WO2023236915A1 - 电磁屏蔽结构、芯片结构、电子设备和车辆 - Google Patents

电磁屏蔽结构、芯片结构、电子设备和车辆 Download PDF

Info

Publication number
WO2023236915A1
WO2023236915A1 PCT/CN2023/098397 CN2023098397W WO2023236915A1 WO 2023236915 A1 WO2023236915 A1 WO 2023236915A1 CN 2023098397 W CN2023098397 W CN 2023098397W WO 2023236915 A1 WO2023236915 A1 WO 2023236915A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
structural
electromagnetic shielding
metal
top plate
Prior art date
Application number
PCT/CN2023/098397
Other languages
English (en)
French (fr)
Inventor
马学文
吴泽亮
许乔阳
黄博林
谢正生
黄睿
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023236915A1 publication Critical patent/WO2023236915A1/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • Embodiments of the present application relate to the field of semiconductor technology, and more specifically, to an electromagnetic shielding structure, a chip structure, electronic equipment and a vehicle.
  • Embodiments of the present application provide an electromagnetic shielding structure, a chip structure, an electronic device, and a vehicle.
  • the electromagnetic shielding structure can achieve heat dissipation while satisfying the electromagnetic shielding of the chip.
  • an electromagnetic shielding structure including: a metal cover, including side walls and a top plate, the top plate including an opening, the bottom end of the side wall is fixed to a printed circuit board, and the side wall is used to surround the printed circuit board.
  • a chip on a circuit board a heat dissipation structural member, including a structural member housing and a structural boss protruding from the structural member housing, and the structural boss being used to contact the chip through an opening on the top plate.
  • the contact between the above-mentioned structural boss and the chip may be direct contact or indirect contact.
  • indirect contact means that other media may exist between the structural boss and the chip.
  • a thermal conductive pad may be provided between the structural boss and the chip, so that the structural boss and the chip can be in contact through the thermal conductive pad.
  • the thermal pad can be conductive rubber, conductive silicon paper, etc., without limitation.
  • the heat dissipation structure may also be called a metal heat dissipation structure.
  • the electromagnetic shielding structure provided by the embodiment of the present application includes a metal cover and a heat dissipation structural member.
  • the metal cover and the heat dissipation structure work together to cover the chip to achieve electromagnetic shielding of the chip.
  • the structural boss of the heat dissipation structure is Contact with the chip allows the heat generated by the chip to be conducted along the structural bosses, thereby realizing chip heat dissipation. Based on this, the electromagnetic shielding structure provided by the embodiments of the present application can achieve heat dissipation while satisfying the electromagnetic shielding of the chip.
  • the structural boss contacts the chip through a thermally conductive pad.
  • the structural boss and the chip can be in contact through a thermal pad.
  • the structural tolerance between the structural boss and the chip can be reduced, and the close combination of the structural boss and the chip can be achieved; on the other hand, the chip generates The heat can be conducted to the structural boss through the thermal pad, thereby realizing chip heat dissipation.
  • the structural member housing and the metal cover are in contact with each other through a conductive shielding material.
  • the conductive shielding material can be any one or more of metal reeds, metal elastic sheets, conductive glue, conductive foam, conductive cloth, copper foil, aluminum foil, etc.
  • the structural component shell and the metal cover can be in contact through conductive shielding materials, so that the metal cover can overlap with the heat dissipation structural component to form a sealed electromagnetic shielding structure, thereby improving the electromagnetic shielding effect.
  • the conductive shielding material includes a metal spring or a metal spring.
  • the metal spring or metal spring is fixed to the structural member housing; or, the metal spring or metal spring is fixed to the top plate of the metal cover; or, The metal reed or metal spring piece and the structural member housing form an integral structure; or the metal reed or metal spring piece and the top plate of the metal cover form an integral structure.
  • the metal reed or metal elastic piece can be fixed to the structural component shell or the top plate of the metal cover through conductive adhesive.
  • the metal reed or metal spring piece is integrally formed with the structural member shell or is integrated with the top plate of the metal cover. It means that the metal reed or metal spring piece is integrally formed with the structural member shell or is integrally formed with the top plate of the metal cover. In one piece.
  • the heat dissipation structural member further includes: structural member spacer ribs, the structural member spacer ribs are used to surround the metal cover.
  • the embodiment of the present application does not limit the downward extension height of the structural member partition bars.
  • the structural member partition bars may only surround the top plate of the metal cover, or may surround part of the lower side wall of the top plate, or may surround the entire Metal hood.
  • the heat dissipation structural member may also include structural member spacers to further hinder the entry of electromagnetic waves and improve the electromagnetic shielding effect.
  • the metal cover is fixed to the printed circuit board by welding.
  • a second aspect provides a chip structure, including a chip and an electromagnetic shielding structure as in the first aspect or any possible implementation of the first aspect.
  • an electronic device including the chip structure as described in the second aspect and a printed circuit board, and the chip structure is fixed to the printed circuit board.
  • the electronic device is a head-up display (HUD).
  • HUD head-up display
  • a fourth aspect provides a vehicle, including an electronic device as in the third aspect or any possible implementation manner of the third aspect.
  • Figure 1 is an example diagram of an electromagnetic shielding structure 100 provided by an embodiment of the present application.
  • Figure 2 is an example diagram of a structural component housing provided by an embodiment of the present application.
  • Figure 3 is an example diagram of an electromagnetic shielding structure 200 provided by an embodiment of the present application.
  • FIG. 4 is an example diagram of an electromagnetic shielding structure 300 provided by an embodiment of the present application.
  • the chip may include universal flash storage (UFS), microcontroller unit (MCU), clock driver, central processing unit (CUP), integrated access switch (integrated access switch) , LSW) etc.
  • UFS universal flash storage
  • MCU microcontroller unit
  • CUP central processing unit
  • integrated access switch integrated access switch
  • the solution of this application can be applied to the control chip involved in the head-up display (HUD) in the vehicle.
  • the control chip is mainly used to control the picture generation unit (PGU) in the HUD to generate images (such as speed, navigation and other driving information), so that they are reflected to the driver through the reflective component and the windshield.
  • PGU picture generation unit
  • the eye box allows the driver to see a virtual image with depth of field in the car.
  • the above-mentioned HUD may include a combined head-up display (combiner-HUD, C-HUD) system, a windshield-type head-up display (windshield-HUD, W-HUD) system, and an augmented reality head-up display (augmented reality HUD, AR-HUD) system. HUD) system and so on.
  • Figure 1 is an example diagram of an electromagnetic shielding structure 100 provided by an embodiment of the present application, wherein (a) in Figure 1 is an example diagram of each component included in the electromagnetic shielding structure 100; (b) in Figure 1 is (a) in Figure 1 shows an example of a side cross-section after assembly of each component.
  • the electromagnetic shielding structure 100 shown in FIG. 1 is only an example and does not constitute a limitation of the present application. In actual operation, the shape and size of each component can be determined according to actual conditions.
  • the electromagnetic shielding structure 100 includes a metal cover 10 and a heat dissipation structure 20 .
  • the metal cover 10 includes a side wall 11 and a top plate 12 .
  • the top plate 12 includes an opening 13 .
  • the bottom end 14 of the side wall 11 is fixed to the printed circuit board 30 .
  • the side wall 11 is used to surround the chip 40 on the printed circuit board 30 .
  • the heat dissipation structure 20 includes a structural housing 21 and a structural boss 22 .
  • the structural boss 22 protrudes from the structural housing 21 .
  • the structural boss 22 is used to contact the chip 40 through the opening 13 on the top plate 12 .
  • each component shown in (a) in Figure 1 can be as follows: fix the metal cover 10 on the printed circuit board 30 so that it surrounds the chip 40 on the printed circuit board 30; The structural member 20 is pressed toward the chip 40 through the opening 13 on the top plate 12, so that the structural boss 22 of the heat dissipation structure member 20 contacts the chip 40 to dissipate heat from the chip 40. At the same time, the heat dissipation structure member 20 overlaps with the metal cover 10 to form the structure shown in Figure 1 The electromagnetic shielding structure shown in (b).
  • the above-mentioned heat dissipation structure member 20 may also be called a metal heat dissipation structure member.
  • the electromagnetic shielding structure 100 provided by the embodiment of the present application includes a metal cover 10 and a heat dissipation structural member 20.
  • the metal cover 10 and the heat dissipation structure 20 work together to cover the chip 40 to achieve electromagnetic shielding of the chip 40; at the same time,
  • the structural boss 22 of the heat dissipation structural member 20 is in contact with the chip 40, so that the heat generated by the chip 40 can be conducted out along the structural boss 22, thereby realizing heat dissipation of the chip 40.
  • the electromagnetic shielding structure 100 provided by the embodiment of the present application can achieve heat dissipation while satisfying the electromagnetic shielding of the chip 40 .
  • the contact between the above-mentioned structural boss 22 and the chip 40 may be direct contact (as shown in (b) of FIG. 1 ) or indirect contact (as shown in (b) of FIG. 3 ).
  • indirect contact can be through structural bosses
  • a thermal pad 50 is provided between 22 and the chip 40, so that the structural boss 22 and the chip 40 can be in contact through the thermal pad 50.
  • the thermal pad 50 may be conductive rubber, conductive silicon paper, etc., without limitation.
  • the structural boss 22 and the chip 40 can be in contact through the thermal pad 50.
  • the structural tolerance between the structural boss 22 and the chip 40 can be reduced, and a tight combination of the structural boss 22 and the chip 40 can be achieved.
  • the heat generated by the chip 40 can be conducted to the structural boss 22 through the thermal pad 50, thereby realizing heat dissipation of the chip 40.
  • the structural member housing 21 and the metal cover 10 may be in contact.
  • the structural member housing 21 and the metal cover 10 may be in contact through the conductive shielding material 60 (as shown in (b) of FIG. 3 ).
  • the conductive shielding material 60 may be any one or more of metal reeds, metal elastic sheets, conductive glue, conductive foam, conductive cloth, copper foil, aluminum foil, etc. It should be understood that in the drawings of the embodiment of the present application, the conductive shielding material 60 is mainly illustrated by taking the structure of a metal reed as an example. However, it should be understood that in actual operation, the structure of the conductive shielding material 60 is not limited to this. It needs to be determined based on the actual situation.
  • the structural member housing 21 and the metal cover 10 can be in contact through the conductive shielding material 60, so that the metal cover 10 can overlap with the heat dissipation structural member 20 to form a sealed electromagnetic shielding structure, thereby improving the electromagnetic shielding effect. .
  • the following uses a metal reed or a metal spring as an example to introduce the positional relationship between the metal reed or metal spring, the structural component housing 21 and the metal cover 10 .
  • a metal spring or metal elastic piece can be fixed to the structural member housing 21 .
  • the metal reed or metal elastic piece can be adhered and fixed to the structural member housing 21 through conductive adhesive.
  • a metal spring or metal elastic piece can be fixed on the top plate 12 of the metal cover 10 .
  • the metal reed or metal elastic piece can be adhered and fixed to the top plate 12 of the metal cover 10 through conductive adhesive.
  • the metal spring or metal elastic piece can be an integral structure with the structural member housing 21 . That is to say, the metal spring or metal elastic piece can be integrally formed with the structural member housing 21 .
  • the metal spring or metal spring piece can be an integral structure with the top plate 12 of the metal cover 10 . That is to say, the metal spring or metal elastic piece can be integrally formed with the top plate 12 of the metal cover 10 .
  • the structural component housing 21 and the metal cover 10 may also be in direct contact without passing through the conductive shielding material, which is not limited in this application.
  • the structural member housing 21 there may be no contact between the structural member housing 21 and the metal cover 10 .
  • top plate 12 of the metal cover 10 and the structural boss 22 may or may not be in contact, which is not limited in this application.
  • the top plate 12 of the metal cover 10 can be fixed on the structural boss 22 during the assembly process (for example, a socket can be provided on the structural boss 22, and a corresponding insert can be provided on the top plate 12, so that the two can be assembled during assembly.
  • the connection can be fixed during the process).
  • the heat dissipation structural member 20 may also include structural member spacers 23, which are used to surround the metal cover 10 (as shown in (b) of Figure 4) to further hinder the interference of electromagnetic waves on the chip and improve Electromagnetic shielding effect.
  • the embodiment of the present application does not limit the downward extension height of the structural member partition rib 23 .
  • the structural member ribs 23 can only surround the top plate 12 of the metal cover 10, or can surround the lower part of the side wall 11 of the top plate 12, or can also surround the entire metal cover 10.
  • the actual structure of the structural component housing 21 can be a housing used to cover the printed circuit board 30 , which means that the heat dissipation structural component 20 and the printed circuit board 30 are separated from each other.
  • the body has an integrated structure. This design allows the electromagnetic shielding structure to be used in scenes with a lot of shaking such as cars, airplanes, and drones. It can ensure that the metal cover and heat dissipation structural parts in the assembled electromagnetic shielding structure will not Falling off due to external force.
  • the metal cover 10 ie, the bottom end 14 of the side wall 11 of the metal cover 10
  • the metal cover 10 can be fixed to the printed circuit board 30 by welding.
  • thermal pad 50 structural ribs 23 , and conductive shielding material 60 may exist at the same time, or only one or two of them may exist.
  • FIG. 3 is an example to introduce the electromagnetic shielding structure 200 in which the thermal pad 50 and the conductive shielding material 60 coexist
  • FIG. 4 is used as an example to describe the electromagnetic shielding structure 200 in which the thermal pad 50, the conductive shielding material 60 and the structural ribs 23 coexist.
  • the electromagnetic shielding structure 300 is introduced.
  • FIG. 3 is an example diagram of an electromagnetic shielding structure 200 provided by an embodiment of the present application.
  • (a) in Figure 3 is an example diagram of each component included in the electromagnetic shielding structure 200;
  • (b) in Figure 3 is an example of a lateral cross-section of each component shown in Figure 3 (a) after assembly. picture.
  • the electromagnetic shielding structure 200 shown in FIG. 3 is only an example and does not constitute a limitation of the present application. In actual operation, the shape and size of each component can be determined according to actual conditions.
  • the electromagnetic shielding structure 200 includes a metal cover 10 and a heat dissipation structure 20 .
  • the metal cover 10 includes a side wall 11 and a top plate 12 .
  • the top plate 12 includes an opening 13 .
  • the bottom end 14 of the side wall 11 is fixed to the printed circuit board 30 .
  • the side wall 11 is used to surround the chip 40 on the printed circuit board 30 .
  • the heat dissipation structure 20 includes a structural housing 21 and a structural boss 22.
  • the structural boss 22 protrudes from the structural housing 21.
  • the structural boss 22 is used to communicate with the heat conductor placed on the chip 40 through the opening 13 on the top plate 12.
  • the pad 50 is in contact, and the structural component housing 21 and the metal cover 10 are in contact through the conductive shielding material 60 .
  • each component shown in (a) in Figure 3 is as follows: fix the metal cover 10 on the printed circuit board 30 so that it surrounds the chip 40 on the printed circuit board 30; Place the thermal pad 50 on the chip 40; press the heat dissipation structural member 20 through the opening 13 on the top plate 12 against the thermal pad 50 so that the structural boss 22 of the heat dissipation structural member 20 contacts the thermal pad 50 to dissipate heat from the chip 40.
  • the structural member housing 21 and the metal cover 10 are contacted and overlapped through the conductive shielding material 60 to form the electromagnetic shielding structure shown in (b) of FIG. 3 . It should also be understood that the embodiments of the present application do not limit the order in which the above steps are performed.
  • FIG. 4 is an example diagram of an electromagnetic shielding structure 300 provided by an embodiment of the present application.
  • (a) in Figure 4 is an example diagram of each component included in the electromagnetic shielding structure 300;
  • (b) in Figure 4 is an example of a lateral cross-section after assembly of each component shown in Figure 4 (a) picture.
  • the electromagnetic shielding structure 300 shown in FIG. 4 is only an example and does not constitute a limitation of the present application. In actual operation, the shape and size of each component can be determined according to actual conditions.
  • the electromagnetic shielding structure 300 includes a metal cover 10 and a heat dissipation structure 20 .
  • the metal cover 10 includes a side wall 11 and a top plate 12 .
  • the top plate 12 includes an opening 13 .
  • the bottom end 14 of the side wall 11 is fixed to the printed circuit board 30 .
  • the side wall 11 is used to surround the chip 40 on the printed circuit board 30 .
  • the heat dissipation structural member 20 includes a structural member shell 21, a structural boss 22 and a structural member spacer 23.
  • the structural boss 22 protrudes from the structural member shell 21.
  • the structural boss 22 is used for placement through the opening 13 on the top plate 12.
  • the thermal pad 50 on the chip 40 is in contact
  • the structural component housing 21 is in contact with the metal cover 10 through the conductive shielding material 60
  • the structural component spacer ribs 23 are used to surround the metal cover 10 .
  • each component shown in (a) in Figure 4 is as follows: fix the metal cover 10 on the printed circuit on the circuit board 30 so that it surrounds the chip 40 on the printed circuit board 30; place the thermal pad 50 on the chip 40; press the heat dissipation structural member 20 through the opening 13 on the top plate 12 to press the thermal pad 50 so that the heat dissipation structural member
  • the structural boss 22 of 20 is in contact with the thermal pad 50 to dissipate heat from the chip 40, and at the same time, the structural component shell 21 and the metal cover 10 are contacted and overlapped through the conductive shielding material 60 and the structural component spacer rib 23 to form (b) in Figure 4 Electromagnetic shielding structure shown. It should also be understood that the embodiments of the present application do not limit the order in which the above steps are performed.
  • Embodiments of the present application also provide a chip structure, including a chip and an electromagnetic shielding structure in any of the above possible implementations.
  • An embodiment of the present application also provides an electronic device, including the above-mentioned chip structure and a printed circuit board, and the chip structure is fixed to the printed circuit board.
  • the electronic device may include, for example, a desktop computer, a notebook computer, a smartphone, a tablet, a personal digital assistant (PDA), a wearable device, a smart speaker, a television, a drone, a vehicle, or a vehicle-mounted device. (such as car computer, car computer, car HUD, etc.) or any of the robots, etc.
  • a desktop computer such as car computer, car computer, car HUD, etc.
  • An embodiment of the present application also provides a vehicle, including the electronic device in any of the above possible implementation manners.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请实施例提供了一种电磁屏蔽结构、芯片结构、电子设备和车辆，可以应用于自动驾驶、人工智能、语音处理、图像处理等领域。其中，该电磁屏蔽结构包括：金属罩，包括侧壁和顶板，该顶板包括开口，该侧壁的底端固定于印制电路板，该侧壁用于环绕印制电路板上的芯片；散热结构件，包括结构件壳体和结构凸台，该结构凸台凸出于结构件壳体，该结构凸台用于通过顶板上的开口与该芯片接触。本申请方案能够在满足芯片电磁屏蔽的同时实现散热。

Description

电磁屏蔽结构、芯片结构、电子设备和车辆
本申请要求于2022年06月06日提交中国专利局、申请号为202210635054.X、申请名称为“电磁屏蔽结构、芯片结构、电子设备和车辆”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及半导体技术领域，并且更具体地，涉及一种电磁屏蔽结构、芯片结构、电子设备和车辆。
背景技术
随着科技的不断发展，通讯设备、计算机、手机、汽车等设备与设备之间及设备本身内部的电磁干扰无处不在，若无法有效消除这些干扰信号，这些干扰信号将会进入这些设备的芯片中，从而干扰大规模集成电路，导致其不能正常工作或在错误状态下工作。
为避免对芯片的电磁干扰作用，当前技术通常在芯片上设置金属罩以屏蔽电磁信号。但金属罩的密闭空腔阻碍了芯片的快速散热，而且，伴随着算力的提升，芯片的速率和功耗也在持续提升，发热量也随之快速上升，严重影响着芯片的应用性能。
因此，如何在满足芯片电磁屏蔽的同时实现散热是亟需解决的技术问题。
发明内容
本申请实施例提供一种电磁屏蔽结构、芯片结构、电子设备和车辆，该电磁屏蔽结构能够在满足芯片电磁屏蔽的同时实现散热。
第一方面，提供了一种电磁屏蔽结构，包括：金属罩，包括侧壁和顶板，该顶板包括开口，该侧壁的底端固定于印制电路板，该侧壁用于环绕该印制电路板上的芯片；散热结构件，包括结构件壳体和结构凸台，该结构凸台凸出于该结构件壳体，该结构凸台用于通过该顶板上的开口与该芯片接触。
可选地，上述结构凸台与芯片接触可以是直接接触，也可以是间接接触。其中，间接接触表征结构凸台和芯片之间可以存在其它介质，例如可以在结构凸台与芯片之间设置有导热垫，使得结构凸台与芯片可以通过导热垫实现接触。可选地，该导热垫可以是导电橡胶，也可以是导电硅纸等，不做限定。
可选地，散热结构件也可以被称为金属散热结构件。
本申请实施例所提供的电磁屏蔽结构包括金属罩和散热结构件，其中，金属罩与散热结构件共同作用将芯片罩起来，实现芯片的电磁屏蔽；与此同时，散热结构件的结构凸台与芯片接触，使得芯片产生的热量可以沿着结构凸台传导出去，从而实现芯片散热。基于此，本申请实施例所提供的电磁屏蔽结构能够在满足芯片电磁屏蔽的同时实现散热。
结合第一方面，在第一方面的某些实现方式中，该结构凸台与该芯片通过导热垫接触。
在本申请实施例中，结构凸台与芯片可以通过导热垫接触，一方面，可以降低结构凸台与芯片之间的结构公差，实现结构凸台与芯片的紧密结合；另一方面，芯片产生的热量可以通过导热垫传导到结构凸台，从而实现芯片散热。
结合第一方面，在第一方面的某些实现方式中，该结构件壳体与该金属罩通过导电屏蔽材料接触。
可选地，该导电屏蔽材料可以是金属簧片、金属弹片、导电胶、导电泡棉、导电布、铜箔、铝箔等中的任意一项或多项。
在本申请实施例中，结构件壳体与金属罩可以通过导电屏蔽材料接触，使得金属罩可以与散热结构件搭接形成密闭的电磁屏蔽结构，从而能够提高电磁屏蔽的效果。
结合第一方面，在第一方面的某些实现方式中，该导电屏蔽材料包括金属簧片或金属弹片。
结合第一方面，在第一方面的某些实现方式中，该金属簧片或金属弹片固定于该结构件壳体；或者，该金属簧片或金属弹片固定于该金属罩的顶板；或者，该金属簧片或金属弹片与该结构件壳体呈一体结构；或者，该金属簧片或金属弹片与该金属罩的顶板呈一体结构。
示例性地，金属簧片或金属弹片可以通过导电胶黏贴固定于结构件壳体或者固定于该金属罩的顶板。
应理解，金属簧片或金属弹片与结构件壳体呈一体结构或者与金属罩的顶板呈一体结构是指金属簧片或金属弹片与结构件壳体是一体成型的或者与金属罩的顶板是一体成型的。
结合第一方面，在第一方面的某些实现方式中，该散热结构件还包括：结构件隔筋，该结构件隔筋用于环绕该金属罩。
本申请实施例对结构件隔筋的向下延伸高度不做限定，可选地，结构件隔筋可以仅环绕金属罩的顶板，也可以环绕顶板再往下的部分侧壁，还可以环绕整个金属罩。
在本申请实施例中，散热结构件还可以包括结构件隔筋，以进一步阻碍电磁波的进入，提高电磁屏蔽效果。
结合第一方面，在第一方面的某些实现方式中，该金属罩通过焊接固定于该印制电路板。
第二方面，提供了一种芯片结构，包括芯片和如第一方面或第一方面中任一可能实现方式中的电磁屏蔽结构。
第三方面，提供了一种电子设备，包括如第二方面所述的芯片结构以及印制电路板，该芯片结构固定于该印制电路板。
结合第三方面，在第三方面的某些实现方式中，该电子设备为平视显示器(head up display，HUD)。
第四方面，提供了一种车辆，包括如第三方面或第三方面中任一可能实现方式中的电子设备。
附图说明
图1是本申请实施例提供的一种电磁屏蔽结构100的示例图；
图2是本申请实施例提供的一种结构件壳体的示例图；
图3是本申请实施例提供的一种电磁屏蔽结构200的示例图；
图4是本申请实施例提供的一种电磁屏蔽结构300的示例图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请方案可以应用于自动驾驶、人工智能、语音处理、图像处理等领域所涉及到的芯片结构中。示例性地，芯片可以包括通用闪存存储(universal flash storage，UFS)、微控制单元(microcontroller unit，MCU)、时钟驱动器、中央处理器(central processing unit，CUP)、综合接入交换机(integrated access switch，LSW)等。
作为一个示例，本申请方案可以应用于车辆中的平视显示器(head up display，HUD)所涉及到的控制芯片中。在可能的实现中，该控制芯片主要用于控制HUD中的图像生成单元(picture generation unit，PGU)产生影像(例如时速、导航等驾驶信息)，使其经过反射组件以及风挡玻璃反射至驾驶员眼盒处，进而使得驾驶员可以在车内看到有景深的虚像。
可选地，上述HUD可以包括组合型抬头显示(combiner-HUD，C-HUD)系统、风挡型抬头显示(windshield-HUD，W-HUD)系统、增强现实型抬头显示(augmented reality HUD，AR-HUD)系统等等。
图1是本申请实施例提供的一种电磁屏蔽结构100的示例图，其中，图1中的(a)为电磁屏蔽结构100所包括的各个组件的示例图；图1中的(b)为图1中的(a)所示的各个组件装配后的侧向剖面示例图。应理解，图1所示的电磁屏蔽结构100仅为示例，不构成对本申请的限定，在实际操作中，各个组件的形状与尺寸可以根据实际情况确定。
如图1所示，电磁屏蔽结构100包括金属罩10和散热结构件20。其中，金属罩10包括侧壁11和顶板12，顶板12包括开口13，侧壁11的底端14固定于印制电路板30，侧壁11用于环绕印制电路板30上的芯片40。散热结构件20包括结构件壳体21和结构凸台22，结构凸台22凸出于结构件壳体21，结构凸台22用于通过顶板12上的开口13与芯片40接触。
具体实现中，图1中的(a)所示的各个组件的装配过程可以如下：将金属罩10固定在印制电路板30上，使其环绕印制电路板30上的芯片40；将散热结构件20通过顶板12上的开口13压向芯片40，使得散热结构件20的结构凸台22与芯片40接触对芯片40进行散热，同时散热结构件20与金属罩10搭接形成图1中的(b)所示电磁屏蔽结构。
可选地，上述散热结构件20也可以被称为金属散热结构件。
本申请实施例所提供的电磁屏蔽结构100包括金属罩10和散热结构件20，其中，金属罩10与散热结构件20共同作用将芯片40罩起来，实现芯片40的电磁屏蔽；与此同时，散热结构件20的结构凸台22与芯片40接触，使得芯片40产生的热量可以沿着结构凸台22传导出去，从而实现芯片40散热。基于此，本申请实施例所提供的电磁屏蔽结构100能够在满足芯片40电磁屏蔽的同时实现散热。
可选地，上述结构凸台22与芯片40接触可以是直接接触(如图1中的(b)所示)，也可以是间接接触(如图3中的(b)所示)。一种设计中，间接接触可以通过结构凸台 22与芯片40之间设置有导热垫50实现，使得结构凸台22与芯片40可以通过导热垫50实现接触。可选地，该导热垫50可以是导电橡胶，也可以是导电硅纸等，不做限定。
在本申请实施例中，结构凸台22与芯片40可以通过导热垫50接触，一方面，可以降低结构凸台22与芯片40之间的结构公差，实现结构凸台22与芯片40的紧密结合；另一方面，芯片40产生的热量可以通过导热垫50传导到结构凸台22，从而实现芯片40散热。
可选地，结构件壳体21与金属罩10可以接触。
作为一种实现方式，结构件壳体21与金属罩10可以通过导电屏蔽材料60接触(如图3中的(b)所示)。可选地，导电屏蔽材料60可以是金属簧片、金属弹片、导电胶、导电泡棉、导电布、铜箔、铝箔等中的任意一项或多项。应理解，在本申请实施例附图中，主要以金属簧片的结构为例对导电屏蔽材料60进行了示意，但应理解的是，实际操作中，导电屏蔽材料60的结构不限于此，需要结合实际情况确定。
在本申请实施例中，结构件壳体21与金属罩10可以通过导电屏蔽材料60接触，使得金属罩10可以与散热结构件20搭接形成密闭的电磁屏蔽结构，从而能够提高电磁屏蔽的效果。
下面以金属簧片或金属弹片为例，介绍金属簧片或金属弹片、结构件壳体21、金属罩10之间的位置关系。
可选地，金属簧片或金属弹片可以固定于结构件壳体21。进一步，金属簧片或金属弹片可以通过导电胶黏贴固定于结构件壳体21。
可选地，金属簧片或金属弹片可以固定于金属罩10的顶板12。进一步，金属簧片或金属弹片可以通过导电胶黏贴固定于金属罩10的顶板12。
可选地，金属簧片或金属弹片可以与结构件壳体21呈一体结构。即就是说，金属簧片或金属弹片可以与结构件壳体21一体成型。
可选地，金属簧片或金属弹片可以与金属罩10的顶板12呈一体结构。即就是说，金属簧片或金属弹片可以与金属罩10的顶板12一体成型。
作为另一种实现方式，结构件壳体21与金属罩10也可以不通过导电屏蔽材料而直接接触，本申请对此不做限定。
可选地，结构件壳体21与金属罩10之间也可以不接触。例如，结构件壳体21与金属罩10之间可以由于结构公差或工艺而存在微小的距离。
具体的，金属罩10的顶板12与结构凸台22可以接触，也可以不接触，本申请对此不做限定。
可选地，金属罩10的顶板12可以在装配过程中固定在结构凸台22上(例如，可以在结构凸台22上设置插口，在顶板12上设置相应的插条，使得二者在装配过程中可以实现连接固定)。
进一步，散热结构件20还可以包括结构件隔筋23，该结构件隔筋23用于环绕金属罩10(如图4中的(b)所示)，以进一步阻碍电磁波对芯片的干扰，提高电磁屏蔽效果。
本申请实施例对结构件隔筋23的向下延伸高度不做限定。可选地，结构件隔筋23可以仅环绕金属罩10的顶板12，也可以环绕顶板12再往下的部分侧壁11，还可以环绕整个金属罩10，
一种可能的设计中，如图2所示，结构件壳体21的实际结构可以为用来罩住印制电路板30的壳体，意味着散热结构件20与印制电路板30的壳体呈一体结构，该设计使得该电磁屏蔽结构在应用于汽车、飞机、无人机等晃动较多的场景中时，能够保证装配好的电磁屏蔽结构中的金属罩和散热结构件不会在外力作用下发生脱落。
可选地，金属罩10(即金属罩10的侧壁11的底端14)可以通过焊接固定于印制电路板30。
应理解，上述所提及的导热垫50、结构隔筋23、导电屏蔽材料60三者可以同时存在，也可以仅存在其中的一项或两项。作为示例，下面以图3为例对同时存在导热垫50和导电屏蔽材料60的电磁屏蔽结构200进行介绍；以图4为例对同时存在导热垫50、导电屏蔽材料60和结构隔筋23的电磁屏蔽结构300进行介绍。
图3是本申请实施例提供的一种电磁屏蔽结构200的示例图。其中，图3中的(a)为电磁屏蔽结构200所包括的各个组件的示例图；图3中的(b)为图3中的(a)所示的各个组件装配后的侧向剖面示例图。应理解，图3所示的电磁屏蔽结构200仅为示例，不构成对本申请的限定，在实际操作中，各个组件的形状与尺寸可以根据实际情况确定。
如图3所示，电磁屏蔽结构200包括金属罩10和散热结构件20。其中，金属罩10包括侧壁11和顶板12，顶板12包括开口13，侧壁11的底端14固定于印制电路板30，侧壁11用于环绕印制电路板30上的芯片40。散热结构件20包括结构件壳体21和结构凸台22，结构凸台22凸出于结构件壳体21，结构凸台22用于通过顶板12上的开口13与放置在芯片40上的导热垫50接触，结构件壳体21与金属罩10通过导电屏蔽材料60接触。
应理解，图3中的(a)所示的各个组件的一种可能的装配过程如下：将金属罩10固定在印制电路板30上，使其环绕印制电路板30上的芯片40；将导热垫50放置在芯片40上；将散热结构件20通过顶板12上的开口13压向导热垫50，使得散热结构件20的结构凸台22与导热垫50接触对芯片40进行散热，同时使得结构件壳体21与金属罩10通过导电屏蔽材料60接触搭接形成图3中的(b)所示电磁屏蔽结构。还应理解的是，本申请实施例对上述各个步骤执行的先后顺序不做限定。
应理解，关于电磁屏蔽结构200的其他信息可参见上文对于电磁屏蔽结构100的相关介绍，不再赘述。
图4是本申请实施例提供的一种电磁屏蔽结构300的示例图。其中，图4中的(a)为电磁屏蔽结构300所包括的各个组件的示例图；图4中的(b)为图4中的(a)所示的各个组件装配后的侧向剖面示例图。应理解，图4所示的电磁屏蔽结构300仅为示例，不构成对本申请的限定，在实际操作中，各个组件的形状与尺寸可以根据实际情况确定。
如图4所示，电磁屏蔽结构300包括金属罩10和散热结构件20。其中，金属罩10包括侧壁11和顶板12，顶板12包括开口13，侧壁11的底端14固定于印制电路板30，侧壁11用于环绕印制电路板30上的芯片40。散热结构件20包括结构件壳体21、结构凸台22和结构件隔筋23，结构凸台22凸出于结构件壳体21，结构凸台22用于通过顶板12上的开口13与放置在芯片40上的导热垫50接触，结构件壳体21与金属罩10通过导电屏蔽材料60接触，结构件隔筋23用于环绕金属罩10。
应理解，图4中的(a)所示的各个组件的装配过程如下：将金属罩10固定在印制电 路板30上，使其环绕印制电路板30上的芯片40；将导热垫50放置在芯片40上；将散热结构件20通过顶板12上的开口13压向导热垫50，使得散热结构件20的结构凸台22与导热垫50接触对芯片40进行散热，同时使得结构件壳体21与金属罩10通过导电屏蔽材料60、结构件隔筋23接触搭接形成图4中的(b)所示电磁屏蔽结构。还应理解的是，本申请实施例对上述各个步骤执行的先后顺序不做限定。
应理解，关于电磁屏蔽结构300的其他信息可参见上文对于电磁屏蔽结构100的相关介绍，不再赘述。
本申请实施例还提供了一种芯片结构，包括芯片和上述任一可能实现方式中的电磁屏蔽结构。
本申请实施例还提供了一种电子设备，包括上述芯片结构和印制电路板，该芯片结构固定于该印制电路板。
可选地，该电子设备例如可以包括台式电脑、笔记本电脑、智能手机、平板电脑、个人数字助理(personal digital assistant，PDA)、可穿戴设备、智能音箱、电视、无人机、车辆、车载装置(例如车机、车载电脑、车载HUD等)或机器人等等中的任意一项。
本申请实施例还提供了一种车辆，包括上述任一可能实现方式中的电子设备。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种电磁屏蔽结构，其特征在于，包括：
    金属罩，包括侧壁和顶板，所述顶板包括开口，所述侧壁的底端固定于印制电路板，所述侧壁用于环绕所述印制电路板上的芯片；
    散热结构件，包括结构件壳体和结构凸台，所述结构凸台凸出于所述结构件壳体，所述结构凸台用于通过所述顶板上的开口与所述芯片接触。
  2. 根据权利要求1所述的电磁屏蔽结构，其特征在于，所述结构凸台与所述芯片通过导热垫接触。
  3. 根据权利要求1或2所述的电磁屏蔽结构，其特征在于，所述结构件壳体与所述金属罩通过导电屏蔽材料接触。
  4. 根据权利要求3所述的电磁屏蔽结构，其特征在于，所述导电屏蔽材料包括金属簧片或金属弹片。
  5. 根据权利要求4所述的电磁屏蔽结构，其特征在于，
    所述金属簧片或金属弹片固定于所述结构件壳体；或者，
    所述金属簧片或金属弹片固定于所述金属罩的顶板；或者，
    所述金属簧片或金属弹片与所述结构件壳体呈一体结构；或者，
    所述金属簧片或金属弹片与所述金属罩的顶板呈一体结构。
  6. 根据权利要求1至5中任一项所述的电磁屏蔽结构，其特征在于，所述散热结构件还包括：
    结构件隔筋，所述结构件隔筋用于环绕所述金属罩。
  7. 根据权利要求1至6中任一项所述的电磁屏蔽结构，其特征在于，所述金属罩通过焊接固定于所述印制电路板。
  8. 一种芯片结构，其特征在于，包括芯片和如权利要求1至7中任一项所述的电磁屏蔽结构。
  9. 一种电子设备，其特征在于，包括如权利要求8所述的芯片结构以及所述印刷电路板，所述芯片结构固定于所述印制电路板。
  10. 根据权利要求9所述的电子设备，其特征在于，所述电子设备为平视显示器HUD。
  11. 一种车辆，其特征在于，包括如权利要求9或10所述的电子设备。
PCT/CN2023/098397 2022-06-06 2023-06-05 电磁屏蔽结构、芯片结构、电子设备和车辆 WO2023236915A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210635054.X 2022-06-06
CN202210635054.XA CN117241567A (zh) 2022-06-06 2022-06-06 电磁屏蔽结构、芯片结构、电子设备和车辆

Publications (1)

Publication Number Publication Date
WO2023236915A1 true WO2023236915A1 (zh) 2023-12-14

Family

ID=89081321

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/098397 WO2023236915A1 (zh) 2022-06-06 2023-06-05 电磁屏蔽结构、芯片结构、电子设备和车辆

Country Status (2)

Country Link
CN (1) CN117241567A (zh)
WO (1) WO2023236915A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140078677A1 (en) * 2012-09-20 2014-03-20 Dominic E. Dolci Heat Sinking and Electromagnetic Shielding Structures
CN105849897A (zh) * 2014-10-17 2016-08-10 华为技术有限公司 散热屏蔽结构及通信产品
CN205750571U (zh) * 2016-05-13 2016-11-30 浙江水晶光电科技股份有限公司 一种适用于汽车抬头显示设备的温度控制装置
US20170367175A1 (en) * 2016-06-15 2017-12-21 Realtek Semiconductor Corp. Electronic apparatus and heat dissipation and emi shielding structure thereof
CN209487497U (zh) * 2019-04-01 2019-10-11 深圳市赛盛技术有限公司 一种芯片结构
CN210641231U (zh) * 2019-08-01 2020-05-29 湖北亿咖通科技有限公司 用于车机的散热屏蔽装置及车机

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140078677A1 (en) * 2012-09-20 2014-03-20 Dominic E. Dolci Heat Sinking and Electromagnetic Shielding Structures
CN105849897A (zh) * 2014-10-17 2016-08-10 华为技术有限公司 散热屏蔽结构及通信产品
CN205750571U (zh) * 2016-05-13 2016-11-30 浙江水晶光电科技股份有限公司 一种适用于汽车抬头显示设备的温度控制装置
US20170367175A1 (en) * 2016-06-15 2017-12-21 Realtek Semiconductor Corp. Electronic apparatus and heat dissipation and emi shielding structure thereof
CN209487497U (zh) * 2019-04-01 2019-10-11 深圳市赛盛技术有限公司 一种芯片结构
CN210641231U (zh) * 2019-08-01 2020-05-29 湖北亿咖通科技有限公司 用于车机的散热屏蔽装置及车机

Also Published As

Publication number Publication date
CN117241567A (zh) 2023-12-15

Similar Documents

Publication Publication Date Title
JP5417477B2 (ja) 電子機器
US11558496B2 (en) Electronic device including antenna
CN112514546B (zh) 包含屏蔽构件的电子设备
EP3684152B1 (en) Electronic device comprising heat radiating structure
KR20160096927A (ko) 이동 단말기
WO2004068229A1 (ja) 液晶表示装置
US20130265504A1 (en) Television and electronic apparatus
US11503748B2 (en) Electromagnetic-wave-shielding sheet capable of dissipating heat of electronic component and electronic device including the same
US11824151B2 (en) Battery including flexible circuit board connected from side of printed circuit board, and electronic device including the battery
US10139955B2 (en) Display unit for vehicle and display control unit
KR20160009914A (ko) 이동 단말기
JP5627392B2 (ja) 携帯情報端末
KR20210063824A (ko) 방열 구조를 포함하는 전자 장치
CN114466093A (zh) 电子设备
WO2023236915A1 (zh) 电磁屏蔽结构、芯片结构、电子设备和车辆
CN114501259B (zh) 一种内核、扬声器模组和电子设备
CN213585867U (zh) 电子设备
JP2018014428A (ja) 電子機器
WO2022041056A1 (zh) 显示装置及电子设备
CN115665624B (zh) 一种扬声器模组和电子设备
JP2018022312A (ja) 固定用スタンドおよび固定方法
JPH10214045A (ja) 画像表示装置
CN107079609B (zh) 硬件屏蔽设备以及包括硬件屏蔽设备的电子设备
CN115085437A (zh) 振动马达和终端设备
CN211556376U (zh) 一种汽车用多功能控制协议转换器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23819080

Country of ref document: EP

Kind code of ref document: A1