WO2023280681A1 - Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte - Google Patents
Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte Download PDFInfo
- Publication number
- WO2023280681A1 WO2023280681A1 PCT/EP2022/068138 EP2022068138W WO2023280681A1 WO 2023280681 A1 WO2023280681 A1 WO 2023280681A1 EP 2022068138 W EP2022068138 W EP 2022068138W WO 2023280681 A1 WO2023280681 A1 WO 2023280681A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- layers
- printed circuit
- conductor
- resin
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims abstract description 70
- 239000011521 glass Substances 0.000 claims abstract description 61
- 239000004753 textile Substances 0.000 claims abstract description 54
- 239000011347 resin Substances 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000003365 glass fiber Substances 0.000 claims description 13
- 239000004744 fabric Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 71
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 239000000306 component Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 239000003518 caustics Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
- B29C70/44—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using isostatic pressure, e.g. pressure difference-moulding, vacuum bag-moulding, autoclave-moulding or expanding rubber-moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Definitions
- the present invention relates to a printed circuit board for a vehicle control unit and a method for producing a printed circuit board for a vehicle control unit.
- the present invention is described below mainly in connection with printed circuit boards for vehicle control units.
- An electrical circuit can be built on a printed circuit board.
- Flame-retardant printed circuit boards can be used in vehicles in particular.
- Flame retardant printed circuit boards can be multi-layer laminates made of glass fiber reinforced plastic and conductor tracks.
- the printed circuit boards can be built up in layers on a central core.
- the core can be an inexpensive standard component used millions of times.
- the core In normal situations, the core can have perfectly adequate properties. When used in the vehicle, however, situations or environmental conditions can prevail that can lead to core component defects due to migration effects.
- An improvement can in this case, for example, an improved service life, in particular a higher insensitivity to migration effects.
- copper ions Under the influence of moisture and/or through electrocorrosion, copper ions can be released from metallic components of an electrical circuit. In the case of high DC voltages in particular, the copper ions can migrate along the glass fibers of a printed circuit board. This migration can be referred to as electromigration and can lead to fault currents in the electrical circuit. This error pattern can be referred to as conductive anodic filament (CAF). This fault pattern can be observed more frequently in the field of electromobility in particular due to the high electrical voltages of, for example, 400V or more that frequently occur there.
- CAF conductive anodic filament
- Printed circuit boards are built up in layers on a core. In this case, layers with electrically conductive conductor tracks alternate with electrically insulating layers.
- Conventional printed circuit boards use a prefabricated core made of several layers of resin-impregnated glass fabric. The layers are typically 200 micrometers thick and have a resin content of less than 45 percent.
- the core can have a thickness in the range of 600 micrometers, for example.
- the core can have a coarse fiberglass structure. The layered construction can take place on both sides of the core.
- an alternative structure of a printed circuit board is presented.
- an alternative structure of the core of the printed circuit board is presented.
- Finer glass fiber fabrics than before are used in combination with a higher resin content than before. It has been observed that this can reduce the potential or risk of copper ion migration along glass fibers of the glass fiber fabric.
- materials that are already available are used in order to keep additional costs as low as possible, with the materials being processed and/or combined in a skilful manner in order to be able to bring about desired physical properties of the printed circuit board.
- a printed circuit board in particular for a control unit of a vehicle, is presented, the printed circuit board having a core made of at least two layers of resin-impregnated glass textile and two conductor levels of the printed circuit board, the layers of glass textile being arranged between the conductor levels and the conductor levels being arranged on opposite sides of the core, the Layers of glass fabric are each between 50 microns and 150 microns thick and have a resin content of between 58% and 74% by volume and the conductor planes are each between 20 microns and 50 microns thick.
- a method for producing a printed circuit board in particular for a control unit of a vehicle, is presented, with a core of the printed circuit board being laminated from two half-cores, with the half-cores each having at least one layer of resin-impregnated glass textile and a conductor level of the printed circuit board, with the layers of glass textile between the conductor levels and arranging the conductive planes on opposite sides of the core, the layers of glass fabric each being between 50 microns and 150 microns thick and having a resin content of between 58% and 74% by volume, and the conductive planes each being between 20 microns and 50 microns thick.
- a printed circuit board can be a multi-layer structure made up of conductor levels with electrically conductive conductor tracks and electrically insulating intermediate layers arranged in between.
- the printed circuit board can have up to 50 layers, for example.
- the conductor tracks can be made of a copper material, for example.
- the circuit board can have flame retardant properties.
- the intermediate layers can consist of resin-impregnated glass textile.
- the resin can be an epoxy resin, for example.
- the glass textile can be a woven, knitted or crocheted fabric, braid or scrim with oriented glass fibers or filaments.
- the glass textile can also be a non-oriented mat, fleece or felt with non-oriented glass fibers or filaments.
- a core of the printed circuit board can be an electrically insulating intermediate layer arranged centrally in the printed circuit board.
- the core can also consist of resin-impregnated glass textile.
- the conductor levels and the intermediate layers can be built up in layers on both sides of the core.
- the core can form a neutral fiber of the circuit board.
- the core can be a support for building up the intermediate layers and conductor levels.
- the core can have recordings for aligning or centering have in a corresponding tool.
- the intermediate layers can have corresponding recordings. In the tool, for example, the mounts can be attached to pins and thus aligned.
- the layered structure can be referred to as lamination.
- Glass textile can be impregnated with a resin and firmly bonded to other layers by an adhesive effect of the resin.
- a resin content of the laminate can be adjusted by precise dosing of the resin.
- a layer thickness of a layer is determined, among other things, by the fineness of the glass textile.
- finer glass textile with a higher resin content is used, at least for the core, than for the cores of conventional circuit boards.
- the increased resin content results in improved wetting of the glass textile.
- the improved wetting results in an increased adhesive effect of the resin on the glass fibers of the glass textile. This means that the glass fibers cannot be torn out of the resin so quickly during the drilling process.
- Flattened yarns made of many glass fibers or filaments (spread fibers) are particularly advantageous for the glass textile, since a good penetration of the glass textile with the resin can be achieved with flattened yarns.
- a half core can be a precursor that is readily available.
- a half-core consists of at least one layer of resin-impregnated glass textile with a conductor layer on top.
- the half cores can be processed already hardened. Further half-cores can also be used to build up further intermediate layers and conductor levels of the printed circuit board. At least one layer of resin-impregnated glass textile can then be laminated onto an existing inner conductor level and another half-core can be laminated onto the glass textile.
- the core can have at least one further layer of resin-impregnated glass textile.
- the further layer of glass textile can be arranged between the half-cores and laminated with the half-cores.
- the further layer can be arranged in a central plane of the printed circuit board. Additional layers can be used to adjust the mechanical properties of the printed circuit board.
- Glass fibers of the glass textile can have a diameter between 33 microns and 180 microns.
- the glass fibers can be used as single filaments.
- filaments can be woven, warp-knitted, knitted, braided, or felted.
- Such glass textiles can be referred to as monofilament.
- several glass fibers can be combined into a bundle and the bundles woven, warp-knitted, knitted, braided or felted.
- the glass textile can be designed as a glass fabric with a plain weave.
- a plain weave can result in a particularly fine glass textile.
- the core can thus have a high level of flexibility
- the printed circuit board can have at least four conductor levels and at least two intermediate layers.
- An intermediate layer made of at least two further layers of resin-impregnated glass textile can be arranged between two adjacent conductor levels.
- the layers of glass fabric can also each be between 50 microns and 150 microns thick and have a resin content between 58% and 74% by volume.
- At least two layers of resin-impregnated glass textile can be laminated onto the outermost conductor levels as the intermediate layers.
- the layers of glass textile of the intermediate layers can be stacked on the conductor levels and laminated to the conductor levels and to each other.
- the layers can be aligned to each other and to the existing conductor levels.
- the layers can then be pressed under temperature and pressure for lamination.
- the layers of glass textile can be provided as prepregs.
- a prepreg can be a glass textile pre-impregnated with synthetic resin.
- the prepreg can be ready for processing.
- the prepreg may have a predetermined resin content.
- the synthetic resin can be a two-component resin made of resin and hardener. The hardener can already be added to the resin.
- the prepreg can be processed chilled.
- the prepreg can cure under pressure and temperature without additional ingredients.
- the prepreg can also be impregnated with a one-component resin.
- a curing process of the synthetic resin can then be accelerated by the effect of temperature and/or ultraviolet light.
- the prepreg can be easily processed. For example, the prepreg may be dry to the touch during processing.
- the half cores can also be prepregs.
- the conductor levels can be structured after laminating the half-cores. When structuring, the conductor tracks can be formed with a width of 200 ⁇ m and a spacing of 200 ⁇ m, for example. A conductor level can have a height of 24.9 ⁇ m, for example. For example, the conductor tracks can be masked and unmasked metal material can be etched away.
- the conductor levels can be patterned before laminating the next intermediate layers.
- the production of the printed circuit board can be carried out step by step with a fixed sequence of steps.
- FIG. 1 shows a sectional view of a circuit board according to an embodiment.
- the printed circuit board 100 has a core 102, four conductor levels 104 and at least two intermediate layers 106.
- the printed circuit board 100 is shown in a greatly simplified form and can also have a larger number of conductor levels 104 .
- the printed circuit board can have up to 50 conductor levels 104 and 48 intermediate layers 106 .
- Conductor tracks 108 are arranged next to one another in a conductor level 104 .
- Different conductor tracks 108 in the same conductor plane 104 are arranged at a lateral distance from one another and are electrically isolated from one another. Conductor tracks 108 arranged in different conductor planes 104 can cross over. The intermediate layer 106 arranged between them insulates the crossing conductor tracks 108 from one another.
- the individual conductor levels 104 can be connected to one another in an electrically conductive manner by plated-through holes 110 .
- a current flow through the electrically insulating intermediate layers 106 or through the electrically insulating core 102 can be made possible via vias 110 .
- a via 110 penetrates both intermediate layers 106 and the core 102. The via 110 thus connects conductor tracks 108 in all conductor planes 104 to one another. Vias 110 may be placed within holes drilled in circuit board 100, for example. Vias 110 can also be buried within the printed circuit board 100 by being covered by intermediate layers 106 lying further outside.
- the circuit board 100 is a flame-retardant circuit board 100 for a vehicle controller.
- the core 102 has at least two layers 112 of resin-impregnated glass textile.
- Two conductor planes 104 abut the core 102 on opposite surfaces.
- An intermediate layer 106 made of at least two further layers 112 of resin-impregnated glass textile is arranged on the conductor planes 104 in each case.
- An intermediate layer 106 or the core 102 is arranged between each of two conductor planes 104 as insulation.
- the outermost conductor levels 104 are arranged on the outermost intermediate layers 106 .
- the layers 112 of glass textile are each between 50 microns and 150 microns thick.
- the plies 112 have a resin content between 58 percent and 74 percent.
- the conductor planes 104 are each between 20 microns and 50 microns thick.
- a half-core 114 consists of a copper layer 116 on at least one layer 112 of resin-impregnated glass textile.
- the half-cores 114 with the layers 112 of glass textile are placed one on top of the other and laminated under pressure and temperature.
- the copper layer 116 may be patterned after lamination to form the conductive traces 108 .
- the half-cores 114 can already be hardened pre-products.
- the half cores can be wetted with synthetic resin and connected to each other. Likewise, the synthetic resin can be arranged as a film between the half-cores.
- an exposable mask 118 is arranged on the respective outermost conductor level 104 in order to structure the conductor tracks 108 .
- the mask 118 can be exposed selectively. Exposed areas of the mask 118 harden and are then resistant to a caustic. Unexposed areas of the mask 118 are rinsed off.
- the copper layer 116 exposed there is removed by the etchant in order to create gaps between the conductor tracks 108 .
- the exposed areas can then also be removed.
- the next intermediate layer 106 consisting of at least two further layers 112 of resin-impregnated glass textile with a thickness of between 50 micrometers and 150 micrometers and a resin content of between 58 percent and 74 percent is then laminated onto the structured outermost conductor level 104 .
- the next conductor level 104 is then in turn applied as a copper layer 116 to this intermediate layer 106 .
- at least one additional layer 112 of resin-impregnated glass textile is arranged between the half-cores 114 and laminated with the half-cores 114 to form the core 102 .
- the additional layer 112 is also between 50 microns and 150 microns thick and has a resin content between 58 percent and 74 percent.
- the additional layer 112 of resin-impregnated glass fabric can provide the reactive synthetic resin between the half-cores 114 required for lamination. A separate application of resin can then be dispensed with.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Textile Engineering (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280045819.2A CN117581640A (zh) | 2021-07-05 | 2022-06-30 | 用于车辆控制器的印刷电路板和制造该印刷电路板的方法 |
EP22744660.6A EP4367981A1 (de) | 2021-07-05 | 2022-06-30 | Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte |
US18/405,252 US20240188213A1 (en) | 2021-07-05 | 2024-01-05 | Circuit board for a control device of a vehicle, and method for manufacturing of such a circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021117278.0 | 2021-07-05 | ||
DE102021117278.0A DE102021117278B4 (de) | 2021-07-05 | 2021-07-05 | Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US18/405,252 Continuation US20240188213A1 (en) | 2021-07-05 | 2024-01-05 | Circuit board for a control device of a vehicle, and method for manufacturing of such a circuit board |
Publications (1)
Publication Number | Publication Date |
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WO2023280681A1 true WO2023280681A1 (de) | 2023-01-12 |
Family
ID=82656345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2022/068138 WO2023280681A1 (de) | 2021-07-05 | 2022-06-30 | Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte |
Country Status (5)
Country | Link |
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US (1) | US20240188213A1 (de) |
EP (1) | EP4367981A1 (de) |
CN (1) | CN117581640A (de) |
DE (1) | DE102021117278B4 (de) |
WO (1) | WO2023280681A1 (de) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6838400B1 (en) * | 1998-03-23 | 2005-01-04 | International Business Machines Corporation | UV absorbing glass cloth and use thereof |
DE10353035A1 (de) * | 2003-11-13 | 2005-06-23 | Siemens Ag | Mehrlagige Leiterplatte |
JP2012167256A (ja) * | 2011-01-24 | 2012-09-06 | Sumitomo Bakelite Co Ltd | プリプレグ、積層板、プリント配線板及び半導体装置 |
WO2018124169A1 (ja) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5275878A (en) | 1990-02-06 | 1994-01-04 | Matsushita Electric Works, Ltd. | Composite dielectric and printed-circuit use substrate utilizing the same |
EP0749673B1 (de) | 1994-03-08 | 2003-12-10 | Teledyne Technologies Incorporated | Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte |
US6136733A (en) | 1997-06-13 | 2000-10-24 | International Business Machines Corporation | Method for reducing coefficient of thermal expansion in chip attach packages |
GB2427408A (en) | 2004-01-20 | 2006-12-27 | World Properties Inc | Circuit Materials Circuits Multi Layer Circuits And Method Of Manufacture |
US20200270413A1 (en) | 2019-02-27 | 2020-08-27 | Rogers Corporation | Low loss dielectric composite comprising a hydrophobized fused silica |
-
2021
- 2021-07-05 DE DE102021117278.0A patent/DE102021117278B4/de active Active
-
2022
- 2022-06-30 CN CN202280045819.2A patent/CN117581640A/zh active Pending
- 2022-06-30 WO PCT/EP2022/068138 patent/WO2023280681A1/de active Application Filing
- 2022-06-30 EP EP22744660.6A patent/EP4367981A1/de active Pending
-
2024
- 2024-01-05 US US18/405,252 patent/US20240188213A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6838400B1 (en) * | 1998-03-23 | 2005-01-04 | International Business Machines Corporation | UV absorbing glass cloth and use thereof |
DE10353035A1 (de) * | 2003-11-13 | 2005-06-23 | Siemens Ag | Mehrlagige Leiterplatte |
JP2012167256A (ja) * | 2011-01-24 | 2012-09-06 | Sumitomo Bakelite Co Ltd | プリプレグ、積層板、プリント配線板及び半導体装置 |
WO2018124169A1 (ja) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
DE102021117278A1 (de) | 2023-01-05 |
DE102021117278B4 (de) | 2023-05-04 |
EP4367981A1 (de) | 2024-05-15 |
US20240188213A1 (en) | 2024-06-06 |
CN117581640A (zh) | 2024-02-20 |
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