WO2011074837A2 - Appareil de sonde pour bosse de soudure de plaquette - Google Patents

Appareil de sonde pour bosse de soudure de plaquette Download PDF

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Publication number
WO2011074837A2
WO2011074837A2 PCT/KR2010/008877 KR2010008877W WO2011074837A2 WO 2011074837 A2 WO2011074837 A2 WO 2011074837A2 KR 2010008877 W KR2010008877 W KR 2010008877W WO 2011074837 A2 WO2011074837 A2 WO 2011074837A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
flexible circuit
wafer
support
Prior art date
Application number
PCT/KR2010/008877
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English (en)
Korean (ko)
Other versions
WO2011074837A3 (fr
Inventor
임이빈
허남중
조준수
Original Assignee
주식회사 프로이천
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 프로이천 filed Critical 주식회사 프로이천
Publication of WO2011074837A2 publication Critical patent/WO2011074837A2/fr
Publication of WO2011074837A3 publication Critical patent/WO2011074837A3/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Definitions

  • the present invention relates to a probe device for a wafer solder bump, and when performing the electrical test of the wafer through the solder bump formed on the bottom surface of the wafer, it is possible to eliminate the electrical connection defect by preventing the solder bumps and the flexible circuit board distortion.
  • a probe device for wafer solder bumps is a probe device for wafer solder bumps.
  • a probe card for testing a semiconductor wafer has a circular sacrificial circuit board having a predetermined thickness, and a plurality of probes are arranged in holes formed in the center of the printed circuit board.
  • the probes may be energized in contact with a pad of the device formed on the semiconductor wafer. Therefore, the probes perform an electrical test by playing a role of transmitting electrical signals between the printed circuit board and the device.
  • solder bumps are formed on a wafer
  • electrical signals were detected using a connection pattern formed on a flexible circuit board in addition to the probes.
  • the flexible circuit board is a substrate made of a flexible material, and the ends of the flexible circuit board are electrically connected to the printed circuit board so that the substrate can transmit signals to the printed circuit board.
  • a flexible circuit board may be formed of a flexible material so as to be bent and extend a signal line to a predetermined length.
  • connection position is shifted by the impact force generated when the solder bumps of the wafer and the connection pattern of the flexible circuit board are connected. Therefore, there is a problem in that the electrical test on the wafer is not normally performed.
  • the ends of the flexible circuit boards extending to a certain length are electrically connected to the printed circuit boards. Even in this case, there is no conventional fixing means, or the fixing force cannot be evenly applied to the entire surface of the flexible circuit board. For this reason, when the impact force is applied from the outside as in the above, there is a problem that the end of the flexible circuit board and the predetermined portion of the printed circuit board is misaligned with each other and thus the normal electrical test is not performed.
  • the present invention was created to solve the above problems, and an object of the present invention is to compare the solder bumps with the connection pattern of the flexible circuit board when performing electrical test of the wafer through the solder bumps formed on the bottom surface of the wafer.
  • the present invention provides a probe device for a wafer solder bump that can improve the accuracy of the connection position, prevent the connection position from being distorted due to external impact that can be generated during the test, and solve the poor connection with the flexible circuit board.
  • the present invention provides a probe device for wafer solder bumps.
  • the wafer solder bump probe device may include a support stacked on an upper surface of a printed circuit board; A flexible circuit board having a connection pattern connected to solder bumps formed on the wafer, the flexible circuit board having a predetermined length, a bottom surface of which is seated on an upper surface of the support portion, and both ends of which are electrically connected to a portion of the printed circuit board; A main fixing part fitted to an edge of the support part and fixing the flexible circuit board to be in close contact with an outer surface of the support part; And a sub fixing part provided on the printed circuit board and closely fixing both ends of the flexible circuit board by using an elastic force.
  • the support portion a rectangular plate-shaped support block made of ceramic and fixed to the upper surface of the printed circuit board, laminated on the upper surface of the support block and made of an elastic material, the upper surface is in close contact with the bottom surface of the flexible circuit board It is preferable to have an elastic pad.
  • a mounting groove having a predetermined depth is further formed on an upper surface of the printed circuit board, and a lower end portion of the support block is fitted into the mounting groove to be seated.
  • the main fixing part may be formed of a body in which a hole fitted into the edge of the support part is formed, and the flexible circuit board is pressed between the inner surface of the hole and the edge of the support part.
  • both ends of the flexible circuit board are connected to an electrode formed on an upper surface of the printed circuit board, and the sub-fixing part includes a first rubber member laminated on both upper surfaces of the flexible circuit board, and the first rubber member. It is preferable to have a first fixing block laminated on the upper surface and fixed to the printed circuit board.
  • first reinforcement block is further disposed on the bottom of the printed circuit board, the first reinforcement block is preferably bolted to the bottom of the printed circuit board is fixed.
  • the printed circuit board further includes a pair of through holes penetrating the printed circuit board at both sides of the main fixing part, and both ends of the flexible circuit board penetrate through the pair of through holes. It may be electrically connected to an electrode formed on the bottom surface of the circuit board.
  • the pair of through holes is preferably formed in a slit shape so that the flexible circuit board having a predetermined width and width passes therethrough.
  • the sub fixing part includes a second rubber member that is in close contact with bottom surfaces of both ends of the flexible circuit board, and a second fixing block that is in close contact with the bottom surface of the second rubber member and fixed to the printed circuit board. .
  • a second reinforcement block may be further disposed on the bottom of the printed circuit board, and the second reinforcement block may be fixed by bolting to the bottom of the printed circuit board.
  • the present invention improves the accuracy of the connection position between the solder bumps and the connection pattern of the flexible circuit board when performing the wafer electrical test through the solder bumps formed on the bottom surface of the wafer, and the external impact that may be generated during the test. This can prevent the connection position from being distorted.
  • FIG. 1 is a combined perspective view showing a probe device for a wafer solder bump according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view illustrating the probe apparatus for the wafer solder bumps of FIG. 1.
  • FIG. 3 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 2.
  • FIG. 4 is an enlarged cross-sectional view illustrating a symbol A of FIG. 3.
  • FIG. 5 is an enlarged cross-sectional view showing a display B of FIG. 3.
  • FIG. 6 is a partial cross-sectional view showing a state in which a support block according to the present invention is seated in a seating groove formed in a substrate.
  • FIG. 7 is an exploded perspective view showing a probe device for a wafer solder bump according to a second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 7.
  • FIG. 9 is an enlarged cross-sectional view showing a display symbol C of FIG. 8.
  • FIG. 10 is an enlarged cross-sectional view showing a display symbol D of FIG. 8.
  • FIG. 1 is a combined perspective view showing a probe device for a wafer solder bump according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view illustrating the probe apparatus for the wafer solder bumps of FIG. 1.
  • 3 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 2.
  • 4 is an enlarged cross-sectional view illustrating a symbol A of FIG. 3.
  • a probe apparatus for a wafer solder bump according to a first embodiment of the present invention will be described.
  • the probe device of the present invention has a disk-shaped printed circuit board 100.
  • a pair of electrode portions 101 are formed at predetermined positions on both sides of the printed circuit board 100.
  • the pair of electrode portions 101 are formed at the same distance from the center of the printed circuit board 100.
  • the support part 200 is stacked at the center of the upper surface of the printed circuit board 100.
  • the support part 200 includes a support block 210 stacked on an upper surface of the printed circuit board 100 and an elastic pad 220 stacked on an upper surface of the support block 210.
  • the support block 210 is made of a ceramic material.
  • the support block 210 is insulative.
  • the four corners of the support block 210 may be formed to be tapered. Therefore, the tapered load may be guided so that the main fixing part 300 to be described below can be easily inserted when the main fixing part 300 to be wrapped to surround the outer circumference of the support part 200.
  • the elastic pad 220 is preferably made of a rubber.
  • the thickness of the elastic pad 220 is formed to be a predetermined thickness thinner than the thickness of the support block 210.
  • the upper surface of the elastic pad 220 is a portion where the bottom surface of the flexible circuit board 400 is in close contact. Therefore, the bottom surface of the flexible circuit board 400 may be prevented from being twisted by being in close contact with the top surface of the elastic pad 220.
  • the four corners of the elastic pad 220 are formed to be tapered to be the same as the support block 210.
  • the lower end of the support block 210 of the support part 200 may be seated and fixed to the seating groove 110 formed in the printed circuit board 100. Therefore, the support block 210 can be prevented from being inserted into the seating groove 110 and seated in the seated state.
  • connection patterns 410 are formed on the top surface of the flexible circuit board 400 having a predetermined length to be seated on the top surface of the elastic pad 220 to contact the solder bumps formed on the bottom surface of the wafer.
  • Both ends of the flexible circuit board 400 seated on the upper surface of the support portion 200, that is, the upper surface of the elastic pad 220 may extend a predetermined length to both sides of the support portion 200.
  • both ends of the flexible circuit board 400 are portions connected to the pair of electrode portions 101 formed on the upper surface of the printed circuit board 100.
  • the main fixing part 300 may be fitted into the support part 200.
  • the main fixing part 300 is formed of a body in which a hole 310 into which the support part 200 can be fitted is formed, and the hole 310 is formed of a hole having a square shape, and the inner side of the hole 310.
  • the four corners are formed to be tapered so that the square corners of the tapered support block 210 are fitted to each other.
  • the support part 200 may be inserted into the hole 310 of the main fixing part 300, and the outer circumference of the support part 200 may be surrounded by the inner circumference of the hole 310.
  • the upper surface of the flexible circuit board 400 forms a state seated on the elastic pad 220, the flexible circuit board 400 on both sides except for the portion seated on the elastic pad 220 is the main fixing portion 300 It may be fitted between the inner surface of the hole 310 and the edge of the support portion 200).
  • both ends of the flexible circuit board 400 extend a predetermined length along a pair of electrode portions 101 formed on the upper surface of the printed circuit board 100 through lower ends of both sides of the main fixing part 300. Can be. That is, both ends of the flexible circuit board 400 may extend outwardly between the lower ends of both sides of the main fixing part 300 and the upper surface of the printed circuit board 100.
  • first positioning holes 10 penetrating up and down are formed at four edges of the main fixing part 300, and upper and lower parts are formed on the printed circuit board 100.
  • First 'positioning holes 11 penetrating are formed.
  • the main fixing part 300, the supporting part 200, and the printed circuit board 100 may be fixedly coupled to each other by the first positioning pins 21. That is, the first positioning pins 21 pass through the first and first 'positioning holes 10 and 11 and serve to couple them together.
  • the lower end of the main fixing part 300 may press the upper surface of the flexible circuit board 400 by pressing the upper surface, and at this time, the main fixing part 300
  • the flexible circuit board 400 exposed to the outside through the hole 310 of FIG. 1 may be pulled with a predetermined force to both sides.
  • the flexible circuit board 400 since the flexible circuit board 400 is in close contact with the elastic pad 220, the flexible circuit board 400 may be pressed against the upper surface of the elastic pad 220 by a predetermined force according to the pulling force. Accordingly, the flexible circuit board 400 may be primarily tightly fixed on the elastic pad 220.
  • the connection pattern 410 formed on the upper surface of the flexible circuit board 400 is exposed through the hole.
  • a pair of both ends of the flexible circuit board 400 which is in close contact between the lower end of the main fixing part 300 and the upper surface of the printed circuit board 100 protrudes to both sides of the main fixing part 300. It can be connected to the electrode portion 101 of.
  • both ends of the flexible circuit board 400 positioned in the pair of electrode units 101 may be tightly fixed by the sub fixing unit 510.
  • the sub fixing part 510 may include a first rubber member 511 positioned on an upper surface of one end of the flexible circuit board 400 connected to the electrode part 101 formed on the upper surface of the printed circuit board 100, and The first fixing block 512 is positioned on the upper surface of the first rubber member 511.
  • the first fixing block 512 is fixed to the printed circuit board 100.
  • Second positioning holes 20 are formed in the first fixing block 512.
  • the printed circuit board 100 is formed with second 'positioning holes 21 that are aligned with the second positioning holes 20.
  • Second positioning pins 22 may be inserted into and fixed to the second and second positioning holes 20 and 21.
  • the second fixing pins 22 are inserted into and fixed to the second and second 'positioning holes 20 and 21, so that the first fixing block 512 is pressed against the printed circuit board 100.
  • one end of the flexible circuit board 400 positioned between the bottom surface of the first rubber member 511 and the electrode portion 101 may be disposed between the electrode portions 101 by the first rubber member 511. Can be crimp fixed.
  • the other end of the flexible circuit board 400 may also be crimped and fixed in the same manner as the one end.
  • both ends of the flexible circuit board 400 may be pressed and fixed to the electrode unit 101 of the printed circuit board 100 by the sub fixing part 510 according to the present invention. 400 may be fixed secondary.
  • a first reinforcement block 610 is further provided on the bottom of the printed circuit board 100.
  • Third positioning holes 30 are formed in the first reinforcing block 610, and a third position in which bottom positions of the printed circuit board 100 coincide with the third positioning holes 30 is provided.
  • 'Positioning holes 31 are formed.
  • third positioning pins 23 may be inserted into the third and third 'positioning holes 30 and 31.
  • the first reinforcing blocks 610 are formed on the bottom surface of the printed circuit board 100 by inserting the third positioning pins 23 into the third and third 'positioning holes 30 and 31.
  • the support part 200 and the bottom of the main fixing part 300 are fixedly installed.
  • the solder bumps of the wafer are connected to the connection pattern 410 of the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. A warpage phenomenon of the printed circuit board 100, which may be generated, may be prevented.
  • the elastic pad 220 and the support block 210 may be fixed to each other by fixing means composed of protrusions and protrusion grooves into which the protrusions are fitted.
  • the protrusions may be formed on the bottom surface of the elastic pad 220
  • the protrusion grooves may be formed on the upper surface of the support block 210, or may be formed in the reverse direction.
  • a lattice-shaped scratch may be further formed on the upper surface of the elastic pad 220 and the upper and lower surfaces of the first rubber member 511.
  • the probe device configured as described above may be in contact with the wafer solder bumps to perform electrical inspection.
  • a wafer having a plurality of solder bumps formed on a bottom surface thereof may be seated on the main fixing part 300.
  • the solder bumps formed on the bottom surface of the wafer may be physically connected to the connection pattern 410 formed on the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. Therefore, the solder bumps and the connection pattern 410 may be in a state where they are energized with each other.
  • the bottom surface of the flexible circuit board 400 having the connection pattern 410 is in close contact with the elastic pad 200, the impact force generated when the wafer is seated on the main fixing part 300 is easy.
  • the flexible circuit board 400 may be prevented from being twisted on the upper surface of the elastic pad 220 due to the impact.
  • connection accuracy of the solder bumps and the connection pattern 410 may be improved.
  • the flexible circuit board 400 is tightly fixed between the hole 310 of the main fixing part 300 and the edge of the support part 200, and the lower end of the main fixing part 300 and the printed circuit board 100. Since the compression is fixed between the upper surface of the), the distortion inside the main fixing part 300 can be prevented due to multiple fixing forces.
  • both ends of the flexible circuit board 400 connected to the pair of electrode parts 101 formed on the upper surface of the printed circuit board 100 are elastic by the first rubber member 511 of the sub fixing part 510. Since it is compressed, both ends of the flexible circuit board 400 may also be easily prevented from being twisted.
  • the portion directly connected to the wafer (the flexible circuit board 400 having the connection pattern 410 exposed through the hole 310 of the main fixing part 300) and the flexible circuit board 400 Since both ends are easily crimped and fixed as described above, it is possible to provide a stable test environment in the case of performing the electrical test to enable a more precise electrical test.
  • a probe apparatus for a wafer solder bump according to a second embodiment of the present invention will be described.
  • FIG. 7 is an exploded perspective view showing a probe device for a wafer solder bump according to a second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 7.
  • FIG. 9 is an enlarged cross-sectional view showing a display symbol C of FIG. 8.
  • FIG. 10 is an enlarged cross-sectional view showing a display symbol D of FIG. 8.
  • the probe device according to the second embodiment has a printed circuit board 100.
  • a pair of electrode portions 101 are formed on both side portions of the bottom surface of the printed circuit board 100.
  • the pair of electrode portions 101 are positioned at the same distance from each other from the center of the printed circuit board 100.
  • main fixing part 300 and the supporting part 200 mentioned in the first embodiment are located on the upper surface of the central part of the printed circuit board 100.
  • the configuration of the main fixing part 300 and the support 200 may be the same as the configuration of the first embodiment.
  • the lower end of the support block 210 of the support 200 may also be fixed to the seating groove 110 formed in the printed circuit board 100 shown in FIG.
  • a pair of slit-shaped through holes 120 penetrating the top and bottom of the printed circuit board 100 are formed at both sides of the main fixing part 300.
  • Each of the through holes 120 is sandwiched and fixed between the main fixing part 300 and the supporting part 200, and protrudes from both sides of the main fixing part 300 through a lower end of the main fixing part 300.
  • the flexible circuit board 400 is inserted into and guides through.
  • both ends of the flexible circuit board 400 may pass through each of the pair of through holes 120 to protrude toward the bottom of the printed circuit board 100.
  • both ends of the flexible circuit board 400 protruding to the bottom portion of the printed circuit board 100 may be pressed and fixed through the sub fixing part 520 in each of the electrode parts 101 of the printed circuit board 100. have.
  • one end of the flexible circuit board 400 is connected to the electrode portion 101 formed on the bottom surface of the printed circuit board 100.
  • the second rubber member 521 of the sub fixing part 520 may be in close contact with the bottom of one end of the printed circuit board 100.
  • the second fixing block 522 of the sub fixing part 520 may press the second rubber member 521 in a state of being in close contact with the bottom surface of the second rubber member 521. It is fixed to the bottom part of 100). Therefore, one end of the flexible circuit board 400 may be fixed to the electrode unit 101 by compression.
  • fourth positioning holes 40 are formed in the second fixing block 522, and the fourth positioning holes are formed in the bottom portion of the printed circuit board 100.
  • Fourth positioning holes 41 are formed to coincide with the positions 40.
  • the fourth positioning pins 24 may be inserted into and fixed to the fourth and fourth 'positioning holes 40 and 41.
  • the fourth fixing pins 24 are inserted into and fixed to the fourth and fourth 'positioning holes 40 and 41, so that the sub fixing part 520 has one end of the flexible circuit board 400 as an electrode.
  • the part 101 can be fixed by compression.
  • a second reinforcement block 620 is further provided on the bottom of the printed circuit board 100.
  • Fifth positioning holes 50 are formed in the second reinforcement block 620, and a fifth position in which the bottom portion of the printed circuit board 100 coincides with the fifth positioning holes 50.
  • 'Positioning holes 51 are formed.
  • the fifth positioning pins 25 may be inserted into the fifth and fifth 'positioning holes 50 and 51. Therefore, the fifth reinforcing pins 25 are inserted into the fifth and fifth 'positioning holes 50 and 51 so that the second reinforcement block 620 is formed on the bottom surface of the printed circuit board 100.
  • the support part 200 and the bottom of the main fixing part 300 are fixedly installed.
  • connection pattern 410 of the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300 as the second reinforcement block 620 is installed.
  • a warpage phenomenon of the printed circuit board 100, which may be generated, may be prevented.
  • the flexible circuit board 400 may be crimped and fixed in multiple. That is, the flexible circuit board 400 is crimped and fixed by the elastic pad 220 in the main fixing part 300, and the inner surface of the hole 310 of the main fixing part 300 and the edge of the support part 200. It is tightly fixed between, and tightly fixed between the lower end of the main fixing part 300 and the upper surface of the printed circuit board 100, and penetrates through the through hole 120 to the bottom of the printed circuit board 100 to print In the state of being in close contact with the bottom surface of the circuit board 100 is pressed by the sub fixing part 520 in the electrode portion 101.
  • an elastic layer having a predetermined thickness may be further formed on the inner wall of the through hole 120.
  • the bottom edges of the through holes 120 may be bent at a predetermined curvature. Therefore, the outer surface of the flexible circuit board 400 may be protected by the elastic layer and the outer surface of the flexible circuit board 400 bent through the through hole 120 may be prevented through the bent portion. have.
  • the probe device configured as described above may be in contact with the wafer solder bumps to perform electrical inspection.
  • a wafer having a plurality of solder bumps formed on a bottom surface thereof may be seated on the main fixing part 300.
  • the solder bumps formed on the bottom surface of the wafer may be physically connected to the connection pattern 410 formed on the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. Therefore, the solder bumps and the connection pattern 410 may be in a state where they are energized with each other.
  • the flexible circuit board 400 on which the connection pattern 410 is formed is elastically contacted with the elastic pad 220, the impact force generated when the wafer is seated on the main fixing part 300 is easily absorbed. In addition, a phenomenon in which the flexible circuit board 400 is distorted due to the impact may be prevented. Therefore, the connection accuracy of the solder bumps and the connection pattern 410 may be improved.
  • the flexible circuit board 400 is tightly fixed between the hole 310 of the main fixing part 300 and the edge of the support part 200, and the lower end of the main fixing part 300 and the printed circuit board 100. Since the compression is fixed between the upper surface of the), the distortion inside the main fixing part 300 can be prevented due to multiple fixing forces.
  • both ends of the flexible circuit board 400 connected to the pair of electrode portions 101 formed on the bottom surface of the printed circuit board 100 may pass through the through holes 120 to the bottom surface portion of the printed circuit board 100. Since it is elastically compressed by the second rubber member 521 of the sub fixing part 520 in the penetrating state, both ends of the flexible circuit board 400 may also be easily prevented from twisting.
  • both ends of the flexible circuit board 400 are connected to the electrode unit 101 through the bottom surface of the printed circuit board 100, both ends of the electrode unit 101 and the flexible circuit board 400 are connected to the printed circuit board. It may not be exposed to the upper surface of the (100). Accordingly, the foreign matter can be prevented from being easily caught between the electrode portion 101 and both ends of the flexible circuit board 400, thereby preventing the deterioration of electrical characteristics due to the foreign matter.
  • the portion directly connected to the wafer (the flexible circuit board 400 having the connection pattern 410 exposed through the hole 310 of the main fixing part 300) and the flexible circuit board 400 Since both ends are easily pressed and fixed on the bottom of the printed circuit board 100 as described above, it is possible to provide a stable test environment in the case of performing the electrical test to enable a more precise electrical test.
  • the invention can be used in the field of development of probe devices for semiconductor testing.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne un appareil de sonde pour bosse de soudure de plaquette. L'appareil de sonde pour bosse de soudure de plaquette comprend : une unité de support montée sur une surface supérieure d'une carte de circuit imprimé ; une carte de circuit flexible possédant un motif de connexion connecté aux bosses de soudure formées sur une plaquette, ayant une longueur prédéterminée, et une surface inférieure montée sur une surface supérieure de l'unité de support avec les deux extrémités connectées électriquement à des parties prédéterminées de la carte de circuit imprimé ; une unité de fixation principale disposée dans un pourtour de l'unité de support de manière à fixer la carte de circuit flexible étroitement sur une surface externe de l'unité de support ; et une sous-unité de fixation disposée sur la carte de circuit imprimé de manière à fixer étroitement les deux extrémités de la carte de circuit flexible par une force élastique. L'appareil de la présente invention évite ainsi toute distorsion des bosses de soudure et de la carte de circuit flexible, et empêche ainsi les défauts de connexion électrique de la plaquette lorsqu'un test électrique de la plaquette est effectué au moyen des bosses de soudure formées sur une surface inférieure de la plaquette.
PCT/KR2010/008877 2009-12-15 2010-12-13 Appareil de sonde pour bosse de soudure de plaquette WO2011074837A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0124547 2009-12-15
KR1020090124547A KR101108479B1 (ko) 2009-12-15 2009-12-15 웨이퍼 솔더 범프용 프로브 장치

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WO2011074837A2 true WO2011074837A2 (fr) 2011-06-23
WO2011074837A3 WO2011074837A3 (fr) 2011-11-10

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Families Citing this family (2)

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KR101189649B1 (ko) 2012-04-25 2012-10-12 주식회사 프로이천 필름타입 프로브카드
CN106679433A (zh) * 2016-12-24 2017-05-17 信宜市翔胜家电科技有限公司 陶炉与电路板的固定结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005140677A (ja) * 2003-11-07 2005-06-02 Japan Electronic Materials Corp プローブシート及びこれを用いたプローブシートユニット
KR20090017385A (ko) * 2007-12-06 2009-02-18 주식회사 파이컴 전기 검사 장치
KR20090019384A (ko) * 2007-08-21 2009-02-25 주식회사 세지 반도체 웨이퍼 검사용 프로브카드

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0883825A (ja) * 1994-09-09 1996-03-26 Tokyo Electron Ltd プローブ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005140677A (ja) * 2003-11-07 2005-06-02 Japan Electronic Materials Corp プローブシート及びこれを用いたプローブシートユニット
KR20090019384A (ko) * 2007-08-21 2009-02-25 주식회사 세지 반도체 웨이퍼 검사용 프로브카드
KR20090017385A (ko) * 2007-12-06 2009-02-18 주식회사 파이컴 전기 검사 장치

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KR20110067797A (ko) 2011-06-22
WO2011074837A3 (fr) 2011-11-10
KR101108479B1 (ko) 2012-01-31

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