 of the signal sending section 130 are arranged in parallel so as to face upward, respectively, and one and the other of the flexible wiring members 132 are connected to the plurality of lead pins 128.
  • the pressure detection section 120 and the signal transmission section 130 are disposed facing each other on the same axis via a curved or bent flexible wire connection material 132, and between the pressure detection section 120 and the signal transmission section 130, The adhesive sheet 142 is sandwiched.
  • one end side and the other end side of the caulking plate 141 are engaged with the base plate 112 of the fluid introduction section 110 and the connector housing 131 of the signal sending section 130, respectively, and the fluid introduction section 110, the pressure detection section 120, and the The signal sending unit 130 is integrally fixed.
  • the assembly process of the pressure sensor 100 is such that, for example, the pressure sensor 100 is stacked from one end side to the other end side in the direction of the central axis C. It was necessary to assemble it. Therefore, the degree of freedom in the assembly process is extremely low, making it difficult to shorten the assembly time.
  • the degree of freedom in the assembly process of the pressure sensor 100 is increased by connecting the pressure detection section 120 and the signal transmission section 130 via the curved or bent flexible connection material 132. Since the height can be increased, assembly time can be shortened.
  • FIG. 5(a) is a cross-sectional view showing a pressure sensor according to another embodiment of the present invention
  • FIG. 5(b) is a cross-sectional view showing a pressure sensor according to still another embodiment of the present invention.
  • the conversion board 233 is arranged parallel to the central axis C, that is, in a direction parallel to the direction in which the signal sending section 130 is adjacent to the pressure detecting section 120.
  • the lead type heat generating component 233h has a lead 233l portion bent at a right angle, and its tip is inserted into a through hole provided in the conversion board 233 from the mounting surface 233b to the soldering surface 233a.
  • the connection terminal 134a is connected to the conversion board 233 by soldering.
  • a land portion 233n is formed at the connection portion of this conversion board 233, and is electrically connected to the electrode 135 through a conductive pattern.
  • the conversion board 333 is arranged in a direction parallel to the direction in which the signal sending section 130 is adjacent to the pressure detecting section 120. Further, in the lead type heat generating component 333h, the lead 333l is bent at a right angle, and the tip thereof is further bent into an L shape. The tip of this L-shaped lead 333l is soldered onto the mounting surface 333b of the conversion board 333, forming a land portion 333n.
  • FIG. 6 is a sectional view showing a pressure sensor according to yet another embodiment of the present invention.
  • the conversion board 433 is arranged in a direction parallel to the direction in which the signal sending section 130 is adjacent to the pressure detecting section 120.
  • the lead 433l is parallel to the conversion board 433, and a part of the lead 433l is attached to the pattern on the mounting surface 433b of the conversion board 433 using, for example, a conductive adhesive. ing.
  • the adhesive pooling area 131e is The area of the opposing portion is extremely small compared to the conversion board 133.
  • the lead-type heat-generating components 233h, 333h, and 433h are inserted into the adhesive reservoir region 131e, and the heat dissipating adhesive 133g swells in a direction perpendicular to the direction in which the signal transmitting section 130 and the pressure detecting section 120 are adjacent to each other.
  • the heat dissipating adhesive 133g Even if it spreads, the heat dissipating adhesive 133g will not drip onto the conversion substrates 233, 333, 433. Further, even if the heat dissipating adhesive 133g creeps up due to surface tension, it can be prevented from dripping onto the conversion substrates 233, 333, 433. Furthermore, even if the heat dissipating adhesive 133g overflows in a direction perpendicular to the direction in which the signal sending section 130 and the pressure detecting section 120 are adjacent to each other, the heat dissipating adhesive 133g is prevented from adhering to the land section 233n or 333n. can.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

Le capteur de pression de l'invention comprend une unité de détection de pression dotée d'une chambre de pression, d'une puce de capteur à semi-conducteur qui détecte la pression d'un fluide introduit dans la chambre de pression, et d'une broche de connexion reliée à la puce de capteur à semi-conducteur et constituant une borne d'entrée/sortie externe de la puce de capteur à semi-conducteur; et une unité d'émission de signaux adjacente à l'unité de détection de pression et dotée d'un boîtier de connecteur qui définit une section de logement de carte, une section de connexion de connecteur et une cloison entre la section de logement de carte et la section de connexion de connecteur, une borne de connexion pour établir une connexion de signal avec l'extérieur, une carte de conversion qui est logée dans la section de logement de carte, qui ajuste les signaux transmis à l'unité de détection de pression par l'intermédiaire de la broche conductrice et qui ajuste les signaux émis à l'extérieur par l'intermédiaire de la borne de connexion, et un composant de génération de chaleur qui est monté sur la carte de conversion et fixé au boîtier de connecteur par un adhésif dissipant la chaleur. L'adhésif dissipant la chaleur est réparti sur une zone de réservoir d'adhésif qui s'étend dans une direction perpendiculaire à la direction dans laquelle l'unité d'émission de signaux est adjacente à l'unité de détection de pression.
PCT/JP2023/003469 2022-06-30 2023-02-02 Capteur de pression WO2024004248A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-106618 2022-06-30
JP2022106618A JP2024006068A (ja) 2022-06-30 2022-06-30 圧力センサ

Publications (1)

Publication Number Publication Date
WO2024004248A1 true WO2024004248A1 (fr) 2024-01-04

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JP (1) JP2024006068A (fr)
WO (1) WO2024004248A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243428A (ja) * 2009-04-09 2010-10-28 Nagano Keiki Co Ltd 流体圧力測定装置
US20120104518A1 (en) * 2009-05-20 2012-05-03 Metallux Sa Pressure sensor
JP2014235072A (ja) * 2013-05-31 2014-12-15 長野計器株式会社 物理量測定センサ
WO2022097437A1 (fr) * 2020-11-04 2022-05-12 株式会社鷺宮製作所 Capteur de pression

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243428A (ja) * 2009-04-09 2010-10-28 Nagano Keiki Co Ltd 流体圧力測定装置
US20120104518A1 (en) * 2009-05-20 2012-05-03 Metallux Sa Pressure sensor
JP2014235072A (ja) * 2013-05-31 2014-12-15 長野計器株式会社 物理量測定センサ
WO2022097437A1 (fr) * 2020-11-04 2022-05-12 株式会社鷺宮製作所 Capteur de pression

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