WO2023178779A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2023178779A1
WO2023178779A1 PCT/CN2022/087668 CN2022087668W WO2023178779A1 WO 2023178779 A1 WO2023178779 A1 WO 2023178779A1 CN 2022087668 W CN2022087668 W CN 2022087668W WO 2023178779 A1 WO2023178779 A1 WO 2023178779A1
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WIPO (PCT)
Prior art keywords
layer
sub
area
substrate
packaging
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PCT/CN2022/087668
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English (en)
French (fr)
Inventor
白丹
Original Assignee
武汉华星光电半导体显示技术有限公司
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Publication of WO2023178779A1 publication Critical patent/WO2023178779A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel and a display device.
  • LTPO LowTemperaturePolycrystallineOxide, low-temperature polycrystalline oxide
  • LTPSTFT LowTemperaturePoly-SiliconTFT, low-temperature polysilicon thin film transistor
  • LTPOTFT LowTemperaturePolycrystallineOxideTFT, low-temperature polycrystalline oxide thin film transistor
  • LTPO display panel in order to block the intrusion of water and oxygen, special structures are formed at certain positions of the LTPO display panel, which can make the organic electrode layer incoherent at these special positions, while the thin film packaging structure is coherent, for example: LTPO display
  • the panel includes a display area and a peripheral area adjacent to the display area.
  • the inorganic layer structure In the peripheral area, the inorganic layer structure includes an undercut opening with an opening.
  • the organic electrode layer is disposed on the inorganic layer structure and in the undercut of the inorganic layer structure.
  • the openings are disconnected to prevent moisture and/or oxygen from intruding into the LTPO display panel from the organic electrode layer and affecting the reliability of the product; however, due to the undercut openings being provided on the inorganic layer structure, the steps are more cumbersome, which will Reduce production capacity and increase preparation costs.
  • the display panel includes a display area 1000, a functional area 2000, and a packaging area 3000 located between the display area 1000 and the functional area 2000; in the packaging area 3000, the display panel includes a ladder structure 132.
  • an undercut opening 1320 is usually provided on the side of the ladder structure 132
  • the electrode layer 170 is disposed on the ladder structure 132
  • the electrode layer 170 is disconnected on the undercut opening 1320 of the ladder structure 132, so that It prevents moisture and/or oxygen from intruding into the display panel.
  • the ladder structure 132 is usually a metal structure.
  • the ladder structure 132 includes a stacked third film layer 1323 and a first film layer. 1321 and the second film layer 1322, wherein the material of the third film layer 1323 and the material of the second film layer 1322 are metal titanium, and the material of the first film layer 1321 is metal aluminum.
  • the undercut opening 1320 is formed in the step structure 132 by side etching the first film layer 1321.
  • the thickness of the second film layer 1322 is thin (generally tens of nanometers), it is easy to Affected by the subsequent manufacturing process of the display panel, it collapses (for example, opening a hole in the functional area 2000 ), thereby causing damage to the undercut opening 1320 , thereby causing the electrode layer 170 located on the stepped structure 132 to be at the undercut opening 1320 It cannot be disconnected, eventually causing moisture and/or oxygen to penetrate from the outside of the organic electrode layer into the display device, affecting the reliability of the product.
  • Embodiments of the present application provide a display panel and a display device to alleviate deficiencies in related technologies.
  • An embodiment of the present application provides a display panel, including a display area, a functional area, and a packaging area located between the display area and the functional area;
  • the display panel includes:
  • a ladder structure is provided on the substrate and is located in the packaging area.
  • An undercut opening is provided on the side of the ladder structure.
  • the ladder structure at least includes a first film layer and a second film layer that are stacked. The undercut opening is opened on the side of the first film layer, and the orthographic projection of the second film layer on the base covers the orthographic projection of the first film layer on the base;
  • An electrode layer is provided on the ladder structure and the substrate, and the electrode layer is disconnected at the undercut opening;
  • the second film layer includes a first sub-layer and a second sub-layer stacked on a side of the first film layer away from the substrate, and the thickness of the second sub-layer is greater than that of the first sub-layer.
  • thickness and the first sub-layer is a metal film layer, and the second sub-layer is an organic film layer.
  • the display panel includes a first insulating functional layer located between the substrate and the ladder structure;
  • the stepped structure includes a plurality of stepped sub-sections spaced apart in the packaging area, and the undercut opening is provided on the side of each of the stepped sub-sections;
  • the electrode layer includes a first electrode layer located on a plurality of the ladder portions and a second electrode layer located on the first insulating functional layer.
  • the display panel further includes a plurality of channels located at intervals in the packaging area, and the channels include via holes passing through the first insulating layer functional layer. ;
  • the orthographic projection of the step portion on the substrate does not overlap with the orthographic projection of the channel on the substrate.
  • the packaging area includes a first packaging sub-area, a second packaging sub-area, and a spacer area between the first packaging sub-area and the second packaging sub-area.
  • the first packaging area is close to the functional area
  • the second packaging area is close to the display area;
  • the ladder structure includes a plurality of first ladder sub-sections spaced in the first packaging sub-region, and a plurality of second ladder sub-sections spaced in the second packaging sub-region;
  • the channel is located in the second packaging area, and an orthographic projection of the channel on the substrate does not overlap with an orthographic projection of the second stepped portion on the substrate.
  • the orthographic projection of the second stepped portion on the substrate is located between the orthographic projections of two adjacent channels on the substrate.
  • the display panel includes a thin film transistor layer provided on the substrate, and an insulating layer provided on the thin film transistor layer.
  • the insulating layer includes a layer located on the display panel. a second insulating functional layer within the region and the second sub-layer located within the packaging region.
  • the second insulating functional layer includes a flat layer located in the display area and disposed on the thin film transistor layer, and the material of the second sub-layer is different from the material of the thin film transistor layer.
  • the flat layer is made of the same material.
  • the thickness of the second sub-layer is greater than or equal to the thickness of the flat layer.
  • the thin film transistor layer includes a metal layer located between the substrate and the insulating layer, and the metal layer includes the ladder structure;
  • the ladder structure includes a stacked third film layer, the first film layer and the second film layer, wherein the material of the third film layer, the material of the first film layer and the The materials of the first sub-layer are all metal materials, and the materials of the second sub-layer are organic insulating materials.
  • the orthographic projection of the third film layer on the substrate overlaps with the orthographic projection of the second film layer on the substrate.
  • the display device includes a display panel, and the display panel includes:
  • It includes a display area, a functional area and a packaging area located between the display area and the functional area;
  • the display panel includes:
  • a ladder structure is provided on the substrate and is located in the packaging area.
  • An undercut opening is provided on the side of the ladder structure.
  • the ladder structure at least includes a first film layer and a second film layer that are stacked. The undercut opening is opened on the side of the first film layer, and the orthographic projection of the second film layer on the base covers the orthographic projection of the first film layer on the base;
  • An electrode layer is provided on the ladder structure and the substrate, and the electrode layer is disconnected at the undercut opening;
  • the second film layer includes a first sub-layer and a second sub-layer stacked on a side of the first film layer away from the substrate, and the thickness of the second sub-layer is greater than that of the first sub-layer.
  • thickness and the first sub-layer is a metal film layer, and the second sub-layer is an organic film layer.
  • the display panel includes a first insulating functional layer located between the substrate and the ladder structure;
  • the stepped structure includes a plurality of stepped sub-sections spaced apart in the packaging area, and the undercut opening is provided on the side of each of the stepped sub-sections;
  • the electrode layer includes a first electrode layer located on a plurality of the ladder portions and a second electrode layer located on the first insulating functional layer.
  • the display panel further includes a plurality of channels located at intervals in the packaging area, and the channels include via holes passing through the first insulating layer functional layer. ;
  • the orthographic projection of the step portion on the substrate does not overlap with the orthographic projection of the channel on the substrate.
  • the packaging area includes a first packaging sub-area, a second packaging sub-area, and a spacer area between the first packaging sub-area and the second packaging sub-area.
  • the first packaging area is close to the functional area
  • the second packaging area is close to the display area;
  • the ladder structure includes a plurality of first ladder sub-sections spaced in the first packaging sub-region, and a plurality of second ladder sub-sections spaced in the second packaging sub-region;
  • the channel is located in the second packaging area, and an orthographic projection of the channel on the substrate does not overlap with an orthographic projection of the second stepped portion on the substrate.
  • the orthographic projection of the second stepped portion on the substrate is located between the orthographic projections of two adjacent channels on the substrate.
  • the display panel includes a thin film transistor layer provided on the substrate, and an insulating layer provided on the thin film transistor layer.
  • the insulating layer includes a layer located on the display panel. a second insulating functional layer within the region and the second sub-layer located within the packaging region.
  • the second insulating functional layer includes a flat layer located in the display area and disposed on the thin film transistor layer, and the material of the second sub-layer is different from the material of the thin film transistor layer.
  • the flat layer is made of the same material.
  • the thickness of the second sub-layer is greater than or equal to the thickness of the flat layer.
  • the thin film transistor layer includes a metal layer located between the substrate and the insulating layer, and the metal layer includes the ladder structure;
  • the ladder structure includes a stacked third film layer, the first film layer and the second film layer, wherein the material of the third film layer, the material of the first film layer and the The materials of the first sub-layer are all metal materials, and the materials of the second sub-layer are organic insulating materials.
  • the orthographic projection of the third film layer on the substrate overlaps with the orthographic projection of the second film layer on the substrate.
  • Embodiments of the present application provide a display panel and a display device.
  • the display panel includes a display area, a functional area, and a packaging area between the display area and the functional area.
  • the display panel includes: a substrate; and a ladder structure. , is provided on the substrate and is located in the packaging area, the ladder structure at least includes a first film layer and a second film layer that are stacked, and an undercut opening is provided on the side of the first film layer,
  • the orthographic projection of the second film layer on the base covers the orthographic projection of the first film layer on the base; an electrode layer is provided on the ladder structure and the base, and the electrode layer is on the base Disconnected at the incision, the embodiment of the present application includes a first sub-layer and a second sub-layer stacked on the side of the first film layer away from the substrate by arranging the second film layer.
  • the thickness of the sub-layer is greater than the thickness of the first sub-layer, and the first sub-layer is a metal film layer, and the second sub-layer is an organic film layer, thereby protecting the first sub-layer, This prevents the first sub-layer from collapsing and other undesirable phenomena during the preparation process of the display panel, which in turn causes water and oxygen to diffuse from the packaging area to the display area, affecting the reliability of the display device.
  • Figure 1 is a schematic cross-sectional view of an existing display panel
  • Figure 2 is an enlarged view of point A in Figure 1;
  • Figure 3 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application.
  • Figure 4 is an enlarged view of B in Figure 3;
  • Figure 5 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application.
  • FIGS. 6A to 6F are structural process flow charts for manufacturing the display panel in FIG. 5 .
  • This embodiment provides a display panel 1, which includes a display area 1000, a functional area 2000, and a packaging area 3000 located between the display area 1000 and the functional area 2000; the display panel 1 includes:
  • the ladder structure 132 is provided on the substrate 10 and is located in the packaging area 3000.
  • An undercut opening 1320 is provided on the side of the ladder structure 132.
  • the ladder structure 132 at least includes a stacked first film layer. 1321 and the second film layer 1322, the undercut opening 1320 is opened on the side of the first film layer 1321, and the orthographic projection of the second film layer 1322 on the substrate 10 covers the first film The orthographic projection of layer 1321 on the substrate 10;
  • the electrode layer 170 is provided on the ladder structure 132 and the substrate 10, and the electrode layer 170 is disconnected at the undercut opening 1320;
  • the second film layer 1322 includes a first sub-layer 1322A and a second sub-layer 1322B stacked on a side of the first film layer 1321 away from the substrate 10 , and the thickness of the second sub-layer 1322B is greater than The thickness of the first sub-layer 1322A, and the first sub-layer 1322A is a metal film layer, and the second sub-layer 1322B is an organic film layer.
  • FIG. 1 is a schematic cross-sectional view of the existing display panel
  • Figure 2 is an enlarged view of point A in Figure 1
  • the display panel 1 includes a display area 1000, a functional area 2000, and a packaging area 3000 located between the display area 1000 and the functional area 2000; in the packaging area 3000, the display panel 1 includes a ladder structure 132.
  • a An undercut opening 1320 is provided on the side of the ladder structure 132.
  • the electrode layer 170 is disposed on the ladder structure 132, and the electrode layer 170 is disconnected on the undercut opening 1320 of the ladder structure 132, thereby blocking the intrusion of moisture and/or oxygen.
  • the display panel 1 can also commission production capacity and reduce the manufacturing cost of the display panel 1.
  • Figure 2 is an enlarged view of A in Figure 1.
  • the ladder structure 132 is usually a metal structure.
  • the ladder structure 132 includes a stacked third film layer 1323, a first film layer 1321 and a second film layer 1322, wherein the material of the third film layer 1323 and the second film layer 1322 is metal titanium, and the first film layer 1323 is made of metal titanium.
  • the material of the layer 1321 is metal aluminum.
  • the first film layer 1321 is side-engraved to form the undercut opening 1320 in the step structure 132.
  • the thickness of the second film layer 1322 is thin and is easily affected by the subsequent manufacturing process of the display panel 1 and collapses, thereby causing damage to the undercut opening 1320 and causing the electrode layer 170 located on the ladder structure 132 to be at the undercut opening 1320 It cannot be disconnected, eventually causing moisture and/or oxygen to penetrate from outside the organic electrode layer 170 into the display device, affecting the reliability of the product.
  • arranging the second film layer 1322 in the ladder structure 132 includes stacking a first sub-layer 1322A and a first sub-layer 1322A disposed on the side of the first film layer 1321 away from the substrate 10 Second sub-layer 1322B, the thickness of the second sub-layer 1322B is greater than the thickness of the first sub-layer 1322A, and the first sub-layer 1322A is a metal film layer, and the second sub-layer 1322B is an organic film layer , thereby protecting the first sub-layer 1322A and preventing the first sub-layer 1322A from collapsing and other undesirable phenomena during the preparation process of the display panel 1 , thereby causing water and oxygen to flow from the packaging area 3000 to The display area 1000 is diffused, which affects the reliability of the display device.
  • FIG. 3 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application
  • FIG. 4 is an enlarged view of position B in FIG. 3 .
  • the display panel 1 includes a display area 1000, a functional area 2000, and a packaging area 3000 located between the display area 1000 and the functional area 2000; the display panel 1 includes a stacked substrate 10 , buffer layer 20, thin film transistor layer 200 and insulating layer 300; wherein, the thin film transistor layer 200 includes a first thin film transistor (not shown in the figure) and a second thin film transistor (not labeled in the figure) arranged at intervals, so The first thin film transistor includes a polysilicon semiconductor layer (not shown in the figure) located on the substrate 10, and the second thin film transistor includes an oxide semiconductor layer (not labeled in the figure) located on the substrate 10.
  • LTPO Low Temperature Polycrystalline Oxide, low-temperature polycrystalline oxide
  • the substrate 10 includes a first substrate 11, a spacer layer 12 and a second substrate 13 that are stacked in sequence; wherein the first substrate 11 and the second substrate 13 may each include a rigid substrate or a flexible substrate.
  • the material when both the first substrate 11 and the second substrate 13 are rigid substrates, the material may be metal or glass.
  • the material may include acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane-based resin, cellulose resin, silicone resin, polyimide-based At least one of resin and polyamide-based resin;
  • the material of the spacer layer 12 includes but is not limited to silicon nitride (SiNx), silicon oxide (SiOx) and other materials with water absorption properties.
  • the third The materials of the substrate 11, the second substrate 13 and the spacer layer 12 are not limited.
  • the thin film transistor layer 200 includes a first gate insulating layer 30, a first metal layer 40, a second gate insulating layer 50, a second metal layer 60 and a first interlayer insulating layer stacked on the substrate 10. 70.
  • the layer 40 includes a first gate electrode 41
  • the second metal layer 60 includes a second gate electrode 61
  • the third metal layer 90 includes a third gate electrode 91
  • the fourth metal layer 110 includes a first source and drain electrode.
  • the fifth metal layer 130 includes a second source and drain electrode 131.
  • the first gate 41 , the second gate 61 and the third gate 91 may all include low-resistance metal materials.
  • the gates may include molybdenum (Mo), aluminum (Al). , conductive materials such as copper (Cu) and/or titanium (Ti), and may include a single layer or multiple layers of the above materials.
  • the first source-drain electrode 111 and the second source-drain electrode 131 may include conductive materials.
  • the materials of the first source-drain electrode 111 and the second source-drain electrode 131 may include molybdenum (Mo). ), aluminum (Al), copper (Cu) and/or titanium (Ti), and may include multiple layers or a single layer of the above materials; it should be noted that in this embodiment, the second source leakage
  • the pole 131 includes a multi-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti) as an example to illustrate the technical solution of the present application.
  • the insulating layer 300 includes a stacked first insulating functional layer (not labeled in the figure) and a second insulating functional layer (not labeled in the figure), and the first insulating layer includes a stacked third gate insulating layer 80 and a second interlayer insulating layer 100.
  • the second insulating functional layer includes a second flat layer 140, a pixel definition layer 150 and a spacer layer 160 stacked on the fifth metal layer 130, wherein the Both the flat layer 120 and the second flat layer 140 include organic insulating materials, and the pixel definition layer 150 includes inorganic insulating materials.
  • the display panel 1 also includes openings (not shown in the figure) located in the functional area 2000.
  • the openings can pass through multiple film layers located on/above the substrate 10, such as buffer layer 20,
  • the first gate insulating layer 30 , the second gate insulating layer 50 , the first interlayer insulating layer 70 , the third gate insulating layer 80 , the second interlayer insulating layer 100 and the first planarization layer 120 can also be passed through.
  • the substrate 10 is not specifically limited in this embodiment; the openings may have any of various suitable shapes, such as rectangular and elliptical; the number of the openings is not limited to one; explanation is required. It should be noted that this embodiment uses the partial film layer of the display panel 1 corresponding to the functional area 2000 for cutting shaped openings as an example to illustrate the technical solution of the present application, wherein the cut partial film layer does not Make specific limitations.
  • the display panel 1 includes a ladder structure 132 disposed on the substrate 10 and located in the packaging area 3000.
  • An undercut opening 1320 is provided on the side of the ladder structure 132.
  • the ladder structure 132 at least includes a stacked structure.
  • the first film layer 1321 and the second film layer 1322, the undercut opening 1320 is opened on the side of the first film layer 1321; specifically, the ladder structure 132 includes a layer stacked on the substrate 10
  • the third film layer 1323, the first film layer 1321 and the second film layer 1322, the undercut opening 1320 is opened on the side of the first film layer 1321, the second film layer 1322 is on the substrate 10
  • the orthographic projection of the first film layer 1321 on the substrate 10 covers the orthographic projection of the third film layer 1323 on the substrate 10 and the orthographic projection of the second film layer 1322 on the substrate 10 The orthographic projection on overlaps.
  • the material of the ladder structure 132 includes metal.
  • the ladder structure 132 may include materials used to form the first gate 41 , the second gate 61 , the third gate 91 , and the third gate 91 .
  • the material of one of the source and drain electrodes 111 and the second source and drain electrodes 131 is the same material.
  • the fourth metal layer 110 includes the ladder structure 132.
  • the ladder structure 132 is made of the same material as the second source and drain electrode 131 and is arranged in the same layer. That is, the ladder structure 132 and the second source and drain electrode 131 are made of the same material.
  • the source and drain electrodes 131 can be manufactured in the same process, thereby reducing the manufacturing cost of the display panel 1 and minimizing the impact on the thickness of the display panel 1; specifically, the third film layer 1323, the first The film layer 1321 and the second film layer 1322 both include metal materials, wherein the material of the third film layer is titanium (Ti), the material of the first film layer 1321 is aluminum (Al), and the material of the third film layer 1321 is titanium (Ti).
  • the material of the second film layer 1322 includes titanium (Ti).
  • the display panel 1 includes an electrode layer 170 disposed on the ladder structure 132 and the substrate 10, and the electrode layer 170 is disconnected at the undercut opening 1320; specifically, the first insulation
  • the functional layer is located between the substrate 10 and the ladder structure 132 .
  • the ladder structure 132 includes a plurality of ladder parts (not labeled in the figure) spaced in the packaging area. Each of the ladder parts
  • the undercut openings 1320 are provided on both sides of the layer 171 and the second electrode layer 172 located on the first insulating functional layer, thereby blocking moisture and/or oxygen from intruding into the display panel 1 through the electrode layer 170 and affecting the reliability of the product.
  • the thickness of the titanium metal is 20 nanometers to 40 nanometers.
  • the thickness of aluminum metal is 60 nanometers to 70 nanometers, that is, in the ladder structure 132, the thickness of the second film layer 1322 is 20 nanometers to 40 nanometers, and the thickness of the first film layer 1321 is 60 nanometers to 70 nanometers.
  • the thickness of the third film layer is 20 nanometers to 40 nanometers. Since the undercut opening 1320 is provided on the side of the ladder structure 132, the undercut opening 1320 is opened in the first film layer 1321.
  • the second film layer 1322 which is smaller in thickness and is not covered by any film layer, is at risk of collapse, thereby damaging the undercut. Opening 1320 causes damage.
  • the electrode layer 170 of the display panel 1 is evaporated on the entire surface. Therefore, in this embodiment, the step structure 132 is provided to include a plurality of spaced apart layers in the packaging area 3000.
  • the undercut openings 1320 are provided on the side of each ladder part, thereby effectively increasing the number of disconnections of the electrode layer 170 in the packaging area 3000, thereby better preventing water vapor.
  • the second film layer 1322 includes a layer laminated on the first film layer 1321 away from the The first sub-layer 1322A and the second sub-layer 1322B on one side of the substrate 10, the thickness of the second sub-layer 1322B is greater than the thickness of the first sub-layer 1322A, and the first sub-layer 1322A is a metal film layer,
  • the second sub-layer 1322B is an organic film layer, thereby protecting the first sub-layer 1322A and preventing the first sub-layer 1322A from being damaged during the preparation process of the display panel 1 (for example, in the functional area 2000 (Open hole design in the display area) may cause collapse and other undesirable phenomena, thereby preventing water and oxygen from diffusing from the packaging area 3000 to the display area 1000, affecting the reliability of the display device.
  • the insulating layer 300 includes the second sub-layer 1322B, wherein the second insulating functional layer is located in the display area 1000, and the second sub-layer 1322B is made of the same material as the second insulating functional layer. And are arranged in the same layer; that is, the second sub-layer 1322B and the second insulating functional layer can be produced in the same process, thereby reducing the manufacturing cost of the display panel 1 and, at the same time, minimizing the impact on the thickness of the display panel 1 Influence.
  • the second sub-layer 1322B and the second flat layer 140 are arranged in the same layer, and the material of the second sub-layer 1322B is the same as the material of the second flat layer 140.
  • the second sub-layer 1322B The material includes an organic insulating material; it can be understood that in this embodiment, the material of the second film layer 1322 is a metal material.
  • the material of the second sub-layer 1322B is an organic insulating material.
  • the organic film layer and the metal film layer have good adhesion, and the second sub-layer 1322B disposed on the first sub-layer 1322A is not easy to fall off, which can effectively improve the adhesion of the second sub-layer 1322B to the first sub-layer 1322A. Protection effect of sub-layer 1322A.
  • the thickness of the second sub-layer 1322B is greater than the thickness of the second flat layer 140 . It can be understood that the electrode layer 170 is located on the second sub-layer 1322B away from the ladder structure 132 On the one hand, this embodiment can effectively induce the disconnection of the electrode layer 170 by setting the thickness of the second sub-layer 1322B to be greater than the thickness of the second flat layer 140 .
  • the second sub-layer 1322B and the second flat layer 140 are provided in the same layer, and the material of the second sub-layer 1322B is the same as the material of the second flat layer 140 are only for illustrative purposes.
  • the second sub-layer 1322B and the pixel definition layer 150 are provided in the same layer, and the material of the second sub-layer 1322B is the same as that of the pixel definition layer 150 .
  • the materials are the same; in one embodiment, the second sub-layer 1322B and the spacer layer 160 are arranged in the same layer, and the material of the second sub-layer 1322B is the same as the material of the spacer layer 160. In this embodiment There are no specific limitations on the location or material of the second sub-layer 1322B.
  • the display panel 1 further includes a plurality of channels 180 spaced apart in the packaging area 3000, and the channels 180 include via holes 181 passing through the first insulating layer functional layer;
  • the orthographic projection of the step portion on the substrate 10 does not overlap with the orthographic projection of the channel 180 on the substrate 10; it can be understood that the via hole 181 of the channel 180 It penetrates at least the third gate insulating layer 80 and the second interlayer insulating layer 100 to further prevent water vapor and oxygen from intruding into the interior of the display panel 1 and improve product reliability.
  • the packaging area 3000 includes a first packaging sub-area 3100, a second packaging sub-area 3200, and a spacing area 3300 located between the first packaging sub-area 3100 and the second packaging sub-area 3200.
  • the first packaging sub-area 3100 is close to the functional area 2000
  • the second packaging sub-area 3200 is close to the display area 1000;
  • the ladder structure 132 includes a plurality of third packaging sub-areas spaced apart in the first packaging sub-area 3100.
  • the orthographic projection of the track 180 on the substrate 10 does not overlap with the orthographic projection of the second stepped sub-portion 132B on the substrate 10; preferably, the orthographic projection of the second stepped sub-portion 132B on the substrate 10
  • the orthographic projection is located between the orthographic projections of two adjacent channels 180 on the substrate 10 .
  • a plurality of first ladder sub-sections 132A are arranged at intervals in the first package sub-region 3100, and a plurality of first ladder sub-sections 132A are arranged at intervals in the second package sub-region 3100.
  • a plurality of second step sub-sections 132B in the area 3200 thereby promoting the electrode layer 170 to be more effectively disconnected in the packaging area 3000, better preventing water vapor from invading the device from the edge of the electrode layer 170, and improving the display
  • the reliability of the device at the same time, by arranging the channel 180 and the second stepped sub-section 132B in the second package sub-region 3200, the second stepped sub-section 132B is positioned on the substrate 10
  • the projection is located between the front projections of two adjacent channels 180 on the substrate 10 , further blocking water vapor and oxygen from intruding into the interior of the display panel 1 , thereby improving product reliability and lifespan.
  • the display panel 1 includes a bank 190 located in the separation area 3300, the bank 190 is arranged around the functional area 2000, the bank 190 includes the first flat layer 120, the third flat layer 120 and the second flat layer 120 arranged in a stack.
  • the two flat layers 140 , the pixel definition layer 150 and the spacer layer 160 , the dam 190 can block water vapor and oxygen from intruding into the interior of the display panel 1 , and can reduce the direction of cracks that may be formed when cutting the openings. The possibility of extending within the display panel 1 further improves packaging reliability.
  • An embodiment of the present application also provides a method for manufacturing a display panel. Please refer to Figures 3, 4, 5 and 6A to 6F.
  • the method for manufacturing a display panel includes the following steps:
  • Step 100 Provide a substrate 10, including providing a first substrate 11, and a spacer layer 12, a second substrate 13, a buffer layer 20, and a first gate insulating layer sequentially formed on the first substrate 11. 30.
  • the second metal layer 60 includes a second gate 61, and the third metal layer 90 includes a third gate 91; as shown in FIG. 6A.
  • Step 200 Pattern the substrate 10 to form a plurality of spaced apart channels 180 in the package sub-region 3000.
  • the channels 180 at least penetrate the third gate insulating layer 80 and the third gate insulating layer 80.
  • Two interlayer insulating layers 100 as shown in Figure 6B.
  • Step 300 Form a ladder structure 132 in the packaging area 3000.
  • the ladder structure 132 includes a first film layer 1321 and a second film layer 1322 that are stacked on each other.
  • the first film layer 1321 is away from the first sub-layer 1322A and the second sub-layer 1322B on the side of the substrate 10.
  • the thickness of the second sub-layer 1322B is greater than the thickness of the first sub-layer 1322A, and the thickness of the second sub-layer 1322B is greater than that of the first sub-layer 1322A.
  • One sub-layer 1322A is a metal film layer
  • the second sub-layer 1322B is an organic film layer.
  • step 300 includes the following steps:
  • Step S301 Form a fourth metal layer 110, a first flat layer 120 and a fifth metal layer 130 in sequence on the second interlayer insulating layer 100.
  • the fourth metal layer 110 includes a metal layer located in the display area 1000.
  • the first source and drain electrode 111, the fifth metal layer 130 includes the second source and drain electrode 131 located in the display area, and the first film layer 1321 and the first sub-layer located in the packaging area 3000.
  • Layer 1322A shown in Figure 6C.
  • Step S302 Form a second insulating functional layer on the substrate 10.
  • the second insulating functional layer includes a second flat layer 140 located in the display area 1000, and a third insulating layer 140 located in the packaging layer 3000.
  • Two sub-layers 1322B, the orthographic projection of the second sub-layer 1322B on the substrate 10 covers the orthographic projection of the first sub-layer 1322A on the substrate 10; as shown in FIG. 6D.
  • Step S400 Form an anode (not marked in the figure) located in the display area 1000 on the substrate 10, and at the same time, etch the ladder structure 132, and open a base on the side of the ladder structure 132. Cut opening 1320, the undercut opening 1320 is opened on the side of the first film layer 1321, and the orthographic projection of the second film layer 1322 on the substrate 10 covers the first film layer 1321. Orthographic projection on the substrate 10; as shown in Figure 6E.
  • Step 500 Form a pixel definition layer 150, a spacer layer 160 and an electrode layer 170 in sequence on the substrate 10.
  • the electrode layer 170 is located on the ladder structure 132 and the substrate 10, and the electrode layer 170 is on The undercut opening 1320 is disconnected; as shown in Figure 6F.
  • This embodiment provides a display device, which includes the display panel described in any of the above embodiments.
  • the display device can be a display screen of a smart phone, tablet computer, notebook computer, smart bracelet, smart watch, smart glasses, smart helmet, desktop computer, smart TV or digital camera, or even Applied to electronic devices with flexible displays.
  • the display panel includes a display area, a functional area and a packaging area between the display area and the functional area.
  • the display panel includes: a substrate. ;
  • the opening, the orthographic projection of the second film layer on the base covers the orthographic projection of the first film layer on the base; the electrode layer is disposed on the ladder structure and the base, and the electrode layer is on The undercut opening is disconnected.
  • the first sub-layer and the second sub-layer are stacked on the side of the first film layer away from the substrate.
  • the thickness of the second sub-layer is greater than the thickness of the first sub-layer, and the first sub-layer is a metal film layer, and the second sub-layer is an organic film layer, thereby playing a role in the first sub-layer.
  • the protection function prevents the first sub-layer from collapsing and other undesirable phenomena during the preparation process of the display panel, which in turn causes water and oxygen to diffuse from the packaging area to the display area, affecting the reliability of the display device.

Abstract

一种显示面板(1)及显示装置，显示面板(1)包括层叠设置的基底(10)、阶梯结构(132)和电极层(170)，阶梯结构(132)位于封装区(3000)内，阶梯结构(132)包括层叠设置的第一膜层(1321)和第二膜层(1322)，第一膜层(1321)的侧边开设有底切开口(1320)，第二膜层(1322)包括层叠设置的第一子层(1322A)和第二子层(1322B)，第二子层(1322B)的厚度大于第一子层(1322A)的厚度，第一子层(1322A)为金属膜层，第二子层(1322B)为有机膜层。

Description

显示面板及显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及显示装置。
 背景技术
随着显示技术的发展，LTPO(LowTemperaturePolycrystallineOxide，低温多晶氧化物)作为一种低功耗的显示技术受到越来越广泛的关注，相比于LTPSTFT（LowTemperaturePoly-SiliconTFT，低温多晶硅薄膜晶体管），LTPOTFT(LowTemperaturePolycrystallineOxideTFT，低温多晶氧化物薄膜晶体管)具有更低的驱动功率。
目前，在LTPO显示面板结构中，为了阻挡水氧入侵，在LTPO显示面板的某些位置形成特殊结构，可以使得有机电极层在该特殊位置处不连贯，而薄膜封装结构连贯，例如：LTPO显示面板包括显示区和与显示区相邻的外围区，在所述外围区域中，无机层结构包括具有开口的底切开口，有机电极层设置在无机层结构上且在无机层结构的底切开口上断开，以阻挡潮气和/或氧由有机电极层侵入到LTPO显示面板中而影响产品的可靠性；然而，由于在无机层结构上设置底切开口，其步骤较为繁琐，这样会降低产能，使制备成本提高。
如图1和图2所示，显示面板包括显示区1000、功能区2000以及位于显示区1000与功能区2000之间的封装区3000；在封装区3000内，显示面板包括阶梯结构132，在现有技术中，通常采用在阶梯结构132的侧边开设有底切开口1320，电极层170设置于阶梯结构132上，且电极层170在阶梯结构132的底切开口1320上断开，从而阻挡潮气和/或氧侵入显示面板，同时，还能提成产能，降低显示面板制造成本，然而，阶梯结构132通常为金属结构，阶梯结构132包括层叠设置的第三膜层1323、第一膜层1321以及第二膜层1322，其中，第三膜层1323的材料和第二膜层1322的材料均为金属钛，第一膜层1321的材料为金属铝，在传统的金属底切（undercut，UC）工艺中，通过对第一膜层1321进行侧刻，从而在阶梯结构132中形成底切开口1320，然而，由于第二膜层1322的厚度较薄（一般几十纳米），很容易受显示面板后续制程影响而塌掉（例如在所述功能区2000开设开孔），从而对底切开口1320造成破坏，进而使位于阶梯结构132上的电极层170在底切开口1320处无法断开，最后导致潮气和/或氧从有机电极层外部渗透到显示装置内，对产品的可靠性造成影响。
。
 技术问题
本申请实施例提供一种显示面板及显示装置，用以缓解相关技术中的不足。
 技术解决方案
为实现上述功能，本申请实施例提供的技术方案如下：
本申请实施例提供一种显示面板，包括显示区、功能区以及位于所述显示区与所述功能区之间的封装区；
所述显示面板包括：
基底；
阶梯结构，设置于所述基底上且位于所述封装区内，所述阶梯结构的侧边开设有底切开口，所述阶梯结构至少包括层叠设置的第一膜层和第二膜层，所述底切开口开设于所述第一膜层侧边，且所述第二膜层在所述基底上的正投影覆盖所述第一膜层在所述基底上的正投影；
电极层，设置于所述阶梯结构和所述基底上，且所述电极层在所述底切开口处断开；
其中，所述第二膜层包括层叠设置于所述第一膜层远离所述基底一侧的第一子层和第二子层，所述第二子层的厚度大于所述第一子层的厚度，且所述第一子层为金属膜层，所述第二子层为有机膜层。
在本申请实施例所提供的显示面板中，所述显示面板包括位于所述基底和所述阶梯结构之间的第一绝缘功能层；
所述阶梯结构包括间隔设置于所述封装区内的多个阶梯子部，每一所述阶梯子部的侧边均开设有所述底切开口；
其中，所述电极层包括位于多个所述阶梯子部上的第一电极层、以及位于所述第一绝缘功能层上的第二电极层。
在本申请实施例所提供的显示面板中，所述显示面板还包括位于所述封装区内间隔设置的多个沟道，所述沟道包括穿过所述第一绝缘层功能层的过孔；
其中，所述阶梯子部在所述基底上的正投影与所述沟道在所述基底上的正投影不重叠。
在本申请实施例所提供的显示面板中，所述封装区包括第一封装子区、第二封装子区以及位于所述第一封装子区与所述第二封装子区之间的间隔区，所述第一封装区靠近所述功能区，所述第二封装区靠近所述显示区；
所述阶梯结构包括间隔设置于所述第一封装子区内的多个第一阶梯子部、以及间隔设置于所述第二封装子区内的多个第二阶梯子部；
所述沟道位于所述第二封装区内，且所述沟道在所述基底上的正投影与所述第二阶梯子部在所述基底上的正投影不重叠。
在本申请实施例所提供的显示面板中，所述第二阶梯子部在所述基底上的正投影位于相邻两所述沟道在所述基底上的正投影之间。
在本申请实施例所提供的显示面板中，所述显示面板包括设置于所述基底上的薄膜晶体管层、以及设置于所述薄膜晶体管层上的绝缘层，所述绝缘层包括位于所述显示区内的第二绝缘功能层和位于所述封装区内的所述第二子层。
在本申请实施例所提供的显示面板中，所述第二绝缘功能层包括位于所述显示区内且设置于所述薄膜晶体管层上的平坦层，所述第二子层的材料与所述平坦层的材料相同。
在本申请实施例所提供的显示面板中，所述第二子层的厚度大于或等于所述平坦层的厚度。
在本申请实施例所提供的显示面板中，所述薄膜晶体管层包括一位于所述基底与所述绝缘层之间的金属层，所述金属层包括所述阶梯结构；
其中，所述阶梯结构包括层叠设置的第三膜层、所述第一膜层以及所述第二膜层，其中，所述第三膜层的材料、所述第一膜层的材料以及所述第一子层的材料均为金属材料，所述第二子层的材料为有机绝缘材料。
在本申请实施例所提供的显示面板中，所述第三膜层在所述基底上的正投影与所述第二膜层在所述基底上的正投影重叠。
在本申请实施例所提供的显示装置中，所述显示装置包括一显示面板，所述显示面板包括：
包括显示区、功能区以及位于所述显示区与所述功能区之间的封装区；
所述显示面板包括：
基底；
阶梯结构，设置于所述基底上且位于所述封装区内，所述阶梯结构的侧边开设有底切开口，所述阶梯结构至少包括层叠设置的第一膜层和第二膜层，所述底切开口开设于所述第一膜层侧边，且所述第二膜层在所述基底上的正投影覆盖所述第一膜层在所述基底上的正投影；
电极层，设置于所述阶梯结构和所述基底上，且所述电极层在所述底切开口处断开；
其中，所述第二膜层包括层叠设置于所述第一膜层远离所述基底一侧的第一子层和第二子层，所述第二子层的厚度大于所述第一子层的厚度，且所述第一子层为金属膜层，所述第二子层为有机膜层。
在本申请实施例所提供的显示装置中，所述显示面板包括位于所述基底和所述阶梯结构之间的第一绝缘功能层；
所述阶梯结构包括间隔设置于所述封装区内的多个阶梯子部，每一所述阶梯子部的侧边均开设有所述底切开口；
其中，所述电极层包括位于多个所述阶梯子部上的第一电极层、以及位于所述第一绝缘功能层上的第二电极层。
在本申请实施例所提供的显示装置中，所述显示面板还包括位于所述封装区内间隔设置的多个沟道，所述沟道包括穿过所述第一绝缘层功能层的过孔；
其中，所述阶梯子部在所述基底上的正投影与所述沟道在所述基底上的正投影不重叠。
在本申请实施例所提供的显示装置中，所述封装区包括第一封装子区、第二封装子区以及位于所述第一封装子区与所述第二封装子区之间的间隔区，所述第一封装区靠近所述功能区，所述第二封装区靠近所述显示区；
所述阶梯结构包括间隔设置于所述第一封装子区内的多个第一阶梯子部、以及间隔设置于所述第二封装子区内的多个第二阶梯子部；
所述沟道位于所述第二封装区内，且所述沟道在所述基底上的正投影与所述第二阶梯子部在所述基底上的正投影不重叠。
在本申请实施例所提供的显示装置中，所述第二阶梯子部在所述基底上的正投影位于相邻两所述沟道在所述基底上的正投影之间。
在本申请实施例所提供的显示装置中，所述显示面板包括设置于所述基底上的薄膜晶体管层、以及设置于所述薄膜晶体管层上的绝缘层，所述绝缘层包括位于所述显示区内的第二绝缘功能层和位于所述封装区内的所述第二子层。
在本申请实施例所提供的显示装置中，所述第二绝缘功能层包括位于所述显示区内且设置于所述薄膜晶体管层上的平坦层，所述第二子层的材料与所述平坦层的材料相同。
在本申请实施例所提供的显示装置中，所述第二子层的厚度大于或等于所述平坦层的厚度。
在本申请实施例所提供的显示装置中，所述薄膜晶体管层包括一位于所述基底与所述绝缘层之间的金属层，所述金属层包括所述阶梯结构；
其中，所述阶梯结构包括层叠设置的第三膜层、所述第一膜层以及所述第二膜层，其中，所述第三膜层的材料、所述第一膜层的材料以及所述第一子层的材料均为金属材料，所述第二子层的材料为有机绝缘材料。
在本申请实施例所提供的显示装置中，所述第三膜层在所述基底上的正投影与所述第二膜层在所述基底上的正投影重叠。
 有益效果
本申请实施例提供一种显示面板及显示装置，所述显示面板包括显示区、功能区以及位于所述显示区与所述功能区之间的封装区；所述显示面板包括：基底；阶梯结构，设置于所述基底上且位于所述封装区内，所述阶梯结构至少包括层叠设置的第一膜层和第二膜层，所述第一膜层的侧边开设有底切开口，所述第二膜层在基底上的正投影覆盖所述第一膜层在基底上的正投影；电极层，设置于所述阶梯结构和所述基底上，且所述电极层在所述底切开口处断开，本申请实施例通过设置所述第二膜层包括层叠设置于所述第一膜层远离所述基底一侧的第一子层和第二子层，所述第二子层的厚度大于所述第一子层的厚度，且所述第一子层为金属膜层，所述第二子层为有机膜层，从而对所述第一子层起到保护作用，避免第一子层在显示面板的制备工艺中出现坍塌等不良现象，进而导致水氧从封装区向显示区扩散，影响显示装置的可靠性。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为现有显示面板的截面示意图；
图2为图1中A处的放大图；
图3为本申请实施例所提供的显示面板的截面示意图；
图4为图3中B处的放大图；
图5为本申请实施例所提供显示面板的制作方法的流程图；
图6A至图6F为图5中显示面板制作的结构工艺流程图。
 本发明的实施方式
本申请实施例提供一种显示面板及显示装置，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
请参阅图3~图4，本实施例提供一种显示面板1，包括显示区1000、功能区2000以及位于所述显示区1000与所述功能区2000之间的封装区3000；所述显示面板1包括：
基底10；
阶梯结构132，设置于所述基底10上且位于所述封装区3000内，所述阶梯结构132的侧边开设有底切开口1320，所述阶梯结构132至少包括层叠设置的第一膜层1321和第二膜层1322，所述底切开口1320开设于所述第一膜层1321侧边，且所述第二膜层1322在所述基底10上的正投影覆盖所述第一膜层1321在所述基底10上的正投影；
电极层170，设置于所述阶梯结构132和所述基底10上，且所述电极层170在所述底切开口1320处断开；
其中，所述第二膜层1322包括层叠设置于所述第一膜层1321远离所述基底10一侧的第一子层1322A和第二子层1322B，所述第二子层1322B的厚度大于所述第一子层1322A的厚度，且所述第一子层1322A为金属膜层，所述第二子层1322B为有机膜层。
可以理解的是，目前，在现有的显示面板1中，如图1和图2所示；其中，图1为现有显示面板的截面示意图，图2为图1中A处的放大图，显示面板1包括显示区1000、功能区2000以及位于显示区1000与功能区2000之间的封装区3000；在封装区3000内，显示面板1包括阶梯结构132，在现有技术中，通常采用在阶梯结构132的侧边开设有底切开口1320，电极层170设置于阶梯结构132上，且电极层170在阶梯结构132的底切开口1320上断开，从而阻挡潮气和/或氧侵入显示面板1，同时，还能提成产能，降低显示面板1制造成本，然而，请结合图1和图2，其中，图2为图1中A处的放大图，阶梯结构132通常为金属结构，阶梯结构132包括层叠设置的第三膜层1323、第一膜层1321以及第二膜层1322，其中，第三膜层1323的材料和第二膜层1322的材料均为金属钛，第一膜层1321的材料为金属铝，在传统的金属底切（undercut，UC）工艺中，通过对第一膜层1321进行侧刻，从而在阶梯结构132中形成底切开口1320，然而，由于第二膜层1322的厚度较薄，很容易受显示面板1后续制程影响而塌掉，从而对底切开口1320造成破坏，进而使位于阶梯结构132上的电极层170在底切开口1320处无法断开，最后导致潮气和/或氧从有机电极层170外部渗透到显示装置内，对产品的可靠性造成影响。
承上，本实施例中，通过在所述阶梯结构132中，设置所述第二膜层1322包括层叠设置于所述第一膜层1321远离所述基底10一侧的第一子层1322A和第二子层1322B，所述第二子层1322B的厚度大于所述第一子层1322A的厚度，且所述第一子层1322A为金属膜层，所述第二子层1322B为有机膜层，从而对所述第一子层1322A起到保护作用，避免所述第一子层1322A在所述显示面板1的制备工艺中出现坍塌等不良现象，进而导致水氧从所述封装区3000向所述显示区1000扩散，影响显示装置的可靠性。
在一实施例中，请结合图3和图4，其中，图3为本申请实施例所提供的显示面板的截面示意图，图4为图3中B处的放大图。
在本实施例中，所述显示面板1包括显示区1000、功能区2000以及位于所述显示区1000与所述功能区2000之间的封装区3000；所述显示面板1包括层叠设置的基底10、缓冲层20、薄膜晶体管层200以及绝缘层300；其中，所述薄膜晶体管层200包括间隔设置的第一薄膜晶体管（图中未画出）和第二薄膜晶体管（图中未标记），所述第一薄膜晶体管包括位于所述基底10上的多晶硅半导体层（图中未画出），所述第二薄膜晶体管包括位于所述基底10上的氧化物半导体层（图中未标记），可以理解的是，在本实施例中，以所述显示面板1为LTPO(LowTemperaturePolycrystallineOxide,低温多晶氧化物)显示面板为例对本申请的技术方案进行举例说明。
所述基底10包括依次层叠设置的第一衬底11、间隔层12以及第二衬底13；其中，所述第一衬底11和所述第二衬底13均可以包括刚性衬底或柔性衬底，当所述第一衬底11和所述第二衬底13均为刚性衬底时，材料可以是金属或玻璃，当所述第一衬底11和所述第二衬底13均为柔性衬底时，材料可以包括丙烯酸树脂、甲基丙烯酸树脂、聚异戊二烯、乙烯基树脂、环氧基树脂、聚氨酯基树脂、纤维素树脂、硅氧烷树脂、聚酰亚胺基树脂、聚酰胺基树脂中的至少一种；所述间隔层12的材质包括但不限于氮化硅(SiNx)、硅氧化物(SiOx)等具有吸水性能的材质，本实施例对所述第一衬底11、所述第二衬底13以及所述间隔层12的材料均不做限制。
所述薄膜晶体管层200包括层叠设置于所述基底10上的第一栅极绝缘层30、第一金属层40、第二栅极绝缘层50、第二金属层60、第一层间绝缘层70、第三栅极绝缘层80、第三金属层90、第二层间绝缘层100、第四金属层110、第一平坦层120以及第五金属层130；具体地，所述第一金属层40包括第一栅极41，所述第二金属层60包括第二栅极61，所述第三金属层90包括第三栅极91，所述第四金属层110包括第一源漏电极111，所述第五金属层130包括第二源漏电极131。
其中，所述第一栅极41、所述第二栅极61以及所述第三栅极91均可以包括低电阻金属材料，例如：上述栅极可以包括具有钼(Mo)、铝(Al)、铜(Cu)和/或钛(Ti)等的导电材料，并且可以包括具有上述材料的单层或多层。
所述第一源漏电极111和所述第二源漏电极131可以包括导电材料，例如：所述第一源漏电极111和所述第二源漏电极131的材料均可以包括具有钼(Mo)、铝(Al)、铜(Cu)和/或钛(Ti)的导电材料，并且可以包括具有上述材料的多层或单层；需要说明的是，本实施例以所述第二源漏电极131包括钛(Ti)/铝(Al)/钛(Ti)的多层结构为例对本申请的技术方案进行举例说明。
所述绝缘层300包括层叠设置的第一绝缘功能层（图中未标记）和第二绝缘功能层（图中未标记），所述第一绝缘层包括层叠设置的第三栅极绝缘层80和第二层间绝缘层100，所述第二绝缘功能层包括层叠设置于所述第五金属层130上的第二平坦层140、像素定义层150以及隔垫层160，其中，所述第一平坦层120和所述第二平坦层140的均包括有机绝缘材料，所述像素定义层150包括无机绝缘材料。
所述显示面板1还包括位于所述功能区2000的开孔（图中未画出），所述开孔可以穿过位于所述基底10上/上方的多个膜层，例如缓冲层20、第一栅极绝缘层30、第二栅极绝缘层50、第一层间绝缘层70、第三栅极绝缘层80、第二层间绝缘层100、第一平坦层120，也可以穿过所述基底10，本实施例对此不做具体限制；所述开孔可以具有各种合适的形状的任意一种，例如：矩形和椭圆形；所述开孔的数量不限于一个；需要说明的是，本实施例以所述显示面板1对应所述功能区2000的部分膜层用于切割以形开孔为例对本申请的技术方案进行举例说明，其中，切割的所述部分膜层不做具体限定。
所述显示面板1包括设置于所述基底10上且位于所述封装区3000内阶梯结构132，所述阶梯结构132的侧边开设有底切开口1320，所述阶梯结构132至少包括层叠设置的第一膜层1321和第二膜层1322，所述底切开口1320开设于所述第一膜层1321侧边；具体地，所述阶梯结构132包括层叠设置于所述基底10上的第三膜层1323、第一膜层1321以及第二膜层1322，所述底切开口1320开设于所述第一膜层1321侧边，所述第二膜层1322在所述基底10上的正投影覆盖所述第一膜层1321在所述基底10上的正投影，所述第三膜层1323在所述基底10上的正投影与所述第二膜层1322在所述基底10上的正投影重叠。
所述阶梯结构132的材料包括金属，例如：所述阶梯结构132可以包括与用于形成所述第一栅极41、所述第二栅极61、所述第三栅极91、所述第一源漏电极111以及所述第二源漏电极131中一者的材料相同的材料。
进一步地，所述第四金属层110包括所述阶梯结构132，所述阶梯结构132与所述第二源漏电极131材料相同且同层设置，即，所述阶梯结构132和所述第二源漏电极131可以在同一工序中制作，从而降低所述显示面板1制造成本，同时也最大化的减少对显示面板1厚度的影响；具体地，所述第三膜层1323、所述第一膜层1321以及所述第二膜层1322均包括金属材料，其中，所述第三膜层的材料为钛(Ti)，所述第一膜层1321的材料为铝(Al)，所述第二膜层1322的材料包括钛(Ti)。
所述显示面板1包括设置于所述阶梯结构132和所述基底10上的电极层170，且所述电极层170在所述底切开口1320处断开；具体地，所述第一绝缘功能层位于所述基底10和所述阶梯结构132之间，所述阶梯结构132包括间隔设置于所述封装区内的多个阶梯子部（图中未标记），每一所述阶梯子部的侧边均开设有所述底切开口1320；其中，多个所述阶梯子部围绕所述功能区2000设置，所述电极层170包括位于多个所述阶梯子部上的第一电极层171、以及位于所述第一绝缘功能层上的第二电极层172，从而阻挡潮气和/或氧由所述电极层170侵入到所述显示面板1中而影响产品的可靠性。
可以理解的是，当所述第二源漏电极131为钛(Ti)/铝(Al)/钛(Ti)的多层结构时，所述钛金属的厚度为20纳米~40纳米，所述铝金属厚度为60纳米~70纳米，即，在所述阶梯结构132中，所述第二膜层1322的厚度为20纳米~40纳米，所述第一膜层1321的厚度为60纳米~70纳米，所述第三膜层的厚度为20纳米~40纳米，由于所述阶梯结构132的侧边开设有底切开口1320，所述底切开口1320开设于所述第一膜层1321侧边，由图2所示，当所述显示面板1开设所述开孔时，厚度较小且无任何膜层覆盖的所述第二膜层1322具有坍塌的风险，从而对所述底切开口1320造成破坏。
承上，在本实施例中，所述显示面板1的所述电极层170是整面蒸镀，因此本实施例通过设置所述阶梯结构132包括间隔设置于所述封装区3000内的多个阶梯子部，每一所述阶梯子部侧边均开设有所述底切开口1320，从而有效增加所述电极层170在所述封装区3000内的断开数量，进而更好地防止水汽从所述电极层170边缘入侵器件，提升显示装置的可靠性，提高了所述显示面板1的寿命；同时，所述第二膜层1322包括层叠设置于所述第一膜层1321远离所述基底10一侧的第一子层1322A和第二子层1322B，所述第二子层1322B的厚度大于所述第一子层1322A的厚度，且所述第一子层1322A为金属膜层，所述第二子层1322B为有机膜层，从而对所述第一子层1322A起到保护作用，避免所述第一子层1322A在显示面板1的制备工艺中（例如在所述功能区2000内进行开孔设计）出现坍塌等不良现象，进而避免水氧从封装区3000向显示区1000扩散，影响显示装置的可靠性。
进一步地，所述绝缘层300包括所述第二子层1322B，其中，所述第二绝缘功能层位于所述显示区1000，所述第二子层1322B与所述第二绝缘功能层材料相同且同层设置；即，所述第二子层1322B和所述第二绝缘功能层可以在同一工序中制作，从而降低显示面板1制造成本，同时，也最大化的减少对显示面板1厚度的影响。
优选地，所述第二子层1322B与所述第二平坦层140同层设置，所述第二子层1322B的材料与所述第二平坦层140的材料相同，所述第二子层1322B的材料包括有机绝缘材料；可以理解的是，在本实施例中，所述第二膜层1322的材料为金属材料，本实施例通过设置所述第二子层1322B的材料为有机绝缘材料，有机膜层和金属膜层具有良好的附着性，设置在所述第一子层1322A上的所述第二子层1322B不易脱落，进而可以有效提高所述第二子层1322B对所述第一子层1322A的保护效果。
优选地，所述第二子层1322B的厚度大于所述第二平坦层140的厚度，可以理解的是，所述电极层170位于所述所述第二子层1322B远离所述阶梯结构132的一侧，本实施例通过设置所述第二子层1322B的厚度大于所述第二平坦层140的厚度，可以有效地促引所述电极层170断开。
需要说明的是，在本实施例中，所述第二子层1322B与所述第二平坦层140同层设置，所述第二子层1322B的材料与所述第二平坦层140的材料相同均仅用于举例说明，例如：在一实施例中，所述第二子层1322B与所述像素定义层150同层设置，所述第二子层1322B的材料与所述像素定义层150的材料相同；在一实施例中，所述第二子层1322B与所述隔垫层160同层设置，所述第二子层1322B的材料与所述隔垫层160的材料相同，本实施例对所述第二子层1322B的位置和材料均不做具体限制。
在本实施例中，所述显示面板1还包括位于所述封装区3000内间隔设置的多个沟道180，所述沟道180包括穿过所述第一绝缘层功能层的过孔181；其中，所述阶梯子部在所述基底10上的正投影与所述沟道180在所述基底10上的正投影不重叠；可以理解的是，所述沟道180的所述过孔181至少贯穿所述第三栅极绝缘层80和所述第二层间绝缘层100，从而进一步阻隔水汽和氧气侵入所述显示面板1内部，提升产品可靠性。
优选地，所述封装区3000包括第一封装子区3100、第二封装子区3200以及位于所述第一封装子区3100与所述第二封装子区3200之间的间隔区3300，所述第一封装子区3100靠近所述功能区2000，所述第二封装子区3200靠近所述显示区1000；所述阶梯结构132包括间隔设置于所述第一封装子区3100内的多个第一阶梯子部132A、以及间隔设置于所述第二封装子区3200内的多个第二阶梯子部132B；其中，所述沟道180位于所述第二封装区3200内，且所述沟道180在所述基底10上的正投影与所述第二阶梯子部132B在所述基底10上的正投影不重叠；优选地，所述第二阶梯子部132B在所述基底10上的正投影位于相邻两所述沟道180在所述基底10上的正投影之间。
可以理解的是，本实施例通过设置多个所述阶梯子部包括间隔设置于所述第一封装子区3100内的多个第一阶梯子部132A、以及间隔设置于所述第二封装子区3200内的多个第二阶梯子部132B，从而促使所述电极层170在所述封装区3000内更加有效的断开，更好地防止水汽从所述电极层170边缘入侵器件，提升显示装置的可靠性；同时，通过在所述第二封装子区3200内设置所述沟道180和所述第二阶梯子部132B，所述第二阶梯子部132B在所述基底10上的正投影位于相邻两所述沟道180在所述基底10上的正投影之间，进一步阻隔了水汽和氧气侵入所述显示面板1内部，提升产品可靠性和寿命。
其中，所述显示面板1包括位于所述间隔区3300内的堤坝190，所述堤坝190围绕所述功能区2000设置，所述堤坝190包括层叠设置的所述第一平坦层120、所述第二平坦层140、所述像素定义层150以及所述隔垫层160，所述堤坝190可以阻隔水汽和氧气侵入所述显示面板1内部，并且可以降低切割所述开孔时可能形成的裂纹朝向所述显示面板1内延伸的可能性，从而进一步提升封装信赖性。
本申请实施例还提供一种显示面板的制作方法，请结合图3、图4、图5以及图6A至图6F、所述显示面板的制作方法包括以下步骤：
步骤100：提供一基底10，包括提供一第一衬底11，以及依次形成于所述第一衬底11上的间隔层12、第二衬底13、缓冲层20、第一栅极绝缘层30、第一金属层40、第二栅极绝缘层50、第二金属层60、第一层间绝缘层70、第三栅极绝缘层80、第三金属层90以及第二间绝缘层100，所述显示面板包括显示区1000、功能区2000以及位于所述显示区1000与所述功能区2000之间的封装区3000，其中，所述第一金属层40包括第一栅极41，所述第二金属层60包括第二栅极61，所述第三金属层90包括第三栅极91；如图6A所示。
步骤200：对所述基底10图案化处理，在所述封装子区3000内形成多个间隔设置的沟道180，所述沟道180至少贯穿所述第三栅极绝缘层80和所述第二层间绝缘层100；如图6B所示。
步骤300：在所述封装区3000内的形成阶梯结构132，所述阶梯结构132包括层叠设置第一膜层1321以及第二膜层1322，其中，所述第二膜层1322包括层叠设置于所述第一膜层1321远离所述基底10一侧的第一子层1322A和第二子层1322B，所述第二子层1322B的厚度大于所述第一子层1322A的厚度，且所述第一子层1322A为金属膜层，所述第二子层1322B为有机膜层。
具体地，在本实施例中，所述步骤300包括以下步骤：
步骤S301:在所述第二层间绝缘层100上依次形成第四金属层110、第一平坦层120以及第五金属层130，所述第四金属层110包括位于所述显示区1000内的第一源漏电极111，所述第五金属层130包括位于所述显示区的第二源漏电极131、及位于所述封装区3000内的所述第一膜层1321和所述第一子层1322A；如图6C所示。
步骤S302：在所述基底10上形成第二绝缘功能层，所述第二绝缘功能层包括位于所述显示区1000内的第二平坦层140、及位于所述封装层3000内的所述第二子层1322B，所述第二子层1322B在所述基底10上的正投影覆盖所述第一子层1322A在所述基底10上的正投影；如图6D所示。
步骤S400：在所述基底10上形成位于所述显示区1000内的阳极（图中未标记），同时，对所述阶梯结构132进行刻蚀，在所述阶梯结构132的侧边开设一底切开口1320，所述底切开口1320开设于所述第一膜层1321侧边，且所述第二膜层1322在所述基底10上的正投影覆盖所述第一膜层1321在所述基底10上的正投影；如图6E所示。
步骤500；在所述基底10上依次形成像素定义层150、隔垫层160以及电极层170，所述电极层170位于所述阶梯结构132和所述基底10上，且所述电极层170在所述底切开口1320处断开；如图6F所示。
本实施例提供一种显示装置，所述显示装置包括上述任一实施例中所述的显示面板。
可以理解的是，所述显示面板已经在上述实施例中进行了详细的说明，在此不在重复说明。
在具体应用时，所述显示装置可以为智能手机、平板电脑、笔记本电脑、智能手环、智能手表、智能眼镜、智能头盔、台式机电脑、智能电视或者数码相机等设备的显示屏，甚至可以应用在具有柔性显示屏的电子设备上。
综上所述，本申请提出一种显示面板及显示装置，所述显示面板包括显示区、功能区以及位于所述显示区与所述功能区之间的封装区；所述显示面板包括：基底；阶梯结构，设置于所述基底上且位于所述封装区内，所述阶梯结构至少包括层叠设置的第一膜层和第二膜层，所述第一膜层的侧边开设有底切开口，所述第二膜层在基底上的正投影覆盖所述第一膜层在基底上的正投影；电极层，设置于所述阶梯结构和所述基底上，且所述电极层在所述底切开口处断开，本申请实施例通过设置所述第二膜层包括层叠设置于所述第一膜层远离所述基底一侧的第一子层和第二子层，所述第二子层的厚度大于所述第一子层的厚度，且所述第一子层为金属膜层，所述第二子层为有机膜层，从而对所述第一子层起到保护作用，避免所述第一子层在所述显示面板的制备工艺中出现坍塌等不良现象，进而导致水氧从所述封装区向所述显示区扩散，影响所述显示装置的可靠性。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种显示面板，其中，包括显示区、功能区以及位于所述显示区与所述功能区之间的封装区；
    所述显示面板包括：
    基底；
    阶梯结构，设置于所述基底上且位于所述封装区内，所述阶梯结构的侧边开设有底切开口，所述阶梯结构至少包括层叠设置的第一膜层和第二膜层，所述底切开口开设于所述第一膜层侧边，且所述第二膜层在所述基底上的正投影覆盖所述第一膜层在所述基底上的正投影；
    电极层，设置于所述阶梯结构和所述基底上，且所述电极层在所述底切开口处断开；
    其中，所述第二膜层包括层叠设置于所述第一膜层远离所述基底一侧的第一子层和第二子层，所述第二子层的厚度大于所述第一子层的厚度，且所述第一子层为金属膜层，所述第二子层为有机膜层。
  2. 如权利要求1所述的显示面板，其中，所述显示面板包括位于所述基底和所述阶梯结构之间的第一绝缘功能层；
    所述阶梯结构包括间隔设置于所述封装区内的多个阶梯子部，每一所述阶梯子部的侧边均开设有所述底切开口；
    其中，所述电极层包括位于多个所述阶梯子部上的第一电极层、以及位于所述第一绝缘功能层上的第二电极层。
  3. 如权利要求2所述的显示面板，其中，所述显示面板还包括位于所述封装区内间隔设置的多个沟道，所述沟道包括穿过所述第一绝缘层功能层的过孔；
    其中，所述阶梯子部在所述基底上的正投影与所述沟道在所述基底上的正投影不重叠。
  4. 如权利要求3所述的显示面板，其中，所述封装区包括第一封装子区、第二封装子区以及位于所述第一封装子区与所述第二封装子区之间的间隔区，所述第一封装区靠近所述功能区，所述第二封装区靠近所述显示区；
    所述阶梯结构包括间隔设置于所述第一封装子区内的多个第一阶梯子部、以及间隔设置于所述第二封装子区内的多个第二阶梯子部；
    所述沟道位于所述第二封装区内，且所述沟道在所述基底上的正投影与所述第二阶梯子部在所述基底上的正投影不重叠。
  5. 如权利要求4所述的显示面板，其中，所述第二阶梯子部在所述基底上的正投影位于相邻两所述沟道在所述基底上的正投影之间。
  6. 如权利要求1所述的显示面板，其中，所述显示面板包括设置于所述基底上的薄膜晶体管层、以及设置于所述薄膜晶体管层上的绝缘层，所述绝缘层包括位于所述显示区内的第二绝缘功能层和位于所述封装区内的所述第二子层。
  7. 如权利要求6所述的显示面板，其中，所述第二绝缘功能层包括位于所述显示区内且设置于所述薄膜晶体管层上的平坦层，所述第二子层的材料与所述平坦层的材料相同。
  8. 如权利要求6所述的显示面板，其中，所述第二子层的厚度大于或等于所述平坦层的厚度。
  9. 如权利要求6所述的显示面板，其中，所述薄膜晶体管层包括一位于所述基底与所述绝缘层之间的金属层，所述金属层包括所述阶梯结构；
    其中，所述阶梯结构包括层叠设置的第三膜层、所述第一膜层以及所述第二膜层，其中，所述第三膜层的材料、所述第一膜层的材料以及所述第一子层的材料均为金属材料，所述第二子层的材料为有机绝缘材料。
    10如权利要求9所述的显示面板，其中，所述第三膜层在所述基底上的正投影与所述第二膜层在所述基底上的正投影重叠。
  10. 一种显示装置，其中，所述显示装置包括一显示面板，所述显示面板包括：
    包括显示区、功能区以及位于所述显示区与所述功能区之间的封装区；
    所述显示面板包括：
    基底；
    阶梯结构，设置于所述基底上且位于所述封装区内，所述阶梯结构的侧边开设有底切开口，所述阶梯结构至少包括层叠设置的第一膜层和第二膜层，所述底切开口开设于所述第一膜层侧边，且所述第二膜层在所述基底上的正投影覆盖所述第一膜层在所述基底上的正投影；
    电极层，设置于所述阶梯结构和所述基底上，且所述电极层在所述底切开口处断开；
    其中，所述第二膜层包括层叠设置于所述第一膜层远离所述基底一侧的第一子层和第二子层，所述第二子层的厚度大于所述第一子层的厚度，且所述第一子层为金属膜层，所述第二子层为有机膜层。
  11. 如权利要求11所述的显示装置，其中，所述显示面板包括位于所述基底和所述阶梯结构之间的第一绝缘功能层；
    所述阶梯结构包括间隔设置于所述封装区内的多个阶梯子部，每一所述阶梯子部的侧边均开设有所述底切开口；
    其中，所述电极层包括位于多个所述阶梯子部上的第一电极层、以及位于所述第一绝缘功能层上的第二电极层。
  12. 如权利要求12所述的显示装置，其中，所述显示面板还包括位于所述封装区内间隔设置的多个沟道，所述沟道包括穿过所述第一绝缘层功能层的过孔；
    其中，所述阶梯子部在所述基底上的正投影与所述沟道在所述基底上的正投影不重叠。
  13. 如权利要求13所述的显示装置，其中，所述封装区包括第一封装子区、第二封装子区以及位于所述第一封装子区与所述第二封装子区之间的间隔区，所述第一封装区靠近所述功能区，所述第二封装区靠近所述显示区；
    所述阶梯结构包括间隔设置于所述第一封装子区内的多个第一阶梯子部、以及间隔设置于所述第二封装子区内的多个第二阶梯子部；
    所述沟道位于所述第二封装区内，且所述沟道在所述基底上的正投影与所述第二阶梯子部在所述基底上的正投影不重叠。
  14. 如权利要求14所述的显示装置，其中，所述第二阶梯子部在所述基底上的正投影位于相邻两所述沟道在所述基底上的正投影之间。
  15. 如权利要求11所述的显示装置，其中，所述显示面板包括设置于所述基底上的薄膜晶体管层、以及设置于所述薄膜晶体管层上的绝缘层，所述绝缘层包括位于所述显示区内的第二绝缘功能层和位于所述封装区内的所述第二子层。
  16. 如权利要求16所述的显示装置，其中，所述第二绝缘功能层包括位于所述显示区内且设置于所述薄膜晶体管层上的平坦层，所述第二子层的材料与所述平坦层的材料相同。
  17. 如权利要求16所述的显示装置，其中，所述第二子层的厚度大于或等于所述平坦层的厚度。
  18. 如权利要求16所述的显示装置，其中，所述薄膜晶体管层包括一位于所述基底与所述绝缘层之间的金属层，所述金属层包括所述阶梯结构；
    其中，所述阶梯结构包括层叠设置的第三膜层、所述第一膜层以及所述第二膜层，其中，所述第三膜层的材料、所述第一膜层的材料以及所述第一子层的材料均为金属材料，所述第二子层的材料为有机绝缘材料。
    20如权利要求19所述的显示装置，其中，所述第三膜层在所述基底上的正投影与所述第二膜层在所述基底上的正投影重叠。
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