WO2011074837A3 - Appareil de sonde pour bosse de soudure de plaquette - Google Patents

Appareil de sonde pour bosse de soudure de plaquette Download PDF

Info

Publication number
WO2011074837A3
WO2011074837A3 PCT/KR2010/008877 KR2010008877W WO2011074837A3 WO 2011074837 A3 WO2011074837 A3 WO 2011074837A3 KR 2010008877 W KR2010008877 W KR 2010008877W WO 2011074837 A3 WO2011074837 A3 WO 2011074837A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
wafer
support unit
flexible circuit
probe apparatus
Prior art date
Application number
PCT/KR2010/008877
Other languages
English (en)
Korean (ko)
Other versions
WO2011074837A2 (fr
Inventor
임이빈
허남중
조준수
Original Assignee
주식회사 프로이천
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 프로이천 filed Critical 주식회사 프로이천
Publication of WO2011074837A2 publication Critical patent/WO2011074837A2/fr
Publication of WO2011074837A3 publication Critical patent/WO2011074837A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne un appareil de sonde pour bosse de soudure de plaquette. L'appareil de sonde pour bosse de soudure de plaquette comprend : une unité de support montée sur une surface supérieure d'une carte de circuit imprimé ; une carte de circuit flexible possédant un motif de connexion connecté aux bosses de soudure formées sur une plaquette, ayant une longueur prédéterminée, et une surface inférieure montée sur une surface supérieure de l'unité de support avec les deux extrémités connectées électriquement à des parties prédéterminées de la carte de circuit imprimé ; une unité de fixation principale disposée dans un pourtour de l'unité de support de manière à fixer la carte de circuit flexible étroitement sur une surface externe de l'unité de support ; et une sous-unité de fixation disposée sur la carte de circuit imprimé de manière à fixer étroitement les deux extrémités de la carte de circuit flexible par une force élastique. L'appareil de la présente invention évite ainsi toute distorsion des bosses de soudure et de la carte de circuit flexible, et empêche ainsi les défauts de connexion électrique de la plaquette lorsqu'un test électrique de la plaquette est effectué au moyen des bosses de soudure formées sur une surface inférieure de la plaquette.
PCT/KR2010/008877 2009-12-15 2010-12-13 Appareil de sonde pour bosse de soudure de plaquette WO2011074837A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0124547 2009-12-15
KR1020090124547A KR101108479B1 (ko) 2009-12-15 2009-12-15 웨이퍼 솔더 범프용 프로브 장치

Publications (2)

Publication Number Publication Date
WO2011074837A2 WO2011074837A2 (fr) 2011-06-23
WO2011074837A3 true WO2011074837A3 (fr) 2011-11-10

Family

ID=44167841

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008877 WO2011074837A2 (fr) 2009-12-15 2010-12-13 Appareil de sonde pour bosse de soudure de plaquette

Country Status (2)

Country Link
KR (1) KR101108479B1 (fr)
WO (1) WO2011074837A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101189649B1 (ko) 2012-04-25 2012-10-12 주식회사 프로이천 필름타입 프로브카드
CN106679433A (zh) * 2016-12-24 2017-05-17 信宜市翔胜家电科技有限公司 陶炉与电路板的固定结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0883825A (ja) * 1994-09-09 1996-03-26 Tokyo Electron Ltd プローブ装置
JP2005140677A (ja) * 2003-11-07 2005-06-02 Japan Electronic Materials Corp プローブシート及びこれを用いたプローブシートユニット
KR20090017385A (ko) * 2007-12-06 2009-02-18 주식회사 파이컴 전기 검사 장치
KR20090019384A (ko) * 2007-08-21 2009-02-25 주식회사 세지 반도체 웨이퍼 검사용 프로브카드

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0883825A (ja) * 1994-09-09 1996-03-26 Tokyo Electron Ltd プローブ装置
JP2005140677A (ja) * 2003-11-07 2005-06-02 Japan Electronic Materials Corp プローブシート及びこれを用いたプローブシートユニット
KR20090019384A (ko) * 2007-08-21 2009-02-25 주식회사 세지 반도체 웨이퍼 검사용 프로브카드
KR20090017385A (ko) * 2007-12-06 2009-02-18 주식회사 파이컴 전기 검사 장치

Also Published As

Publication number Publication date
KR101108479B1 (ko) 2012-01-31
KR20110067797A (ko) 2011-06-22
WO2011074837A2 (fr) 2011-06-23

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