WO2023286685A1 - 無機基板と耐熱高分子フィルムの積層体 - Google Patents

無機基板と耐熱高分子フィルムの積層体 Download PDF

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Publication number
WO2023286685A1
WO2023286685A1 PCT/JP2022/026927 JP2022026927W WO2023286685A1 WO 2023286685 A1 WO2023286685 A1 WO 2023286685A1 JP 2022026927 W JP2022026927 W JP 2022026927W WO 2023286685 A1 WO2023286685 A1 WO 2023286685A1
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Prior art keywords
polymer film
heat
resistant polymer
laminate
inorganic substrate
Prior art date
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Ceased
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PCT/JP2022/026927
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English (en)
French (fr)
Japanese (ja)
Inventor
桂也 ▲徳▼田
哲雄 奥山
郷司 前田
治美 米虫
伝一朗 水口
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Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
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Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to KR1020247001037A priority Critical patent/KR20240035455A/ko
Priority to EP22842029.5A priority patent/EP4371766A4/en
Priority to JP2023534755A priority patent/JPWO2023286685A1/ja
Priority to CN202280049053.5A priority patent/CN117677497A/zh
Priority to US18/558,962 priority patent/US20240227363A1/en
Publication of WO2023286685A1 publication Critical patent/WO2023286685A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Definitions

  • the present invention relates to a laminate in which a heat-resistant polymer film such as polyimide resin is formed on an inorganic substrate.
  • the laminate of the present invention is useful, for example, in manufacturing flexible devices and flexible wiring boards in which electronic elements are formed on the surface of a flexible substrate.
  • polymer films such as polyimide (hereinafter also referred to simply as “polymer films") as substrate materials for manufacturing flexible electronic devices. Since polymer films such as polyimide films are produced in the form of long rolls, it is generally accepted that a roll-to-roll production line is ideal even in the production of flexible devices.
  • many conventional electronic devices such as display devices, sensor arrays, touch screens, and printed wiring boards use hard rigid substrates such as glass substrates, semiconductor wafers, or glass fiber reinforced epoxy substrates. Manufacturing equipment is also configured on the premise of using such rigid substrates.
  • a rigid inorganic substrate such as a glass substrate is used as a temporary support, and a polymer film is temporarily attached to the temporary support.
  • a flexible electronic device manufacturing method is known in which the polymer film is subjected to electronic device processing, and then the polymer film having the electronic device formed thereon is peeled off from the temporary support.
  • a rigid substrate such as a glass substrate is used as a temporary support
  • a polymer solution or a polymer precursor solution is applied to the temporary support, and dried.
  • a chemical reaction is caused to convert the precursor into a polymer film, thereby obtaining a laminate of the temporary support and the polymer film, and similarly forming an electronic device on the polymer film.
  • a technique is known in which a flexible electronic device is manufactured by peeling after coating. (Patent document 2)
  • the laminate is often exposed to high temperatures.
  • formation of functional elements such as polysilicon and oxide semiconductors requires a process in a temperature range of about 200.degree. C. to 600.degree.
  • a temperature of about 200° C. to 300° C. may be applied to the film. Some heating may be required. Therefore, the polymer film constituting the laminate is required to have heat resistance, but as a matter of fact, there are only a limited number of polymer films that can withstand such a high temperature range, and in many cases, polyimide is selected.
  • a laminate in the form of a rigid temporary support and a polymer film layer that will eventually be peeled off and become the base material of a flexible electronic device will be superimposed. Since such a laminate can be handled as a rigid plate material, it can be handled in the same manner as a glass substrate in an apparatus for manufacturing liquid crystal displays, plasma displays, organic EL displays, etc. using conventional glass substrates.
  • the laminate of heat-resistant polymer film and inorganic substrate is handled using robot forks and vacuum lifters for transporting glass in the display manufacturing process. If the direction of the laminate is changed while being gripped by such a conveying device, a twisting force is applied in the plane direction, causing the problem that the heat-resistant polymer film is peeled off from the inorganic substrate.
  • the size of the laminate is large, specifically, when one side is 400 mm or more, the shear force applied to the position where the rotation axis is separated when the direction is changed becomes large, and the heat-resistant polymer film is separated from the inorganic substrate. Delamination is more likely to occur.
  • the present invention is intended to solve the above problems, and in a laminate of an inorganic substrate and a heat-resistant polymer film, the peeling of the heat-resistant polymer film from the inorganic substrate is suppressed during handling, particularly when changing the direction of the laminate. It is an object of the present invention to provide a laminated body that has been processed.
  • the present inventors found that by setting the shear peel strength between the inorganic substrate and the heat-resistant polymer film to a certain level or more, the blurring of the laminate can be suppressed. Completed.
  • the present invention includes the following configurations.
  • the present invention since the shear peel strength between the inorganic substrate and the heat-resistant polymer film is high, peeling between the inorganic substrate and the heat-resistant polymer film can be suppressed during mechanical handling.
  • the present invention is effective in a system using a large-sized inorganic substrate in which a large force (twist) is applied to the inorganic substrate in the planar direction when the direction is changed.
  • FIG. 2(a) is a schematic diagram of an example in which the laminate is warped toward the heat-resistant polymer side
  • FIG. 2(b) is a schematic diagram of an example in which the laminate is warped toward the inorganic substrate side.
  • 1 is a schematic diagram of a sample for shear peel strength measurement in the present invention.
  • FIG. 3(a) is a plan view of the measurement sample
  • FIG. 3(b) is a cross-sectional view of the measurement sample.
  • 1 is a schematic diagram of an apparatus for measuring warpage during heating in the present invention.
  • the heat-resistant polymer film of the present invention includes polyimide-based resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide resin, alicyclic polyimide resin).
  • polyimide-based resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide resin, alicyclic polyimide resin).
  • Polyolefin resins such as polyethylene and polypropylene; Copolyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene-2,6-naphthalate (e.g., wholly aromatic polyesters and semi-aromatic polyesters); Copolymerization represented by polymethyl methacrylate (meth) acrylate; polycarbonate; polyamide; polysulfone; polyether sulfone; polyether ketone; cellulose acetate; cellulose nitrate; aromatic polyamide; polyvinyl chloride; I can give an example.
  • the heat-resistant polymer film of the present invention preferably contains at least one selected from the group consisting of polyimide, polyamide and polyamideimide, provided that the polymer film is used in a process involving heat treatment at 300°C or higher. Therefore, among the polymer films exemplified above, those that can actually be applied are limited.
  • the polymer films preferred are films using so-called super engineering plastics, and more specifically polyimide resins, polyamide resins, polyamideimide resins, and azole resins.
  • Particularly preferred specific examples include an aromatic polyimide film, an aromatic amide film, an aromatic amideimide film, an aromatic benzoxazole film, an aromatic benzothiazole film, an aromatic benzimidazole film, and the like.
  • a polyimide resin film is prepared by applying a polyamic acid (polyimide precursor) solution obtained by reacting diamines and tetracarboxylic acids in a solvent to a support for producing a polyimide film and drying it to form a green film (hereinafter referred to as (Also referred to as "polyamic acid film”), and a method of obtaining a green film on a support for producing a polyimide film or in a state of being peeled off from the support by high-temperature heat treatment to cause a dehydration ring closure reaction, and polyamic acid.
  • a polyamic acid polyimide precursor
  • the former method which is a method of passing through a green film
  • the polymer film that passes through the green film may be solvent-insoluble polyimide, there is a wide range of monomer selection. Therefore, it is possible to select a composition that easily secures adhesion to the inorganic substrate, and as a result, the shear peel strength to the inorganic substrate can be improved.
  • polyamic acid (polyimide precursor) solution includes, for example, spin coating, doctor blade, applicator, comma coater, screen printing method, slit coating, reverse coating, dip coating, curtain coating, slit die coating, etc.
  • spin coating doctor blade, applicator, comma coater, screen printing method, slit coating, reverse coating, dip coating, curtain coating, slit die coating, etc.
  • application of conventionally known solutions. means can be used as appropriate.
  • the diamines that make up the polyamic acid are not particularly limited, and aromatic diamines, aliphatic diamines, alicyclic diamines, etc. that are commonly used in polyimide synthesis can be used. From the viewpoint of heat resistance, aromatic diamines are preferred. Diamines may be used alone or in combination of two or more.
  • Diamines are not particularly limited, and examples include 4,4'-diaminobenzanilide, 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl, 5-amino-2-(p-aminophenyl ) benzoxazole, 1,3-bis(4-aminophenoxy)benzene, oxydianiline (bis(4-aminophenyl)ether), paraphenylenediamine (1,4-phenylenediamine) and the like.
  • the tetracarboxylic acids constituting the polyamic acid include aromatic tetracarboxylic acids (including their acid anhydrides), aliphatic tetracarboxylic acids (including their acid anhydrides), and alicyclic tetracarboxylic acids, which are commonly used in polyimide synthesis. Acids (including anhydrides thereof) can be used. When these are acid anhydrides, one or two anhydride structures may be present in the molecule, but preferably those having two anhydride structures (dianhydrides) are good. Tetracarboxylic acids may be used alone, or two or more of them may be used in combination.
  • the tetracarboxylic acid is not particularly limited. 3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone and the like.
  • the polyimide film may be a transparent polyimide film.
  • a colorless transparent polyimide which is an example of the polymer film, will be described. In order to avoid complication, it is simply referred to as transparent polyimide.
  • the transparency of the transparent polyimide it is preferable that the total light transmittance is 75% or more. It is more preferably 78% or more, still more preferably 80% or more, still more preferably 82% or more, and particularly preferably 84% or more.
  • the upper limit of the total light transmittance of the transparent polyimide is not particularly limited, it is preferably 98% or less, more preferably 97% or less for use as a flexible electronic device.
  • the colorless transparent polyimide in the present invention is preferably polyimide having a total light transmittance of 75% or more.
  • the method for measuring the total light transmittance of the polymer film is according to the method described in Examples.
  • Aromatic tetracarboxylic acids for obtaining highly colorless and transparent polyimide include 4,4′-(2,2-hexafluoroisopropylidene)diphthalic acid, 4,4′-oxydiphthalic acid, bis(1,3- dioxo-1,3-dihydro-2-benzofuran-5-carboxylic acid) 1,4-phenylene, bis(1,3-dioxo-1,3-dihydro-2-benzofuran-5-yl)benzene-1,4 -dicarboxylate, 4,4'-[4,4'-(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(benzene-1,4-diyloxy)]dibenzene- 1,2-dicarboxylic acid, 3,3′,4,4′-benzophenonetetracarboxylic acid, 4,4′-[(3-oxo-1,3-dihydro-2-benzo
  • Aromatic tetracarboxylic acids may be used alone, or two or more of them may be used in combination.
  • the amount of aromatic tetracarboxylic acids to be copolymerized is, for example, preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass of the total tetracarboxylic acids when heat resistance is emphasized. More preferably, it is 80% by mass or more, particularly preferably 90% by mass or more, and may be 100% by mass.
  • Alicyclic tetracarboxylic acids include 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, 1,2,3,4-cyclohexanetetracarboxylic acid, 1 , 2,4,5-cyclohexanetetracarboxylic acid, 3,3′,4,4′-bicyclohexyltetracarboxylic acid, bicyclo[2,2,1]heptane-2,3,5,6-tetracarboxylic acid, Bicyclo[2,2,2]octane-2,3,5,6-tetracarboxylic acid, bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic acid, tetrahydroanthracene -2,3,6,7-tetracarboxylic acid, tetradecahydro-1,4:5,8:9,10-trimethanoanthracene-2,3,
  • dianhydrides having two acid anhydride structures are preferred, particularly 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic acid Acid dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride is preferred, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic An acid dianhydride is more preferred, and 1,2,3,4-cyclobutanetetracarboxylic acid dianhydride is even more preferred. In addition, these may be used independently and may use 2 or more types together.
  • the amount of alicyclic tetracarboxylic acids to be copolymerized is, for example, preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass of the total tetracarboxylic acids when importance is placed on transparency. % or more, more preferably 80% by mass or more, particularly preferably 90% by mass or more, and may be 100% by mass.
  • Tricarboxylic acids include aromatic tricarboxylic acids such as trimellitic acid, 1,2,5-naphthalenetricarboxylic acid, diphenylether-3,3′,4′-tricarboxylic acid, and diphenylsulfone-3,3′,4′-tricarboxylic acid.
  • acids or hydrogenated products of the above aromatic tricarboxylic acids such as hexahydrotrimellitic acid; Glycol bistrimellitate, and their monoanhydrides and esters.
  • monoanhydrides having one acid anhydride structure are preferred, and trimellitic anhydride and hexahydrotrimellitic anhydride are particularly preferred. In addition, these may be used individually and may be used in combination.
  • Dicarboxylic acids include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, naphthalenedicarboxylic acid, 4,4'-oxydibenzenecarboxylic acid, or the above aromatic dicarboxylic acids such as 1,6-cyclohexanedicarboxylic acid.
  • aromatic dicarboxylic acids and hydrogenated products thereof are preferred, and terephthalic acid, 1,6-cyclohexanedicarboxylic acid, and 4,4'-oxydibenzenecarboxylic acid are particularly preferred.
  • dicarboxylic acids may be used alone or in combination.
  • Diamines or isocyanates for obtaining highly colorless and transparent polyimides are not particularly limited, and polyimide synthesis, polyamideimide synthesis, aromatic diamines, aliphatic diamines, and alicyclic diamines commonly used in polyamide synthesis. , aromatic diisocyanates, aliphatic diisocyanates, alicyclic diisocyanates, and the like can be used. From the viewpoint of heat resistance, aromatic diamines are preferred, and from the viewpoint of transparency, alicyclic diamines are preferred. In addition, the use of aromatic diamines having a benzoxazole structure makes it possible to exhibit high heat resistance, high elastic modulus, low thermal shrinkage, and low coefficient of linear expansion. Diamines and isocyanates may be used alone or in combination of two or more.
  • aromatic diamines examples include 2,2′-dimethyl-4,4′-diaminobiphenyl, 1,4-bis[2-(4-aminophenyl)-2-propyl]benzene, 1,4-bis (4-amino-2-trifluoromethylphenoxy)benzene, 2,2′-ditrifluoromethyl-4,4′-diaminobiphenyl, 4,4′-bis(4-aminophenoxy)biphenyl, 4,4′- Bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl]ketone, bis[4-(3-aminophenoxy)phenyl]sulfide, bis[4-(3-aminophenoxy)phenyl]sulfone , 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,
  • some or all of the hydrogen atoms on the aromatic ring of the aromatic diamine may be substituted with a halogen atom, an alkyl or alkoxyl group having 1 to 3 carbon atoms, or a cyano group, and Some or all of the hydrogen atoms in the alkyl or alkoxyl groups of 1 to 3 may be substituted with halogen atoms.
  • aromatic diamines having a benzoxazole structure are not particularly limited, and examples thereof include 5-amino-2-(p-aminophenyl)benzoxazole, 6-amino-2-(p-aminophenyl)benzoxazole, oxazole, 5-amino-2-(m-aminophenyl)benzoxazole, 6-amino-2-(m-aminophenyl)benzoxazole, 2,2′-p-phenylenebis(5-aminobenzoxazole), 2 , 2′-p-phenylenebis(6-aminobenzoxazole), 1-(5-aminobenzoxazolo)-4-(6-aminobenzoxazolo)benzene, 2,6-(4,4′-diamino diphenyl)benzo[1,2-d:5,4-d']bisoxazole, 2,6-(4,4'-diaminodiphenyl)benzo
  • aromatic diamines may be used singly or in combination.
  • Alicyclic diamines include, for example, 1,4-diaminocyclohexane, 1,4-diamino-2-methylcyclohexane, 1,4-diamino-2-ethylcyclohexane, 1,4-diamino-2-n-propyl cyclohexane, 1,4-diamino-2-isopropylcyclohexane, 1,4-diamino-2-n-butylcyclohexane, 1,4-diamino-2-isobutylcyclohexane, 1,4-diamino-2-sec-butylcyclohexane, 1,4-diamino-2-tert-butylcyclohexane, 4,4'-methylenebis(2,6-dimethylcyclohexylamine) and the like.
  • 1,4-diaminocyclohexane and 1,4-diamino-2-methylcyclohexane are particularly preferred, and 1,4-diaminocyclohexane is more preferred.
  • the alicyclic diamines may be used alone or in combination.
  • Diisocyanates include, for example, diphenylmethane-2,4'-diisocyanate, 3,2'- or 3,3'- or 4,2'- or 4,3'- or 5,2'- or 5,3' - or 6,2'- or 6,3'-dimethyldiphenylmethane-2,4'-diisocyanate, 3,2'- or 3,3'- or 4,2'- or 4,3'- or 5,2 '- or 5,3'- or 6,2'- or 6,3'-diethyldiphenylmethane-2,4'-diisocyanate, 3,2'- or 3,3'- or 4,2'- or 4, 3'- or 5,2'- or 5,3'- or 6,2'- or 6,3'-dimethoxydiphenylmethane-2,4'-diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-3, 3'-diisocyanate,
  • Diisocyanates may be used alone or in combination.
  • the polymer film is preferably a polyimide film.
  • the polymer film is a polyimide film, it has excellent heat resistance.
  • the polymer film is a polyimide film, it can be suitably cut with an ultraviolet laser.
  • the thickness of the polymer film is preferably 3 ⁇ m or more, more preferably 7 ⁇ m or more, still more preferably 14 ⁇ m or more, and still more preferably 20 ⁇ m or more.
  • the upper limit of the thickness of the polymer film is not particularly limited, it is preferably 250 ⁇ m or less, more preferably 100 ⁇ m or less, and still more preferably 50 ⁇ m or less for use as a flexible electronic device.
  • the average coefficient of linear expansion (CTE) of the polymer film between 30°C and 250°C is preferably 30 ppm/K or less. It is more preferably 28 ppm/K or less, still more preferably 25 ppm/K or less, and even more preferably 20 ppm/K or less. Moreover, it is preferably -5 ppm/K or more, more preferably -3 ppm/K or more, and still more preferably 1 ppm/K or more.
  • CTE is a factor representing reversible expansion and contraction with respect to temperature.
  • the CTE of the polymer film refers to the average value of the CTE in the coating direction (MD direction) and the CTE in the width direction (TD direction) of the polymer solution or polymer precursor solution.
  • the method for measuring the CTE of the polymer film is according to the method described in Examples.
  • the CTE difference between the polymer film and the inorganic substrate is preferably 27 ppm/K or less, more preferably 25 ppm/K or less, and even more preferably 17 ppm/K or less.
  • yellowness index When the polymer film is a transparent polyimide film, its yellowness index (hereinafter also referred to as “yellow index” or “YI”) is preferably 13 or less, more preferably 12 or less, and still more preferably 11. It is below.
  • the lower limit of the yellowness index of the transparent polyimide is not particularly limited, it is preferably 0.1 or more, more preferably 0.2 or more, and still more preferably 0.3 or more for use as a flexible electronic device. is.
  • the haze is preferably 1.0 or less, more preferably 0.8 or less, still more preferably 0.5 or less, and still more preferably 0.3 or less.
  • the lower limit is not particularly limited, industrially, there is no problem if it is 0.01 or more, and it may be 0.05 or more.
  • the heat shrinkage rate of the polymer film between 30° C. and 500° C. is preferably ⁇ 0.9% or less, more preferably ⁇ 0.6%, and still more preferably ⁇ 0.2% or less. is.
  • Thermal shrinkage is a factor representing irreversible expansion and contraction with respect to temperature.
  • the method for measuring the heat shrinkage of the polymer film is according to the method described in Examples.
  • the tensile breaking strength of the polymer film is preferably 60 MPa or more, more preferably 80 MPa or more, and still more preferably 100 MPa or more. Although the upper limit of the tensile strength at break is not particularly limited, it is practically less than about 1000 MPa. When the tensile strength at break is 60 MPa or more, it is possible to prevent the polymer film from breaking when peeled from the inorganic substrate.
  • the tensile strength at break of the polymer film refers to the average value of the tensile strength at break in the machine direction (MD direction) and the tensile strength at break in the width direction (TD direction) of the polymer film.
  • the tensile elongation at break of the polymer film is preferably 1% or more, more preferably 5% or more, and still more preferably 10% or more. When the tensile elongation at break is 1% or more, the handleability is excellent.
  • the tensile elongation at break of the polymer film refers to the average value of the tensile elongation at break in the machine direction (MD direction) and the tensile elongation at break in the width direction (TD direction) of the polymer film.
  • the tensile modulus of the polymer film must be 4 GPa or more. It is preferably 4.5 GPa or more, more preferably 5 GPa or more. When the tensile elastic modulus is 4 GPa or more, the polymer film undergoes little elongation deformation when peeled from the inorganic substrate, and is excellent in handleability.
  • the tensile elastic modulus should be 9 GPa or less. It is preferably 8.5 GPa or less, more preferably 8 GPa or less. When the tensile modulus is 9 GPa or less, the polymer film can be used as a flexible film.
  • the method for measuring the tensile modulus of the polymer film is according to the method described in Examples.
  • the storage elastic modulus of the polymer film at 280°C is preferably 9 GPa or less. It is more preferably 8 GPa or less, still more preferably 7 GPa or less. When the storage elastic modulus at 280° C. is 9 GPa or less, the force of the polymer film to deform the inorganic substrate is small, so the warpage of the laminate caused by the polymer film undergoing dimensional changes due to thermal shrinkage and CTE at high temperatures is reduced.
  • the storage elastic modulus of the polymer film at 280° C. is preferably 2.5 GPa or more, more preferably 3 GPa or more, and still more preferably 4 GPa or more.
  • the tensile elastic modulus and storage elastic modulus of the polymer film refer to the average value of the tensile elastic modulus in the machine direction (MD direction) and the tensile elastic modulus in the width direction (TD direction) of the polymer film.
  • the methods for measuring the tensile modulus and storage modulus of the polymer film are according to the methods described in Examples.
  • the thickness unevenness of the polymer film is preferably 20% or less, more preferably 12% or less, still more preferably 7% or less, and particularly preferably 4% or less. If the thickness unevenness exceeds 20%, it tends to be difficult to apply to narrow areas.
  • the polymer film is preferably obtained in the form of being wound up as a long polymer film with a width of 300 mm or more and a length of 10 m or more at the time of production. More preferred are those in the form of molecular films. When the polymer film is wound into a roll, it can be easily transported in the form of a rolled polymer film.
  • the polymer film preferably contains a lubricant.
  • the lubricant is not particularly limited, inorganic particles are preferable, and silica is more preferable.
  • the particle size of the lubricant is preferably 1 nm or more, more preferably 5 nm or more, still more preferably 10 nm or more, and preferably 1000 nm or less, more preferably 100 nm or less, and still more preferably 50 nm or less. is.
  • the content of the lubricant is preferably 0.01% by mass or more in the polymer film (or with respect to the total polymer solid content in the polyamic acid solution). It is more preferably 0.05% by mass or more, and still more preferably 0.1% by mass or more. Also, it is preferably less than 1% by mass, more preferably 0.8% by mass or less, and even more preferably 0.5% by mass or less.
  • the inorganic substrate may be a plate-shaped substrate that can be used as a substrate made of an inorganic substance.
  • semiconductor wafers, and metal composites include laminates of these, those in which these are dispersed, and those in which these fibers are contained.
  • the glass plate examples include quartz glass, high silicate glass (96% silica), soda lime glass, lead glass, aluminoborosilicate glass, borosilicate glass (Pyrex (registered trademark)), borosilicate glass (no alkali), Borosilicate glass (microsheet), aluminosilicate glass, etc. are included. Among these, those having a coefficient of linear expansion of 5 ppm/K or less are desirable. "EAGLE”, "AN100” manufactured by Asahi Glass Co., Ltd., “OA10, OA11G” manufactured by Nippon Electric Glass Co., Ltd., and "AF32” manufactured by SCHOTT are desirable.
  • the semiconductor wafer examples include, but are not limited to, silicon wafer, germanium, silicon-germanium, gallium-arsenide, aluminum-gallium-indium, nitrogen-phosphorus-arsenic-antimony, SiC, InP (indium phosphide), InGaAs, GaInNAs, Wafers of LT, LN, ZnO (zinc oxide), CdTe (cadmium telluride), ZnSe (zinc selenide), and the like can be mentioned.
  • the wafer preferably used is a silicon wafer, and particularly preferably a mirror-polished silicon wafer having a size of 8 inches or more.
  • the metals include single element metals such as W, Mo, Pt, Fe, Ni, and Au, and alloys such as Inconel, Monel, Nimonic, carbon copper, Fe—Ni system Invar alloys, and Super Invar alloys.
  • multi-layer metal plates obtained by adding other metal layers and ceramic layers are also included. In this case, if the overall coefficient of linear expansion (CTE) with the additional layer is low, Cu, Al, etc. may also be used for the main metal layer.
  • the metal used for the additional metal layer is limited as long as it has properties such as strong adhesion to the transparent heat-resistant polymer film, no diffusion, good chemical resistance and heat resistance. Suitable examples include Cr, Ni, TiN, Mo-containing Cu, and the like, although they are not used.
  • the ceramic plate in the present invention includes Al2O3 , Mullite, ALN, SiC, crystallized glass, Cordierite, Spodumene, Pb-BSG+ CaZrO3 + Al2O3 , Crystallized glass + Al2O3 , Crystallized Ca-BSG, BSG+Quartz, and BSG+Al. 2 O 3 , Pb-BSG+Al 2 O 3 , Glass-ceramic, Zerodur materials and other substrate ceramics.
  • the planar portion of the inorganic substrate be sufficiently flat.
  • the PV value of the surface roughness is preferably 50 nm or less, more preferably 20 nm or less, and even more preferably 5 nm or less.
  • the adhesiveness to the polymer film is enhanced, and thus the shear peel strength to the polymer film can be improved.
  • the lower limit is not particularly limited, it may be industrially 0.1 nm or more, and may be 1 nm or more.
  • the thickness of the inorganic substrate is not particularly limited, the thickness is preferably 10 mm or less, more preferably 3 mm or less, and even more preferably 1.3 mm or less from the viewpoint of handleability.
  • the lower limit of the thickness is not particularly limited, it is preferably 0.07 mm or more, more preferably 0.15 mm or more, and still more preferably 0.3 mm or more. If it is too thin, it may be easily damaged and difficult to handle. On the other hand, if it is too thick, it may become heavy and difficult to handle.
  • the tensile elastic modulus of the inorganic substrate is preferably 50 GPa or more, more preferably 60 GPa or more, and still more preferably 65 GPa or more. Also, the upper limit of the tensile modulus is 80 GPa, more preferably 78 GPa or less. When the tensile modulus of elasticity of the inorganic substrate is within the above range, the handleability is excellent.
  • the laminate of the present invention is obtained by laminating the heat-resistant polymer film and the inorganic substrate without substantially using an adhesive.
  • the heat-resistant polymer film has a laminated structure of two or more layers, the heat-resistant polymer film in contact with the inorganic substrate and the heat-resistant polymer film adjacent to the transparent heat-resistant polymer film layer without contacting the inorganic substrate. It preferably contains a layer.
  • the shear peel strength between the heat-resistant polymer film and the inorganic substrate must be 0.8 MPa or more. It is preferably 0.9 MPa or more, and more preferably 1 MPa or more, because it can easily suppress peeling of the inorganic substrate and the heat-resistant polymer film during mechanical handling.
  • the upper limit of the shear peel strength is not particularly limited, but 10 MPa or less is sufficient, and 5 MPa or less is acceptable. It is preferable to select the heat-resistant polymer film and the inorganic substrate so that the shear peel strength is within the above range.
  • the shape of the laminate is not particularly limited, and may be square or rectangular. It is preferably rectangular with a long side length of 300 mm or more, more preferably 500 mm or more, and still more preferably 1000 mm or more. Although the upper limit is not particularly limited, industrially, 20,000 mm or less is sufficient, and 10,000 mm or less is acceptable.
  • the size of the laminate is preferably such that when the inorganic substrate is rectangular, the diameter of the circumscribed circle is 500 mm or more.
  • an inorganic substrate of this size it is possible to sufficiently obtain the effect of improving the handleability of the laminate, which is the effect of the present invention. It is more preferably 520 mm or more, and still more preferably 550 mm or more.
  • the upper limit is not particularly limited, industrially, 1000 mm or less is sufficient, and 800 mm or less is acceptable.
  • the warpage of the laminate of the heat-resistant polymer film and the inorganic substrate is 300 ⁇ m or less when heated at 280° C. for 1 hour.
  • the laminate has a warp of 300 ⁇ m or less when heated at 280° C. for 1 hour, that is, after the high-temperature process, it is possible to avoid cracks in the coating applied to the surface of the laminate, functional layers, and misalignment in the apparatus. .
  • the adhesive layer as used in the present invention means a layer containing less than 10% (less than 10% by mass) of Si (silicon) component by mass.
  • the phrase “substantially not used (not interposed)” means that the thickness of the adhesive layer interposed between the inorganic substrate and the transparent heat-resistant polymer film is preferably 0.4 ⁇ m or less, more preferably 0.4 ⁇ m or less. It is 3 ⁇ m or less, more preferably 0.2 ⁇ m or less, particularly preferably 0.1 ⁇ m or less, and most preferably 0 ⁇ m.
  • Silane coupling agent (SCA)> In the laminate, when a heat-resistant polymer film that has been formed into a film in advance is attached to an inorganic substrate, it is preferable to have a layer of a silane coupling agent between the heat-resistant polymer film and the inorganic substrate.
  • the silane coupling agent refers to a compound containing 10% by mass or more of Si (silicon) component.
  • the silane coupling agent preferably contains a large amount of a silicon oxide component because it improves heat resistance, and particularly preferably has heat resistance at a temperature of about 400°C.
  • the thickness of the silane coupling agent layer is preferably less than 0.2 ⁇ m.
  • the range for use as a flexible electronic device is preferably 100 nm or less (0.1 ⁇ m or less), more preferably 50 nm or less, and even more preferably 10 nm. When normally produced, the thickness is about 0.10 ⁇ m or less. Also, in a process that requires as little silane coupling agent as possible, a thickness of 5 nm or less can be used. If the thickness is less than 1 nm, the peel strength may be lowered or there may be a portion where the adhesive is not adhered, so the thickness is preferably 1 nm or more.
  • silane coupling agent in the present invention is not particularly limited, one having an amino group or an epoxy group is preferred.
  • Specific examples of silane coupling agents include N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(amino ethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, 2- (3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxy
  • the laminate may be produced by applying a polymer precursor or polymer solution onto an inorganic substrate and heating.
  • a polymer precursor or polymer solution onto an inorganic substrate and heating.
  • conditions are applied according to the type of the resin layer. , then:
  • the heat treatment for the imidization reaction it is possible to carry out at a constant temperature. It is preferable from the viewpoint of suppressing deterioration of surface smoothness due to volatilization of the solvent.
  • the minimum temperature is preferably 150 to 190°C, and the maximum temperature is preferably 280 to 450°C.
  • the minimum temperature is more preferably 180-190°C, and the maximum temperature is more preferably 290-450°C.
  • the temperature is constant, it is preferably 200 to 370°C, more preferably 210 to 350°C. It is also possible to continuously raise the temperature from the drying temperature of the applied solution.
  • the total time for heat treatment after drying is preferably 5 to 100 minutes, more preferably 10 to 50 minutes.
  • the adhesive strength between the heat-resistant polymer film and the inorganic substrate is preferably 0.3 N/cm or less. This makes it very easy to separate the heat-resistant polymer film from the inorganic substrate after the device is formed on the heat-resistant polymer film. Therefore, it is possible to manufacture a device connection body that can be mass-produced, thereby facilitating the manufacture of flexible electronic devices.
  • the adhesive strength is preferably 0.25 N/cm or less, more preferably 0.2 N/cm or less, still more preferably 0.15 N/cm or less, and particularly preferably 0.1 N/cm or less. is. Moreover, it is preferable that it is 0.01 N/cm or more.
  • the adhesive strength is the value of the laminate (initial adhesive strength) after heat treatment at 100° C. for 10 minutes in an air atmosphere after bonding the heat-resistant polymer film and the inorganic substrate together. Further, it is preferable that the laminate after the initial adhesion strength measurement is further heat treated at 200° C. for 1 hour in a nitrogen atmosphere has an adhesion strength within the above range (adhesion strength after heat treatment at 200° C.).
  • the laminate of the present invention can be produced, for example, by the following procedure.
  • a laminate can be obtained by treating at least one surface of an inorganic substrate with a silane coupling agent in advance, superimposing the surface treated with the silane coupling agent and a heat-resistant polymer film, and laminating the two by applying pressure.
  • a laminate can also be obtained by treating at least one surface of a heat-resistant polymer film with a silane coupling agent in advance, superimposing the surface treated with the silane coupling agent on an inorganic substrate, and laminating the two by applying pressure.
  • Examples of pressurizing methods include ordinary press or lamination in the atmosphere and press or lamination in a vacuum. 200 mm), lamination in air is preferred.
  • a preferable pressure is 1 MPa to 20 MPa, more preferably 3 MPa to 10 MPa. If the pressure is high, the substrate may be damaged, and if the pressure is low, some parts may not adhere.
  • the preferred temperature is 90° C. to 300° C., more preferably 100° C. to 250° C. If the temperature is high, the film may be damaged, and if the temperature is low, adhesion may be weak.
  • a flexible electronic device By using the laminate, a flexible electronic device can be easily manufactured using existing equipment and processes for manufacturing electronic devices. Specifically, a flexible electronic device can be produced by forming an electronic element or wiring (electronic device) on a heat-resistant polymer film of a laminate, and peeling the heat-resistant polymer film together from the laminate.
  • the electronic device means an electronic circuit including a wiring board having a single-sided, double-sided, or multilayer structure responsible for electrical wiring, active elements such as transistors and diodes, and passive devices such as resistors, capacitors, inductors, etc.
  • Sensor elements that sense pressure, temperature, light, humidity, etc., biosensor elements, light emitting elements, liquid crystal displays, electrophoretic displays, image display elements such as self-luminous displays, wireless and wired communication elements, computing elements, memory elements, Refers to MEMS elements, solar cells, thin film transistors, and the like.
  • the heat-resistant polymer film is peeled off from the inorganic substrate.
  • BPDA 3,3',4,4'-biphenyltetracarboxylic dianhydride
  • PMDA Pyromellitic dianhydride
  • TFMB 4,4'-diamino-2,2'-bis(trifluoromethyl ) biphenyl
  • TFMB N,N-dimethylacetamide
  • Polyamic acid solution A5 was obtained by stirring polyamic acid solution A3 and polyamic acid solution A4 at a volume ratio of 90:10 at 25° C. for 24 hours.
  • a polyimide acid solution A6 was obtained in the same manner as the polyamic acid solution A5 except that the volume ratio was changed to 75:25.
  • ⁇ Preparation of polyamic acid solution A9> After purging the inside of a reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod with nitrogen, 22.0 parts by mass of 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (TFMB), 252.1 parts by mass of N,N-dimethylacetamide (DMAc) and a dispersion obtained by dispersing colloidal silica as a lubricant in dimethylacetamide ("Snowtex (registered trademark) DMAC-ST-ZL" manufactured by Nissan Chemical Industries); was added so that the silica (lubricant) was 0.2% by mass based on the total polymer solid content in the polyamic acid solution) and completely dissolved, and then 22.0 parts by mass of 3,3',4,4' -Biphenyltetracarboxylic acid dianhydride (BPDA) was added portionwise as a solid, and then stirred at room temperature for 24 hours
  • a dispersion obtained by dispersing colloidal silica in dimethylacetamide as a lubricant (“Snowtex (registered trademark) DMAC-ST-ZL” manufactured by Nissan Chemical Industries) and silica (lubricant) are the final polymers in the polyamic acid solution. 3% by mass based on the total solid content), and stirred for 4 hours. 28.8 parts by mass of 4,4′-diamino-2,2′-bis(trifluoromethyl)biphenyl (TFMB) was added thereto, and after stirring, 4,4′-(hexafluoroisopropylidene)diphthalic acid was added. 42.0 parts by mass of anhydride (6FDA) was gradually added in several portions so that the temperature rise was 2° C. or less to obtain a polyamic acid solution A10 having a solid content (NV) of about 20% by mass.
  • NV solid content
  • ODPA 4,4′-oxydiphthalic anhydride
  • GBL gamma-butyrolactone
  • Polyamic acid solution A1 was coated on the non-lubricating side of polyethylene terephthalate film A4100 (support manufactured by Toyobo Co., Ltd.) using a comma coater so as to have a final film thickness of 25 ⁇ m.
  • the polyethylene terephthalate A4100 film was passed through a hot air oven and wound up, at which time it was dried at 100° C. for 10 minutes.
  • the polyamic acid film (green film) that has acquired self-supporting properties is peeled off from the support, passed through a pin tenter having a pin sheet with pins arranged, and gripped by inserting the ends of the film into the pins so that the film does not break. and conveyed by adjusting the interval between the pin sheets so that unnecessary slack does not occur, and heated under the conditions of 200°C for 3 minutes, 250°C for 3 minutes, 400°C for 3 minutes, and 450°C for 3 minutes. to allow the imidization reaction to proceed.
  • the film was cooled to room temperature for 2 minutes, and portions of the film with poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain 500 m of heat-resistant polymer film F1 with a width of 450 mm.
  • a heat-resistant polymer film F2 was obtained in the same manner as the heat-resistant polymer film F1 except that the polyamic acid solution A2 was used instead of the polyamic acid solution A1.
  • a heat-resistant polymer film F3 was obtained in the same manner as the heat-resistant polymer film F2, except that the final film thickness was 15 ⁇ m.
  • a heat-resistant polymer film F6 was obtained in the same manner as the heat-resistant polymer film F5, except that the polyamic acid solution A6 was used instead of the polyamic acid solution A5.
  • Polyimide solution B1 was coated on the non-lubricating surface of polyethylene terephthalate film A4100 (manufactured by Toyobo Co., Ltd.) using a comma coater so that the final film thickness was adjusted to 25 ⁇ m.
  • the polyethylene terephthalate A4100 film was passed through a hot air oven and wound up, at which time it was dried at 100° C. for 10 minutes.
  • the polyamic acid film that has acquired self-supporting properties is peeled off from the support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the ends of the film into the pins so that the film does not break, and The sheet was transported while adjusting the distance between the pin sheets so as not to cause unnecessary slack, and heated under the conditions of 200° C. for 3 minutes, 250° C. for 3 minutes, and 300° C. for 6 minutes to volatilize the solvent.
  • the film was cooled to room temperature for 2 minutes, and portions of the film with poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain 500 m of polyimide film B1 with a width of 450 mm.
  • a heat-resistant polymer film F9 was prepared in the same manner as the heat-resistant polymer film F1, except that the polyamic acid solution A7 was used instead of the polyamic acid solution A1.
  • a heat-resistant polymer film F10 was produced in the same manner as the heat-resistant polymer film F8, except that the polyamic acid solution A8 was used instead of the polyimide solution B1.
  • a heat-resistant polymer film F11 was produced in the same manner as the heat-resistant polymer film F8 except that the polyamic acid solution A9 was used instead of the polyimide solution B1.
  • a heat-resistant polymer film F12 was produced in the same manner as the heat-resistant polymer film F8, except that the polyamic acid solution A10 was used instead of the polyimide solution B1.
  • ⁇ Inorganic substrate> A commercially available inorganic substrate was used. OA-10G (manufactured by Nippon Electric Glass Co., Ltd., thickness 0.5 mm, CTE 3 ppm/K, PV value 5 nm)
  • PV value measurement ⁇ Surface roughness of inorganic substrate (PV value measurement)>
  • the PV value of the surface of the inorganic substrate to be bonded to the heat-resistant polymer was measured using E-Sweep (SII-NT). After fixing the inorganic substrate to the sample table, static electricity was removed with a static electricity removal blower, and observation was carried out. A Si-DF20 cantilever was used, and measurements were taken at 10 points in an observation field of view of 5 ⁇ m ⁇ 5 ⁇ m, and the average value was taken as the PV value of the inorganic substrate.
  • ⁇ Thickness measurement of heat-resistant polymer film> The thickness of the heat-resistant polymer film was measured using a macrometer (Millitron 1245D, manufactured by Finereuf). Table 1 shows the results.
  • the heat-resistant polymer film F7 prepared by directly applying the polyamic acid solution to the inorganic substrate and heating, the heat-resistant polymer film F7 was peeled off from the inorganic substrate and the thickness was measured. In the following, the physical properties of the heat-resistant polymer film F7 peeled from the inorganic substrate were similarly measured.
  • Test pieces were obtained by cutting the heat-resistant polymer films F1 to F12 into strips of 100 mm ⁇ 10 mm in the machine direction (MD direction) and the width direction (TD direction). Using a tensile tester (manufactured by Shimadzu Corporation, Autograph model name AG-5000A), the tensile modulus was measured in each of the MD and TD directions under the conditions of a tensile speed of 50 mm/min and a distance between chucks of 40 mm. Table 1 shows the results.
  • ⁇ Storage modulus of heat-resistant polymer film at 280°C> Q800 manufactured by TA Instruments Co., Ltd. was used to measure the storage modulus of the laminate. Measurement was performed at 30°C to 400°C at an initial load of 0.02N, a frequency of 10Hz, a sample width of 5mm, a chuck distance of 20mm, and a rate of 5°C/min to measure the storage modulus at 280°C.
  • ⁇ Heat shrinkage rate of heat-resistant polymer film> A strip-shaped sample of 15 ⁇ 20 cm was cut out from a position 10 cm from the L edge of the heat-resistant polymer film, and 10 cm from the center and R edge. This strip was subjected to humidity conditioning at 23° C. and 50% RH for 24 hours, and then marked at intervals of 10 cm. After that, the film was heated at 250° C. for 1 hour, and after humidity conditioning at 23° C. and 50% RH for 24 hours, the thermal shrinkage rate was measured by measuring the distance between marks.
  • the heat-resistant polymer film F7 a strip-shaped sample of 15 ⁇ 20 cm was cut out from the center of the film.
  • CTE Linear expansion coefficient of heat-resistant polymer film
  • the heat-resistant polymer films (polyimide films) F1 to F12 were measured for expansion ratio under the following conditions in the machine direction (MD direction) and the width direction (TD direction).
  • the expansion/contraction rate/temperature was measured at intervals of 15° C. as above, and this measurement was performed up to 300° C., and the average value of all measured values was calculated as CTE.
  • Table 1 shows the results.
  • Total light transmittance The total light transmittance (TT) of the heat-resistant polymer film was measured using a Hazemeter (NDH5000, manufactured by Nippon Denshoku Co., Ltd.). A D65 lamp was used as the light source. In addition, the same measurement was performed 3 times and the arithmetic mean value was adopted. Table 1 shows the results.
  • FIG. 1 is a schematic diagram of an apparatus for applying a silane coupling agent to an inorganic substrate S1.
  • a 370 mm ⁇ 470 mm size inorganic substrate was used.
  • the inorganic substrate used was washed with pure water, dried, irradiated with a UV/O3 irradiator (SKR1102N-03 manufactured by LAN Technical Co., Ltd.) for 1 minute, and dried.
  • UV/O3 irradiator Srradiated with a UV/O3 irradiator
  • KBM903 was placed in a 1 L chemical solution tank, and the water bath outside was heated to 43°C. The emerging vapors were then sent into the chamber along with clean dry air.
  • the gas flow rate was 25 L/min, and the substrate temperature was 24.degree.
  • the clean dry air had a temperature of 23° C. and a humidity of 1.2% RH. Since the exhaust was connected to a negative pressure exhaust port, it was confirmed by a differential pressure gauge that the chamber had a negative pressure of about 10 Pa.
  • a heat-resistant polymer film F1 (360 mm x 460 mm size) was laminated on the silane coupling agent layer to obtain a laminate.
  • a laminator manufactured by MCK was used for lamination, and the lamination conditions were compressed air pressure: 0.6 MPa, temperature: 22° C., humidity: 55% RH, and lamination speed: 50 mm/sec.
  • This laminate was heated at 110° C. for 10 minutes to obtain an inorganic substrate/heat-resistant polymer film laminate. Table 1 shows the results. Since the heat-resistant polymer film F1 was colored, the total light transmittance was not measured.
  • Examples 2 to 6, 8, 9, Comparative Examples 1 to 3 The same operation as in Example 1 was performed by changing the combination of the inorganic substrate and the heat-resistant polymer film. Table 1 shows the combinations. The results are shown in Table 1. Since the heat-resistant polymer films F4 to F6 were colored, the total light transmittance was not measured.
  • Example 7 Polyamic acid solution A1 was cast on an inorganic substrate of 370 mm ⁇ 470 mm with a bar coater to a dry thickness of 25 ⁇ m, and dried in a hot air oven at 90° C. for 1 hour. Thereafter, the temperature was gradually increased to 400° C. at a rate of 5° C./min, and imidization was performed by further heating for 10 min to obtain an inorganic substrate/heat-resistant polymer film laminate having a thickness of about 25 ⁇ m. Table 1 shows the results. Since the heat-resistant polymer film F7 was colored, the total light transmittance was not measured.
  • the 90° peel strength between the inorganic substrate and the heat-resistant polymer film was measured.
  • the measurement conditions for the 90° initial peel strength are as follows. The film is peeled off at an angle of 90° to the inorganic substrate. Measurement is performed 5 times, and the average value is taken as the measured value. Measuring device; Autograph AG-IS manufactured by Shimadzu Corporation Measurement temperature; room temperature (25°C) Peeling speed; 100mm/min Atmosphere; atmospheric measurement sample width; 2.5 cm

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