WO2023153556A1 - Tête de sonde de type précharge - Google Patents

Tête de sonde de type précharge Download PDF

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Publication number
WO2023153556A1
WO2023153556A1 PCT/KR2022/004443 KR2022004443W WO2023153556A1 WO 2023153556 A1 WO2023153556 A1 WO 2023153556A1 KR 2022004443 W KR2022004443 W KR 2022004443W WO 2023153556 A1 WO2023153556 A1 WO 2023153556A1
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WO
WIPO (PCT)
Prior art keywords
guide film
open area
block
probe head
probe
Prior art date
Application number
PCT/KR2022/004443
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English (en)
Korean (ko)
Inventor
안승배
주영훈
Original Assignee
(주)티에스이
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Filing date
Publication date
Application filed by (주)티에스이 filed Critical (주)티에스이
Publication of WO2023153556A1 publication Critical patent/WO2023153556A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Definitions

  • the present invention relates to a probe head for testing a semiconductor device, and more particularly to a preloaded probe head that alleviates the shock received by a block by forming an elastic space by introducing a guide film having an open area formed on the upper part of the block.
  • a manufacturing process of a semiconductor device includes a patterning process for manufacturing semiconductor elements, an electrical die sorting (EDS) process for electrically testing them to determine whether or not they are defective, and an assembly process for integrating each semiconductor element on a wafer. there is.
  • EDS electrical die sorting
  • the EDS process is a process of supplying an inspection current to each semiconductor element and examining an electrical signal output therefrom to determine whether or not it is defective. A probe that electrically contacts each semiconductor element to test its performance. The device is widely used.
  • probe devices include a tester that supplies test current and tests and analyzes the resulting signal, a probe card that electrically connects the test object (semiconductor device) and the tester, and the test object and the probe card. It consists of a probe (probe) that is in direct contact with the printed circuit board of the.
  • the probe is provided in a probe head structure in which a plurality of probes are accommodated and assembled to ensure stable contact while maintaining appropriate contact resistance between an object to be inspected and a probe card, and to ensure durability even during multiple tests.
  • the probe head is composed of a probe and a block in which the probe is accommodated and assembled, and the first and second ends of the probe are accommodated so as to protrude outward from the first and second surfaces of the block to form the printed circuit board.
  • the substrate and the contact terminal of the semiconductor element are electrically contacted with appropriate pressure, respectively.
  • Coupling holes are formed in the block at pitch intervals corresponding to the contact terminals of the semiconductor device to be tested, the probe is accommodated and assembled in the coupling hole, and the probe slides inside the coupling hole by a predetermined pressure during the test. formed into a structure
  • the block includes an upper plate supporting the upper side of the probe and a lower plate supporting the lower side of the probe, and the upper plate and the lower plate are spaced apart from each other by a predetermined distance to stably support the probe.
  • the probe 10 is tested while repeatedly sliding up and down inside the coupling hole 21 formed in the block 20 of the probe head.
  • a stopper 11 is formed on the upper side of the probe 10 to prevent unauthorized departure from the lower side of the coupling hole 21 .
  • the flatness of a printed circuit board is 30 ⁇ m to 50 ⁇ m, and according to this flatness, the impact applied to the block or the upper plate by the plurality of stoppers in a specific area is further increased, and the test is There is a problem in that breakage of blocks or the like in the area occurs more easily during repeated execution.
  • An object of the present invention is to provide a preloaded probe head that alleviates the shock received by a block by forming an elastic space by introducing a guide film having an open area formed on the upper part of the block.
  • the present invention provides a probe head for testing a semiconductor device, which includes a probe having a stopper, and a block having a coupling hole to which the probe is coupled, and an open area on top of the block to expose the coupling hole.
  • a guide film is formed, and the lower part of the open area is formed relatively wider than the upper part to provide an elastic space between the probe stopper and the block by the guide film.
  • the guide film is preferably formed of a single layer or a plurality of layers.
  • guide films each having an open area are stacked to expose the coupling hole on the upper part of the block, and at least one of the guide films stacked on the upper part of the block is formed of the open area. It is preferable that the size is formed larger than the size of the coupling hole.
  • the guide film includes a first guide film having a first open area including an area where the coupling hole is formed and an area where the stopper is formed, and is formed on the first guide film and includes only the area where the coupling hole is formed. It is provided with a second guide film formed with a second open area, wherein the first open area and the second open area are overlapped around the coupling hole, and the area of the first guide film on which the stopper is formed. It is preferable to provide the elastic space by the first open area including a.
  • the open area of the guide film formed on the uppermost layer from the block has an open area most similar to the size of the coupling hole.
  • the guide film is preferably formed of a plurality of combinations of the first guide film and the second guide film.
  • the second guide film preferably has a buffer part formed in an area connected to or adjacent to the second open area and formed with the stopper, and the buffer part has the second open area as a center in a first direction or in a second direction. direction, or formed by cutting in the first and second directions.
  • the buffer part may be radially formed around the second open area.
  • the size of the elastic space is equal to or greater than that of the pressing portion of the stopper.
  • the guide film is preferably formed of a polymer substrate or a coating layer of a polymer material.
  • the polymer substrate is made of polyimide, polycarbonate (PC), polyethylenenaphthalate (PEN), polyacrylate, polyvinylalcohol, polyethylene terephthalate , PET), polyethersulfone (PES), or any one or a combination of two or more may be used.
  • the open area may be formed by laser processing, and the formation of the open area is performed by layering the guide film on top of the block and then laser processing to form the bonding hole. It may be performed at the same time as the forming process, or after forming the open area by laser processing, a guide film may be post-laminated on top of the block.
  • the polymer substrate is coupled to the upper portion of the block by a fixing member, or the polymer substrate has an adhesive layer on the bonding surface so that the upper portion of the block and the polymer substrate can be adhered to each other. may be formed.
  • photoresist may be used as the polymer material, and in this case, the open area may be formed by a photopatterning process after coating photoresist on top of the block.
  • the shape of the open area may be formed to correspond to the horizontal cross-sectional shape of the probe, and may be formed in any one of a circular shape, an elliptical shape, and a polygonal shape.
  • the block is formed of a structure including an upper plate having a first coupling hole and a lower plate spaced apart from the upper plate and having a second coupling hole formed thereon, or the upper plate and the lower plate are selectively provided in plurality. It can be formed into a structure formed of.
  • the guide film is formed on the upper plate to which the pressing force of the stopper is applied, and the open area is formed corresponding to the first coupling hole.
  • the present invention relates to a probe head for testing semiconductor devices, wherein a plurality of guide films are introduced on the top of a block to form an elastic space on the top of the block corresponding to the pressing part of the probe stopper so that the block is This is to mitigate the impact.
  • a guide film which is a flexible material, is introduced into the pressing part of the stopper to first absorb the impact force caused by the stopper, and secondly to stop by providing a preload space (buffer space) by the elastic space. It is possible to absorb the impact force caused by the fur, thereby minimizing the stress applied to the probe and the block, thereby improving the durability of the probe and block.
  • the present invention provides an elastic space in the pressing part of the probe to offset the flatness of the printed circuit board or the like in contact with the upper tip of the probe, thereby mitigating the probe card assembly tolerance, and It has the effect of further improving durability.
  • the height of the block is increased, and the length of the probe tip is increased, thereby extending the overall lifespan of the probe head.
  • the present invention has an effect of prolonging the life of a product and performing a more precise test by minimizing an impact force caused by a probe stopper that may occur during a semiconductor device test process.
  • FIG. 1 A schematic diagram of a conventional probe head.
  • FIG. 2 A schematic diagram of a probe head according to an embodiment of the present invention.
  • Figure 6 A schematic diagram showing a method of laminating a guide film according to the present invention on top of a block.
  • Figure 15 A schematic diagram showing the action state between the stopper and the guide film according to an embodiment of the present invention.
  • the present invention relates to a probe head for testing semiconductor devices, in which a guide film is introduced on top of a block to form an elastic space on the top of the block corresponding to a probe stopper to mitigate the shock received by the block during semiconductor device testing.
  • the impact force caused by the probe stopper that may occur during the semiconductor device test process is minimized to prolong the life of the product and perform more precise tests.
  • FIG. 2 is a schematic view of a probe head according to an embodiment of the present invention
  • FIGS. 3 to 5 are schematic views of a probe head according to another embodiment of the present invention
  • FIG. 6 is a block diagram of a guide film according to the present invention.
  • 7 to 14 are schematic diagrams showing various embodiments of the uppermost guide film according to the present invention
  • FIG. 15 shows the action state between the stopper and the guide film according to an embodiment of the present invention. It is also a model.
  • the probe head according to the present invention in the probe head for testing semiconductor devices, includes a probe 100 on which a stopper 110 is formed and a block on which a coupling hole 210 to which the probe 100 is coupled is formed. 200, and a guide film 300 having an open area 310 is formed on the top of the block 200 to expose the coupling hole 210, and the lower part of the open area 310 is formed on the upper part. It is formed relatively wide compared to , and provides an elastic space 400 by the guide film 300 between the probe stopper 110 and the block 200 .
  • the probe head according to the present invention is largely composed of the probe 100, the block 200, and the guide film 300, and the elastic space 400 created by them.
  • the probe 100 may be any probe 100 having any shape, function, and material for testing existing semiconductor devices, and the block 200 also stably fixes the probe 100 and the probe 100
  • the block 200 of any shape that can guarantee the flow space of is also free.
  • a coupling hole 210 for coupling the probe 100 is formed in the block 200, and thousands to tens of thousands of probes 100 can be coupled to one block 200, and the coupling hole ( 210) is also formed correspondingly.
  • the coupling hole ( 210) is also formed correspondingly.
  • description will be made in each figure, focusing on a state in which one probe 100 is coupled to the block 200.
  • a stopper is generally provided on one side of the probe 100 so that the probe 100 does not leave the lower side of the coupling hole 210 of the block 200 without permission.
  • the stopper 110 may be formed at any position of the probe 100, and is generally formed adjacent to the upper tip of the probe 100.
  • An embodiment of the present invention will also be described centering on the probe 100 having the stopper 110 formed adjacent to the upper tip, and in general, the probe 100 repeatedly slides up and down inside the coupling hole 210. while the test is performed.
  • the guide film 300 according to an embodiment of the present invention is formed as a single layer, and an open area 310 is formed on the top of the block 200 so that the coupling hole 210 is exposed, and the open area 310 is formed.
  • the lower portion of the region 310 is formed relatively wider than the upper portion to provide an elastic space 400 between the probe stopper 110 and the block 200 by the guide film 300 .
  • the open area 310 of the guide film 300 is formed in a step shape, and the lower portion of the open area 310 is formed between the area where the coupling hole 210 is formed and the area where the stopper 110 is formed. Including all of them, the upper part of the open area 310 includes only the area where the coupling hole 210 is formed, and the lower part of the open area 310 is formed relatively wider than the upper part, so that the probe stopper 110 ) And the elastic space 400 is provided between the block 200.
  • an open area ( 310) are stacked, and at least one of the guide films 300 stacked on top of the block 200 has the size of the open area 310 equal to the size of the coupling hole 210. It is characterized in that it is formed larger than.
  • a guide film 300 having an open area 310 formed thereon is stacked in multiple layers to expose the coupling hole 210 on the upper part of the block 200, Since the open areas 310 have different sizes, an elastic space 400 is provided between the block 200 and the guide film 300.
  • the size of the open area 310 is larger than the size of the coupling hole 210, so that the probe stopper 110 and the block It is to provide an elastic space (400) between (200).
  • an open area 310 is formed in the guide film 300 according to the present invention so that the coupling hole 210 can be exposed, and when stacked in two or more layers, at least one open area of the guide film 300 310 is formed larger than the size of the coupling hole 210, and the elastic space 400 is formed below the pressing part of the stopper 110 (the part where the stopper 110 presses the block) to stop the stop It is to provide a preload space (buffer space) capable of absorbing the impact force caused by the fur 110.
  • a preload space buffer space
  • the size of the coupling hole 210 may correspond to the width or diameter of the coupling hole 210.
  • the open area 310 formed larger than the size of the coupling hole 210 may be expanded in the direction in which the stopper 110 is formed to form a rectangular shape
  • the open area 310 formed larger than the size of the coupling hole 210 may be formed in an elliptical shape.
  • the open area 310 formed larger than the size of the coupling hole 210 is not limited to the shape as long as it can provide an elastic space 400 in a shape extending to the lower side of the stopper 110, and the probe 100 Corresponding to the shape of the horizontal cross section of the circular, elliptical, and polygonal shapes, or formed in various shapes such as stripe fine patterns, square fine patterns, and circular fine patterns according to the shape of the pressing part of the stopper 110 It can be.
  • the size of the elastic space 400 according to the present invention is at least equal to or larger than that of the pressing portion of the stopper 110, so that a sufficient preload space can be secured.
  • the first open area when the guide film 300 is formed in two layers (FIG. 3), the first open area includes an area where the coupling hole 210 is formed and an area where the stopper 110 is formed.
  • a first guide film 320 on which 321 is formed, and a second open area 331 formed on the first guide film 320 and including only the area where the coupling hole 210 is formed is formed. It is provided as a guide film 330, and the first open area 321 and the second open area 331 are overlappingly formed around the coupling hole 210, so that the first guide film 320
  • the elastic space 400 is provided by the first open area 321 including the area where the stopper 110 is formed.
  • the first open area 321 formed in the first guide film 320 includes the area where the coupling hole 210 and the stopper 110 are formed, it is formed larger than the size of the coupling hole 210, Since the second open area 331 formed in the second guide film 330 includes only the area where the coupling hole 210 is formed, the size is the same as or similar to the size of the coupling hole 210 .
  • the open area 310 of the guide film 300 formed on the uppermost layer from the block 200 is the first guide film 320 formed on the lower layer.
  • the open area 310 of the guide film 300 formed on the uppermost layer from the block 200 is the first guide film 320 formed on the lower layer.
  • it has an open area 310 most similar to the size of the coupling hole 210 .
  • the impact force caused by the uppermost guide film 300 can be absorbed first, and the impact force caused by the stopper 110 can be absorbed secondarily by the elastic space 400.
  • the guide film 300 may include a plurality of combinations of the first guide film 320 and the second guide film 330, but is not limited thereto, and the stop Guide films 300 having open areas 310 of various shapes and sizes may be stacked in multiple layers to provide an elastic space 400 capable of absorbing the impact force of the fur 110 .
  • FIGS. 2 to 4 shows a case where the block 200 is formed in a single shape
  • the embodiment of FIG. 5 shows a case where the block 200 is composed of an upper plate 220 and a lower plate 230. is shown.
  • the block 200 according to the present invention can be implemented in various ways.
  • the block 200 according to the embodiment of FIG. 5 is formed with an upper plate 220 having a first coupling hole 221, spaced apart from the upper plate 220, and a second coupling hole 231 formed thereon.
  • a lower plate 230 may be included, or a plurality of the upper plate 220 and the lower plate 230 may be selectively formed as needed.
  • one upper plate 220 and two lower plates 230 spaced apart from each other by the space necessary for the flow of the probe 100 are shown.
  • the stopper 110 contacts and presses the top of the top plate 220, so that an elastic space 400 is formed therebetween, and the first coupling hole is formed on the top of the top plate 220.
  • the guide film 300 having the open area 310 is provided.
  • the first guide film 320 formed with the first open area 321 including the area where the first coupling hole 221 is formed and the area where the stopper 110 is formed is placed on the top of the upper plate 220.
  • the first guide film 320 is laminated, and the second guide film 330 having the second open area 331 including only the area where the first coupling hole 221 is formed is laminated on the top of the first guide film 320 .
  • the present invention can be applied to blocks 200 of various shapes, and by forming an elastic space 400 in the pressing part with the probe stopper 110, the impact force by the stopper 110 can be absorbed. do.
  • FIG. 6 shows a method of stacking the guide film 300 according to the present invention on top of the block 200, and shows the guide film 300 made of two layers as an embodiment of the present invention.
  • the block (upper plate 220) 200 has a larger (first coupling hole 221) larger than the size of the coupling hole (first coupling hole 221) 210 formed and the stopper 110
  • An upper guide film (second guide film 330) formed with an open area (second open area 331) including only the formed area is stacked so as to overlap with the coupling hole (first coupling hole 221) as a center. .
  • FIG. 7 to 14 show various embodiments of the uppermost guide film according to the present invention.
  • the second open area 331 and the buffer part 332 formed on the second guide film 330 are shown.
  • the second open area 331 is formed in a quadrangular shape.
  • the size of the coupling hole is also quadrangular.
  • the buffer part 332 may be formed in various directions, such as a first direction, a second direction, a first direction and a second direction, with the second open area 331 as the center, and if necessary, a stripe pattern or a dot pattern. , can be formed in various ways such as circular or polygonal patterns.
  • the guide film 300 according to the present invention is made of a flexible material, and when the stopper 110 presses the upper part of the guide film 300 in the elastic space 400, the wave of the guide film 300 to the periphery. Varnish (waveness) is generated, and in this case, the durability of the product is hindered.
  • the buffer part 332 is to prevent such a problem, and prevents the guide film 300 from crying, deformation, or damage.
  • FIG. 8 to 11 show a case in which the buffer part 332 is formed in a cutout shape
  • FIG. 8 shows a line-shaped buffer part 332 connected to the second open area 331
  • FIG. 9 shows the second open area ( 331)
  • FIG. 10 shows a branch-shaped buffer unit 332 connected to the second open area 331.
  • the coupling hole may also be circular.
  • the buffer part 332 is formed by extending along the circumference of the probe, with the second open area 331 as the center.
  • the buffer portion 332 may be formed by radially cutting.
  • the 15 shows an action state between the stopper 110 and the guide film 300 when the buffer unit 332 is formed, and the second centering on the buffer unit 332 by the pressing force of the stopper 110.
  • the second guide film 330 does not cry or deform even when the stopper 110 presses it.
  • the user forms the buffer part 332 of various shapes in consideration of the shape of the probe, the shape of the coupling hole, the shape of the probe stopper or the shape of the pressing part, and the degree of pressing force to form the second guide film (top layer guide film). 330 is deformed or prevented from crying.
  • the guide film according to the present invention is formed of a flexible material that can absorb impact force to some extent without being damaged by elastically flowing in and out of the elastic space 400 by the pressing force of the stopper 110. It can be implemented as a polymer substrate or a coating layer of a polymer material.
  • the polymer substrate may be any material as long as it is electrically and chemically stable, flexible, and has excellent processability.
  • the open area 310 may be formed by laser processing.
  • the formation of the open area 310 may be performed simultaneously with the process of forming the coupling hole by laser processing after the guide film is stacked on top of the block 200 .
  • a guide film may be post-laminated on top of the block 200 .
  • the formation of the open area 310 of the guide film may be performed by laminating the guide film on the block 200, that is, the top of the upper plate 220, and then processing the bonding hole by using a laser.
  • the first guide film 320 is first laminated on the top of the block 200, and the first open area 321 is formed while processing the coupling hole using a laser, and then the second guide film 330 After stacking ), the second open area 331 may be formed using a laser. If necessary, the second open area 331 of the second guide film 330 may be separately formed and then laminated on the first guide film 320 .
  • first open area 321 of the first guide film 320 by laser processing and forming the second open area 331 of the second guide film 330, respectively, they are sequentially formed. After stacking on top of the block 200 or stacking the first guide film 320 and the second guide film 330, the first open area 321 and the second open area ( 331) may be formed and stacked on top of the block 200.
  • the open area 310 of the guide film may be formed by various well-known patterning processes (wet or dry), which may be opened after the stacking layer depending on the physical properties of the guide film or the shape of the open area 310. After the formation of the region 310 or the formation of the open region 310, post-lamination may be selected and performed.
  • the polymer substrate is coupled to the top of the block 200 by a fixing member, or the polymer substrate is attached to a bonding surface so that it can be adhered between the top of the block 200 and the polymer substrate.
  • An adhesive layer may be formed.
  • the fixing member may be variously employed, such as a screw, a jig, or a clutch.
  • the effect of increasing the height of the block 200 is manifested, thereby increasing the length of the probe tip to extend the overall lifespan of the probe head. do. That is, when the probe tip is worn, the effect of extending the probe tip may be expressed by removing the guide film.
  • the guide film may be formed in two or more layers as needed.
  • the guide film according to the present invention may be formed of a coating layer of a polymer material, which uses a photoresist (PR) to coat the photoresist on top of the block 200 and then perform a photopatterning process. By doing so, a predetermined open area 310 is formed.
  • PR photoresist
  • the first guide film 320 and the second guide film 330 have different hardnesses by using different photoresists or adjusting the degree of curing by adjusting the curing time or energy during heat or ultraviolet curing. It is also possible to form a guide film having.
  • the hardness of the second guide film 330 is lower than that of the first guide film 320 so that the impact force of the stopper 110 can be better absorbed by the second guide film 330
  • the first guide film 320 may support the elastic space 400 .
  • the open area 310 may be formed by a pre-lamination or post-lamination method of a guide film on the upper part of the block 200 in combination with the aforementioned laser processing process, wet or dry etching process, and the like.
  • the present invention relates to a probe head for testing a semiconductor device, wherein a plurality of guide films are introduced on an upper portion of a block to form an elastic space on the upper portion of the block corresponding to the pressing portion of the probe stopper, thereby performing the probe head in a semiconductor device test process. This is to mitigate the impact of the block.
  • a guide film which is a flexible material, is introduced into the pressing part of the stopper to first absorb the impact force caused by the stopper, and secondly to stop by providing a preload space (buffer space) by the elastic space. It is possible to absorb the impact force caused by the fur, thereby minimizing the stress applied to the probe and the block, thereby improving the durability of the probe and block.
  • the present invention provides an elastic space in the pressing part of the probe to offset the flatness of the printed circuit board that is in contact with the upper tip of the probe, thereby alleviating the probe card assembly tolerance and durability of the probe and block. can be further improved.
  • the length of the probe tip can be increased by increasing the height of the block, thereby extending the overall lifetime of the probe head.
  • the present invention minimizes the impact force caused by the probe stopper that may occur during a semiconductor device test process, thereby prolonging the life of the product and performing a more precise test.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne une tête de sonde pour tester des éléments semi-conducteurs, la caractéristique technique centrale étant une tête de sonde de type précharge comprenant : une sonde avec une butée ; et un bloc avec un orifice d'accouplement pour accoupler la sonde, un film de guidage avec une zone ouverte pour exposer l'orifice d'accouplement étant fourni sur le dessus du bloc, et une partie inférieure sous la zone ouverte étant formée pour être large par rapport à la partie supérieure afin de fournir une zone flexible, grâce au film de guidage, entre la butée de la sonde et le bloc. En conséquence, les multiples films de guidage placés sur le dessus du bloc forment sur celui-ci des espaces flexibles qui correspondent à la partie pressée de la butée de la sonde, ce qui présente l'avantage de réduire l'impact reçu par le bloc pendant le test de l'élément semi-conducteur.
PCT/KR2022/004443 2022-02-11 2022-03-29 Tête de sonde de type précharge WO2023153556A1 (fr)

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WO2021023739A1 (fr) * 2019-08-07 2021-02-11 Technoprobe S.P.A. Tête de sonde destinée à des dispositifs électroniques et carte sonde correspondante
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JP2013148500A (ja) * 2012-01-20 2013-08-01 Murata Mfg Co Ltd 電子部品特性測定用治具
KR20150031371A (ko) * 2013-09-13 2015-03-24 한국기계연구원 프로브 모듈 및 프로브 모듈의 제조 방법
KR20170092523A (ko) * 2014-12-04 2017-08-11 테크노프로브 에스.피.에이. 수직형 프로브들을 포함하는 테스트 헤드
WO2021023739A1 (fr) * 2019-08-07 2021-02-11 Technoprobe S.P.A. Tête de sonde destinée à des dispositifs électroniques et carte sonde correspondante
KR20210119814A (ko) * 2020-03-25 2021-10-06 (주)포인트엔지니어링 프로브 헤드 및 이를 구비하는 프로브 카드

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