WO2022083321A1 - 显示基板及其制作方法、显示装置 - Google Patents

显示基板及其制作方法、显示装置 Download PDF

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Publication number
WO2022083321A1
WO2022083321A1 PCT/CN2021/116522 CN2021116522W WO2022083321A1 WO 2022083321 A1 WO2022083321 A1 WO 2022083321A1 CN 2021116522 W CN2021116522 W CN 2021116522W WO 2022083321 A1 WO2022083321 A1 WO 2022083321A1
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Prior art keywords
layer
insulating layer
display area
opening
display
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PCT/CN2021/116522
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English (en)
French (fr)
Inventor
于洋
曹方旭
王品凡
李文强
谢春燕
王博
王景泉
Original Assignee
京东方科技集团股份有限公司
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Priority to US17/915,678 priority Critical patent/US20230255074A1/en
Publication of WO2022083321A1 publication Critical patent/WO2022083321A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/822—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display substrate, a manufacturing method thereof, and a display device.
  • a display device such as an AMOLED (Active-matrix organic light-emitting diode) display device, has the advantages of being able to individually control each sub-pixel for display, high contrast, and bright colors.
  • AMOLED Active-matrix organic light-emitting diode
  • a display substrate has a display area and a non-display area adjacent to the display area.
  • the display substrate includes: a flexible substrate, the flexible substrate includes at least one stretchable area, the stretchable area extends from the display area to the non-display area, and the stretchable area is provided a plurality of openings arranged in an array; a cathode layer located on the first side of the flexible substrate, the cathode layer extends from the display area to the non-display area, and the edge of the cathode layer is located in the a non-display area; at least one insulating layer between the flexible substrate and the cathode layer, the at least one insulating layer configured to expose the plurality of openings, and the at least one insulating layer
  • the layer is provided with at least one isolation slot, the isolation slot is disposed around the opening, and the isolation slot is configured to isolate the cathode layer.
  • the display substrate further includes: a light-emitting functional layer located between the cathode layer and the at least one insulating layer, the light-emitting functional layer extending from the display area to the non-display area , the edge of the light-emitting functional layer is located between the edge of the cathode layer and the display area; wherein at least part of the blocking groove simultaneously blocks the cathode layer and the light-emitting functional layer.
  • the cross section obtained by cutting the blocking groove along the radial direction of the opening is substantially an inverted T shape.
  • the at least one insulating layer includes a first inorganic insulating layer and a first organic insulating layer that are separated from the cathode layer in sequence; the isolation groove passes through the first inorganic insulating layer and at least part of the the first organic insulating layer.
  • the display substrate further includes: at least one signal line disposed on the first side of the flexible substrate and located in the non-display area, the signal line having at least one first escape opening , the first escape opening is configured to expose the opening.
  • the at least one insulating layer covers the sidewall of the first escape opening; or, the at least one insulating layer covers the sidewall of the first escape opening and the signal line is far away from the flexible substrate A part of the surface of the surface close to the first escape opening.
  • the signal line includes a first metal layer and a second metal layer that are sequentially away from the flexible substrate;
  • the at least one insulating layer includes a first organic insulating layer that is sequentially adjacent to the flexible substrate and a second organic insulating layer;
  • the second organic insulating layer covers the side of the first metal layer close to the opening and a part of the surface of the first metal layer away from the flexible substrate;
  • the second metal layer layer is in electrical contact with the first metal layer, and the second metal layer covers the side of the second organic insulating layer away from the opening and a part of the surface of the second organic insulating layer away from the flexible substrate ;
  • the first organic insulating layer covers the side surface of the second metal layer close to the opening and a part of the surface of the second metal layer away from the flexible substrate.
  • the at least one insulating layer further includes a first inorganic insulating layer and a second inorganic insulating layer; the second inorganic insulating layer is located on the second organic insulating layer, the first metal layer, between the second metal layer and the flexible substrate; the first inorganic insulating layer covers at least part of the surface of the first organic insulating layer away from the flexible substrate, and the first organic insulating layer is close to the flexible substrate.
  • the sides of the opening and the second organic insulating layer are adjacent to the sides of the opening, and the first inorganic insulating layer is connected to the second inorganic insulating layer.
  • the signal lines include voltage signal lines disposed around the display area.
  • the display substrate further includes: a cathode overlap layer located in the non-display area, including a first part and a second part connected to each other, the first part is electrically connected to the surface of the cathode layer close to the flexible substrate, the second part is electrically connected to the surface of the voltage signal line away from the flexible substrate; the cathode bonding layer has at least one second escape opening configured to expose the hole.
  • the at least one insulating layer covers the side wall of the second escape opening; or, the at least one insulating layer covers the side wall of the second escape opening and the cathode overlap layer is far away from the flexible A part of the surface of the substrate close to the second escape opening.
  • the display substrate further includes: a first blocking dam disposed on a first side of the flexible substrate, the first blocking dam is located in the non-display area and disposed around the display area, the The first barrier dam covers at least the side of the voltage signal line away from the display area and the side of the cathode bonding layer away from the display area, and the first barrier dam has at least one third escape opening, so The third escape opening is configured to expose the opening; a second blocking dam is disposed on the first side of the flexible substrate, the second blocking dam is located in the non-display area and is disposed around the display area , the second barrier dam is located on the surface of the second part of the cathode overlap layer away from the flexible substrate, the second barrier dam has at least one fourth escape opening, and the fourth escape opening is configured to expose the opening, the first escape opening and the second escape opening; an encapsulation layer disposed on the first side of the flexible substrate, the encapsulation layer covering the cathode layer, the first escape opening A blocking dam and the second blocking
  • the display substrate is substantially rectangular, the number of the stretchable regions is four, and the four stretchable regions are respectively located at four corner positions of the display substrate; The number of the stretchable regions is one, and one stretchable region covers all the display areas and all the non-display areas.
  • the plurality of openings arranged in the array include: first openings extending in a first direction; and second openings extending in a second direction crossing the first direction; wherein, In the first direction and the second direction, the first openings and the second openings are alternately arranged.
  • a display device in another aspect, includes: the display substrate according to any one of the above embodiments.
  • a method for manufacturing a display substrate includes: forming at least one layer on a first side of a flexible substrate an insulating layer; a plurality of openings arranged in an array are formed in the stretchable area of the flexible substrate, and at least part of the openings pass through the at least one insulating layer; wherein the stretchable area extends from the display area extending to the non-display area; forming at least one isolation groove on the at least one insulating layer, and the isolation groove is arranged around the opening; forming the cathode on the flexible substrate formed with the at least one insulating layer layer, the cathode layer extends from the display area to the non-display area, the edge of the cathode layer is located in the non-display area, and the cathode layer is cut off by the blocking groove.
  • the method before forming the cathode layer, further includes: forming a light-emitting functional layer on the first side of the flexible substrate, the light-emitting functional layer extending from the display area to the non-display area, The edge of the light-emitting functional layer is located between the edge of the cathode layer and the display area; wherein at least part of the blocking groove blocks the cathode layer and the light-emitting functional layer at the same time.
  • the at least one insulating layer includes a first inorganic insulating layer and a first organic insulating layer that are separated from the cathode layer in sequence; the at least one isolation groove is formed in the at least one insulating layer, including : etching the first inorganic insulating layer and at least part of the first organic insulating layer through an etching process to form the at least one isolation groove.
  • FIG. 1 is a structural diagram of a display substrate according to some embodiments.
  • FIG. 2 is a partial structural diagram showing the substrate in the stretchable area A in FIG. 1;
  • Fig. 3 is a kind of sectional structure diagram along the BB' position in the stretchable area A in Fig. 2;
  • Fig. 4 is another cross-sectional structural view along the BB' position in the stretchable region A in Fig. 2;
  • FIG. 5A is a relative positional relationship diagram of the first to fifth escape openings and the opening 3 according to some embodiments
  • FIG. 5B is another relative positional relationship diagram of the first to fifth escape openings and the opening 3 according to some embodiments.
  • 6A is a cross-sectional structural diagram of a display substrate taken along a direction perpendicular to a boundary of a display area according to some embodiments;
  • 6B is a cross-sectional structural view of the display substrate taken along a direction parallel to the boundary of the display area according to some embodiments;
  • FIG. 7 is a block diagram of a display device according to some embodiments.
  • FIG. 8 is a flowchart of a method of fabricating a display substrate according to some embodiments.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the drawings due to, for example, manufacturing techniques and/or tolerances, are contemplated.
  • example embodiments should not be construed as limited to the shapes of the regions shown herein, but to include deviations in shapes due, for example, to manufacturing. For example, an etched area shown as a rectangle will typically have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • some embodiments of the present disclosure provide a display substrate 100 having a display area Q 1 and a non-display area Q 2 adjacent to the display area Q 1 , wherein the non-display area Q 2 It may be located only on one or more sides of the display area Q1, or according to the example shown in FIG. 1 , the non-display area Q2 may be arranged in a circle around the display area Q1.
  • the display substrate 100 includes a flexible substrate 1 , a cathode layer 21 located on a first side of the flexible substrate 1 , and at least one insulating layer 4 located between the flexible substrate 1 and the cathode layer 21 .
  • the flexible substrate 1 includes at least one stretchable area A, and the stretchable area A extends from the display area Q 1 to the non-display area Q 2 .
  • the number of stretchable areas A is four, and the four stretchable areas A are located at four corner positions of the display substrate 100 respectively.
  • the number of stretchable areas A is one, and one stretchable area A covers all the display areas Q 1 and all the non-display areas Q 2 at the same time.
  • the stretchable area A is provided with a plurality of openings 3 arranged in an array.
  • the plurality of openings 3 arranged in the array may include: first openings 31 extending along the first direction X; and extending along the second direction Y crossing the first direction X The second opening 32 .
  • the first openings 31 and the second openings 32 are alternately arranged. This arrangement is beneficial to make the flexible substrate 1 have better stretchability.
  • the cross arrangement of the second direction Y and the first direction X includes, but is not limited to, the manner in which the first and second directions Y and the first direction X are perpendicular to each other as shown in FIG. 2 , that is, the second direction Y and the first direction X
  • the included angle between them is not limited to a right angle, and the included angle may also include an acute angle.
  • the plurality of openings 3 can be directly fabricated on the display substrate motherboard, and after that, a single display substrate 100 can be obtained by cutting.
  • the corners of the display substrate 100 ie, the position of the triangle dotted frame in FIG. 2
  • the corners of the display substrate 100 can also be cut to form rounded corners, which is convenient for use in display devices with rounded corners.
  • openings 3 may also be formed on the cut corners.
  • the openings 3 are through holes through the flexible substrate 1 .
  • the openings 3 are blind holes. It can be understood that when the opening 3 is a blind hole, the opening 3 only has an opening on the first side of the flexible substrate 1 .
  • the present disclosure does not limit the depth of the blind hole, that is, the depth of the blind hole can be determined according to the required stretchability. For example, the deeper the blind hole, the greater the stretchability; less stretch.
  • the stretchable area A of the flexible substrate 1 extends from the display area Q1 to the non-display area Q2 , and the flexible substrate 1 is provided with a plurality of arrays in the stretchable area A
  • the openings 3, therefore, the flexible substrate 1 can be stretched both in at least part of the display area Q1 and at least part of the non-display area Q2 .
  • the display device can achieve a curved display effect by stretching the display substrate 100 .
  • the cathode layer 21 extends from the display area Q 1 to the non-display area Q 2 , and the edge of the cathode layer 21 is located in the non-display area Q 2 .
  • the at least one insulating layer 4 is configured to expose a plurality of openings 3, and the at least one insulating layer 4 is provided with at least one isolating groove 45 disposed around the openings 3 (eg, isolating groove 45 A circle can be provided around the opening 3 ; alternatively, the blocking groove 45 can also be provided only half a circle or a third circle around the opening 3 , etc.), and the blocking groove 45 is configured to block the cathode layer 21 .
  • the isolation groove 45 can be provided, for example, in the part of the at least one insulating layer 4 covered by the cathode layer 21 .
  • “The part of the at least one insulating layer 4 covered by the cathode layer 21 ” refers to at least part of the at least one insulating layer 4 covered by the design boundary of the cathode layer 21 . It can be understood that in actual production, for example, when the cathode layer 21 is fabricated by an evaporation process, there may be a certain deviation between the actual evaporation boundary of the cathode layer 21 and the design boundary. Therefore, in an actual product, the part of the at least one insulating layer 4 that is not covered by the cathode layer 21 may also be provided with a partition groove 45 .
  • the stretchable area A of the flexible substrate 1 is arranged to extend from the display area Q 1 to the non-display area Q 2 , and the stretchable area A of the flexible substrate 1 can be extended from the display area Q 1 to the non-display area Q 2 .
  • the stretched area A is provided with a plurality of openings 3 arranged in an array, so that the flexible substrate 1 can be stretched in at least part of the display area Q1 and at least part of the non-display area Q2 .
  • the blocking groove 45 is arranged around the opening 3, and the blocking groove 45 is configured to block the cathode layer 21, which can also prevent the water vapor from passing through the blocking groove.
  • the side of 45 close to the opening 3 penetrates through the cathode layer 21 to the side of the partition groove 45 far away from the hole 3, so that the opening 3 can be set to achieve a stretchable effect, and the water vapor can easily corrode the cathode layer 21, resulting in display A problem of poor display occurs in the display area of the substrate 100 .
  • the display substrate 100 further includes: a light-emitting functional layer 22 (eg, an electron transport layer, an electron injection layer, an organic light-emitting layer) located between the cathode layer 21 and at least one insulating layer 4 , hole injection layer and hole transport layer, etc.), the light emitting functional layer 22 extends from the display area Q 1 to the non-display area Q 2 , and the edge of the light emitting functional layer 22 is located between the edge of the cathode layer 21 and the display area Q 1 .
  • a light-emitting functional layer 22 eg, an electron transport layer, an electron injection layer, an organic light-emitting layer located between the cathode layer 21 and at least one insulating layer 4 , hole injection layer and hole transport layer, etc.
  • water vapor can also be prevented from infiltrating from the side of the partition groove 45 close to the opening 3 through the light-emitting functional layer 22 to the side of the partition groove 45 far away from the hole 3, so that the opening 3 can be arranged on the side of the opening 3.
  • the problem that the light-emitting functional layer 22 and the cathode layer 21 are easily corroded by water vapor is improved, so as to reduce the influence of external water vapor on the display substrate 100 .
  • the display substrate further includes an anode layer including a plurality of anodes 23 corresponding to the plurality of sub-pixels.
  • the anode 23 fabricated above the isolation groove 45 may be attached to the inner wall of the isolation groove 45 .
  • the cross section obtained by cutting off the partition groove 45 along the radial direction Z of the opening 3 is approximately an inverted T shape.
  • Such a design helps to isolate the light-emitting functional layer 22 and the cathode layer 21 when the light-emitting functional layer 22 and the cathode layer 21 are fabricated.
  • the material of the cathode layer 21 is deposited at the bottom of the isolation groove 45 , so that both the light-emitting functional layer 22 and the cathode layer 21 can be disconnected at the isolation groove 45 , thereby facilitating the subsequent packaging layers to achieve good encapsulation.
  • being roughly inverted T-shaped may refer to the stated shape (ie, inverted T-shaped), or it may also refer to a shape similar to the stated shape, such as a curved edge or a jagged edge. Inverted T, etc.
  • the at least one insulating layer 4 includes a first inorganic insulating layer 41 and a first organic insulating layer 42 that are sequentially away from the cathode layer.
  • the blocking groove 45 passes through the first inorganic insulating layer 41 and at least part of the first organic insulating layer 42 . It is worth noting that, in some examples, by directly etching the stacked first inorganic insulating layer 41 and the first organic insulating layer 42, the above-mentioned isolation groove with a substantially inverted T-shaped cross section can be obtained. At this time, it also has the advantages of simple process and convenient manufacture.
  • the display substrate 100 further includes: at least one signal line 5 disposed on the first side of the flexible substrate 1 and located in the non-display area Q 2 , the signal line 5 There is at least one first escape opening 51 configured to expose the opening 3 .
  • each of the first escape openings 51 may expose one opening 3 .
  • the first escape port 51 may also be set to expose two or more openings 3 , which is not limited in the present disclosure.
  • the side wall of the first avoidance port 51 may be a closed ring as shown in FIG. 5A (for example, the sidewall of the first avoidance port 51 may be arranged around the opening 3);
  • the side wall can also be a partial annular shape with an opening as shown in FIG. 5B (for example, the side wall of the first escape opening 51 can also be provided with a half circle, a third circle, etc. around the opening 3 ).
  • the at least one layer of insulating layer 4 covers the side wall of the first escape opening 51; or, the at least one layer of insulating layer 4 covers the side wall of the first escape opening 51 and the signal line 5 is close to the surface of the flexible substrate 1 away from the side wall. Part of the surface of the first escape opening 51 .
  • the at least one insulating layer 4 can be used to protect the side wall of the signal line 5 close to the opening 3 (that is, the side wall of the first escape opening 51 ), or the at least one insulating layer 4 can be used.
  • the side wall of the signal line 5 close to the opening 3 ie the side wall of the first escape opening 51
  • the part of the surface of the signal line 5 away from the flexible substrate 1 close to the first escape opening 51 are protected.
  • the material of the signal line 5 can usually include metal ions such as Al (aluminum), and by providing the at least one insulating layer 4, on the one hand, water vapor can be blocked from infiltrating from the opening 3 to the signal line 5, thereby preventing Problems such as Al corrosion occur in the signal line 5 .
  • metal ions such as Al (aluminum)
  • the at least one insulating layer 4 by providing the at least one insulating layer 4, on the one hand, water vapor can be blocked from infiltrating from the opening 3 to the signal line 5, thereby preventing Problems such as Al corrosion occur in the signal line 5 .
  • substitution reaction between Al ions in the signal line 5 and Ag (silver) ions in the etching solution can also be prevented. Therefore, the signal line 5 can be effectively protected by providing the at least one insulating layer 4 .
  • the signal line 5 includes a first metal layer 52 and a second metal layer 53 that are separated from the flexible substrate 1 in sequence. This arrangement is beneficial to reduce the resistance on the signal line 5 and improve the signal transmission efficiency.
  • the at least one insulating layer 4 may include a first organic insulating layer 42 and a second organic insulating layer 43 adjacent to the flexible substrate 1 in sequence.
  • the second organic insulating layer 43 covers the side surface of the first metal layer 52 close to the opening 3 and a part of the surface of the first metal layer 52 away from the flexible substrate 1 .
  • the second metal layer 53 is in electrical contact with the first metal layer 52 and covers the side of the second organic insulating layer 43 away from the hole 3 and a part of the surface of the second organic insulating layer 43 away from the flexible substrate 1 .
  • the first organic insulating layer 42 covers the side surface of the second metal layer 53 close to the opening 3 and a part of the surface of the second metal layer 53 away from the flexible substrate 1 .
  • the first metal layer 22 and the second metal layer 23 of the signal line 2 can be effectively protected by the first organic insulating layer 41 and the second organic insulating layer 42 .
  • the at least one insulating layer 4 may further include a first inorganic insulating layer 41 and a second inorganic insulating layer 44 .
  • the second inorganic insulating layer 44 is located between the second organic insulating layer 43 , the first metal layer 52 , the second metal layer 53 and the flexible substrate 1 .
  • the first inorganic insulating layer 41 covers at least part of the surface of the first organic insulating layer 42 away from the flexible substrate 1, the side of the first organic insulating layer 42 close to the opening 3 and the side of the second organic insulating layer 42 close to the opening 3, and
  • the first inorganic insulating layer 41 is connected to the second inorganic insulating layer 44 .
  • the first inorganic insulating layer 41 and the second inorganic insulating layer 44 it can have better barrier capability, so that four insulating layers (ie, the first inorganic insulating layer 41 and the first organic insulating layer 42) can be used. , the second organic insulating layer 43 and the second inorganic insulating layer 44 ) to more effectively protect the signal line 5 .
  • etching may be performed. The process etches the position where the first inorganic insulating layer 41 is in contact with the second inorganic insulating layer 44, and forms an opening 3 (for example, a through hole or a blind hole) passing through the first inorganic insulating layer 41 and the second inorganic insulating layer 44 .
  • the above-mentioned signal line 5 may be a voltage signal line 50 located in the non - display area Q2 , and the voltage signal line 50 may be disposed around the display area Q1.
  • the display substrate 100 further includes a cathode bonding layer 24 located in the non-display area Q2 , and the cathode bonding layer 24 includes a first part and a second part which are connected to each other. One part is electrically connected to the surface of the cathode layer 21 close to the flexible substrate 1 , and the second part is electrically connected to the surface of the voltage signal line 20 away from the flexible substrate 1 .
  • the cathode bonding layer 24 has at least one second escape opening 241 , and the second escape opening 241 is configured to expose the opening 3 .
  • the side wall of the second avoidance port 241 may be a closed ring as shown in FIG. 5A (for example, the sidewall of the second avoidance port 241 may be arranged around the opening 3);
  • the side wall can also be a partial ring with an opening as shown in FIG. 5B (for example, the side wall of the second escape opening 241 can also be provided with a half circle, a third circle, etc. around the opening 3 ).
  • the cathode bonding layer 24 located in the non-display area Q2 can avoid the openings 3, that is, the arrangement of the cathode bonding layer 24 does not affect the arrangement position of the openings 3 in the non-display area Q2 . Therefore, the stretchable region A of the flexible substrate 1 may have substantially uniform stretch performance in the display region Q 1 and the non-display region Q 2 .
  • the at least one insulating layer 4 covers the sidewall of the second escape opening 241 .
  • the at least one insulating layer 4 can be used to protect the side wall of the cathode bonding layer 24 close to the opening 3 (that is, the side wall of the second escape opening 241 ), thereby preventing the cathode bonding layer 24 from being exposed to water. Oxygen corrosion, and can prevent the metal ions in the cathode overlap layer 24 from the replacement reaction with the metal ions in the etching solution.
  • the at least one insulating layer 4 covers the sidewall of the second escape opening 241 and the surface of the cathode bonding layer 24 away from the flexible substrate 1 close to the second escape opening 241 . part of the surface.
  • the isolation column 4 can be used to better protect the cathode overlap layer 24 to prevent the cathode overlap layer 24 from being corroded by water and oxygen, and to prevent the metal ions in the cathode overlap layer 24 and the metal ions in the etching solution, etc. A displacement reaction occurs.
  • the cathode overlapping layer 24 can be made of the same layer and the same material as the anode 23 . This is beneficial to simplify the manufacturing process of the display substrate 100 .
  • the display substrate 100 further includes: a first barrier dam 61 , a second barrier dam 62 and an encapsulation layer 25 .
  • the first blocking dam 61 is disposed on the first side of the flexible substrate 1 , the first blocking dam 61 is located in the non-display area Q 2 and is disposed around the display area Q 1 , and the first blocking dam 61 at least covers the voltage signal
  • the line 50 is away from the side of the display area Q1 and the cathode bonding layer 24 is away from the side of the display area Q1.
  • the first blocking dam 61 has at least one third escape opening 610 , and the third escape opening 610 is configured to expose the opening 3 .
  • the side wall of the third escape port 610 may be a closed ring as shown in FIG. 5A (for example, the side wall of the third escape port 610 may be arranged around the opening 3);
  • the side wall can also be a partial ring with an opening as shown in FIG. 5B (for example, the side wall of the third escape opening 610 can also be provided with a half circle, a third circle, etc. around the opening 3 ).
  • the third escape opening 610 is configured not to penetrate the side of the first barrier dam 61 close to the display area Q1 and the side of the first barrier dam 61 away from the display area Q1 at the same time, so that in the process of fabricating the display substrate 100, The first blocking dam 61 can block the flow of the material on the side close to the display area to the side away from the display area, so that the display substrate 100 can be well packaged.
  • the first barrier dam 61 also covers a part of the surface of the voltage signal line 50 away from the flexible substrate 1 (that is, the entire surface of the voltage signal line 50 away from the flexible substrate 1 is close to the first barrier dam.
  • Part of the surface of the cathode bonding layer 24 away from the flexible substrate 1 that is, the part of the surface of the entire surface of the cathode bonding layer 24 away from the flexible substrate 1 that is close to the first barrier dam 61).
  • the first barrier dam 61 may be a three-layer structure.
  • the first layer may be made of the same material as the flat layer 26
  • the second layer may be made of the same material as the flat layer 26 .
  • the layer can be made of the same material as the pixel definition layer 27
  • the third layer can be made of the same material as the filling layer 28 .
  • the flat layer 26 may include the above-mentioned first organic insulating layer and/or second organic insulating layer.
  • the pixel definition layer 27 extends from the display area Q 1 to the non-display area Q 2 , and the edge of the pixel definition layer 27 is located in the non-display area Q 2 .
  • the pixel definition layer 27 has openings for defining a plurality of sub-pixel regions.
  • the cathode bonding layer 24 has a plurality of holes 242 distributed in an array, and at least one hole 242 of the plurality of holes 242 penetrates the cathode bonding layer 24 .
  • the orthographic projection of at least some of the holes 242 on the flexible substrate 1 is within the range of the orthographic projection of the planar layer 26 on the flexible substrate 1 . In this way, in the process of manufacturing the display substrate 100 , the gas generated in the film layer (such as the flat layer 26 ) under the cathode overlap layer 24 can be released, thereby improving the reliability of the display substrate.
  • the above-described filling layer 28 may be used to fill the holes 242 on the cathode bonding layer 24 .
  • the upper surface of the cathode bonding layer 24 can be flattened, which facilitates the fabrication of other film layers on the cathode bonding layer 24 .
  • the cathode layer 21 and the cathode bonding layer 24 are overlapped, the area actually electrically connected is grid-shaped, and the filling layer material is filled in the middle, which is non-conductive.
  • the second barrier dam 62 is disposed on the first side of the flexible substrate 1 , the second barrier dam 62 is located in the non-display area Q2 and is disposed around the display area Q1, and the second barrier dam 62 is located in the cathode overlap
  • the second barrier dam 62 has at least one fourth escape opening 620, and the fourth escape opening 620 is configured to expose the opening 3, the first escape opening 51 and the The second escape opening 241 .
  • the side wall of the fourth escape port 620 may be a closed ring as shown in FIG. 5A (for example, the side wall of the fourth escape port 620 may be arranged around the opening 3 in a circle);
  • the side wall can also be a partial ring with an opening as shown in FIG. 5B (for example, the side wall of the fourth escape opening 620 can also be provided with a half circle, a third circle, etc. around the opening 3 ).
  • the fourth escape opening 620 is configured not to penetrate the side of the second barrier dam 62 close to the display area Q1 and the side of the second barrier dam 62 away from the display area Q1 at the same time, so that in the process of fabricating the display substrate 100 , The second blocking dam 62 can block the flow of the material on the side close to the display area Q 1 to the side away from the display area Q 1 , so that the display substrate 100 can be well packaged.
  • the second barrier dam 62 may be a two-layer structure.
  • the first layer may be made of the same material as the pixel definition layer 27
  • the second layer may be made of the same material as the pixel definition layer 27
  • Layer 28 is made of the same material as the layer.
  • the encapsulation layer 25 is disposed on the first side of the flexible substrate 1, the encapsulation layer 25 covers the cathode layer 21, the first barrier dam 61 and the second barrier dam 62, and the encapsulation layer 55 has at least one fifth
  • the escape port 251 and the fifth escape port 251 are configured to expose at least the opening 3 .
  • the side wall of the fifth escape port 251 may be a closed ring as shown in FIG. 5A (for example, the side wall of the fifth escape port 251 may be arranged around the opening 3);
  • the side wall can also be a partial ring with an opening as shown in FIG. 5B (for example, the side wall of the fifth escape opening 251 can also be provided with a half circle, a third circle, etc. around the opening 3 ).
  • the display substrate 100 may further include a buffer layer 11 on the first side surface of the flexible substrate 1 .
  • the buffer layer 11 extends from the display area Q 1 to the non-display area Q 2 , and the edge of the buffer layer 11 is located on the side of the first barrier dam 61 away from the display area Q 1 .
  • the buffer layer 11 has openings exposing the openings 3 .
  • FIGS. 3 , 4 , 6A and 6B only the cross-sectional structural schematic diagrams of the display substrate are shown in FIGS. 3 , 4 , 6A and 6B, not In the figures, the connection relationship other than the cross-sectional parts is shown), therefore, it can be understood that at least two parts separated in each figure can be substantially connected together.
  • the portion of the buffer layer 11 extending to the side of the first barrier dam 61 away from the display area Q 1 is formed with at least one groove 110 , and the groove 110 is arranged around the first barrier dam 61 .
  • the grooves 110 can block the inward expansion of the outer cracks to affect the display region Q 1 , so that the reliability of the display substrate 100 can be improved.
  • a third blocking dam 63 may also be provided on the side of the groove 110 away from the substrate.
  • the third blocking dam 63 can achieve a better effect of blocking the extension of cracks.
  • Some embodiments of the present disclosure provide a display device 200 , as shown in FIG. 7 , the display device 200 includes the display substrate described in any of the foregoing embodiments.
  • the display device 200 may be, for example, any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, and a navigator.
  • a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, and a navigator.
  • Some embodiments of the present disclosure further provide a method for fabricating a display substrate.
  • the display substrate 100 has a display area Q 1 and a non-display area Q 2 adjacent to the display area Q 1 .
  • the manufacturing method includes:
  • At least one insulating layer 4 (eg, a first inorganic insulating layer 41 , a first organic insulating layer 42 , a second organic insulating layer 43 and a second inorganic insulating layer 44 ) is formed on the first side of the flexible substrate 1 .
  • a plurality of openings 3 arranged in an array are formed in the stretchable area A of the flexible substrate 1, and at least part of the openings 3 pass through at least one insulating layer 4; wherein, the stretchable area A extends from the display area Q 1 extends to the non-display area Q 2 .
  • At least one isolation groove 45 is formed on the at least one insulating layer 4, and the isolation groove 45 is arranged around the opening 3 (for example, the isolation groove 45 can be arranged around the opening 3 once; alternatively, the isolation groove 45 can also only surround the opening 3 Hole 3 is set half circle or one third circle, etc.).
  • the isolation groove 45 may be provided, for example, in the part of the at least one insulating layer 4 covered by the cathode layer 21 .
  • “The part of the at least one insulating layer 4 covered by the cathode layer 21 ” refers to at least part of the at least one insulating layer 4 covered by the design boundary of the cathode layer 21 . It can be understood that in actual production, for example, when the cathode layer 21 is fabricated by an evaporation process, there may be a certain deviation between the actual evaporation boundary of the cathode layer 21 and the design boundary. Therefore, in an actual product, the part of the at least one insulating layer 4 that is not covered by the cathode layer 21 may also be provided with a partition groove 45 .
  • a cathode layer 21 is formed on the flexible substrate 1 on which the at least one insulating layer 4 is formed.
  • the cathode layer 21 extends from the display area Q 1 to the non-display area Q 2 , and the edge of the cathode layer 21 is located in the non-display area Q 2 , and the cathode layer 21 is cut off by the cut-off groove 45 .
  • the manufacturing method further includes: forming a light-emitting functional layer 22 (eg, an electron transport layer, an electron injection layer, etc.) on the first side of the flexible substrate 1 , organic light-emitting layer, hole injection layer and hole transport layer, etc.), the light-emitting functional layer 22 extends from the display area Q 1 to the non-display area Q 2 , and the edge of the light-emitting functional layer 22 is located at the edge of the cathode layer 21 and the display area Q 2 1 ; wherein, at least part of the blocking groove 45 blocks the cathode layer 21 and the light-emitting functional layer 22 at the same time.
  • a light-emitting functional layer 22 eg, an electron transport layer, an electron injection layer, etc.
  • the formed display substrate 100 after the formed display substrate 100 is encapsulated, it can also prevent water vapor from infiltrating from the side of the partition groove 45 close to the opening 3 through the light-emitting functional layer 22 to the side of the partition groove 45 far away from the hole 3, so that the When the openings 3 are provided, the problem that the light-emitting functional layer 22 and the cathode layer 21 are easily corroded by water vapor is improved, so as to reduce the influence of external water vapor on the display substrate 100 .
  • the at least one insulating layer 4 includes a first inorganic insulating layer 41 and a first organic insulating layer 42 that are sequentially away from the cathode layer 21 .
  • the forming at least one isolation groove 45 on the at least one insulating layer 4 includes: etching the first inorganic insulating layer 41 and at least part of the first organic insulating layer 42 through an etching process to form at least one isolation groove 45 .
  • Such a design is beneficial to simplify the manufacturing process, thereby facilitating the rapid processing of the above-mentioned blocking groove 45 .
  • the manufacturing method of the display substrate provided by some embodiments of the present disclosure is used to manufacture the display substrate 100 in any of the above-mentioned embodiments. Therefore, the manufactured display substrate 100 has the above-mentioned characteristics All the beneficial effects will not be repeated here.

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Abstract

一种显示基板，包括：柔性衬底、位于柔性衬底第一侧的阴极层和位于柔性衬底与阴极层之间的至少一层绝缘层。柔性衬底包括至少一个可拉伸区域，可拉伸区域从显示区延伸至非显示区，可拉伸区域内设置有阵列排布的多个开孔。阴极层从显示区延伸至非显示区，且阴极层的边缘位于非显示区。所述至少一层绝缘层被配置为暴露出多个开孔，并且至少一层绝缘层设置有至少一个隔断槽，隔断槽围绕开孔设置，且隔断槽被配置为隔断阴极层。

Description

显示基板及其制作方法、显示装置
本申请要求于2020年10月22日提交的、申请号为202011140961.4的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及其制作方法、显示装置。
背景技术
显示装置，例如AMOLED(Active-matrix organic light-emitting diode，有源矩阵有机发光二极管)显示装置，具有能够单独控制每个子像素进行显示，对比度高，色彩艳丽等优点。
发明内容
一方面，提供一种显示基板。所述显示基板具有显示区和与所述显示区邻接的非显示区。所述显示基板包括：柔性衬底，所述柔性衬底包括至少一个可拉伸区域，所述可拉伸区域从所述显示区延伸至所述非显示区，所述可拉伸区域内设置有阵列排布的多个开孔；位于所述柔性衬底第一侧的阴极层，所述阴极层从所述显示区延伸至所述非显示区，且所述阴极层的边缘位于所述非显示区；位于所述柔性衬底与所述阴极层之间的至少一层绝缘层，所述至少一层绝缘层被配置为暴露出所述多个开孔，并且所述至少一层绝缘层设置有至少一个隔断槽，隔断槽围绕开孔设置，且隔断槽被配置为隔断所述阴极层。
在一些实施例中，所述显示基板还包括：位于所述阴极层与所述至少一层绝缘层之间的发光功能层，所述发光功能层从所述显示区延伸至所述非显示区，所述发光功能层的边缘位于所述阴极层的边缘和所述显示区之间；其中，至少部分所述隔断槽同时隔断所述阴极层和所述发光功能层。
在一些实施例中，沿所述开孔的径向方向截断所述隔断槽后得到的横截面大致呈倒T型。
在一些实施例中，所述至少一层绝缘层包括依次远离所述阴极层的第一无机绝缘层和第一有机绝缘层；所述隔断槽穿过所述第一无机绝缘层和至少部分所述第一有机绝缘层。
在一些实施例中，所述显示基板还包括：设置于所述柔性衬底的第一侧、且位于所述非显示区的至少一条信号线，所述信号线上具有至少一个第一避让口，所述第一避让口被配置为暴露出所述开孔。其中，所述至少一层绝缘 层覆盖所述第一避让口的侧壁；或者，所述至少一层绝缘层覆盖所述第一避让口的侧壁和所述信号线远离所述柔性衬底的表面中靠近所述第一避让口的部分表面。
在一些实施例中，所述信号线包括依次远离所述柔性衬底的第一金属层和第二金属层；所述至少一层绝缘层包括依次靠近所述柔性衬底的第一有机绝缘层和第二有机绝缘层；所述第二有机绝缘层覆盖所述第一金属层靠近所述开孔的侧面和所述第一金属层远离所述柔性衬底的部分表面；所述第二金属层与所述第一金属层电接触，且所述第二金属层覆盖所述第二有机绝缘层远离所述开孔的侧面和所述第二有机绝缘层远离所述柔性衬底的部分表面；所述第一有机绝缘层覆盖所述第二金属层靠近所述开孔的侧面和所述第二金属层远离所述柔性衬底的部分表面。
在一些实施例中，所述至少一层绝缘层还包括第一无机绝缘层和第二无机绝缘层；所述第二无机绝缘层位于所述第二有机绝缘层、所述第一金属层、第二金属层和所述柔性衬底四者之间；所述第一无机绝缘层覆盖所述第一有机绝缘层远离所述柔性衬底的至少部分表面、所述第一有机绝缘层靠近所述开孔的侧面和所述第二有机绝缘层靠近所述开孔的侧面，并且所述第一无机绝缘层连接至所述第二无机绝缘层。
在一些实施例中，所述信号线包括电压信号线，所述电压信号线围绕所述显示区设置。所述显示基板还包括：位于所述非显示区的阴极搭接层，包括彼此相连的第一部分和第二部分，所述第一部分与所述阴极层靠近所述柔性衬底的表面电连接，所述第二部分与所述电压信号线远离所述柔性衬底的表面电连接；所述阴极搭接层上具有至少一个第二避让口，所述第二避让口被配置为暴露出所述开孔。其中，所述至少一层绝缘层覆盖所述第二避让口的侧壁；或者，所述至少一层绝缘层覆盖所述第二避让口的侧壁和所述阴极搭接层远离所述柔性衬底的表面中靠近所述第二避让口的部分表面。
在一些实施例中，所述显示基板还包括：设置于所述柔性衬底第一侧的第一阻挡坝，所述第一阻挡坝位于所述非显示区且围绕所述显示区设置，所述第一阻挡坝至少覆盖所述电压信号线远离所述显示区的侧面和所述阴极搭接层远离所述显示区的侧面，所述第一阻挡坝上具有至少一个第三避让口，所述第三避让口被配置为暴露出所述开孔；设置于所述柔性衬底第一侧的第二阻挡坝，所述第二阻挡坝位于所述非显示区且围绕所述显示区设置，所述第二阻挡坝位于所述阴极搭接层的第二部分远离所述柔性衬底的表面上，所述第二阻挡坝上具有至少一个第四避让口，所述第四避让口被配置为暴露出 所述开孔、所述第一避让口和所述第二避让口；设置于所述柔性衬底第一侧的封装层，所述封装层覆盖所述阴极层、所述第一阻挡坝和所述第二阻挡坝，所述封装层上具有至少一个第五避让口，所述第五避让口被配置为至少暴露出所述开孔。
在一些实施例中，所述显示基板大致呈矩形，所述可拉伸区域的数量为四个，四个所述可拉伸区域分别位于所述显示基板的四个角位置处；或者，所述可拉伸区域的数量为一个，一个所述可拉伸区域覆盖全部所述显示区和全部所述非显示区。
在一些实施例中，所述阵列排布的多个开孔包括：沿第一方向延伸的第一开孔；和，沿与第一方向交叉的第二方向延伸的第二开孔；其中，在所述第一方向和所述第二方向上，所述第一开孔与所述第二开孔均交替排布。
另一方面，提供一种显示装置。所述显示装置包括：如上述任一项实施例所述的显示基板。
再一方面，提供一种显示基板的制作方法，所述显示基板具有显示区和与所述显示区邻接的非显示区；所述制作方法包括：在柔性衬底的第一侧形成至少一层绝缘层；在柔性衬底的可拉伸区域内形成阵列排布的多个开孔，至少部分开孔穿过所述至少一层绝缘层；其中，所述可拉伸区域从所述显示区延伸至所述非显示区；在所述至少一层绝缘层形成至少一个隔断槽，隔断槽围绕开孔设置；在形成有所述至少一层绝缘层的所述柔性衬底上形成所述阴极层，所述阴极层从所述显示区延伸至所述非显示区，所述阴极层的边缘位于所述非显示区，且所述阴极层被所述隔断槽所隔断。
在一些实施例中，在形成所述阴极层之前，还包括：在所述柔性衬底的第一侧形成发光功能层，所述发光功能层从所述显示区延伸至所述非显示区，所述发光功能层的边缘位于所述阴极层的边缘和所述显示区之间；其中，至少部分所述隔断槽同时隔断所述阴极层和所述发光功能层。
在一些实施例中，所述至少一层绝缘层包括依次远离所述阴极层的第一无机绝缘层和第一有机绝缘层；所述在所述至少一层绝缘层形成至少一个隔断槽，包括：通过刻蚀工艺刻蚀所述第一无机绝缘层和至少部分所述第一有机绝缘层，以形成所述至少一个隔断槽。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还 可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的显示基板的结构图；
图2为图1中显示基板在可拉伸区域A的局部结构图；
图3为图2中可拉伸区域A内沿B-B'位置的一种截面结构图；
图4为图2中可拉伸区域A内沿B-B'位置的另一种截面结构图；
图5A为根据一些实施例的第一～第五避让口与开孔3的一种相对位置关系图；
图5B为根据一些实施例的第一～第五避让口与开孔3的另一种相对位置关系图；
图6A为根据一些实施例的显示基板沿垂直于显示区边界方向截得的截面结构图；
图6B为根据一些实施例的显示基板沿平行于显示区边界方向截获的截面结构图；
图7为根据一些实施例的显示装置的结构图；
图8为根据一些实施例的一种显示基板的制作方法的流程图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或 暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
参见图1～图3，本公开一些实施例提供了一种显示基板100，该显示基板100具有显示区Q 1和与显示区Q 1邻接的非显示区Q 2，其中，非显示区Q 2可以是仅位于显示区Q 1的一侧或多侧，或者还可以按照如图1示出的示例，非显示区Q 2围绕显示区Q 1设置一圈。
显示基板100包括：柔性衬底1、位于柔性衬底1第一侧的阴极层21、以及位于柔性衬底1与阴极层21之间的至少一层绝缘层4。
其中，柔性衬底1包括至少一个可拉伸区域A，可拉伸区域A从显示区Q 1延伸至非显示区Q 2。在一些示例中，可拉伸区域A的数量为四个，四个可拉伸区域A分别位于显示基板100的四个角位置处。在另一些示例中，可拉伸区域A的数量为一个，一个可拉伸区域A同时覆盖全部显示区Q 1和全部非显示区Q 2。
可拉伸区域内A设置有阵列排布的多个开孔3。“阵列排布的多个开孔3”的具体排布方式有多种。例如，如图2所示，所述阵列排布的多个开孔3可以包括：沿第一方向X延伸的第一开孔31；和沿与第一方向X交叉的第二方向Y延伸的第二开孔32。其中，在第一方向X和第二方向Y上，第一开孔31与第二开孔32均交替排布。这样设置，有利于使柔性衬底1具有较好的可拉伸性能。
其中，第二方向Y与第一方向X交叉设置包括但不限于图2示出的第一 第二方向Y与第一方向X相互垂直的方式，也即，第二方向Y与第一方向X之间的夹角不局限于直角，该夹角也可以包括锐角。
在制作显示基板100过程中，多个开孔3可以直接制作在显示基板母板上，之后，进行切割即可得到单个显示基板100。在此基础上，参见图2，还可以对显示基板100的角部(即图2中的三角形虚线框位置)进行切割以形成圆角，这样便于将其应用在具有圆角的显示装置中。其中，示例性的，如图2所示，在被切割掉的角部上，也可以制作有开孔3。
在一些示例中，开孔3为贯穿柔性衬底1的通孔。在另一些示例中，开孔3为盲孔。可以理解，当开孔3为盲孔时，该开孔3仅在柔性衬底1的第一侧具有开口。而且，本公开不对盲孔的深度进行限制，也即，盲孔的深度可以根据所需要达到的可拉伸性能来决定，例如，盲孔越深，可拉伸幅度越大；反之，则可拉伸幅度越小。
在该显示基板100中，柔性衬底1的可拉伸区域A从显示区Q 1延伸至非显示区Q 2，并且柔性衬底1在可拉伸区域A内设置有阵列排布的多个开孔3，因此，柔性衬底1在至少部分显示区Q 1和至少部分非显示区Q 2内均可以被拉伸。这样设计，使得在将该显示基板100应用于显示装置中时，可以通过拉伸显示基板100来使显示装置实现曲面显示效果。
继续参见图1～图3，阴极层21从显示区Q 1延伸至非显示区Q 2，且阴极层21的边缘位于非显示区Q 2。
所述至少一层绝缘层4被配置为暴露出多个开孔3，并且所述至少一层绝缘层4设置有至少一个隔断槽45，隔断槽45围绕开孔3设置(例如，隔断槽45可以围绕开孔3设置一圈；或者，隔断槽45也可以仅围绕开孔3设置半圈或三分之一圈等)，隔断槽45被配置为隔断阴极层21。
其中，隔断槽45例如可以设置在所述至少一层绝缘层4被阴极层21覆盖的部分。“所述至少一层绝缘层4被阴极层21覆盖的部分”是指阴极层21的设计边界所覆盖到的至少部分所述至少一层绝缘层4。可以理解，在实际制作中，例如在通过蒸镀工艺制作阴极层21的时，阴极层21的实际蒸镀边界可能会与设计边界之间存在一定的偏差。所以，在实际产品中，所述至少一层绝缘层4中未被阴极层21覆盖到的部分也可能设置有隔断槽45。
这样设置，在封装显示基板后，可以阻止水汽由隔断槽45靠近开孔3的一侧通过阴极层21渗向隔断槽45远离开孔3的一侧，从而可以在设置开孔3的同时，改善水汽容易腐蚀阴极层21的问题，以降低外部水汽对显示基板100造成的影响。
综上所述，本公开一些实施例提供的显示基板100中，通过设置柔性衬底1的可拉伸区域A从显示区Q 1延伸至非显示区Q 2，并且柔性衬底1的可拉伸区域A内设置有阵列排布的多个开孔3，使得柔性衬底1在至少部分显示区Q 1和至少部分非显示区Q 2内均可以被拉伸。与此同时，由于在所述至少一层绝缘层4设置有至少一个隔断槽45，隔断槽45围绕开孔3设置，且隔断槽45被配置为隔断阴极层21，还可以阻止水汽由隔断槽45靠近开孔3的一侧通过阴极层21渗向隔断槽45远离开孔3的一侧，从而可以在设置开孔3实现可拉伸效果的同时，改善水汽容易腐蚀阴极层21，造成显示基板100的显示区发生显示不良的问题。
在一些实施例中，如图4所示，显示基板100还包括：位于阴极层21与至少一层绝缘层4之间的发光功能层22(例如，电子传输层、电子注入层、有机发光层、空穴注入层和空穴传输层等)，发光功能层22从显示区Q 1延伸至非显示区Q 2，发光功能层22的边缘位于阴极层21的边缘和显示区Q 1之间。其中，至少部分隔断槽同时隔断阴极层21和发光功能层22。
这样设置，在封装显示基板后，还可以阻止水汽由隔断槽45靠近开孔3的一侧通过发光功能层22渗向隔断槽45远离开孔3的一侧，从而可以在设置开孔3的同时，改善水汽容易腐蚀发光功能层22和阴极层21的问题，以降低外部水汽对显示基板100造成的影响。
在一些示例中，参见图3和图4，显示基板还包括阳极层，阳极层包括与多个子像素对应的多个阳极23。示例性的，在隔断槽45上方制作的阳极23可以附着在隔断槽45的内壁上。
在一些实施例中，参见图3和图4，沿开孔3的径向方向Z截断隔断槽45后得到的横截面大致呈倒T型。这样设计，有助于在制作发光功能层22和阴极层21时，使发光功能层22和阴极层21被隔断，也即，在隔断槽45处，可以使制作发光功能层22的材料和制作阴极层21的材料沉积在隔断槽45的底部，从而使发光功能层22和阴极层21均可以在隔断槽45处断开，进而有利于后续封装层实现良好封装。
其中，大致呈倒T型，可以是指呈所阐述的形状(即倒T型)，或者也可以是指呈与所阐述的形状相类似的形状，例如边缘有曲度或边缘呈锯齿状的倒T型等。
在本公开的一些实施例中，如图3和图4所示，所述至少一层绝缘层4包括依次远离阴极层的第一无机绝缘层41和第一有机绝缘层42。隔断槽45穿过第一无机绝缘层41和至少部分第一有机绝缘层42。值得指出的是，在一 些示例中，通过对层叠设置的第一无机绝缘层41和第一有机绝缘层42直接进行刻蚀，即可得到上述横截面大致呈倒T型的隔断槽。此时，还具有工艺简单，制作方便的优点。
在一些实施例中，如图3和图4所示，显示基板100还包括：设置于柔性衬底1的第一侧、且位于非显示区Q 2的至少一条信号线5，信号线5上具有至少一个第一避让口51，第一避让口51被配置为暴露出开孔3。例如在图3和图4的示例中，每个第一避让口51可以暴露出一个开孔3。当然，在其它示例中，也可以设置第一避让口51暴露出两个或两个以上的开孔3，本公开不对此进行限制。
其中，第一避让口51的侧壁可以是如图5A示出的封闭环状(例如该第一避让口51的侧壁可以围绕开孔3设置一圈)；或者，第一避让口51的侧壁也可以是如图5B示出的具有开口的部分环状(例如该第一避让口51的侧壁也可以围绕开孔3设置半圈、三分之一圈等)。
所述至少一层绝缘层4覆盖第一避让口51的侧壁；或者，所述至少一层绝缘层4覆盖第一避让口51的侧壁和信号线5远离柔性衬底1的表面中靠近第一避让口51的部分表面。
这样设置，可以利用所述至少一层绝缘层4对信号线5靠近开孔3的侧壁(也即第一避让口51的侧壁)进行保护，或者可以利用所述至少一层绝缘层4同时对信号线5靠近开孔3的侧壁(也即第一避让口51的侧壁)以及信号线5远离柔性衬底1的表面中靠近第一避让口51的部分表面进行保护。
值得指出的是，信号线5的材质通常可以包括Al(铝)等金属离子，通过设置所述至少一层绝缘层4，一方面可以阻挡水汽从开孔3渗入到信号线5，从而可以防止信号线5发生Al腐蚀等问题。另一方面，在后续进行刻蚀工艺期间，还可以防止信号线5中的Al离子与刻蚀液中的Ag(银)离子等发生置换反应。因此，通过设置所述至少一层绝缘层4可以有效的对信号线5进行保护。
示例性的，如图3和图4所示，信号线5包括依次远离柔性衬底1的第一金属层52和第二金属层53。这样设置，有利于减小信号线5上的电阻，提高信号传输效率。
在此基础上，所述至少一层绝缘层4可以包括依次靠近柔性衬底1的第一有机绝缘层42、第二有机绝缘层43。
其中，第二有机绝缘层43覆盖第一金属层52靠近开孔3的侧面和第一金属层52远离柔性衬底1的部分表面。
第二金属层53与第一金属层52电接触，且第二金属层53覆盖第二有机绝缘层43远离开孔3的侧面和第二有机绝缘层43远离柔性衬底1的部分表面。
第一有机绝缘层42覆盖第二金属层53靠近开孔3的侧面和第二金属层53远离柔性衬底1的部分表面。
这样设计，可以利用第一有机绝缘层41和第二有机绝缘层42对信号线2的第一金属层22和第二金属层23进行有效的保护。
在此基础上，示例性的，所述至少一层绝缘层4还可以包括第一无机绝缘层41和第二无机绝缘层44。
第二无机绝缘层44位于第二有机绝缘层43、第一金属层52、第二金属层53和柔性衬底1四者之间。
第一无机绝缘层41覆盖第一有机绝缘层42远离柔性衬底1的至少部分表面、第一有机绝缘层42靠近开孔3的侧面和第二有机绝缘层42靠近开孔3的侧面，并且第一无机绝缘层41连接至第二无机绝缘层44。
这样设计，由于设置有第一无机绝缘层41和第二无机绝缘层44，可以具有更好的阻隔能力，从而可以利用四个绝缘层(即第一无机绝缘层41、第一有机绝缘层42、第二有机绝缘层43和第二无机绝缘层44)对信号线5进行更有效的保护。
在制作该显示基板100的过程中，示例性的，可以在形成上述第一无机绝缘层41、第一有机绝缘层42、第二有机绝缘层43和第二无机绝缘层44之后，通过刻蚀工艺刻蚀出第一无机绝缘层41与第二无机绝缘层44相接触的位置，形成穿过第一无机绝缘层41和第二无机绝缘层44的开孔3(例如通孔或者盲孔)。
在本公开的一些实施例中，上述信号线5可以是位于非显示区Q 2的电压信号线50，该电压信号线50可以围绕显示区Q 1设置。
参见图3、图4、图6A和图6B，显示基板100还包括位于非显示区Q 2的阴极搭接层24，阴极搭接层24包括彼此相连的第一部分和第二部分，所述第一部分与所述阴极层21靠近所述柔性衬底1的表面电连接，所述第二部分与所述电压信号线20远离所述柔性衬底1的表面电连接。
所述阴极搭接层24上具有至少一个第二避让口241，所述第二避让口241被配置为暴露出所述开孔3。
其中，第二避让口241的侧壁可以是如图5A示出的封闭环状(例如该第二避让口241的侧壁可以围绕开孔3设置一圈)；或者，第二避让口241的 侧壁也可以是如图5B示出的具有开口的部分环状(例如该第二避让口241的侧壁也可以围绕开孔3设置半圈、三分之一圈等)。
这样设计，使得位于非显示区Q 2的阴极搭接层24可以对开孔3进行避让，也即阴极搭接层24的设置并未对开孔3在非显示区Q 2的排布位置产生影响，从而使得柔性衬底1的可拉伸区域A在显示区Q 1和非显示区Q 2可以具有基本一致的拉伸性能。
示例性的，参见图3和图4，所述至少一层绝缘层4覆盖第二避让口241的侧壁。这样设置，可以利用所述至少一层绝缘层4对阴极搭接层24靠近开孔3的侧壁(也即第二避让口241的侧壁)进行保护，从而防止阴极搭接层24受到水氧侵蚀，并且可以防止阴极搭接层24中的金属离子与刻蚀液中的金属离子等发生置换反应。
又示例性的，所述至少一层绝缘层4覆盖所述第二避让口241的侧壁和所述阴极搭接层24远离所述柔性衬底1的表面中靠近所述第二避让口241的部分表面。这样设置，可以利用隔离柱4更好的保护阴极搭接层24，以防止阴极搭接层24受到水氧侵蚀，并防止阴极搭接层24中的金属离子与刻蚀液中的金属离子等发生置换反应。
其中，阴极搭接层24可以与上述阳极23同层同材料制作。这样有利于简化显示基板100的制作工艺。
在上述一些实施例的基础上，示例性的，参见图6A，显示基板100还包括：第一阻挡坝61、第二阻挡坝62和封装层25。
如图6A所示，第一阻挡坝61设置于柔性衬底1的第一侧，第一阻挡坝61位于非显示区Q 2且围绕显示区Q 1设置，第一阻挡坝61至少覆盖电压信号线50远离显示区Q 1的侧面和阴极搭接层24远离显示区Q 1的侧面。第一阻挡坝61上具有至少一个第三避让口610，第三避让口610被配置为暴露出开孔3。
其中，第三避让口610的侧壁可以是如图5A示出的封闭环状(例如该第三避让口610的侧壁可以围绕开孔3设置一圈)；或者，第三避让口610的侧壁也可以是如图5B示出的具有开口的部分环状(例如该第三避让口610的侧壁也可以围绕开孔3设置半圈、三分之一圈等)。
此外，该第三避让口610被配置为不同时贯穿第一阻挡坝61靠近显示区Q 1的侧面与该第一阻挡坝61远离显示区Q 1的侧面，这样在制作显示基板100过程中，第一阻挡坝61可以阻挡其靠近显示区一侧的材料流向其远离显示区的一侧，从而使得显示基板100可以实现良好封装。
示例性的，如图6A所示，第一阻挡坝61还覆盖电压信号线50远离柔性衬底1的部分表面(也即电压信号线50远离柔性衬底1的全部表面中靠近第一阻挡坝61的部分表面)和阴极搭接层24远离柔性衬底1的部分表面(也即阴极搭接层24远离柔性衬底1的全部表面中靠近第一阻挡坝61的部分表面)。
继续参见图6A，在一些示例中，该第一阻挡坝61可以为三层结构，例如，沿远离柔性衬底1的方向，第一层可以与平坦层26同层同材料制成，第二层可以与像素定义层27同层同材料制成，第三层可以与填充层28同层同材料制成。
其中，平坦层26可以包括上述第一有机绝缘层和/或第二有机绝缘层。
像素定义层27从显示区Q 1延伸到非显示区Q 2，像素定义层27的边缘位于非显示区Q 2。像素定义层27具有用于限定多个子像素区域的开口。
在一些示例中，如图6A所示，阴极搭接层24上具有阵列分布的多个孔242，多个孔242中的至少一个孔242贯通阴极搭接层24。多个孔242中的至少部分孔242在柔性衬底1上的正投影位于平坦层26在柔性衬底1上的正投影的范围之内。这样可以在制作显示基板100的过程中，释放阴极搭接层24下方膜层(比如平坦层26)中产生的气体，提高了显示基板的可靠性。
上述填充层28可以用于填充于阴极搭接层24上的孔242。这样，可以使阴极搭接层24的上表面平整，便于在阴极搭接层24上制作其它膜层。
此处，需要说明的是，阴极层21与阴极搭接层24搭接时，实际电连接的区域是网格状的，中间填充有填充层材料是不导电的。
如图6A所示，第二阻挡坝62设置于柔性衬底1的第一侧，第二阻挡坝62位于非显示区Q 2且围绕显示区Q 1设置，第二阻挡坝62位于阴极搭接层24的第二部分远离柔性衬底1的表面上，第二阻挡坝62上具有至少一个第四避让口620，第四避让口620被配置为暴露出开孔3、第一避让口51和第二避让口241。
其中，第四避让口620的侧壁可以是如图5A示出的封闭环状(例如该第四避让口620的侧壁可以围绕开孔3设置一圈)；或者，第四避让口620的侧壁也可以是如图5B示出的具有开口的部分环状(例如该第四避让口620的侧壁也可以围绕开孔3设置半圈、三分之一圈等)。
此外，该第四避让口620被配置为不同时贯穿第二阻挡坝62靠近显示区Q 1的侧面与该第二阻挡坝62远离显示区Q 1的侧面，这样在制作显示基板100过程中，第二阻挡坝62可以阻挡其靠近显示区Q 1一侧的材料流向其远离显 示区Q 1的一侧，从而使得显示基板100可以实现良好封装。
在一些示例中，该第二阻挡坝62可以为两层结构，例如，沿远离柔性衬底1的方向，第一层可以与像素定义层27同层同材料制成，第二层可以与填充层28同层同材料制成。
参见图6A和图6B，封装层25设置于柔性衬底1的第一侧，封装层25覆盖阴极层21、第一阻挡坝61和第二阻挡坝62，封装层55上具有至少一个第五避让口251，第五避让口251被配置为至少暴露出开孔3。
其中，第五避让口251的侧壁可以是如图5A示出的封闭环状(例如该第五避让口251的侧壁可以围绕开孔3设置一圈)；或者，第五避让口251的侧壁也可以是如图5B示出的具有开口的部分环状(例如该第五避让口251的侧壁也可以围绕开孔3设置半圈、三分之一圈等)。
在本公开的一些实施例中，参见图3、图4、图6A和图6B，显示基板100还可以包括位于柔性衬底1第一侧表面上的缓冲层11。缓冲层11从显示区Q 1延伸到非显示区Q 2，并且缓冲层11的边缘位于第一阻挡坝61远离显示区Q 1的一侧。其中，缓冲层11上具有暴露出开孔3的开口。
需要说明的是，本公开为了清楚、简要的示意出显示基板的结构，在图3、图4、图6A和图6B中仅示出了显示基板的截面结构示意图，而非剖视图(也即未在图中示意除截面部分以外的连接关系)，因此，可以理解的是，各个图中分离的至少两部分实质上是可以连接在一起的。
在此基础上，示例性的，如图6A所示，缓冲层11延伸到第一阻挡坝61远离显示区Q 1一侧的部分形成有至少一个槽110，槽110围绕第一阻挡坝61设置。这样在制作显示基板100的过程中，可以通过槽110阻挡外侧裂纹向内扩展影响到显示区Q 1，从而可以提高显示基板100的可靠性。
示例性的，如图6A所示，在槽110远离衬底的一侧还可以设置第三阻挡坝63。通过第三阻挡坝63可以达到更好的阻挡裂纹延伸的效果。
本公开一些实施例提供了一种显示装置200，如图7所示，该显示装置200包括如上述任一实施例所述的显示基板。
示例性地，显示装置200例如可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
该显示装置200的技术效果，可参见上述任一实施例描述的显示基板的技术效果，此处不再赘述。
本公开一些实施例还提供了一种显示基板的制作方法，参见图1，显示基板100具有显示区Q 1和与显示区Q 1邻接的非显示区Q 2。参见图2、图3和 图8，所述制作方法包括：
S1、在柔性衬底1的第一侧形成至少一层绝缘层4(例如第一无机绝缘层41、第一有机绝缘层42、第二有机绝缘层43和第二无机绝缘层44)。
S2、在柔性衬底1的可拉伸区域A内形成阵列排布的多个开孔3，至少部分开孔3穿过至少一层绝缘层4；其中，可拉伸区域A从显示区Q 1延伸至非显示区Q 2。
S3、在所述至少一层绝缘层4形成至少一个隔断槽45，隔断槽45围绕开孔3设置(例如，隔断槽45可以围绕开孔3设置一圈；或者，隔断槽45也可以仅围绕开孔3设置半圈或三分之一圈等)。
其中，隔断槽45例如可以设置在所述至少一层绝缘层4被阴极层21覆盖的部分。“所述至少一层绝缘层4被阴极层21覆盖的部分”是指阴极层21的设计边界所覆盖到的至少部分所述至少一层绝缘层4。可以理解，在实际制作中，例如在通过蒸镀工艺制作阴极层21的时，阴极层21的实际蒸镀边界可能会与设计边界之间存在一定的偏差。所以，在实际产品中，所述至少一层绝缘层4中未被阴极层21覆盖到的部分也可能设置有隔断槽45。
S4、在形成有所述至少一层绝缘层4的柔性衬底1上形成阴极层21，阴极层21从显示区Q 1延伸至非显示区Q 2，阴极层21的边缘位于非显示区Q 2，且阴极层21被隔断槽45所隔断。
这样设置，使得所形成的显示基板100在封装后，可以阻止水汽由隔断槽45靠近开孔3的一侧通过阴极层21渗向隔断槽45远离开孔3的一侧，从而可以在设置开孔3的同时，改善水汽容易腐蚀阴极层21的问题，以降低外部水汽对显示基板100造成的影响。
在此基础上，示例性的，参见图4，在形成阴极层21之前，该制作方法还包括：在柔性衬底1的第一侧形成发光功能层22(例如，电子传输层、电子注入层、有机发光层、空穴注入层和空穴传输层等)，发光功能层22从显示区Q 1延伸至非显示区Q 2，发光功能层22的边缘位于阴极层21的边缘和显示区Q 1之间；其中，至少部分隔断槽45同时隔断阴极层21和发光功能层22。
这样设置，使得所形成的显示基板100在封装后，还可以阻止水汽由隔断槽45靠近开孔3的一侧通过发光功能层22渗向隔断槽45远离开孔3的一侧，从而可以在设置开孔3的同时，改善水汽容易腐蚀发光功能层22和阴极层21的问题，以降低外部水汽对显示基板100造成的影响。
在一些实施例中，参见图3和图4，所述至少一层绝缘层4包括依次远离阴极层21的第一无机绝缘层41和第一有机绝缘层42。
所述在所述至少一层绝缘层4形成至少一个隔断槽45，包括：通过刻蚀工艺刻蚀第一无机绝缘层41和至少部分第一有机绝缘层42，以形成至少一个隔断槽45。
这样设计，有利于简化制作工艺，从而便于快速加工出上述隔断槽45。
需要说明的是，本公开一些实施例提供的显示基板的制作方法，用于制作出如上所述的任一实施例中的显示基板100，因此，所制作出的显示基板100具有如上所述的全部有益效果，此处不再进行赘述。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (15)

  1. 一种显示基板，具有显示区和与所述显示区邻接的非显示区；所述显示基板包括：
    柔性衬底，所述柔性衬底包括至少一个可拉伸区域，所述可拉伸区域从所述显示区延伸至所述非显示区，所述可拉伸区域内设置有阵列排布的多个开孔；
    位于所述柔性衬底第一侧的阴极层，所述阴极层从所述显示区延伸至所述非显示区，且所述阴极层的边缘位于所述非显示区；
    位于所述柔性衬底与所述阴极层之间的至少一层绝缘层，所述至少一层绝缘层被配置为暴露出所述多个开孔，并且所述至少一层绝缘层设置有至少一个隔断槽，隔断槽围绕开孔设置，且隔断槽被配置为隔断所述阴极层。
  2. 根据权利要求1所述的显示基板，还包括：
    位于所述阴极层与所述至少一层绝缘层之间的发光功能层，所述发光功能层从所述显示区延伸至所述非显示区，所述发光功能层的边缘位于所述阴极层的边缘和所述显示区之间；
    其中，至少部分所述隔断槽同时隔断所述阴极层和所述发光功能层。
  3. 根据权利要求1或2所述的显示基板，其中，沿所述开孔的径向方向截断所述隔断槽后得到的横截面大致呈倒T型。
  4. 根据权利要求1～3中任一项所述的显示基板，其中，所述至少一层绝缘层包括依次远离所述阴极层的第一无机绝缘层和第一有机绝缘层；
    所述隔断槽穿过所述第一无机绝缘层和至少部分所述第一有机绝缘层。
  5. 根据权利要求1～4中任一项所述的显示基板，还包括：
    设置于所述柔性衬底的第一侧、且位于所述非显示区的至少一条信号线，所述信号线上具有至少一个第一避让口，所述第一避让口被配置为暴露出所述开孔；
    其中，所述至少一层绝缘层覆盖所述第一避让口的侧壁；或者，
    所述至少一层绝缘层覆盖所述第一避让口的侧壁和所述信号线远离所述柔性衬底的表面中靠近所述第一避让口的部分表面。
  6. 根据权利要求5所述的显示基板，其中，所述信号线包括依次远离所述柔性衬底的第一金属层和第二金属层；所述至少一层绝缘层包括依次靠近所述柔性衬底的第一有机绝缘层和第二有机绝缘层；
    所述第二有机绝缘层覆盖所述第一金属层靠近所述开孔的侧面和所述第一金属层远离所述柔性衬底的部分表面；
    所述第二金属层与所述第一金属层电接触，且所述第二金属层覆盖所述第二有机绝缘层远离所述开孔的侧面和所述第二有机绝缘层远离所述柔性衬底的部分表面；
    所述第一有机绝缘层覆盖所述第二金属层靠近所述开孔的侧面和所述第二金属层远离所述柔性衬底的部分表面。
  7. 根据权利要求6所述的显示基板，其中，所述至少一层绝缘层还包括第一无机绝缘层和第二无机绝缘层；
    所述第二无机绝缘层位于所述第二有机绝缘层、所述第一金属层、第二金属层和所述柔性衬底四者之间；
    所述第一无机绝缘层覆盖所述第一有机绝缘层远离所述柔性衬底的至少部分表面、所述第一有机绝缘层靠近所述开孔的侧面和所述第二有机绝缘层靠近所述开孔的侧面，并且所述第一无机绝缘层连接至所述第二无机绝缘层。
  8. 根据权利要求5～7中任一项所述的显示基板，其中，所述信号线包括电压信号线，所述电压信号线围绕所述显示区设置；
    所述显示基板还包括：
    位于所述非显示区的阴极搭接层，包括彼此相连的第一部分和第二部分，所述第一部分与所述阴极层靠近所述柔性衬底的表面电连接，所述第二部分与所述电压信号线远离所述柔性衬底的表面电连接；
    所述阴极搭接层上具有至少一个第二避让口，所述第二避让口被配置为暴露出所述开孔；
    其中，所述至少一层绝缘层覆盖所述第二避让口的侧壁；或者，
    所述至少一层绝缘层覆盖所述第二避让口的侧壁和所述阴极搭接层远离所述柔性衬底的表面中靠近所述第二避让口的部分表面。
  9. 根据权利要求8所述的显示基板，还包括：
    设置于所述柔性衬底第一侧的第一阻挡坝，所述第一阻挡坝位于所述非显示区且围绕所述显示区设置，所述第一阻挡坝至少覆盖所述电压信号线远离所述显示区的侧面和所述阴极搭接层远离所述显示区的侧面，所述第一阻挡坝上具有至少一个第三避让口，所述第三避让口被配置为暴露出所述开孔；
    设置于所述柔性衬底第一侧的第二阻挡坝，所述第二阻挡坝位于所述非显示区且围绕所述显示区设置，所述第二阻挡坝位于所述阴极搭接层的第二部分远离所述柔性衬底的表面上，所述第二阻挡坝上具有至少一个第四避让口，所述第四避让口被配置为暴露出所述开孔、所述第一避让口和所述第二避让口；
    设置于所述柔性衬底第一侧的封装层，所述封装层覆盖所述阴极层、所述第一阻挡坝和所述第二阻挡坝，所述封装层上具有至少一个第五避让口，所述第五避让口被配置为至少暴露出所述开孔。
  10. 根据权利要求1～9中任一项所述的显示基板，其中，所述显示基板大致呈矩形，所述可拉伸区域的数量为四个，四个所述可拉伸区域分别位于所述显示基板的四个角位置处；
    或者，所述可拉伸区域的数量为一个，一个所述可拉伸区域覆盖全部所述显示区和全部所述非显示区。
  11. 根据权利要求1～10中任一项所述的显示基板，其中，所述阵列排布的多个开孔包括：
    沿第一方向延伸的第一开孔；和，
    沿与第一方向交叉的第二方向延伸的第二开孔；
    其中，在所述第一方向和所述第二方向上，所述第一开孔与所述第二开孔均交替排布。
  12. 一种显示装置，包括：
    如权利要求1～11中任一项所述的显示基板。
  13. 一种显示基板的制作方法，所述显示基板具有显示区和与所述显示区邻接的非显示区；所述制作方法包括：
    在柔性衬底的第一侧形成至少一层绝缘层；
    在柔性衬底的可拉伸区域内形成阵列排布的多个开孔，至少部分开孔穿过所述至少一层绝缘层；其中，所述可拉伸区域从所述显示区延伸至所述非显示区；
    在所述至少一层绝缘层形成至少一个隔断槽，隔断槽围绕开孔设置；
    在形成有所述至少一层绝缘层的所述柔性衬底上形成阴极层，所述阴极层从所述显示区延伸至所述非显示区，所述阴极层的边缘位于所述非显示区，且所述阴极层被所述隔断槽所隔断。
  14. 根据权利要求13所述的制作方法，在形成所述阴极层之前，还包括：
    在所述柔性衬底的第一侧形成发光功能层，所述发光功能层从所述显示区延伸至所述非显示区，所述发光功能层的边缘位于所述阴极层的边缘和所述显示区之间；
    其中，至少部分所述隔断槽同时隔断所述阴极层和所述发光功能层。
  15. 根据权利要求13或14所述的制作方法，其中，所述至少一层绝缘层包括依次远离所述阴极层的第一无机绝缘层和第一有机绝缘层；
    所述在所述至少一层绝缘层形成至少一个隔断槽，包括：
    通过刻蚀工艺刻蚀所述第一无机绝缘层和至少部分所述第一有机绝缘层，以形成所述至少一个隔断槽。
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