WO2023173459A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2023173459A1
WO2023173459A1 PCT/CN2022/082646 CN2022082646W WO2023173459A1 WO 2023173459 A1 WO2023173459 A1 WO 2023173459A1 CN 2022082646 W CN2022082646 W CN 2022082646W WO 2023173459 A1 WO2023173459 A1 WO 2023173459A1
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WO
WIPO (PCT)
Prior art keywords
layer
opening
inorganic
display panel
inorganic layer
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PCT/CN2022/082646
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English (en)
French (fr)
Inventor
彭斯敏
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武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/754,255 priority Critical patent/US20240057449A1/en
Publication of WO2023173459A1 publication Critical patent/WO2023173459A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of display technology, and in particular, to a display panel and a display device.
  • OLED organic light emitting diode Emitting diode
  • OLED organic light emitting diode Emitting diode
  • the display panel In addition to the display surface, the display panel also has components such as cameras, earpieces, microphones, circuits, etc., which also occupy a considerable part of the screen-to-body ratio.
  • Embodiments of the present application provide a display panel and a display device, which are used to solve the problem in existing display panels that water and oxygen present in existing display panels can invade laterally into the display area through the openings in the photosensitive area of the substrate, resulting in poor display such as hole black spots. .
  • An embodiment of the present application provides a display panel, including a photosensitive area, a transition area surrounding the photosensitive area, and a display area surrounding the transition area.
  • the display panel further includes:
  • the base substrate includes a substrate, a first inorganic layer, and a first organic layer that are stacked in sequence;
  • a driving circuit layer is provided on one side of the base substrate, the driving circuit layer includes a second inorganic layer, and the first organic layer is provided between the first inorganic layer and the second inorganic layer,
  • the second inorganic layer is provided with a first opening in the transition region, the first organic layer is provided with a second opening in the transition region, the first opening is electrically conductive with the second opening and the The width of the first opening is smaller than the width of the second opening;
  • the light-emitting layer is arranged on the side of the driving circuit layer away from the substrate, and is disconnected at the second opening when covering the transition area;
  • An encapsulation layer is provided on the side of the light-emitting layer away from the base substrate.
  • the bottom surface of the second opening is in contact with a surface of a side of the first inorganic layer close to the first organic layer.
  • the luminescent layer is disposed on a side surface of the first inorganic layer close to the first organic layer at the second opening, and the luminescent layer is disposed at the second opening.
  • the width at is less than the width of the bottom surface of the second opening.
  • the encapsulation layer is continuously provided at the second opening.
  • the encapsulation layer is at the second opening and a side wall of the second opening, a side surface of the first inorganic layer close to the first organic layer, and the light emitting layer. A side surface of the layer facing away from the first inorganic layer is in contact.
  • the orthographic projection of the first opening on the first inorganic layer falls within the orthographic projection of the second opening on the first inorganic layer.
  • the length of any edge of the first opening beyond the edge on the same side of the second opening is greater than 0 and less than or equal to 2 ⁇ m.
  • the distance between a side surface of the first inorganic layer close to the first inorganic layer and a side surface of the second inorganic layer close to the first inorganic layer is 1.5 ⁇ m and less than or equal to 3 ⁇ m.
  • the first inorganic layer and the second inorganic layer are made of the same material.
  • the substrate includes a second organic layer, the second organic layer is disposed on a side of the first inorganic layer facing away from the first organic layer, and is connected to the first organic layer.
  • the materials are the same.
  • the display panel includes a blocking wall disposed in the transition area and surrounding the photosensitive area, and the blocking wall is disposed on a side of the second inorganic layer facing away from the first organic layer. ;
  • first opening and the second opening are provided on the side of the blocking wall close to the photosensitive area and on the side of the blocking wall away from the photosensitive area.
  • the driving circuit layer includes a third organic layer, the light-emitting layer is disposed on the third organic layer, and the blocking wall is made of the same material as the third organic layer.
  • the base substrate and the driving circuit layer are provided with through holes in the photosensitive area.
  • An embodiment of the present application also provides a display device, including a photosensitive device and a display panel.
  • the display panel includes a photosensitive area, a transition area surrounding the photosensitive area, and a display area surrounding the transition area.
  • the photosensitive device corresponds to the The photosensitive area is set as described above, and the display panel also includes:
  • the base substrate includes a substrate, a first inorganic layer, and a first organic layer that are stacked in sequence;
  • a driving circuit layer is provided on one side of the base substrate, the driving circuit layer includes a second inorganic layer, and the first organic layer is provided between the first inorganic layer and the second inorganic layer,
  • the second inorganic layer is provided with a first opening in the transition region, the first organic layer is provided with a second opening in the transition region, the first opening is electrically conductive with the second opening and the The width of the first opening is smaller than the width of the second opening;
  • the light-emitting layer is arranged on the side of the driving circuit layer away from the substrate, and is disconnected at the second opening when covering the transition area;
  • An encapsulation layer is provided on the side of the light-emitting layer away from the base substrate.
  • the bottom surface of the second opening is in contact with a surface of a side of the first inorganic layer close to the first organic layer.
  • the luminescent layer is disposed on a side surface of the first inorganic layer close to the first organic layer at the second opening, and the luminescent layer is disposed at the second opening.
  • the width at is less than the width of the bottom surface of the second opening.
  • the encapsulation layer is continuously provided at the second opening.
  • the encapsulation layer is at the second opening and a side wall of the second opening, a side surface of the first inorganic layer close to the first organic layer, and the light emitting layer. A side surface of the layer facing away from the first inorganic layer is in contact.
  • the orthographic projection of the first opening on the first inorganic layer falls within the orthographic projection of the second opening on the first inorganic layer.
  • the length of any edge of the first opening beyond the edge on the same side of the second opening is greater than 0 and less than or equal to 2 ⁇ m.
  • Embodiments of the present application provide a display panel and a display device.
  • the display device includes the display panel.
  • the display panel includes a photosensitive area, a transition area surrounding the photosensitive area, and a transition area surrounding the photosensitive area.
  • the display panel further includes: a base substrate, including a first inorganic layer and a first organic layer that are stacked in sequence; a drive circuit layer disposed on one side of the base substrate, the The driving circuit layer includes a second inorganic layer, the first organic layer is provided between the first inorganic layer and the second inorganic layer, and the second inorganic layer is provided with a first opening in the transition area, The first organic layer is provided with a second opening in the transition region, the first opening is electrically connected to the second opening, and the width of the first opening is smaller than the width of the second opening; the light-emitting layer, The driving circuit layer is disposed on the side of the driving circuit layer away from the substrate, and is disconnected at the second opening when covering the transition area; the encapsulation layer is disposed on the side of the light-emitting layer away from the base substrate.
  • Figure 1 is a schematic plan view of a display panel provided by an embodiment of the present application.
  • Figure 2 is a partial structural schematic diagram along the A-A direction of the first display panel provided by the embodiment of the present application;
  • Figure 3 is a schematic structural diagram of the first display panel at the groove provided by the embodiment of the present application.
  • Figure 4 is a partial cross-sectional view along the A-A direction of the second display panel provided by the embodiment of the present application;
  • Figure 5 is a schematic structural diagram of the second display panel at the groove provided by the embodiment of the present application.
  • Figure 6 is a schematic structural diagram of a groove provided by an embodiment of the present application.
  • Figure 7 is a schematic plan view of the transition zone and the light-transmitting zone provided by the embodiment of the present application.
  • 8a to 8d are schematic flowcharts of the manufacturing method of the display panel provided by the embodiment of the present application.
  • FIG. 1 is a schematic plan view of a display panel provided by an embodiment of the present application.
  • the display panel includes a photosensitive area PA and a transition area surrounding the photosensitive area PA.
  • TA a display area AA surrounding the transition area TA, and a non-display area NA provided on the periphery of the display area AA.
  • the display area AA is used to realize the function of picture display.
  • the display area AA may be provided with a plurality of pixels distributed in an array for emitting light, and the plurality of pixels may emit light under the driving of a pixel driving circuit to achieve a screen display function.
  • the photosensitive area can be used to obtain and sense external light.
  • an optical sensor may be provided in the photosensitive area PA. The optical sensor may acquire light from the external environment, convert the acquired light into a corresponding electrical signal, and transmit the electrical signal to a processor for processing.
  • the optical sensor may be a camera. By installing the camera in the photosensitive area PA, the function of under-screen photography or face recognition can be realized.
  • the first direction x is the width direction of the display panel
  • the second direction y is the length direction of the display panel
  • the third direction z is the thickness direction of the display panel
  • the third direction The direction z is perpendicular to the first direction x and the second direction y.
  • Figure 2 is a partial structural schematic diagram along the A-A direction of the first display panel provided by an embodiment of the present application.
  • the display panel also includes a base substrate 10 and a driving circuit layer 20.
  • the base substrate 10 It includes a substrate 13 , a first inorganic layer 11 and a first organic layer 12 that are stacked in sequence.
  • the driving circuit layer 20 is disposed on a side of the first organic layer 12 away from the first inorganic layer 11 .
  • the substrate 13 includes a second organic layer, and the second organic layer is disposed on a side of the first inorganic layer 11 away from the first organic layer 12 .
  • the substrate 13 may be a single-layer organic film structure composed of the second organic layer.
  • the substrate 13 may also be a double-layer or multi-layer organic film formed by stacking two or more organic film layers on the side of the first inorganic layer 11 away from the first organic layer 12 . membrane structure.
  • the first inorganic layer 11 is made of inorganic materials and has good ability to block water and oxygen.
  • the material of the first inorganic layer 11 may be any one of silicon nitride, silicon oxide, and silicon oxynitride.
  • the water vapor transmission rate (WVTR) of the first inorganic layer 11 is approximately 10-6/m2/day.
  • the first organic layer 12 and the second organic layer may be made of organic materials.
  • the organic material may include, but is not limited to, polyimide (PI), polyamide (PA), polycarbonate (PC), polyphenylene ether sulfone (PES), polyethylene terephthalate ( One or a mixture of PET, polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), and cyclic olefin copolymer (COC).
  • the driving circuit layer 20 includes a second inorganic layer 21 and a plurality of insulating layers 22, metal layers 23, and flat layers 24 stacked on a side of the second inorganic layer 21 facing away from the base substrate 10.
  • the third organic layer 25 is formed by a second inorganic layer 21 and a plurality of insulating layers 22, metal layers 23, and flat layers 24 stacked on a side of the second inorganic layer 21 facing away from the base substrate 10.
  • the second inorganic layer 21 may be made of inorganic materials, so that the second inorganic layer 21 has good ability to block water and oxygen.
  • the material of the second inorganic layer 21 may be any one of silicon nitride, silicon oxide, and silicon oxynitride.
  • the second inorganic layer 21 can be made of the same material as the first inorganic layer 11 .
  • the insulating layer 22 may include a stacked first gate insulating layer 220 , a second gate insulating layer 221 , and an interlayer dielectric layer 222
  • the flat layer 24 may include a stacked layer.
  • the metal layer 23 may include a first metal layer 230 provided on the first gate insulating layer 220.
  • the second metal layer 231 provided on the second gate insulating layer 221
  • the third metal layer 232 provided on the interlayer dielectric layer 222
  • the fourth metal layer 233 provided on the first planarization layer 240 .
  • the display panel also includes a light-emitting layer 30.
  • the light-emitting layer 30 may include an anode, a hole injection layer, a hole transport layer, an organic light-emitting material layer, and an electron transport layer that are stacked on the driving circuit layer 20 in sequence. Electron injection layer and cathode, wherein the anode and organic light-emitting material layer are only provided in the display area AA, the hole injection layer, hole transport layer, electron transport layer, electron injection layer and cathode can all adopt the entire surface The evaporation process is used to form the display area AA and the non-display area NA. It should be noted that the light-emitting layer 30 below is a general term for the hole injection layer, hole transport layer, electron transport layer, electron injection layer, cathode and other film layers formed by evaporation on the entire surface.
  • the third organic layer 25 is a pixel definition layer, and the material of the third organic layer 25 may be an organic black photoresist material.
  • a plurality of pixel openings may be provided on the third organic layer 25
  • the light-emitting layer 30 may be provided on the third organic layer 25
  • the organic light-emitting material layer in the light-emitting layer 30 may be provided only on the pixels.
  • the pixel opening is used to define a plurality of pixel units 31 that can emit light.
  • the color of the pixel unit 31 may include but is not limited to red, green and blue.
  • the base substrate 10 and the drive circuit layer 20 are provided with a through hole 40 in the photosensitive area PA.
  • the through hole 40 penetrates the base substrate 10 and the drive circuit layer in the thickness direction of the base substrate 10 . circuit layer 20, thereby improving the light transmittance of the photosensitive area PA.
  • the photosensitive device may be disposed corresponding to the photosensitive area PA, and the light-emitting device may be disposed in the through hole 40 or below the through hole 40 .
  • the display panel further includes an encapsulation layer 50 , which is disposed on a side of the light-emitting layer 30 away from the base substrate 10 and covers the light-emitting layer 30 .
  • first opening 210 is provided on the second inorganic layer 21, and the second opening 120 is provided on the first organic layer 12.
  • the first opening 210 is electrically connected to the second opening 120 and the The width of the first opening 210 is smaller than the width of the second opening 120 , and the light-emitting layer 30 is disconnected at the second opening 120 when covering the transition area TA.
  • the second inorganic layer 21 is provided with a first opening 210 , and the first opening 210 can penetrate the second inorganic layer 21 in the third direction z.
  • the first organic layer 12 is provided with a second opening 120 corresponding to the first opening 210.
  • the first opening 210 and the second opening 120 are connected to each other.
  • the second opening 120 can be in the first opening 120.
  • the surface of the side of the first organic layer 12 close to the second inorganic layer 21 is recessed to the inside of the first organic layer 12 , but does not penetrate the first organic layer 12 , that is, The bottom surface of the second opening 120 is not in contact with the surface of the first inorganic layer 11 close to the first organic layer 12, and is separated from the first inorganic layer 11 by a portion of the first organic layer.
  • Layer 12 of organic material is not in contact with the surface of the first inorganic layer 11 close to the first organic layer 12, and is separated from the first inorganic layer 11 by a portion of the first organic layer.
  • the width of the first opening 210 is smaller than the width of the second opening 120 , some areas of the bottom surface of the second opening 120 will be covered by the edge of the first opening 210 . Blocked, this part of the area cannot be deposited with luminescent material.
  • the area on the bottom of the second opening 120 that is not blocked by the edge of the first opening 210 will deposit luminescent material and form the luminescent layer 30, so that the luminescent layer 30 is deposited and formed on the first opening 210.
  • the portion of the opening 210 ground is disconnected from the other portions deposited within the transition zone TA.
  • the through hole 40 penetrates the base substrate 10 in the thickness direction of the base substrate 10 , and the base substrate 10 is on the inner wall of the through hole 40
  • water vapor and oxygen can invade into the interior of the substrate substrate 10 through the inner wall of the through hole 40 and pass through the light-emitting layer 30 located in the transition area TA and the encapsulation layer 50 located in the first opening 210 and the second opening 120
  • Possible cracks invade the luminescent layer of the display area AA, causing the organic luminescent material in the luminescent layer 30 in the display area AA to fail, resulting in hole black spots on the display panel.
  • the good water and oxygen barrier ability of the first inorganic layer 11 can be used to block the intrusion of water and oxygen into the display area through the second organic layer located below the first inorganic layer 11 AA path, while disconnecting the luminescent layer 30 at the second opening 120, can block the path of water and oxygen from intruding into the display area AA through the luminescent layer 30, thereby reducing the risk of luminescent material failure and improving the appearance of holes in the display panel.
  • the problem of dark spots is disposed below the first organic layer 12 .
  • FIG. 4 is a partial cross-sectional view along the A-A direction of the second display panel provided by the embodiment of the present application
  • FIG. 5 is the second display panel provided by the embodiment of the present application.
  • a schematic structural diagram of the display panel at the groove It should be noted that the structure of the second display panel shown in Figure 4 is roughly the same as the structure of the first display panel shown in Figure 2.
  • a second opening 120 is provided on the first organic layer 12, and the bottom surface of the second opening 120 and the side of the first inorganic layer 11 close to the first organic layer 12 Surface contact, that is, the second opening 120 penetrates the first organic layer 12 in the thickness direction of the first organic layer 12 and exposes the first inorganic layer 11 located below the first organic layer 12 surface.
  • the etching gas removes the first organic layer 12 from the first organic layer 12 .
  • the first inorganic layer 11 will not be affected and the etching will stop. Therefore, it can be ensured that the depths of the plurality of second openings 120 formed by the etching are completely consistent, thereby improving the film formation efficiency of the packaging layer 50 in the second openings 120. Uniformity, thereby reducing the risk of cracks in the encapsulation layer due to differences in depth of the second opening 120 .
  • the light-emitting layer 30 is provided at the second opening 120 on the side surface of the first inorganic layer 11 exposed by the second opening 120 and close to the first organic layer 12, so The width of the light-emitting layer 30 at the second opening 120 is smaller than the width of the bottom surface of the second opening 120 .
  • the encapsulation layer 50 is continuously provided at the second opening 120 .
  • the encapsulation layer 50 is connected to the sidewall of the second opening 120 and the first inorganic layer 11 close to the first organic layer 12 at the second opening 120 .
  • the side surface of the luminescent layer 30 is in contact with the side surface of the luminescent layer 30 away from the first inorganic layer 11 , so that the luminescent layer 30 located in the second opening 120 can be completely wrapped by the encapsulation layer 50 and the first inorganic layer 11 This prevents water and oxygen from intruding into the light-emitting layer in the display area AA through the light-emitting layer 30 on the bottom surface of the second opening 120, thereby reducing the risk of failure of the light-emitting material in the light-emitting layer.
  • the orthographic projection of the first opening 210 on the first inorganic layer 11 falls within the orthographic projection of the second opening 120 on the first inorganic layer 11 .
  • the shape of the first opening 210 is an inverted trapezoid in cross-section parallel to the first direction x and the third direction z, and the side walls of the first opening 210 are inclined.
  • the width of the first opening 210 in the first direction x gradually increases along the third direction z.
  • the side wall of the second opening 120 is recessed toward the inside of the first opening 210 and forms a curved surface in a cross section parallel to the first direction x and the third direction z.
  • the second opening 120 is in the third direction.
  • the width in one direction x first gradually increases and then decreases along the third direction z.
  • the third opening 210 can be made The width of the two openings 120 in the first direction
  • the portion of the opening 210 that protrudes from the edge of the second opening 120 blocks the material deposited to form the luminescent layer 30 to ensure that the luminescent layer 30 formed on the bottom of the second opening 120 and the luminescent layer 30 formed outside the second opening 120 It is completely disconnected and cannot completely cover the surface of the first inorganic layer 11 exposed by the second opening 120, so that the subsequently formed encapsulating layer 50 can form a completely encapsulating sealing structure with the first inorganic layer 11 and the light-emitting layer 30, thereby The path of water and oxygen intruding from the light-emitting layer 30 at the bottom of the second opening 120 to the light-emitting layer can be completely cut off.
  • any edge of the first opening 210 beyond the edge of the same side of the second opening 120 is greater than 0 and less than or equal to 2 ⁇ m.
  • Figure 6 is a schematic structural diagram of the first opening and the second opening provided by the embodiment of the present application.
  • the surrounding edges of the first opening 210 exceed the surrounding edges of the second opening 120.
  • the distance d between the lower edge of the first opening 210 and the lower edge of the second opening 120 may be 0.2 ⁇ m, 0.5 ⁇ m, 1 ⁇ m, 1.5 ⁇ m, or 2 ⁇ m, etc. In this way, it can be ensured that the luminescent layer 30 at the bottom of the second opening 120 is completely disconnected from the luminescent layer 30 outside the second opening 120 , and water and oxygen can be blocked from intruding into the luminescent layer AA in the display area through the luminescent layer 30 in the second opening 120 . path of.
  • the distance H is greater than or equal to 1.5 ⁇ m and less than or equal to 3 ⁇ m.
  • the distance H between the side surface of the first inorganic layer 11 close to the first organic layer 12 and the side surface of the second inorganic layer 21 close to the first organic layer 12 may be 1.5 ⁇ m. , 1.8 ⁇ m, 2 ⁇ m, 2.5 ⁇ m, 2.8 ⁇ m or 3 ⁇ m, etc.
  • the distance between the first inorganic layer 11 and the second inorganic layer 21 is too small, the light-emitting layer 30 in the second opening 120 and the light-emitting layer 30 outside the second opening 120 cannot be disconnected.
  • the first inorganic layer 11 and the encapsulation layer 50 cannot completely cover the luminescent layer 30 at the bottom of the second opening 120 , and water and oxygen can invade into the luminescent layer in the display area AA through the luminescent layer in the second opening 120 , causing the luminescent layer to The luminescent material fails.
  • the encapsulation layer 50 deposited in the second opening 120 will be disconnected, cracks will occur, and the first opening 210 and the second opening 120 will not be able to be connected.
  • the side walls and bottom form a continuous closed structure, which reduces the encapsulation effect of the encapsulation layer 50. Water and oxygen can invade into the luminescent layer through the cracks in the encapsulation layer 50, causing the luminescent material in the luminescent layer to fail.
  • the distance between the side surface of the first inorganic layer 11 close to the first organic layer 12 and the side surface of the second inorganic layer 21 close to the first organic layer 12 is limited to 1.5 ⁇ m. to 3 ⁇ m, it can not only ensure the encapsulation effect of the encapsulation layer 50 , but also ensure that the encapsulation layer 50 and the first inorganic layer 11 form a complete package for the light-emitting layer 30 , completely blocking water and oxygen from passing through the light-emitting layer 30 at the bottom of the second opening 120 Path that invades the luminescent layer.
  • the display panel further includes a blocking wall 60 , which can be disposed in the transition area TA and surrounds the photosensitive area PA, and is disposed on the second inorganic layer 21 away from the first organic layer 21 . on one side of layer 12.
  • the retaining wall 60 may have a multi-layer stacked structure or a single-layer structure.
  • the blocking wall 60 may adopt the first gate insulating layer 220 , the second gate insulating layer 221 , the interlayer dielectric layer 222 , the first flattening layer 240 , the second flattening layer 241 and the third flattening layer 240 .
  • the three organic layers 25 are formed through processes and material preparation, thereby forming a multi-layer stacked structure. In practical applications, only the film forming process and materials of the third organic layer 25 may be used to prepare and form the third organic layer 25 simultaneously.
  • the encapsulation layer 50 includes a first inorganic encapsulation layer 51, a second inorganic encapsulation layer 53 located on the first inorganic encapsulation layer 51, and a gap between the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 51.
  • Organic encapsulation layer 52 between layers 53 .
  • the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 are both disposed in the display area AA and the transition area TA.
  • the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 are also This covers the retaining wall 60 .
  • the barrier 60 may be used to define a diffusion boundary of the organic material forming the organic encapsulation layer 52 , so that the organic encapsulation layer 52 is only formed on the side of the barrier 60 away from the photosensitive area PA.
  • first opening 210 and the second opening 120 are provided on both the side of the blocking wall 60 close to the photosensitive area PA and the side of the blocking wall 60 away from the photosensitive area PA.
  • the first inorganic encapsulation layer 51 covers the side walls of the first opening 210 and the second opening 120 and is located at the side.
  • the luminescent layer 30 on the bottom surface of the second opening 120 and the first inorganic layer 11 not covered by the luminescent layer 30, the first inorganic encapsulating layer 51 and the first inorganic layer 11 form a structure surrounding the Sealing structure of the luminescent layer 30 .
  • the organic encapsulation layer 52 is disposed on the first inorganic encapsulation layer 51 and fills the second opening 120 and the first opening 210 .
  • the second inorganic encapsulation layer 53 is disposed on the organic encapsulation layer 52 .
  • the first inorganic encapsulation layer 51 covers the side walls of the first opening 210 and the second opening 120 , the luminescent layer 30 located on the bottom surface of the second opening 120 and the first inorganic layer 11 not covered by the luminescent layer 30 , the first inorganic encapsulation layer 51 and the first inorganic layer 11 A sealing structure surrounding the light-emitting layer 30 is formed.
  • the second inorganic encapsulation layer 53 covers the first inorganic encapsulation layer 51 located within the first opening 210 and the second opening 120 , and also covers the first inorganic encapsulation layer 53 located on the second inorganic layer 21 . Encapsulation layer 51.
  • the display panel includes a plurality of first openings 210 and a plurality of second openings 120, each of the first openings 210 and a corresponding second opening 120 are in communication with each other, and a plurality of the first openings 210 are electrically connected to each other.
  • the first opening 210 and the second opening 120 surround the photosensitive area PA layer by layer.
  • FIG. 7 is a schematic plan view of the transition area and the light-transmitting area provided by the embodiment of the present application.
  • the blocking wall 60 is provided with a side on one side close to the photosensitive area PA.
  • the two sets of first openings 210 and the second openings 120 surround the photosensitive area PA layer by layer, thereby increasing the intrusion of water and oxygen from the side of the base substrate 10 path to the display area AA, thereby reducing the risk of water and oxygen intrusion causing the failure of the luminescent material.
  • the photosensitive area PA is circular, and the first opening 210 and the second opening 120 located on both sides of the blocking wall 60 are annular groove structures surrounding the photosensitive area PA.
  • the photosensitive area PA may also be in the shape of a water drop, an ellipse, or other irregular shapes, and the shapes of the first opening 210 and the second opening 120 may be adapted to a water drop shape surrounding the photosensitive area PA. , elliptical ring or other irregular shapes, there are no restrictions here.
  • the embodiment of the present application also provides a manufacturing method of the display panel.
  • the manufacturing method of the display panel is used to prepare the display panel provided in the above embodiment.
  • Figures 8a to 8d are schematic process flow diagrams of the manufacturing method of the display panel provided by the embodiment of the present application.
  • the manufacturing method of the display panel is as follows:
  • Step S10 sequentially form the first inorganic layer 11 and the first organic layer 12 on the substrate 13;
  • Step S20 Form a driving circuit layer and a plurality of retaining walls 60 on the side of the first organic layer 12 facing away from the first inorganic layer 11;
  • Step S30 Form a first opening 210 on the second inorganic layer 21 of the driving circuit layer;
  • Step S40 Based on the first opening 210, form a second opening 120 on the first organic layer 12 with a width smaller than the first opening 210 and conductive with the first opening 210;
  • Step S50 Form a light-emitting layer on the side of the driving circuit layer facing away from the substrate 10, and the light-emitting layer is disconnected at the second opening 120.
  • Step S60 Form an encapsulation layer 50 on the side of the light-emitting layer away from the base substrate 10.
  • the substrate 13 includes a second organic layer, and the first inorganic layer 11 and the first organic layer 12 may be formed on the second organic layer in sequence.
  • the first organic layer 12 and the second organic layer are both made of organic materials.
  • the organic material may include, but is not limited to, polyimide (PI), polyamide (PA), polycarbonate (PC), polyphenylene ether sulfone (PES), polyethylene terephthalate ( One or a mixture of PET, polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), and cyclic olefin copolymer (COC).
  • the first organic layer 12 and the second organic layer are made of the same material.
  • the substrate 13 may be a single-layer organic film structure composed of the second organic layer. In some other embodiments, the substrate 13 may also be a double-layer or multi-layer organic film structure formed by stacking two or more organic film layers in sequence.
  • the first inorganic layer 11 is made of inorganic materials and has good ability to block water and oxygen. Specifically, the first inorganic layer 11 is made of one or two materials of silicon nitride and silicon oxide. The water vapor transmission rate (WVTR) of the first inorganic layer 11 is approximately 10-6/m2/day.
  • the second inorganic layer 21 is made of inorganic materials and has good ability to block water and oxygen.
  • the first inorganic layer 11 is made of one or two materials of silicon nitride and silicon oxide.
  • the second inorganic layer 21 can be made of the same material as the first inorganic layer 11 .
  • Figure 8b does not show the insulating layer, metal layer, flat layer and pixel definition layer.
  • the structure of the insulating layer, metal layer, flat layer and pixel definition layer can be referred to Figure 2 and Figure 4 , will not be described in detail here.
  • the retaining wall 60 can be prepared simultaneously with the third organic layer using the process of the third organic layer in the driving circuit layer.
  • the structure of the driving circuit layer can be referred to Figures 2 and 2.
  • the structure of the driving circuit layer 20 in Figure 4 will not be described again here.
  • a patterned first opening 210 may be formed on the second inorganic layer 21 by photolithography.
  • the first opening 210 is an annular opening surrounding the photosensitive area, and the first opening 210 penetrates the second inorganic layer 21 in the thickness direction of the second inorganic layer 21 .
  • the first organic layer 12 can be etched using O2 by a gas etching method based on the first opening 210 to form a patterned second opening 120 .
  • the second opening 120 is an annular opening surrounding the photosensitive area.
  • the second opening 120 may penetrate the first organic layer 12 and expose the first inorganic layer 11 . In other embodiments, as shown in FIG. 2 , the second opening 120 may only extend into the first organic layer 12 but not penetrate the first organic layer 12 .
  • the light-emitting layer 30 may include an anode, a hole injection layer, a hole transport layer, an organic light-emitting material layer, an electron transport layer, an electron injection layer and The cathode, wherein the anode and the organic light-emitting material layer are only provided in the display area, the hole injection layer, hole transport layer, electron transport layer, electron injection layer and cathode can all adopt the entire surface evaporation process, formed in the display area and the non-display area.
  • step S50 since the width of the first opening 210 is smaller than the width of the second opening 120, when the luminescent layer 30 is deposited, the surrounding edges of the first opening 210 can block the second opening 120, and the luminescent layer 30 is only deposited. Formed on the bottom surface of the second opening 120 , the portion of the light-emitting layer 30 at the second opening 120 can be disconnected from other portions.
  • the encapsulation layer 50 may be a thin film encapsulation structure formed by sequentially superimposing a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer.
  • the first inorganic encapsulation layer and the second inorganic encapsulation layer may adopt an entire surface.
  • the first inorganic encapsulation layer may be formed on the side walls of the first opening 210 and the second opening 120 and cover the light-emitting layer on the bottom of the second opening 120 and the third part not covered by the light-emitting layer.
  • the first inorganic layer 11 can also be used as a barrier for etching the first organic layer 12 so that the depths of the plurality of second openings 120 formed by the etching are consistent, thereby ensuring that the encapsulation layer 50 can be in the second opening 120 Continuous deposition at the second opening 120 avoids cracks in the encapsulation layer 50 at the second opening 120 , thereby reducing the risk of failure of the luminescent material in the luminescent layer.
  • embodiments of the present application further provide a display device.
  • the display device includes the display panel provided in the above embodiments.
  • the display device may be a mobile terminal, such as color electronic paper, color electronic paper, etc. e-books, smart phones, etc., the display device can also be a wearable terminal, such as a smart watch, a smart bracelet, etc., or the display device can also be a fixed terminal, such as a color electronic billboard, color electronic poster, etc.
  • Embodiments of the present application provide a display panel and a display device.
  • the display device includes the display panel.
  • the display panel includes a photosensitive area, a transition area surrounding the photosensitive area, and a display area surrounding the transition area.
  • the display panel further includes: a base substrate, including an inorganic protective layer and first and second surfaces arranged oppositely, and the inorganic protective layer is arranged between the first surface and the second surface and is connected to the first surface and the second surface.
  • the first surface and the second surface are spaced apart from each other; a driving circuit layer is provided on a side of the first surface facing away from the second surface; a photosensitive hole is provided in the photosensitive area, and the photosensitive hole penetrating the base substrate in the thickness direction of the base substrate; a groove disposed in the transition area and surrounding the photosensitive area, the groove being concave from the first surface of the base substrate into the base substrate and located on the side of the inorganic protective layer close to the first surface; and an encapsulation layer disposed on the driving circuit layer and covering the side walls and bottom of the groove,
  • the inorganic protective layer disposed inside the base substrate blocks the path of water and oxygen from lateral intrusion into the display area from the opening of the base substrate in the photosensitive area, thereby preventing water and oxygen from accumulating in the transition area, thereby solving the problem of Poor display problems such as black spots on holes caused by water and oxygen intrusion.

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Abstract

一种显示面板及显示装置，该显示装置包括显示面板，显示面板包括感光区（PA）、过渡区（TA）以及显示区（AA），显示面板还包括衬底基板（10）、驱动电路层（20）以及发光层（30），通过使发光层（30）在衬底基板（10）上的开口（210,120）处断开，阻断水氧通过感光区（PA）的通孔（40）侧向入侵至显示区（AA）的路径，从而可以解决由于水氧入侵导致的孔黑斑等显示不良的问题。

Description

显示面板及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板及显示装置。
 背景技术
有机发光二极管（organic light emitting diode, OLED）显示技术是一种可以自发光的显示技术，不需要背光，而且不具有高亮度、低功耗、宽视角、高响应速度等优点，目前已广泛应用于手机面板显示行业。显示面板除了显示面以外，还有摄像头、听筒、话筒、电路等部件，也占据了相当的一部分的屏占比。
 技术问题
目前，市面上产品较多采用的工艺是将衬底基板感光区的边缘进行挖孔，形成凹槽，以使公共层在凹槽处断开，阻挡水氧通过公共层侧向入侵的路径。这种设计虽然可以最大程度地降低水氧侧向入侵的风险，但是却增加了水氧从衬底基板侧垂直入侵的路径。由于感光区的衬底基板在切割后是完全暴露在高湿环境中，水氧极易从衬底基板的侧向进去，聚集在凹槽下方的衬底基板材料中，可以通过无机膜层的间隙、针孔（pinhole）、裂缝等地方进入显示区，从而导致显示区内发光层的发光材料失效，出现孔黑斑等显示不良的情况发生。此外，凹槽的结构（如深度、宽度等）不一致也会导致封装层在凹槽处沉积形成的薄膜的质量，继而影响封装效果，增加孔黑板现象发生的几率，严重影响产品品质。
综上所述，现有显示面板存在水氧可以通过衬底基板在感光区的开孔侧向入侵至显示区导致孔黑斑等显示不良的问题。故，有必要提供一种显示面板及显示装置来改善这一缺陷。
 技术解决方案
本申请实施例提供一种显示面板及显示装置，用于解决现有显示面板存在的水氧可以通过衬底基板在感光区的开孔侧向入侵至显示区导致孔黑斑等显示不良的问题。
本申请实施例提供一种显示面板，包括感光区、围绕所述感光区的过渡区以及围绕所述过渡区的显示区，所述显示面板还包括：
衬底基板，包括依次层叠设置的衬底、第一无机层、以及第一有机层；
驱动电路层，设置在所述衬底基板的一侧，所述驱动电路层包括第二无机层，所述第一有机层设置在所述第一无机层和所述第二无机层之间，所述第二无机层在所述过渡区设置有第一开口，所述第一有机层在所述过渡区设置有第二开口，所述第一开口与所述第二开口导通且所述第一开口的宽度小于所述第二开口的宽度；
发光层，设置在所述驱动电路层远离所述基板的一侧，且在覆盖所述过渡区时在所述第二开口处断开设置；
封装层，设置在所述发光层远离所述衬底基板的一侧。
根据本申请一实施例，所述第二开口的底面与所述第一无机层靠近所述第一有机层的一侧表面接触。
根据本申请一实施例，所述发光层在所述第二开口处设置于所述第一无机层靠近所述第一有机层的一侧表面之上，所述发光层在所述第二开口处的宽度小于所述第二开口的底面的宽度。
根据本申请一实施例，所述封装层在所述第二开口处连续设置。
根据本申请一实施例，所述封装层在所述第二开口处与所述第二开口的侧壁、所述第一无机层靠近所述第一有机层的一侧表面、以及所述发光层背离所述第一无机层的一侧表面接触。
根据本申请一实施例，所述第一开口在所述第一无机层上的正投影落于所述第二开口在所述第一无机层上的正投影内。
根据本申请一实施例，所述第一开口的任意一侧边缘超出所述第二开口的同侧边缘的长度大于0且小于或等于2μm。
根据本申请一实施例，所述第一无机层靠近所述第无机层的一侧表面与所述第二无机层靠近所述第一无机层的一侧表面之间的距离1.5μm且小于或等于3μm。
根据本申请一实施例，所述第一无机层与所述第二无机层的材料相同。
根据本申请一实施例，所述衬底包括第二有机层，所述第二有机层设置于所述第一无机层背离所述第一有机层的一侧，并且与所述第一有机层的材料相同。
根据本申请一实施例，所述显示面板包括设置于所述过渡区并环绕所述感光区的挡墙，所述挡墙设置于所述第二无机层背离所述第一有机层的一侧；
其中，所述挡墙靠近所述感光区的一侧、以及所述挡墙远离所述感光区的一侧均设置有所述第一开口和所述第二开口。
根据本申请一实施例，所述驱动电路层包括第三有机层，所述发光层设置于所述第三有机层之上，所述挡墙与所述第三有机层的材料相同。
根据本申请一实施例，所述衬底基板和所述驱动电路层在所述感光区设置的通孔。
本申请实施例还提供一种显示装置，包括感光器件和显示面板，所述显示面板包括感光区、围绕所述感光区的过渡区以及围绕所述过渡区的显示区，所述感光器件对应所述感光区设置，所述显示面板还包括：
衬底基板，包括依次层叠设置的衬底、第一无机层、以及第一有机层；
驱动电路层，设置在所述衬底基板的一侧，所述驱动电路层包括第二无机层，所述第一有机层设置在所述第一无机层和所述第二无机层之间，所述第二无机层在所述过渡区设置有第一开口，所述第一有机层在所述过渡区设置有第二开口，所述第一开口与所述第二开口导通且所述第一开口的宽度小于所述第二开口的宽度；
发光层，设置在所述驱动电路层远离所述基板的一侧，且在覆盖所述过渡区时在所述第二开口处断开设置；
封装层，设置在所述发光层远离所述衬底基板的一侧。
根据本申请一实施例，所述第二开口的底面与所述第一无机层靠近所述第一有机层的一侧表面接触。
根据本申请一实施例，所述发光层在所述第二开口处设置于所述第一无机层靠近所述第一有机层的一侧表面之上，所述发光层在所述第二开口处的宽度小于所述第二开口的底面的宽度。
根据本申请一实施例，所述封装层在所述第二开口处连续设置。
根据本申请一实施例，所述封装层在所述第二开口处与所述第二开口的侧壁、所述第一无机层靠近所述第一有机层的一侧表面、以及所述发光层背离所述第一无机层的一侧表面接触。
根据本申请一实施例，所述第一开口在所述第一无机层上的正投影落于所述第二开口在所述第一无机层上的正投影内。
根据本申请一实施例，所述第一开口的任意一侧边缘超出所述第二开口的同侧边缘的长度大于0且小于或等于2μm。
 有益效果
本揭示实施例的有益效果：本申请实施例提供一种显示面板及显示装置，所述显示装置包括所述显示面板，所述显示面板包括感光区、围绕所述感光区的过渡区以及围绕所述过渡区的显示区，所述显示面板还包括：衬底基板，包括依次层叠设置的第一无机层和第一有机层；驱动电路层，设置在所述衬底基板的一侧，所述驱动电路层包括第二无机层，所述第一有机层设置在所述第一无机层和所述第二无机层之间，所述第二无机层在所述过渡区设置有第一开口，所述第一有机层在所述过渡区设置有第二开口，所述第一开口与所述第二开口导通且所述第一开口的宽度小于所述第二开口的宽度；发光层，设置在所述驱动电路层远离所述基板的一侧，且在覆盖所述过渡区时在所述第二开口处断开设置；封装层，设置在所述发光层远离所述衬底基板的一侧，以此通过使发光层在衬底基板上的第二开口处断开，阻断水氧从感光区的通孔侧向入侵至显示区的路径，以此避免水氧在过渡区聚集，从而可以解决由于水氧入侵导致的孔黑斑等显示不良的问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示面板的平面结构示意图；
图2为本申请实施例提供的第一种显示面板沿A-A方向的局部结构示意图；
图3为本申请实施例提供的第一种显示面板在凹槽处的结构示意图；
图4为本申请实施例提供的第二种显示面板沿A-A方向的局部截面示意图；
图5为本申请实施例提供的第二种显示面板在凹槽处的结构示意图；
图6为本申请实施例提供的凹槽的结构示意图；
图7为本申请实施例提供的过渡区以及透光区的平面示意图；
图8a至图8d为本申请实施例提供的显示面板的制作方法的流程结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本揭示可用以实施的特定实施例。本揭示所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本揭示，而非用以限制本揭示。在图中，结构相似的单元是用以相同标号表示。
下面结合附图和具体实施例对本揭示做进一步的说明：
本申请实施例提供一种显示面板，如图1所示，图1为本申请实施例提供的显示面板的平面结构示意图，所述显示面板包括感光区PA、围绕所述感光区PA的过渡区TA、围绕所述过渡区TA的显示区AA以及设置于所述显示区AA外围的非显示区NA。
所述显示区AA用于实现画面显示的功能。例如，所述显示区AA内可以设置有多个呈阵列分布的用于发光的像素，多个所述像素可以在像素驱动电路的驱动下进行发光以此实现画面显示的功能。所述感光区可以用于获取并感知外界光线。例如，所述感光区PA内可以设置有光学传感器，所述光学传感器可以获取外界环境的光线，然后将获取的光线转换为对应的电信号并将电信号传递至处理器进行处理。所述光学传感器可以是摄像头，通过将摄像头安装在感光区PA内，可以实现屏下摄像或者人脸识别的功能。
需要说明的是，下文中第一方向x为所述显示面板的宽度方向，第二方向y为所述显示面板的长度方向，第三方向z为所述显示面板的厚度方向，所述第三方向z垂直于所述第一方向x和所述第二方向y。
如图2所示，图2为本申请实施例提供的第一种显示面板沿A-A方向的局部结构示意图，所述显示面板还包括衬底基板10以及驱动电路层20，所述衬底基板10包括依次层叠设置的衬底13、第一无机层11和第一有机层12，所述驱动电路层20设置于第一有机层12背离所述第一无机层11的一侧之上。
所述衬底13包括第二有机层，所述第二有机层设置于所述第一无机层11背离所述第一有机层12的一侧。
在本申请实施例中，所述衬底13可以为所述第二有机层构成的单层有机膜层结构。在其他一些实施例中，所述衬底13也可以是由两层或者多层有机膜层依次堆叠在第一无机层11背离所述第一有机层12一侧形成的双层或者多层有机膜层结构。
在本申请实施例中，所述第一无机层11由无机材料制备形成，具备良好的阻隔水氧的能力。具体的，所述第一无机层11的材料可以为氮化硅、氧化硅、氮氧化硅中任意一种。所述第一无机层11的水蒸气透过率（water vapor transmission rate, WVTR）约为10-6/m2/day。
所述第一有机层12和第二有机层可以采用有机材料制备形成。例如，所述有机材料可以包括但不限于聚酰亚胺（PI）、聚酰胺(PA)、聚碳酸酯(PC)、聚苯醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚甲基丙烯酸甲酯(PMMA)、环烯烃共聚物(COC)中的一种或者多种的混合物。
优选的，所述第一有机层12与所述第二有机层的材料相同。所述驱动电路层20包括第二无机层21、以及层叠设置于所述第二无机层21背离所述衬底基板10一侧之上的多个绝缘层22、金属层23、平坦层24、第三有机层25。
在本申请实施例中，所述第二无机层21可以由无机材料制备形成，以使所述第二无机层21具备良好的阻隔水氧的能力。具体的，所述第二无机层21的材料可以为氮化硅、氧化硅、氮氧化硅中的任意一种。优选的，所述第二无机层21可以采用与所述第一无机层11相同的材料制备形成。
如图2所示，所述绝缘层22可以包括层叠设置的第一栅极绝缘层220、第二栅极绝缘层221、层间介质层222，所述平坦层24可以包括设置于所述层间介质层222上的第一平坦层240、设置于第一平坦层240上的第二平坦层241，所述金属层23可以包括设置于第一栅极绝缘层220上的第一金属层230、设置于第二栅极绝缘层221上的第二金属层231、设置于层间介质层222上的第三金属层232以及设置于第一平坦层240上的第四金属层233。
所述显示面板还包括发光层30，所述发光层30可以包括依次层叠设置于所述驱动电路层20上的阳极、空穴注入层、空穴传输层、有机发光材料层、电子传输层、电子注入层以及阴极，其中阳极和有机发光材料层均只设置于所述显示区AA内，所述空穴注入层、空穴传输层、电子传输层、电子注入层以及阴极均可以采用整面蒸镀的工艺，形成于所述显示区AA以及所述非显示区NA。需要说明的是，下文中发光层30是对整面蒸镀形成的空穴注入层、空穴传输层、电子传输层、电子注入层以及阴极等膜层的统称。
在本申请实施例中，所述第三有机层25即为像素定义层，所述第三有机层25的材料可以为有机黑色光阻材料。所述第三有机层25上可以设置有多个像素开口，所述发光层30可以设置于所述第三有机层25，所述发光层30中的有机发光材料层可以仅设置于所述像素开口内，以利用所述像素开口限定出多个可以发光的像素单元31。所述像素单元31的颜色可以包括但不限于红色、绿色以及蓝色。
所述衬底基板10和所述驱动电路层20在所述感光区PA设置有通孔40，所述通孔40在所述衬底基板10的厚度方向上贯穿所述衬底基板10以及驱动电路层20，以此提高所述感光区PA的透光率。感光器件可以与所述感光区PA对应设置，所述发光器件具体可以设置于所述通孔40内或者设置于通孔40的下方。
所述显示面板还包括封装层50，所述封装层50设置于所述发光层30远离所述衬底基板10的一侧之上，并且覆盖所述发光层30。
进一步的，所述第二无机层21上设置有第一开口210，所述第一有机层12上设有第二开口120，所述第一开口210与所述第二开口120导通且所述第一开口210的宽度小于所述第二开口120的宽度，所述发光层30在覆盖所述过渡区TA时在所述第二开口120处断开设置。
以图2所示的显示面板为例，所述第二无机层21上设置有第一开口210，所述第一开口210在第三方向z上可以贯穿所述第二无机层21。所述第一有机层12上设有与所述第一开口210对应设置的第二开口120，所述第一开口210与所述第二开口120相互连通，所述第二开口120可以在第三方向z上由所述第一有机层12靠近所述第二无机层21的一侧表面凹陷至所述第一有机层12的内部，但并未贯穿所述第一有机层12，即所述第二开口120的底面不与所述第一无机层11靠近所述第一有机层12的一侧表面接触，且与所述第一无机层11之间相互间隔了部分所述第一有机层12的有机材料。
在整面蒸镀形成所述发光层30时，由于所述第一开口210的宽度小于所述第二开口120的宽度，第二开口120的底面存在部分区域会被第一开口210的边缘所遮挡，该部分区域无法沉积发光材料，第二开口120的底面上未被第一开口210的边缘所遮挡的区域则会沉积发光材料并形成发光层30，以使发光层30沉积形成在第一开口210地面的部分与沉积形成在过渡区TA内的其他部分之间断开连接。
需要说明的是，若不对过渡区TA内的发光层30进行断开设置，由于通孔40在衬底基板10的厚度方向上贯穿衬底基板10，且衬底基板10在通孔40的内壁并未进行封装处理，水汽和氧气可以通过通孔40的内壁入侵至衬底基板10内部，并通过位于过渡区TA的发光层30以及位于第一开口210和第二开口120内的封装层50可能存在的裂缝侵入至显示区AA的发光层，致使显示区AA内发光层30中的有机发光材料失效，导致显示面板出现孔黑斑的现象。
通过在第一有机层12下方设置第一无机层11，利用第一无机层11良好的阻隔水氧能力，可以阻断水氧通过位于第一无机层11下方的第二有机层侵入至显示区AA的路径，同时将发光层30在第二开口120处断开设置，可以阻断水氧通过发光层30侵入至显示区AA的路径，从而可以降低发光材料失效的风险，改善显示面板出现孔黑斑的问题。
在其中一个实施例中，结合图4和图5所示，图4为本申请实施例提供的第二种显示面板沿A-A方向的局部截面示意图，图5为本申请实施例提供的第二种显示面板在凹槽处的结构示意图，需要说明的是，图4所示的第二种显示面板的结构与图2所示的第一种显示面板的结构大致相同，区别在于：图4所示的第二种显示面板中，所述第一有机层12上设置有第二开口120，所述第二开口120的底面与所述第一无机层11靠近所述第一有机层12的一侧表面接触，即所述第二开口120在所述第一有机层12的厚度方向上贯穿所述第一有机层12，并且暴露出位于所述第一有机层12下方的第一无机层11的表面。
需要说明的是，由于第一无机层11和第一有机层12分别采用无机材料和有机材料制备形成，在对第一有机层12蚀刻形成第二开口120时，蚀刻气体将第一有机层12贯穿后，不会对第一无机层11造成影响，蚀刻就会停止，因此可以确保蚀刻形成的多个第二开口120的深度完全一致，从而可以提高第二开口120内封装层50成膜的均一性，进而可以降低由于第二开口120深度的差异导致封装层产生裂缝的风险。
进一步的，所述发光层30在所述第二开口120处设置于所述第二开口120暴露出的所述第一无机层11靠近所述第一有机层12的一侧表面之上，所述发光层30在所述第二开口120处的宽度小于所述第二开口120的底面的宽度。
进一步的，所述封装层50在所述第二开口120处连续设置。
结合图4和图5所示，所述封装层50在所述第二开口120处与所述第二开口120的侧壁、所述第一无机层11靠近所述第一有机层12的一侧表面、以及所述发光层30背离所述第一无机层11的一侧表面接触，如此可以利用封装层50和所述第一无机层11将位于第二开口120内的发光层30完全包裹住，避免水氧通过第二开口120底面上的发光层30侵入至显示区AA内的发光层，从而可以降低发光层中的发光材料失效的风险。
进一步的，所述第一开口210在所述第一无机层11上的正投影落于所述第二开口120在所述第一无机层11上的正投影内。
在其中一个实施例中，如图3所示，所述第一开口210的形状在平行于第一方向x和第三方向z的截面呈倒置梯形，第一开口210的侧壁呈倾斜状，第一开口210在第一方向x上的宽度沿第三方向z逐渐增大。
所述第二开口120的侧壁向所述第一开口210的内部凹进，在平行于所述第一方向x和第三方向z的截面呈曲面，所述第二开口120在所述第一方向x上的宽度沿第三方向z先逐渐增大，再逐渐减小。
需要说明的是，通过限制所述第一开口210在所述第一无机层11上的正投影落于所述第二开口120在所述第一无机层11上的正投影内，可使第二开口120在第一方向x上的宽度大于第一开口210在第一方向x上的宽度，且第一开口210的四周边缘均凸出于第二开口120的四周边缘，以此利用第一开口210凸出于所述第二开口120边缘的部分对沉积形成发光层30的材料进行阻挡，确保形成于第二开口120底面的发光层30与形成于第二开口120之外的发光层30完全断开，并且无法完全覆盖第二开口120所暴露出的第一无机层11的表面，使得后续形成的封装层50可以与第一无机层11对发光层30形成完全包裹的密封结构，从而可以彻底切断水氧从第二开口120底部的发光层30侵入至发光层的路径。
进一步的，所述第一开口210任意一侧边缘超出所述第二开口120的同侧边缘的长度大于0且小于或等于2μm。
如图6所示，图6为本申请实施例提供的第一开口和第二开口处的结构示意图，所述第一开口210的四周边缘均超出所述第二开口120的四周边缘，所述第一开口210下侧边缘超出所述第二开口120的下侧边缘之间的距离d可以为0.2μm、0.5μm、1μm、1.5μm或者2μm等。如此，可以确保第二开口120底部的发光层30与第二开口120以外的发光层30彻底断开，阻断水氧通过第二开口120内的发光层30侵入至显示区内AA的发光层的路径。
进一步的，如图6所示，所述第一无机层11靠近所述第一有机层12的一侧表面与所述第二无机层21靠近所述第一有机层12的一侧表面之间的距离H大于或等于1.5μm且小于或等于3μm。例如，所述第一无机层11靠近所述第一有机层12的一侧表面与所述第二无机层21靠近所述第一有机层12的一侧表面之间的距离H可以为1.5μm、1.8μm、2μm、2.5μm、2.8μm或者3μm等。
需要说明的是，若第一无机层11与第二无机层21之间的距离过小，会使得第二开口120内的发光层30与第二开口120之外的发光层30无法断开，第一无机层11和封装层50无法对第二开口120底部的发光层30形成完全包裹，水氧可以通过第二开口120内的发光层入侵至显示区AA内的发光层，导致发光层中的发光材料失效。若第一无机层11与第二无机层21之间的距离过大，则会导致第二开口120内沉积形成的封装层50断开，产生裂缝，无法对第一开口210和第二开口120的侧壁以及底部形成连续封闭的结构，使得封装层50的封装效果降低，水氧可以通过封装层50上的裂缝入侵至发光层，导致发光层中的发光材料失效。
因此，将所述第一无机层11靠近所述第一有机层12的一侧表面与所述第二无机层21靠近所述第一有机层12的一侧表面之间的距离限制在1.5μm至3μm之间，既可以保证封装层50的封装效果，也可以保证封装层50和第一无机层11对发光层30形成完全包裹，彻底阻断水氧从第二开口120底部的发光层30侵入发光层的路径。
进一步的，所述显示面板还包括挡墙60，所述挡墙60可以设置于所述过渡区TA并环绕所述感光区PA，并且设置于所述第二无机层21背离所述第一有机层12的一侧之上。
所述挡墙60可以具有多层堆叠结构或者单层结构。例如图4所示，所述挡墙60可以采用所述第一栅极绝缘层220、第二栅极绝缘层221、层间介质层222、第一平坦层240、第二平坦层241以及第三有机层25的工艺以及材料制备形成，以此形成多层堆叠的结构。在实际应用中，也可以仅利用所述第三有机层25的成膜工艺以及材料与所述第三有机层25同步制备形成。
进一步的，所述封装层50包括第一无机封装层51、位于所述第一无机封装层51上的第二无机封装层53以及位于所述第一无机封装层51与所述第二无机封装层53之间的有机封装层52。
所述第一无机封装层51和所述第二无机封装层53均设置于所述显示区AA以及所述过渡区TA，所述第一无机封装层51和所述第二无机封装层53还以此覆盖所述挡墙60上。所述挡墙60可以用于界定形成所述有机封装层52的有机材料的扩散边界，以使所述有机封装层52仅形成于所述挡墙60背离所述感光区PA的一侧。
进一步的，所述挡墙60靠近所述感光区PA的一侧以及所述挡墙60远离所述感光区PA的一侧均设置有所述第一开口210和所述第二开口120。
如图4所示，在所述挡墙60靠近所述显示区AA的一侧，所述第一无机封装层51覆盖所述第一开口210和所述第二开口120的侧壁、位于所述第二开口120底面的所述发光层30以及未被所述发光层30覆盖的所述第一无机层11，所述第一无机封装层51和所述第一无机层11形成包围所述发光层30的密封结构。所述有机封装层52设置于所述第一无机封装层51上并且填充所述第二开口120和所述第一开口210，所述第二无机封装层53设置于所述有机封装层52上。
结合图4和图5所示，在所述挡墙60靠近所述感光区PA的一侧，所述第一无机封装层51覆盖所述第一开口210和所述第二开口120的侧壁、位于所述第二开口120底面上的所述发光层30以及未被所述发光层30覆盖的所述第一无机层11，所述第一无机封装层51和所述第一无机层11形成包围所述发光层30的密封结构。所述第二无机封装层53覆盖位于所述第一开口210和第二开口120内的所述第一无机封装层51，并且还覆盖位于所述第二无机层21上的所述第一无机封装层51。
进一步的，所述显示面板包括多个所述第一开口210以及多个所述第二开口120，每个所述第一开口210与对应的一个所述第二开口120相互导通，多个所述第一开口210以及所述第二开口120逐层环绕所述感光区PA。
结合图4和图7所示，图7为本申请实施例提供的过渡区以及透光区的平面示意图，本申请实施例中，所述挡墙60靠近所述感光区PA的一侧设置有两组所述第一开口210和所述第二开口120，两组所述第一开口210和第二开口120逐层环绕所述感光区PA，以此增加水氧从衬底基板10侧面入侵至显示区AA的路径，从而可以降低水氧入侵导致发光材料失效的风险。
在本申请实施例中，所述感光区PA为圆形，位于所述挡墙60两侧的所述第一开口210和第二开口120均为环绕所述感光区PA的环形凹槽结构。在实际应用中，所述感光区PA也可以为水滴形、椭圆形或者其他不规则图形，所述第一开口210和第二开口120的形状可以适配为围绕所述感光区PA的水滴形、椭圆环形或其他不规则图形，此处不做限制。
依据本申请上述实施例提供的显示面板，本申请实施例还提供一种显示面板的制作方法，所述显示面板的制作方法用于制备上述实施例提供的显示面板。如图8a至图8d所示，图8a至图8d为本申请实施例提供的显示面板的制作方法的流程结构示意图，所述显示面板的制作方法如下：
步骤S10：在衬底13上依次形成第一无机层11和第一有机层12；
步骤S20：在所述第一有机层12背离所述第一无机层11的一侧形成驱动电路层以及多个挡墙60；
步骤S30：在所述驱动电路层的第二无机层21上形成第一开口210；
步骤S40：在所述第一开口210的基础上，在所述第一有机层12上形成宽度小于所述第一开口210并且与所述第一开口210导通的第二开口120；以及
步骤S50：在所述驱动电路层背离所述基板10的一侧形成发光层，所述发光层在所述第二开口120处断开。
步骤S60：在所述发光层远离所述衬底基板10的一侧形成封装层50。
所述步骤S10中，所述衬底13包括第二有机层，所述第一无机层11和第一有机层12可以依次形成于所述第二有机层上。
所述第一有机层12和所述第二有机层均采用有机材料制备形成。例如，所述有机材料可以包括但不限于聚酰亚胺（PI）、聚酰胺(PA)、聚碳酸酯(PC)、聚苯醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚甲基丙烯酸甲酯(PMMA)、环烯烃共聚物(COC)中的一种或者多种的混合物。优选的，所述第一有机层12和所述第二有机层采用相同的材料进行制备。
在本申请实施例中，所述衬底13可以为所述第二有机层构成的单层有机膜层结构。在其他一些实施例中，所述衬底13也可以是由两层或者多层有机膜层依次堆叠形成的双层或者多层有机膜层结构。
所述第一无机层11由无机材料制备形成，具备良好的阻隔水氧的能力。具体的，所述第一无机层11由氮化硅和氧化硅中的一种或者两种材料制备形成。所述第一无机层11的水蒸气透过率（water vapor transmission rate, WVTR）约为10-6/m2/day。
所述第二无机层21由无机材料制备形成，具备良好的阻隔水氧的能力。具体的，所述第一无机层11由氮化硅和氧化硅中的一种或者两种材料制备形成。优选的，所述第二无机层21可以采用与所述第一无机层11相同的材料制备形成。
结合图8a至图8b所示，图8b并未将绝缘层、金属层、平坦层以及像素定义层展示出来，绝缘层、金属层、平坦层以及像素定义层的结构可以参考图2以及图4，此处不做赘述。
所述步骤S20中，所述挡墙60可以采用所述驱动电路层中的第三有机层的工艺制程与所述第三有机层同步进行制备，所述驱动电路层的结构可参照图2和图4中驱动电路层20的结构，此处不做赘述。
所述步骤S30中，如图8c所示，可以通过光刻的方法在所述第二无机层21上形成图案化的第一开口210。所述第一开口210为环绕感光区的环形开口，第一开口210在所述第二无机层21的厚度方向上贯穿所述第二无机层21。
所述步骤S40中，如图8d所示，可以在所述第一开口210的基础上，通过气体蚀刻的方法采用O2对第一有机层12进行蚀刻，以形成图案化的第二开口120。所述第二开口120为环绕所述感光区的环形开口。
在图8d所示的实施例中，所述第二开口120可以贯穿所述第一有机层12，并且暴露出所述第一无机层11。在其他实施例中，也可以如图2所示，所述第二开口120也可以仅伸入至所述第一有机层12内，但并不贯穿所述第一有机层12。
所述步骤S50中，所述发光层30可以包括依次层叠设置于所述驱动电路层20上的阳极、空穴注入层、空穴传输层、有机发光材料层、电子传输层、电子注入层以及阴极，其中阳极和有机发光材料层均只设置于所述显示区内，所述空穴注入层、空穴传输层、电子传输层、电子注入层以及阴极均可以采用整面蒸镀的工艺，形成于所述显示区以及所述非显示区。
所述步骤S50中，由于第一开口210的宽度小于第二开口120的宽度，在沉积形成发光层30时，第一开口210的四周边缘可以对第二开口120形成遮挡，发光层30仅沉积形成在第二开口120的底面上，如此可使在发光层30在第二开口120处的部分能够与其他部分之间断开。
所述步骤S60中，封装层50可以是由第一无机封装层、有机封装层和第二无机封装层依次叠加形成的薄膜封装结构，第一无机封装层和第二无机封装层可以采用整面沉积的方式形成，第一无机封装层可以形成于第一开口210和第二开口120的侧壁上，并且覆盖所述第二开口120底面上的发光层和未被所述发光层覆盖的第一无机层11，以此利用第一无机封装层和第一无机层11对第二开口120底面上的发光层形成密封结构，彻底阻断水氧通过第二开口120内的发光层侵入至发光层的路径，同时还可以利用第一无机层11作为蚀刻第一有机层12的阻挡作用，使得蚀刻形成的多个第二开口120的深度一致，以此保证封装层50能够在第二开口120处连续沉积，避免封装层50在第二开口120处产生裂缝，从而可以降低发光层中发光材料失效的风险。
依据本申请上述实施例提供的显示面板，本申请实施例还提供一种显示装置，所述显示装置包括上述实施例提供的显示面板，所述显示装置可以是移动终端，例如彩色电子纸、彩色电子书、智能手机等，显示装置也可以是可穿戴式终端，例如智能手表、智能手环等，显示装置也可以是固定终端，例如彩色电子广告牌、彩色电子海报等。
本申请实施例提供一种显示面板及显示装置，所述显示装置包括所述显示面板，所述显示面板包括感光区、围绕所述感光区的过渡区以及围绕所述过渡区的显示区，所述显示面板还包括：衬底基板，包括无机保护层以及相对设置的第一表面和第二表面，所述无机保护层设置于所述第一表面和所述第二表面之间，并且与所述第一表面以及所述第二表面相互间隔设置；驱动电路层，设置于所述第一表面背离所述第二表面的一侧上；感光孔，设置于所述感光区，所述感光孔在所述衬底基板的厚度方向上贯穿所述衬底基板；凹槽，设置于所述过渡区并环绕所述感光区，所述凹槽由所述衬底基板的所述第一表面凹进所述衬底基板内，并且位于所述无机保护层靠近所述第一表面的一侧；以及封装层，设置于所述驱动电路层上，并覆盖所述凹槽的侧壁以及底部，以此通过设置于衬底基板内部的无机保护层阻断水氧从衬底基板在感光区的开孔侧向入侵至显示区的路径，以此避免水氧在过渡区聚集，从而可以解决由于水氧入侵导致的孔黑斑等显示不良的问题。
综上所述，虽然本申请以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为基准。

Claims (20)

  1. 一种显示面板，包括感光区、围绕所述感光区的过渡区以及围绕所述过渡区的显示区，所述显示面板还包括：
    衬底基板，包括依次层叠设置的衬底、第一无机层、以及第一有机层；
    驱动电路层，设置在所述衬底基板的一侧，所述驱动电路层包括第二无机层，所述第一有机层设置在所述第一无机层和所述第二无机层之间，所述第二无机层在所述过渡区设置有第一开口，所述第一有机层在所述过渡区设置有第二开口，所述第一开口与所述第二开口导通且所述第一开口的宽度小于所述第二开口的宽度；
    发光层，设置在所述驱动电路层远离所述基板的一侧，且在覆盖所述过渡区时在所述第二开口处断开设置；
    封装层，设置在所述发光层远离所述衬底基板的一侧。
  2. 如权利要求1所述的显示面板，其中，所述第二开口的底面与所述第一无机层靠近所述第一有机层的一侧表面接触。
  3. 如权利要求2所述的显示面板，其中，所述发光层在所述第二开口处设置于所述第一无机层靠近所述第一有机层的一侧表面之上，所述发光层在所述第二开口处的宽度小于所述第二开口的底面的宽度。
  4. 如权利要求3所述的显示面板，其中，所述封装层在所述第二开口处连续设置。
  5. 如权利要求4所述的显示面板，其中，所述封装层在所述第二开口处与所述第二开口的侧壁、所述第一无机层靠近所述第一有机层的一侧表面、以及所述发光层背离所述第一无机层的一侧表面接触。
  6. 如权利要求1所述的显示面板，其中，所述第一开口在所述第一无机层上的正投影落于所述第二开口在所述第一无机层上的正投影内。
  7. 如权利要求6所述的显示面板，其中，所述第一开口的任意一侧边缘超出所述第二开口的同侧边缘的长度大于0且小于或等于2μm。
  8. 如权利要求7所述的显示面板，其中，所述第一无机层靠近所述第二无机层的一侧表面与所述第二无机层靠近所述第一无机层的一侧表面之间的距离1.5μm且小于或等于3μm。
  9. 如权利要求1所述的显示面板，其中，所述第一无机层与所述第二无机层的材料相同。
  10. 如权利要求1所述的显示面板，其中，所述衬底包括第二有机层，所述第二有机层设置于所述第一无机层背离所述第一有机层的一侧，并且与所述第一有机层的材料相同。
  11. 如权利要求1所述的显示面板，其中，所述显示面板包括设置于所述过渡区并环绕所述感光区的挡墙，所述挡墙设置于所述第二无机层背离所述第一有机层的一侧；
    其中，所述挡墙靠近所述感光区的一侧、以及所述挡墙远离所述感光区的一侧均设置有所述第一开口和所述第二开口。
  12. 如权利要求11所述的显示面板，其中，所述驱动电路层包括第三有机层，所述发光层设置于所述第三有机层之上，所述挡墙与所述第三有机层的材料相同。
  13. 如权利要求1所述的显示面板，其中，所述衬底基板和所述驱动电路层在所述感光区设置有通孔。
  14. 一种显示装置，包括感光器件和显示面板，所述显示面板包括感光区、围绕所述感光区的过渡区以及围绕所述过渡区的显示区，所述感光器件对应所述感光区设置，所述显示面板还包括：
    衬底基板，包括依次层叠设置的衬底、第一无机层、以及第一有机层；
    驱动电路层，设置在所述衬底基板的一侧，所述驱动电路层包括第二无机层，所述第一有机层设置在所述第一无机层和所述第二无机层之间，所述第二无机层在所述过渡区设置有第一开口，所述第一有机层在所述过渡区设置有第二开口，所述第一开口与所述第二开口导通且所述第一开口的宽度小于所述第二开口的宽度；
    发光层，设置在所述驱动电路层远离所述基板的一侧，且在覆盖所述过渡区时在所述第二开口处断开设置；
    封装层，设置在所述发光层远离所述衬底基板的一侧。
  15. 如权利要求14所述的显示装置，其中，所述第二开口的底面与所述第一无机层靠近所述第一有机层的一侧表面接触。
  16. 如权利要求15所述的显示装置，其中，所述发光层在所述第二开口处设置于所述第一无机层靠近所述第一有机层的一侧表面之上，所述发光层在所述第二开口处的宽度小于所述第二开口的底面的宽度。
  17. 如权利要求16所述的显示装置，其中，所述封装层在所述第二开口处连续设置。
  18. 如权利要求17所述的显示装置，其中，所述封装层在所述第二开口处与所述第二开口的侧壁、所述第一无机层靠近所述第一有机层的一侧表面、以及所述发光层背离所述第一无机层的一侧表面接触。
  19. 如权利要求14所述的显示装置，其中，所述第一开口在所述第一无机层上的正投影落于所述第二开口在所述第一无机层上的正投影内。
  20. 如权利要求19所述的显示装置，其中，所述第一开口的任意一侧边缘超出所述第二开口的同侧边缘的长度大于0且小于或等于2μm。
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CN112885882A (zh) * 2021-01-27 2021-06-01 昆山国显光电有限公司 显示面板及其制备方法
CN113964167A (zh) * 2021-11-18 2022-01-21 合肥维信诺科技有限公司 显示面板制备方法、显示面板和显示装置
CN114203774A (zh) * 2021-11-18 2022-03-18 维信诺科技股份有限公司 一种显示面板及其制备方法

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