WO2023163271A1 - Tête de sonde à faible frottement - Google Patents

Tête de sonde à faible frottement Download PDF

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Publication number
WO2023163271A1
WO2023163271A1 PCT/KR2022/004452 KR2022004452W WO2023163271A1 WO 2023163271 A1 WO2023163271 A1 WO 2023163271A1 KR 2022004452 W KR2022004452 W KR 2022004452W WO 2023163271 A1 WO2023163271 A1 WO 2023163271A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
guide
low
probe head
block
Prior art date
Application number
PCT/KR2022/004452
Other languages
English (en)
Korean (ko)
Inventor
안승배
주영훈
Original Assignee
(주)티에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)티에스이 filed Critical (주)티에스이
Publication of WO2023163271A1 publication Critical patent/WO2023163271A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne une tête de sonde pour tester des éléments semi-conducteurs, la caractéristique technique centrale étant une tête de sonde à faible frottement comprenant : une sonde ; un bloc pourvu d'un trou de réception dans lequel la sonde est reçue ; et un film de guidage disposé sur le dessus du bloc et ayant un trou de guidage qui correspond au trou de réception pour recevoir la sonde, sur un côté du trou de guidage se trouvant une partie de guidage flexible pour supporter de manière flexible la sonde.
PCT/KR2022/004452 2022-02-25 2022-03-29 Tête de sonde à faible frottement WO2023163271A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0024827 2022-02-25
KR1020220024827A KR20230127485A (ko) 2022-02-25 2022-02-25 저마찰형 프로브 헤드

Publications (1)

Publication Number Publication Date
WO2023163271A1 true WO2023163271A1 (fr) 2023-08-31

Family

ID=87766072

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/004452 WO2023163271A1 (fr) 2022-02-25 2022-03-29 Tête de sonde à faible frottement

Country Status (3)

Country Link
KR (1) KR20230127485A (fr)
TW (1) TWI833229B (fr)
WO (1) WO2023163271A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101363367B1 (ko) * 2012-09-04 2014-02-25 주식회사 에스피에스테크 인쇄회로기판 검사장치
KR20170125070A (ko) * 2015-03-13 2017-11-13 테크노프로브 에스.피.에이. 상이한 작동 조건 하에서 각각의 가이드 구멍 내에서 개선된 슬라이드 이동을 하고 테스트 헤드 내에서 프로브를 정확히 유지하는 수직형 프로브를 구비한 테스트 헤드
KR20170129806A (ko) * 2015-03-13 2017-11-27 테크노프로브 에스.피.에이. 특히 고주파 응용을 위한 수직형 프로브를 구비한 테스트 헤드
KR20180059867A (ko) * 2015-10-21 2018-06-05 가부시키가이샤 니혼 마이크로닉스 프로브 카드 및 접촉 검사 장치
KR20200088378A (ko) * 2017-11-09 2020-07-22 테크노프로브 에스.피.에이. 고주파 소자들의 테스트를 위한 테스트 헤드용 콘택 프로브

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235785B2 (ja) * 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
TW201843457A (zh) * 2017-05-05 2018-12-16 旺矽科技股份有限公司 具有垂直式探針之探針頭
CN108241078B (zh) * 2017-05-18 2020-06-02 苏州韬盛电子科技有限公司 垂直探针卡
KR20200104061A (ko) * 2019-02-26 2020-09-03 (주)포인트엔지니어링 프로브 카드용 가이드 플레이트 및 이를 구비한 프로브 카드

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101363367B1 (ko) * 2012-09-04 2014-02-25 주식회사 에스피에스테크 인쇄회로기판 검사장치
KR20170125070A (ko) * 2015-03-13 2017-11-13 테크노프로브 에스.피.에이. 상이한 작동 조건 하에서 각각의 가이드 구멍 내에서 개선된 슬라이드 이동을 하고 테스트 헤드 내에서 프로브를 정확히 유지하는 수직형 프로브를 구비한 테스트 헤드
KR20170129806A (ko) * 2015-03-13 2017-11-27 테크노프로브 에스.피.에이. 특히 고주파 응용을 위한 수직형 프로브를 구비한 테스트 헤드
KR20180059867A (ko) * 2015-10-21 2018-06-05 가부시키가이샤 니혼 마이크로닉스 프로브 카드 및 접촉 검사 장치
KR20200088378A (ko) * 2017-11-09 2020-07-22 테크노프로브 에스.피.에이. 고주파 소자들의 테스트를 위한 테스트 헤드용 콘택 프로브

Also Published As

Publication number Publication date
TWI833229B (zh) 2024-02-21
KR20230127485A (ko) 2023-09-01
TW202334655A (zh) 2023-09-01

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