WO2023243104A1 - Alliage de brasage, pièce de jonction, matériau de jonction, pâte à braser, structure de jonction et dispositif de commande - Google Patents

Alliage de brasage, pièce de jonction, matériau de jonction, pâte à braser, structure de jonction et dispositif de commande Download PDF

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Publication number
WO2023243104A1
WO2023243104A1 PCT/JP2022/024426 JP2022024426W WO2023243104A1 WO 2023243104 A1 WO2023243104 A1 WO 2023243104A1 JP 2022024426 W JP2022024426 W JP 2022024426W WO 2023243104 A1 WO2023243104 A1 WO 2023243104A1
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WIPO (PCT)
Prior art keywords
solder alloy
mass
joint
solder
less
Prior art date
Application number
PCT/JP2022/024426
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English (en)
Japanese (ja)
Inventor
貴則 嶋崎
大輔 丸山
元気 越智
正也 新井
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株式会社タムラ製作所
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Priority to PCT/JP2022/024426 priority Critical patent/WO2023243104A1/fr
Priority to JP2022538357A priority patent/JP7148760B1/ja
Publication of WO2023243104A1 publication Critical patent/WO2023243104A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Definitions

  • the present invention relates to a solder alloy, a joint, a joint material, a solder paste, a joint structure, and a control device.
  • Solder alloys are widely known as materials for joining (soldering) materials to be joined (for example, printed wiring boards and electronic components). From the viewpoint of reducing environmental impact, lead-free solder alloys, particularly Sn--Ag--Cu solder alloys, have been widely used in recent years.
  • the melting temperature (in this specification, “melting point” or “liquidus temperature”) of the Sn-Ag-Cu solder alloy is 217°C to 227°C.
  • the melting temperature of the solder alloy used is determined by considering the temperature distribution within the printed wiring board surface based on the difference in heat capacity of the electronic components mounted on the printed wiring board. Heating at +20°C or higher is generally practiced. Therefore, when soldering is performed using a Sn--Ag--Cu based solder alloy, the heating temperature is set at approximately 240°C to 250°C.
  • solder alloy containing Bi and having good ductility for example, Bi is 32% by mass or more and 40% by mass or less, Sb is 0.1% by mass or more and 1.0% by mass or less, and Cu is 0.1% by mass.
  • a lead-free solder alloy (Patent Document 1) containing 0.001 mass% or more and 0.1 mass% or less Ni, with the balance consisting of Sn and unavoidable impurities (Patent Document 1) or , Bi: 35 to 68%, Sb: 0.1 to 2.0%, Ni: 0.01 to 0.10%, and the balance is Sn (Patent Document 2) ) exists.
  • Patent Document 1 discloses that the melting point of the lead-free solder alloy is maintained low, the melting points of the lead-free solder alloys disclosed in the examples all exceed 170°C.
  • the heating temperature during soldering is lowered from 240°C to 250°C, that is, from the heating temperature when using Sn-Ag-Cu solder alloy to 190°C, the soldering material, especially printed wiring boards, etc. It is said that the occurrence of warpage caused by thermal loads in electronic components can be halved.
  • the melting temperature of the solder alloy used is required to be 170°C or lower.
  • solder alloy disclosed in Patent Document 2 has excellent ductility and has a fine alloy structure, so it is said to have excellent shear strength and heat cycle resistance.
  • the solder alloy disclosed in Patent Document 2 does not contain Cu. Therefore, depending on the environment in which the electronic device or control device is used, there is a possibility that the heat cycle resistance of the joint (solder joint) may not be sufficient.
  • an instantaneous and concentrated strong external force may be applied to the materials to be joined or the joint portion due to the electronic device falling to the ground or the like.
  • the types of instantaneous and concentrated strong external forces applied to the joint i.e., tension, compression, shear, bending, and torsion, depend on the position of the joint on the printed circuit board (joint structure), the printed circuit in the electronic device, etc. It varies depending on the position of the substrate and the part of the joint, and multiple types of forces may be applied to the joint at almost the same time.
  • Patent Documents 1 and 2 do not disclose or suggest such resistance of the joint portion (hereinafter referred to as "drop impact resistance" in this specification).
  • An object of the present invention is to solve the above-mentioned problems, and to provide a solder alloy that has a liquidus temperature of 170° C. or lower and can form a joint having heat cycle resistance and drop impact resistance. be.
  • the solder alloy of the present invention contains Bi of 45% by mass or more and 63% by mass or less, Sb of 0.1% by mass or more and 1% by mass or less, and Cu of 0.05% by mass or more and 1% by mass or less, It contains a total of 0.001% by mass or more and 0.1% by mass or less of one or more selected from Ni and Co, the remainder being Sn and unavoidable impurities, and the liquidus temperature is 170° C. or less.
  • the solder alloy of the present invention can further contain Fe in an amount of 0.001% by mass or more and 0.05% by mass or less.
  • the solder alloy of the present invention further contains at least 0.001% by mass or more of one or more selected from P, Ga, and Ge in a total of 0.001% by mass or more. 0.05% by mass or less.
  • the solder alloy of the present invention further contains one or more selected from Mn, Ti, Al, Cr, V, and Mo.
  • the total content can be 0.001% by mass or more and 0.05% by mass or less.
  • the solder paste of the present invention contains a flux and a powder made of the solder alloy according to any one of (1) to (4) above.
  • the joint of the present invention is formed using the solder alloy according to any one of (1) to (4) above.
  • the bonded structure of the present invention includes a first material to be bonded, a bonded portion, and a second material to be bonded, and the bonded portion is the bonded portion described in (7) above. , the first material to be joined and the second material to be joined are joined.
  • a control device of the present invention includes the bonded structure described in (8) above.
  • the solder alloy of the present invention has a liquidus temperature of 170° C. or less, and can form a joint having heat cycle resistance and drop impact resistance.
  • solder alloy of this embodiment contains a predetermined amount of a predetermined alloying element and has a liquidus temperature of 170°C or less, so that even if it contains more than a certain amount of Bi, the solder alloy has good ductility and strength. can be improved in a well-balanced manner. Thereby, it is possible to suppress the occurrence of joint defects during soldering, and to form a joint portion having heat cycle resistance and drop impact resistance.
  • the joints formed using the solder alloy of this embodiment are caused by external forces applied to the joints during soldering and when manufacturing control devices and electronic devices, and stress within the joints due to this. It is also possible to suppress the occurrence of cracks within the joint.
  • the solder alloy of the present embodiment is used for soldering at a heating temperature of 190° C., it is possible to suppress the generation of unmelted solder, thereby providing a highly reliable joint. Can be done. Furthermore, since the solder alloy of the present embodiment can be soldered under a heating temperature condition of 190°C, it is possible to solder the solder alloy at a heating temperature of 190°C. Thermal load can be reduced. As a result, it is possible to suppress deformation (warpage) that occurs in the material to be joined, and to suppress the occurrence of poor bonding between the material to be joined and the joint portion due to the warpage.
  • a bonded structure having a joint part for joining materials to be joined for example, a printed circuit board having a joint part for joining a printed wiring board and an electronic component
  • a printed circuit board having a joint part for joining a printed wiring board and an electronic component is placed in an environment where heat cycles are repeated.
  • Repeated stress is generated within the joint due to the thermal expansion and contraction of the joint itself and the difference in thermal expansion coefficient between the printed wiring board and the electronic component.
  • This stress then causes thermal fatigue failure (cracks) in the joint.
  • stress concentration tends to occur at the tip of a crack, and as a result of the above-mentioned stress concentrating on this tip, the crack may develop and the joint may break.
  • the solder alloy of this embodiment not only strengthens the joint by solid solution but also contains ⁇ -SnSb, Cu 6 Sn 5 , (Cu, Ni) 6 Sn 5 , (Cu, Co) in the joint. Fine intermetallic compounds with high strength such as 6 Sn 5 and (Cu, Ni, Co) 6 Sn 5 can be precipitated in a well-balanced manner.
  • the solder alloy of this embodiment can provide good ductility to the joint by balancing the types and contents of each alloying element. As described above, the solder alloy of this embodiment can improve the ductility and strength of the joint in a well-balanced manner, thereby suppressing the occurrence and propagation of cracks within the joint, resulting in a good heat cycle. resistance can be achieved.
  • the Bi content is less than 45% by mass, it becomes difficult to control the liquidus temperature of the solder alloy to 170° C. or lower. Furthermore, if the Bi content exceeds 63% by mass, the ductility of the solder alloy may decrease.
  • the solder alloy of this embodiment contains 0.1% by mass or more and 1% by mass or less of Sb, thereby achieving solid solution strengthening due to solid solution of Sb in the Sn phase of the joint, and the formation of fine ⁇ particles in the joint. - Precipitation strengthening due to the precipitation of SnSb can be achieved.
  • the solder alloy of this embodiment lowers the liquidus temperature of the solder alloy while increasing the ductility of the solder alloy. Since it is possible to improve the strength and strength in a well-balanced manner, it is possible to realize good heat cycle resistance and drop impact resistance.
  • the preferable content of Sb is 0.2% by mass or more and 0.8% by mass or less. Moreover, the content of Sb is more preferably 0.3% by mass or more and 0.7% by mass or less. By setting the Sb content within this range, it is possible to further improve the ductility and strength of the solder alloy in a well-balanced manner while lowering the liquidus temperature of the solder alloy, thereby improving heat cycle resistance and drop impact resistance. The properties can be further improved.
  • the solder alloy of the present embodiment contains fine (Cu, Ni) 6 Sn 5 , Since (Cu, Co) 6 Sn 5 and (Cu, Ni, Co) 6 Sn 5 can be precipitated, the heat cycle resistance of the joint can be improved.
  • the solder alloy of this embodiment has a liquidus temperature of the solder alloy by balancing the types and contents of other alloying elements and the total content of one or more selected from Ni and Co. Since it is possible to further improve the ductility and strength of the solder alloy in a more well-balanced manner while reducing the heat cycle resistance and drop impact resistance of the joint, it is possible to further improve the heat cycle resistance and drop impact resistance of the joint.
  • the solder alloy of the present embodiment can contain a total of 0.001% by mass or more and 0.05% by mass or less of one or more types selected from Mn, Ti, Al, Cr, V, and Mo.
  • Mn, Ti, Al, Cr, V, and Mo By adding one or more selected from Mn, Ti, Al, Cr, V, and Mo to the solder alloy, the intermetallic compounds in the joint become even finer, making it possible to suppress the growth of cracks and improve the solder alloy. It is possible to achieve excellent heat cycle resistance.
  • the total content of one or more selected from Mn, Ti, Al, Cr, V, and Mo exceeds 0.05% by mass, voids may occur in the joint and heat cycle resistance may deteriorate. be.
  • solder paste of this embodiment includes a powder made of the above-mentioned solder alloy (hereinafter referred to as "alloy powder"), and for example, the alloy powder and flux are kneaded to form a paste. It is made by
  • the flux includes, for example, a base resin, a thixotropic agent, an activator, and a solvent.
  • solvent examples include alcohol-based, butyl cellosolve-based, glycol ether-based, and ester-based solvents. These can be used alone or in combination.
  • an antioxidant can be added to the flux.
  • examples of the antioxidant include hindered phenolic antioxidants, phenolic antioxidants, bisphenol antioxidants, polymer type antioxidants, and the like.
  • additives such as a matting agent and an antifoaming agent may be added to the flux.
  • the blending ratio (mass %) of the alloy powder and flux can be from 65:35 to 95:5 in terms of alloy powder:flux ratio. Also, for example, the blending ratio can be from 85:15 to 93:7 or from 87:13 to 92:8.
  • the particle size of the alloy powder can be 1 ⁇ m or more and 40 ⁇ m or less. Moreover, the particle size can also be 5 ⁇ m or more and 35 ⁇ m or less, or 10 ⁇ m or more and 30 ⁇ m or less.
  • solder paste of the present embodiment contains the alloy powder, it is possible to perform soldering at a heating temperature of 190°C, and therefore it is possible to reduce the thermal load applied to the materials to be joined during heating. Furthermore, it is possible to form a joint having good heat cycle resistance and drop impact resistance.
  • the joint part of this embodiment is formed using the above-mentioned solder alloy, and joins the materials to be joined. Note that, in this specification, a joint formed using a joining material containing the above-mentioned solder alloy is also included in "a joint formed using a solder alloy.”
  • the method for forming the joint of this embodiment may be any method as long as it can be formed using the solder alloy described above, and any method such as a reflow method or a flow method can be adopted. Further, the bonding material to be used can be appropriately selected depending on the size, type and purpose of the materials to be bonded, the forming method, etc.
  • the joined structure of this embodiment includes a first member to be joined, a joint portion, and a second member to be joined.
  • the joint part is the joint part described above, that is, it is formed using the solder alloy described above, and joins the first material to be joined and the second material to be joined.
  • Examples of the combination of the first material to be joined and the second material to be joined include a substrate (the surface of which is made of ceramic, metal, alloy, or resin, and on which an electronic circuit is formed); printed wiring boards (boards on which electronic circuits are formed but no electronic parts, etc. are mounted), printed circuit boards (printed wiring boards on which electronic parts, etc. are mounted), electronic parts, silicon Examples include two or more types selected from wafers, semiconductor packages, semiconductor chips, etc. Specific combinations include, for example, a printed wiring board and an electronic component, a printed wiring board and a semiconductor chip, a semiconductor package and a printed circuit board, a printed wiring board and a printed wiring board, and the like.
  • the bonded structure of this embodiment is produced, for example, by the following method.
  • the bonding material described above is applied to a predetermined position of the first material to be bonded, for example, on an electronic circuit. is placed (or applied in the case of solder paste), and the second material to be joined is placed thereon. Then, these are reflowed at a predetermined heating temperature, for example, a peak temperature of 190° C., to form a joint portion for joining the first material to be joined and the second material to be joined.
  • a predetermined heating temperature for example, a peak temperature of 190° C.
  • Control Device includes the above-described bonded structure. Therefore, the control device of this embodiment has good heat cycle resistance and drop impact resistance, and can ensure high reliability.
  • test pieces 10 as shown in FIG. 1 were prepared for each.
  • the test piece 10 was produced so that the elongation measurement target area was as follows. - Length of central parallel part (between G1 and G2 in Figure 1) of test piece 10 (L in Figure 1): 12 mm ⁇ Width of central parallel part of test piece 10 (W in Figure 1): 2 mm ⁇ Thickness of central parallel part of test piece 10: 4mm
  • test piece 10 was tested at room temperature using a tabletop precision universal testing machine (product name: Autograph AG-50kNX plus, manufactured by Shimadzu Corporation) at a stroke of 0.72 mm/min until it broke. I pulled it in the X direction. Then, the stroke distance when the test piece 10 broke was set as GL1, and the length L of the central parallel part of the test piece before tension was set as GL0, and the elongation rate of the test piece 10 was calculated based on the following formula.
  • tabletop precision universal testing machine product name: Autograph AG-50kNX plus, manufactured by Shimadzu Corporation
  • Elongation rate (%) (GL1-GL0)/GL0 ⁇ 100
  • Five test pieces 10 were prepared for each type of solder alloy, and the elongation percentage and the average value thereof were calculated for each according to the above procedure, and evaluated based on the following criteria. The results are shown in Tables 4 to 6.
  • the average elongation rate is 25% or more and less than 30%.
  • Average elongation rate is less than 25%
  • solder paste was printed on a glass epoxy substrate using a metal mask. Then, four LGAs were placed on each glass epoxy substrate at predetermined positions on the printed solder paste. Note that the printed film thickness of the solder paste was adjusted using a metal mask. Then, the glass epoxy substrate on which the LGA is mounted is reflowed using a reflow oven (product name: TNV-M6110CR, manufactured by Tamura Seisakusho Co., Ltd.) to form the LGA, the glass epoxy substrate, and the joint portion that joins them. A test board with the following was fabricated.
  • a reflow oven product name: TNV-M6110CR, manufactured by Tamura Seisakusho Co., Ltd.
  • the preheating was from 100°C to 120°C
  • the peak temperature was 185°C
  • the time at 150°C or higher was 60 seconds
  • the cooling rate from the peak temperature to 100°C was from 1°C to 4°C/sec.
  • the oxygen concentration was set at 200 ⁇ 100 ppm.
  • the produced test substrate was subjected to a drop impact test under the following conditions using a drop impact tester (product name: HDST-150J, Shinei Technology Co., Ltd.). That is, in accordance with the JEDEC standard JESD22-B111, the test board was repeatedly allowed to freely fall from a height at which a shock waveform with an acceleration of 1,500 G and a width of 0.5 ms was applied. During the drop impact test, the electrical resistance of each joint of the test board was constantly observed, and when the resistance value exceeded 1,000 ⁇ , it was determined that the board had broken, and the number of drops until breakage was measured.
  • a drop impact tester product name: HDST-150J, Shinei Technology Co., Ltd.
  • Characteristic life is 110 times or more
  • Characteristic life is 90 times or more and less than 110 times
  • Characteristic life is 70 times or more and less than 90 times
  • Characteristic life is less than 70 times be
  • solder paste was printed on a glass epoxy substrate using a metal mask. Then, ten chip components were placed on each glass epoxy substrate at predetermined positions on the printed solder paste. Note that the printed film thickness of the solder paste was adjusted using a metal mask. Then, the glass epoxy substrate on which the chip components are mounted is reflowed using a reflow oven (product name: TNV-M6110CR, manufactured by Tamura Seisakusho Co., Ltd.), and the chip components, the glass epoxy substrate, and the bonding bonding are performed to bond them together. A mounting board having a section was fabricated.
  • each Test boards a to c were prepared by exposing the mounting boards to a thermal shock cycle as described below.
  • the target portion c was cut out from each test substrate a, and this was sealed using an epoxy resin (product name: HERZOG Epo low viscosity resin (base resin and hardening agent), manufactured by HERZOG Japan Co., Ltd.). Then, using a wet polishing machine (product name: TegraPol-25, manufactured by Marumoto Struers Co., Ltd.), the center cross section of each chip component mounted on each test board can be seen. TM-1000, manufactured by Hitachi High-Technologies Corporation), the condition of each joint on each test board a to c was observed, and the presence or absence of a crack completely crossing the joint was confirmed. , evaluated according to the following criteria. The results are shown in Tables 4 to 6.
  • Liquidus temperature measurement For each solder alloy, the liquidus temperature was measured using a differential scanning calorimeter (product name: DSC Q2000, manufactured by TA Instruments) and evaluated according to the following criteria. The results are shown in Tables 4 to 6. Note that the measurement conditions (temperature increase rate) for the liquidus temperature were 2° C./min, and the amount of sample used for the measurement was 10 mg. ⁇ : Liquidus temperature is 170°C or less ⁇ : Liquidus temperature is over 170°C

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'alliage de brasage selon la présente invention a une température de liquidus d'au plus 170 °C et peut former une pièce de jonction ayant une résistance au cycle thermique et une résistance au choc par chute. L'alliage de brasage contient de 45 à 63 % en masse de Bi, de 0,1 à 1 % en masse de Sb, de 0,05 à 1 % en masse de Cu, et un total de 0,001 à 0,1 % en masse d'un ou de plusieurs éléments choisis parmi Ni et Co, le reste étant constitué de Sn et d'impuretés inévitables, et a une température de liquidus d'au plus 170 °C.
PCT/JP2022/024426 2022-06-17 2022-06-17 Alliage de brasage, pièce de jonction, matériau de jonction, pâte à braser, structure de jonction et dispositif de commande WO2023243104A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/024426 WO2023243104A1 (fr) 2022-06-17 2022-06-17 Alliage de brasage, pièce de jonction, matériau de jonction, pâte à braser, structure de jonction et dispositif de commande
JP2022538357A JP7148760B1 (ja) 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置

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PCT/JP2022/024426 WO2023243104A1 (fr) 2022-06-17 2022-06-17 Alliage de brasage, pièce de jonction, matériau de jonction, pâte à braser, structure de jonction et dispositif de commande

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195915A (zh) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP2017177211A (ja) * 2016-03-31 2017-10-05 株式会社タムラ製作所 はんだ合金およびはんだ組成物
JP2018023987A (ja) * 2016-08-09 2018-02-15 株式会社日本スペリア社 接合方法
WO2018174162A1 (fr) * 2017-03-23 2018-09-27 株式会社日本スペリア社 Joint de brasure
WO2019171978A1 (fr) * 2018-03-08 2019-09-12 千住金属工業株式会社 Alliage de soudure, pâte à souder, bille de soudure, soudure à âme décapante à flux de résine et joint à brasure tendre
WO2020047481A1 (fr) * 2018-08-31 2020-03-05 Indium Corporation Alliages de brasage snbi et snin

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195915A (zh) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP2017177211A (ja) * 2016-03-31 2017-10-05 株式会社タムラ製作所 はんだ合金およびはんだ組成物
JP2018023987A (ja) * 2016-08-09 2018-02-15 株式会社日本スペリア社 接合方法
WO2018174162A1 (fr) * 2017-03-23 2018-09-27 株式会社日本スペリア社 Joint de brasure
WO2019171978A1 (fr) * 2018-03-08 2019-09-12 千住金属工業株式会社 Alliage de soudure, pâte à souder, bille de soudure, soudure à âme décapante à flux de résine et joint à brasure tendre
WO2020047481A1 (fr) * 2018-08-31 2020-03-05 Indium Corporation Alliages de brasage snbi et snin

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