WO2023236427A1 - 一种电子结构及其制作方法 - Google Patents

一种电子结构及其制作方法 Download PDF

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Publication number
WO2023236427A1
WO2023236427A1 PCT/CN2022/129847 CN2022129847W WO2023236427A1 WO 2023236427 A1 WO2023236427 A1 WO 2023236427A1 CN 2022129847 W CN2022129847 W CN 2022129847W WO 2023236427 A1 WO2023236427 A1 WO 2023236427A1
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hole
processed
electronic structure
conductive
manufacturing
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PCT/CN2022/129847
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English (en)
French (fr)
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蒋承志
吕文峰
荆鹏
鲁强
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北京梦之墨科技有限公司
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Publication of WO2023236427A1 publication Critical patent/WO2023236427A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the present application belongs to the field of electronic circuit manufacturing technology, and in particular relates to an electronic structure and a manufacturing method thereof.
  • Vias are also called metallized holes.
  • a common hole is drilled at the intersection of the wires that need to be connected on each layer.
  • the commonly used hole metallization processes are mainly drilling ⁇ cleaning ⁇ shadowing (shielding) ⁇ electroplating. This process is cumbersome to operate, and product performance requires high process control. It also involves electroplating, which is difficult to carry out in industries or regions with high environmental protection requirements. The investment in the production line is large, and the cost is difficult for small companies or entrepreneurial companies to bear.
  • one purpose of this application is to propose a method for manufacturing an electronic structure to solve the problems of complex processes, high costs, and environmental pollution in the current technology.
  • the manufacturing method of the electronic structure includes: providing a substrate; forming a hole to be processed on the substrate; filling the hole to be processed with a conductive slurry and performing a curing process , obtaining a conductive pillar located in the hole to be processed; etching the conductive pillar along the axial direction of the conductive pillar by laser or machinery to obtain a metallized hole; wherein the etching size is smaller than the cross-section of the hole to be processed.
  • the method before etching the conductive pillars, the method further includes: forming positioning marks on the substrate; and laser or mechanical etching of the conductive pillars based on the positioning marks.
  • the hole to be processed is a through hole or a blind hole.
  • the hole to be processed is a through hole; before filling the hole to be processed with the conductive slurry, the method further includes: sealing the hole to be processed from one side of the base material, Thereby, the hole to be processed is filled with conductive slurry from the other side of the base material; and, after the conductive pillar located in the hole to be processed is obtained, the hole to be processed is released.
  • the adhesive force between the diaphragm and the conductive pillar is respectively smaller than the internal stress of the conductive pillar and the bonding force between the conductive pillar and the substrate.
  • Another object of the present application is to propose an electronic structure to solve the problems in the prior art.
  • Figure 1 is a flow chart of a manufacturing method of an electronic structure in an embodiment of the present application
  • Figure 2 is a process example 1 of the manufacturing method of the electronic structure in the embodiment of the present application.
  • Figure 3 is a second process example of the manufacturing method of the electronic structure in the embodiment of the present application.
  • FIG. 4 is a third process example of the manufacturing method of the electronic structure in the embodiment of the present application.
  • the embodiment of the present application discloses a method of manufacturing an electronic structure.
  • Figure 1 is a flow chart of the method of producing an electronic structure in the embodiment of the present application
  • Figure 2 is a diagram of the implementation of the present application.
  • FIG. 3 is the second process example of the manufacturing method of the electronic structure in the embodiment of the present application.
  • the method for making the electronic structure includes:
  • Step S11 provide a substrate
  • Step S13 Fill the hole to be processed with conductive slurry and perform a curing process to obtain a conductive pillar located in the hole to be processed;
  • the base material in the embodiments of this application can be a hard base material or a flexible base material or a flexible stretchable base material, such as PET, PI, PTFE, PC, ABS, LCP, PU, TPU, FR4, paper, wood, One or more composite substrates such as glass, stone, fabric, etc.
  • the method of forming the hole to be processed on the substrate in step S12 is not limited to one or more of punching, cutting, etching, drilling and other subtractive methods.
  • laser etching or mechanical etching punching or drilling
  • laser etching or mechanical etching can be used to form blind holes, which will help improve the production efficiency, hole quality and precision of blind holes.
  • the conductive paste in the embodiment of the present application is a conductive mixture containing a binder and a conductive filler; wherein the binder can be resin or glass powder, and the conductive filler can be gold, silver, copper, aluminum, zinc, nickel, One or more of silver-coated copper, gallium, indium, tin, zinc, bismuth, gallium-based alloy, indium-based alloy, bismuth-based alloy, tin-based alloy, zinc-based alloy, etc.
  • the method of curing the conductive paste in the hole to be processed in step S13 in the embodiment of the present application is not limited to light curing, thermal curing, natural curing, etc.
  • the specific curing method depends on the properties of the selected conductive paste.
  • the curing treatment of the conductive slurry should not cause unacceptable denaturation and deformation of the base material; generally, the curing temperature of the conductive slurry should not be higher than the heat-resistant temperature of the base material, so as to avoid causing problems during the curing process of the conductive slurry.
  • the substrate is curled and deformed, affecting product quality.
  • natural curing and light curing can generally be performed at room temperature and can be applied to most substrates without considering the temperature resistance of the substrate.
  • the conductive pillar is etched along the axial direction of the conductive pillar by laser or machinery to obtain a metallized hole;
  • laser etching refers to using a laser beam to ablate the conductive pillar
  • Mechanical etching refers to the mechanical reduction of conductive pillars using cutting tools such as drills.
  • the etching size is smaller than the cross-section of the hole to be processed, which specifically means that the conductive pillar is etched, and the conductive pillar is not completely etched, leaving a conductive layer attached to the wall of the hole to be processed.
  • etching is performed based on the center point of the conductive pillar, thereby obtaining a conductive layer with uniform wall thickness and improving the aesthetics and consistency of the metallized holes; however, those skilled in the art should understand that without considering the aesthetics and Under the premise of consistency, the requirements for uniform wall thickness of the conductive layer attached to the hole wall can be reduced, so that the center point of the conductive pillar can not be used as the base point for etching.
  • the method of etching the conductive pillars in the embodiment of the present application can be laser etching.
  • mechanical etching there will be no direct rigid contact with the conductive pillars, which reduces the impact of etching on the conductive layer and the substrate.
  • the influence of the bonding force between them can avoid the defect of peeling off of the conductive layer; at the same time, it will not produce waste chips attached to the surface of the substrate, affecting the product quality or increasing the subsequent cleaning process.
  • this application processes conductive pillars to form metalized holes, whether they are via holes or blind holes, which is beneficial to reducing the overall quality of the electronic structure and improving the aesthetics of the electronic structure, and is especially suitable for miniaturized, light and thin electronic structures.
  • FIG. 4 is the third process example of the manufacturing method of the electronic structure in the embodiment of the present application.
  • the hole to be processed in the embodiment of the present application is a through hole
  • the hole to be processed can be sealed from one side of the base material before filling the hole to be processed with conductive slurry. hole, so that the conductive slurry is used to fill the hole to be processed from the other side of the substrate; in this embodiment, by closing one side of the through hole, the conductive slurry can be prevented from seeping during or after the filling process. Leakage affects the quality of metallized holes.
  • some filling equipment on the market (such as printing presses) use negative pressure workbenches.
  • the workbench is equipped with a number of air holes and provides negative pressure to fix the substrate on the workbench. In this application, one side of the through hole is closed so that it can be used on a negative pressure workbench to avoid the negative pressure workbench from affecting the filling process of the hole to be processed.
  • the hole to be processed can be unblocked.
  • the unblocking of the hole to be processed can be removed after the conductive slurry is solidified to obtain the conductive pillar.
  • this application does not specifically limit the unblocking time limit; for example, it can also be obtained after etching. Metalized holes are removed afterwards.
  • a plugging member can be used to seal the hole to be processed.
  • the shape of the plugging member only needs to satisfy the requirement of completely closing one side of the through hole (that is, at least one side is larger than the cross section of the through hole). Its shape does not require Limited to blocks, strips, plates, diaphragms, etc.; preferably, the blocking member can be a diaphragm.
  • the diaphragm is light and thin and easy to combine with the base material; on the other hand, after the diaphragm is combined with the base material, it is not easy to produce unevenness. It can be used as a filling workbench with a flat structure.
  • the material of the blocking member satisfies the following relationship: the adhesive force between the blocking member (such as a diaphragm) and the conductive pillar is respectively smaller than the internal stress of the conductive pillar and the bonding force between the conductive pillar and the base material. The bonding force between them prevents the conductive pillars or conductive pillar fragments from peeling off when the sealing member is removed.
  • a glue layer may be provided on the plugging member.
  • the plugging member is bonded to the base material through the glue layer to seal the hole to be processed, and is closely attached to the base material through the glue layer. On one side, the hole to be processed is closed, thereby further improving the tightness between the sealing member and the base material and avoiding leakage.
  • the adhesive force between the blocking member and the glue layer is greater than the adhesive force between the base material and the glue layer, thereby avoiding damage to the base material when the blocking member is removed.
  • the conductive pillar together with the blocking member adjacent to it may be etched together during the etching process of step S14, thereby reducing the interaction between the blocking member and the conductive member.
  • the influence of the gas in the hole to be processed on the filling can be reduced through process control, such as screen printing, pouring, and spraying. , squeezing, etc.
  • process control such as screen printing, pouring, and spraying. , squeezing, etc.
  • the blocking member (such as a diaphragm) in the embodiments of the present application may have a vent hole that prohibits the leakage of conductive slurry.
  • the vent hole may allow gas to pass through but not allow conductive slurry to pass through. Therefore, During filling, the gas in the hole to be processed can be exhausted as much as possible, thereby achieving a filling effect of the conductive slurry.
  • the blocking member with ventilation holes can use a commercially available breathable film, or use micro-engraving technology (such as laser etching) to form the ventilation holes on the blocking member.
  • the above embodiments describe the filling process of through-holes using a plugging member.
  • the through-holes can be filled without relying on a plugging member.
  • the viscosity and surface tension of the selected conductive slurry In larger cases, there is no need to use plugging parts, and the conductive slurry can be bound in the hole to be processed by relying on its own viscosity and surface tension.
  • the through holes of the base material can also be staggered with the air holes on the workbench, and the filling of the through holes in the embodiment of the present application can also be realized.
  • Another object of the present application is to propose an electronic structure, which can be obtained by any of the above-described electronic structure manufacturing methods.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

本申请公开了一种电子结构及其制作方法，涉及电子电路制造技术领域；该电子结构的制作方法，包括：提供一基材；在所述基材之上形成待加工孔；利用导电浆料填灌所述待加工孔并进行固化处理，获得位于待加工孔内的导电柱；通过激光或机械沿所述导电柱的轴向刻蚀所述导电柱，获得金属化孔；其中，刻蚀尺寸小于所述待加工孔的横截面。本申请通过利用导电浆料填灌待加工孔，再通过激光刻蚀的方式形成金属化孔，相对于现有技术而言，只需要填灌工艺和镭雕工艺，工艺简单，易于实施；并且无需搭建电镀环境，技术与成本要求远低于电镀，而且该工艺不会伴随产生污染废气、废液，满足环保要求高的行业或地区使用。

Description

一种电子结构及其制作方法
本申请要求于2022年06月06日提交中国专利局，申请号为2022106291715，申请名称为“一种电子结构及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于电子电路制造技术领域，尤其涉及一种电子结构及其制作方法。
背景技术
过孔也称金属化孔。在双面板和多层板中，为连通各层之间的印制导线，在各层需要连通的导线的交汇处钻上一个公共孔。针对目前的FPC和PCB等电子线路板，常用的孔金属化工艺主要为钻孔→清洗→黑影(遮蔽)→电镀。此工艺操作繁琐，产品性能对工艺过程控制要求高；同时涉及到电镀，在环保要求高的行业或者地区难以开展；产线投入大，成本对于小公司或创业型公司很难承受。
申请内容
有鉴于此，本申请的一个目的是提出一种电子结构的制作方法,以解决现在技术中工艺复杂、成本高、污染环境的问题。
在一些说明性实施例中，所述电子结构的制作方法，包括：提供一基材；在所述基材之上形成待加工孔；利用导电浆料填灌所述待加工孔并进行固化处理，获得位于待加工孔内的导电柱；通过激光或机械沿所述导电柱的轴向刻蚀所述导电柱，获得金属化孔；其中，刻蚀尺寸小于所述待加工孔的横截面。
在一些可选地实施例中，在刻蚀所述导电柱之前，还包括：在所述基材之上形成定位标识；基于所述定位标识对所述导电柱进行激光或机械刻蚀。
在一些可选地实施例中，所述待加工孔为贯穿孔或盲孔。
在一些可选地实施例中，所述待加工孔为贯穿孔；在利用导电浆料填灌所述待加工孔之前，还包括：自所述基材的一侧封闭所述待加工孔，从而自所述基材的另一侧利用导电浆料填灌所述待加工孔；以及，在获得位于所述待加工孔内的导电柱之后，解除对所述待加工孔的封闭。
在一些可选地实施例中，所述自所述基材的一侧封闭所述待加工孔，具体包括：利用膜片封闭所述待加工孔。
在一些可选地实施例中，所述膜片上设有胶层；所述膜片通过胶层粘合在所述基材上封闭所述待加工孔；其中，所述膜片与所述胶层之间的粘合力大于所述基材与所述胶层之间的粘合力。
在一些可选地实施例中，所述膜片与所述导电柱之间的粘合力分别小于所述导电柱的内应力和所述导电柱与所述基材之间的结合力。
在一些可选地实施例中，利用所述激光或机械对所述导电柱连同其底部膜片进行一并刻蚀。
在一些可选地实施例中，所述膜片上开设有禁止所述导电浆料渗漏的透气孔。
本申请的另一个目的在于提出一种电子结构，以解决现有技术中的问题。
在一些说明性实施例中，所述电子结构通过上述任一项所述的电子结构的制作方法获得。
与现有技术相比，本申请具有如下优势：
本申请通过利用导电浆料填灌待加工孔，再通过激光刻蚀的方式形成金属化孔，相对于现有技术而言，只需要填灌工艺和镭雕工艺，工艺简单，易于实施；并且无需搭建电镀环境，技术与成本要求远低于电镀，而且该工艺不会伴随产生污染废气、废液，满足环保要求高的行业或地区使用。
附图说明
图1是本申请实施例中的电子结构的制作方法的流程图；
图2是本申请实施例中的电子结构的制作方法的工艺示例一；
图3是本申请实施例中的电子结构的制作方法的工艺示例二；
图4是本申请实施例中的电子结构的制作方法的工艺示例三。
具体实施方式
现将详细地参照本申请的各种实施例，在附图中示出了所述实施例的示例。当结合这些实施例进行描述时，应当理解的是，所述实施例并不旨将本申请限制于这些实施例。相反，本申请旨在覆盖可以包括在所附权利要求书所定义的本申请的精神和范围内的替代形式、修改形式和等效物。此外，在本申请的以下具体实施方式中，阐述了许多具体细节以便提供对本申请的透彻理解。然而，应当理解的是，在没有这些特定细节的情况下也可以实践本申请。
需要说明的是，在不冲突的情况下本申请实施例中的各技术特征均可以相互结合。
本申请实施例中公开了一种电子结构的制作方法，具体地，如图1-3所示，图1是本申请实施例中的电子结构的制作方法的流程图；图2是本申请实施例中的电子结构的制作方法的工艺示例一；图3是本申请实施例中的电子结构的制作方法的工艺示例二。该电子结构的制作方法，包括：
步骤S11、提供一基材；
步骤S12、在所述基材之上形成待加工孔；其中，待加工孔可以包含贯穿孔，也可以包含盲孔，又或者既包含有待加工孔又包含盲孔；
步骤S13、利用导电浆料填灌所述待加工孔并进行固化处理，获得位于待加工孔内的导电柱；
步骤S14、通过激光或机械沿所述导电柱的轴向刻蚀所述导电柱，获得金属化孔；其中，刻蚀尺寸小于所述待加工孔的横截面。
本申请通过利用导电浆料填灌待加工孔，再以刻蚀的方式形成金属化孔，相对于现有技术而言，只需要填灌工艺和刻蚀工艺，工艺简单，易于实施；并且无需搭建电镀环境，技术与成本要求远低于电镀，而且该工艺不会伴随产生污染废气、废液，满足环保要求高的行业或地区使用。
本申请实施例中的基材可选用硬质基材或柔性基材或柔性可拉伸基材，如PET、PI、PTFE、PC、ABS、LCP、PU、TPU、FR4、纸材、木材、玻璃、石材、织物等中的一种或多种复合基材。
本申请实施例中步骤S12中在所述基材之上形成待加工孔的方式不限于冲孔、裁减、刻蚀、钻孔等减材方式中的一种或多种。优选地，针对于贯穿孔而言，可选用激光刻蚀或机械刻蚀(冲孔或钻孔)的方式形成贯穿孔，有利于提升贯穿孔的制作效率、孔质量与精密度。而针对于盲孔而言，可选用激光刻蚀或机械刻蚀(钻孔)的方式形成盲孔，有利于提升盲孔的制作效率、孔质量与精密度。
在另一些实施例中，在基材之上形成待加工孔的方式还可以通过堆叠组合的方式形成，即利用预先形成有贯穿孔的基材进行对位堆叠形成本申请实施例中的待加工孔(如贯穿孔)，以及利用预先形成有贯穿孔的基材(或预先形成有盲孔的基材)配合其他基材进行对位堆叠形成本申请实施例中的待加工孔(如盲孔)。其中，本申请实施例中不限制该实施例中堆叠的层数及厚度。该实施例适用于多层板的金属化孔的加工处理。
本申请实施例中的导电浆料为包含有粘结剂与导电填料的导电混合物；其中，粘结剂可选用树脂或玻璃粉，导电填料可选用金、银、铜、铝、锌、镍、银包铜、镓、 铟、锡、锌、铋、镓基合金、铟基合金、铋基合金、锡基合金、锌基合金等中的一种或多种。
本申请实施例中步骤S13中利用导电浆料填灌所述待加工孔的方式不限于喷涂、印刷、打印、刮涂、挤出、浇灌等中的一种或多种方式。优选地，利用导电浆料填灌所述待加工孔的方式可选用印刷工艺，相对于其它工艺而言，具有易控、高效、无需额外前/后处理的优势。另一方面，在印刷过程中，可对导电浆料及待加工孔施加一定的压力，也有利于导电浆料在待加工孔内的填实与紧密结合，进而提升后续金属化孔的质量、以及与待加工孔壁的附着强度。
本申请实施例中的步骤S13中对待加工孔内的导电浆料进行固化处理的方式不限于光固化、热固化、自然固化等。具体固化方式由选用的导电浆料的性质而定。其中，导电浆料的固化处理不应引起基材产生不可接受的变性与变形；一般的，导电浆料的固化温度不应高于基材的耐温温度，从而避免导电浆料固化过程中造成基材卷曲、变形，影响产品质量。其中，自然固化与光固化一般可在室温环境下进行，可适用于绝大多数的基材，可无需考虑基材的耐温温度。
优选地，本申请实施例中导电浆料选用热固型导电浆料，固化方式为热烘；相对于光固型导电浆料而言，其成本远低于光固型导电浆料；另一方面，热固型导电浆料具有固化充分、高效的优势。
本申请实施例中步骤S14中通过激光或机械沿所述导电柱的轴向刻蚀所述导电柱，获得金属化孔；其中，激光刻蚀是指利用激光束对导电柱进行烧蚀处理，机械刻蚀是指利用钻头等加工刀头对导电柱进行机械减材处理。其中，刻蚀尺寸小于所述待加工孔的横截面，具体是指针对导电柱进行刻蚀，且未完全刻蚀导电柱，仍留有导电层附着在待加工孔孔壁。一般的，刻蚀以导电柱的中心点为基点进行刻蚀，从而得到壁厚均匀的导电层，提升金属化孔的美观感和一致性；但本领域技术人员应理解，在不考虑美观和一致性的前提下，可降低对附着在孔壁上的导电层的壁厚均匀要求，从而可不以导电柱的中心点为基点进行刻蚀。
优选地，本申请实施例中的刻蚀导电柱的方式可选用激光刻蚀，相比于机械刻蚀而言，不会与导电柱产生直接的刚性接触，降低刻蚀对导电层与基材之间结合力的影响，避免导电层出现脱落剥离的缺陷；同时，也不会产生废屑附着在基材表面，影响产品质量或增加后续清洁工序。
另一方面，本申请通过加工导电柱形成金属化孔，无论是过孔或盲孔，有利于降低电子结构的整体质量，提升电子结构的美观感，尤其适用于小型化轻薄型电子结构。
如图4所示，图4是本申请实施例中的电子结构的制作方法的工艺示例三。
在一些实施例中，本申请实施例中的待加工孔为贯穿孔的情况时，可在利用导电浆料填灌所述待加工孔之前，自所述基材的一侧封闭所述待加工孔，从而自所述基材的另一侧利用导电浆料填灌所述待加工孔；该实施例中通过封闭贯穿孔的一侧，可避免导电浆料在填灌过程中或之后出现渗漏影响金属化孔质量的问题。另一方面，市面上的部分填灌设备(例如印刷机)的工作台选用负压工作台，其工作台上开设有若干气孔，并提供负压的方式将基材固定保持在工作台上，本申请中通过封闭贯穿孔的一侧，使其可适用于负压工作台，避免负压工作台对待加工孔的填灌工序造成影响。
再有，在获得位于所述待加工孔内的导电柱之后，可解除对所述待加工孔的封闭。其中，解除对所述待加工孔的封闭可在导电浆料固化得到导电柱之后即可去除，除此之外，本申请不对解除时限进行具体限制；示例性的，亦可在经过刻蚀得到金属化孔之后去除。
本申请实施例中的封闭所述待加工孔可选用封堵件，该封堵件的形状只要满足完全封闭贯穿孔的一侧即可(即至少一面大于贯穿孔的横截面)，其形状不限于块、条、板、膜片等；优选地，封堵件可选用膜片，一方面膜片轻薄，易于与基材结合；另一方面，膜片与基材结合后，不易产生凹凸，可满足平面结构的填灌工作台使用。
其中，封堵件的材质满足如下关系：封堵件(如膜片)与所述导电柱之间的粘合力分别小于所述导电柱的内应力和所述导电柱与所述基材之间的结合力，从而避免封堵件移除时，连带导电柱或导电柱碎片剥落。
进一步的，本申请实施例中封堵件上可设有胶层，所述封堵件通过胶层粘合在所述基材上封闭所述待加工孔，通过胶层紧密贴附在基材一侧，封闭待加工孔，从而进一步提升封堵件与基材之间的紧密程度，避免渗漏现象的出现。其中，所述封堵件与所述胶层之间的粘合力大于所述基材与所述胶层之间的粘合力，从而避免封堵件移除时，对基材造成破坏。
另一方面，在利用封堵件封闭依次贯穿孔的情况下，可在步骤S14的刻蚀过程中对导电柱连同与其相邻的封堵件进行一并刻蚀，从而降低封堵件与导电柱之间的接触面积，进而降低封堵件与导电柱之间的结合强度，避免封堵件移出时，带离导电柱或导电柱碎片。
在一些实施例中，本申请实施例中步骤S13中往待加工孔内填灌导电浆料时，可通过工艺控制降低待加工孔内气体对于填灌的影响，例如丝网印刷、浇灌、喷涂、挤 入等方式，这些工艺通过逐步填充的方式填灌待加工孔，可以使待加工孔中的气体在逐步填灌的过程中，逐渐排出至完全排出，进而达到导电浆料填实的效果。
在另一些实施例中，本申请实施例中的封堵件(例如膜片)可具有禁止导电浆料渗漏的透气孔，该透气孔可允许气体通过，而不允许导电浆料通过，因此在填灌时，可尽可能的排出待加工孔内的气体，从而实现填灌导电浆料的填实效果。其中，带有透气孔的封堵件可采用市面上的透气膜，又或者利用微刻技术(如激光刻蚀)在封堵件上形成该透气孔。
上述实施例中阐述了配合封堵件实现贯穿孔的填灌工序，在另一些实施例中，针对贯穿孔亦可不依靠于封堵件进行填灌，在选用的导电浆料的粘度和表面张力较大的情况下，无需利用封堵件，依靠导电浆料自身的粘度和表面张力即可将其束缚在待加工孔内。而针对负压工作台而言，亦可使基材的贯穿孔错开工作台上的气孔，亦可实现本申请实施例中贯穿孔的填灌。
本申请的另一个目的在于提出一种电子结构，该电子结构可通过上述任一项所述的电子结构的制作方法获得。
本领域技术人员还应当理解，结合本文的实施例描述的各种说明性的逻辑框、模块、电路和算法步骤均可以实现成电子硬件、计算机软件或其组合。为了清楚地说明硬件和软件之间的可交换性，上面对各种说明性的部件、框、模块、电路和步骤均围绕其功能进行了一般地描述。至于这种功能是实现成硬件还是实现成软件，取决于特定的应用和对整个系统所施加的设计约束条件。熟练的技术人员可以针对每个特定应用，以变通的方式实现所描述的功能，但是，这种实现决策不应解释为背离本申请的保护范围。

Claims (10)

  1. 一种电子结构的制作方法，其特征在于，包括：
    提供一基材；
    在所述基材之上形成待加工孔；
    利用导电浆料填灌所述待加工孔并进行固化处理，获得位于待加工孔内的导电柱；
    通过激光或机械沿所述导电柱的轴向刻蚀所述导电柱，获得金属化孔；
    其中，刻蚀尺寸小于所述待加工孔的横截面。
  2. 根据权利要求1所述的电子结构的制作方法，其特征在于，在刻蚀所述导电柱之前，还包括：
    在所述基材之上形成定位标识；
    基于所述定位标识对所述导电柱进行激光或机械刻蚀。
  3. 根据权利要求1所述的电子结构的制作方法，其特征在于，所述待加工孔为贯穿孔或盲孔。
  4. 根据权利要求3所述的电子结构的制作方法，其特征在于，所述待加工孔为贯穿孔；在利用导电浆料填灌所述待加工孔之前，还包括：
    自所述基材的一侧封闭所述待加工孔，从而自所述基材的另一侧利用导电浆料填灌所述待加工孔；以及，
    在获得位于所述待加工孔内的导电柱之后，解除对所述待加工孔的封闭。
  5. 根据权利要求4所述的电子结构的制作方法，其特征在于，所述自所述基材的一侧封闭所述待加工孔，具体包括：
    利用膜片封闭所述待加工孔。
  6. 根据权利要求5所述的电子结构的制作方法，其特征在于，所述膜片上设有胶层；所述膜片通过胶层粘合在所述基材上封闭所述待加工孔；其中，所述膜片与所述胶层之间的粘合力大于所述基材与所述胶层之间的粘合力。
  7. 根据权利要求5所述的电子结构的制作方法，其特征在于，所述膜片与所述导电柱之间的粘合力分别小于所述导电柱的内应力和所述导电柱与所述基材之间的结合力。
  8. 根据权利要求5所述的电子结构的制作方法，其特征在于，利用所述激光或机械对所述导电柱连同其底部膜片进行一并刻蚀。
  9. 根据权利要求5所述的电子结构的制作方法，其特征在于，所述膜片上开设有禁止所述导电浆料渗漏的透气孔。
  10. 一种电子结构，其特征在于，通过权利要求1-9中任一项所述的电子结构的制作方法获得。
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