WO2023162175A1 - 非可逆回路 - Google Patents

非可逆回路 Download PDF

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Publication number
WO2023162175A1
WO2023162175A1 PCT/JP2022/008016 JP2022008016W WO2023162175A1 WO 2023162175 A1 WO2023162175 A1 WO 2023162175A1 JP 2022008016 W JP2022008016 W JP 2022008016W WO 2023162175 A1 WO2023162175 A1 WO 2023162175A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground conductor
conductor
main surface
dielectric substrate
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/008016
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
毅 大島
勇太 杉山
晃洋 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to GB2411122.1A priority Critical patent/GB2633206B/en
Priority to JP2024501091A priority patent/JP7490158B2/ja
Priority to PCT/JP2022/008016 priority patent/WO2023162175A1/ja
Publication of WO2023162175A1 publication Critical patent/WO2023162175A1/ja
Priority to US18/783,137 priority patent/US12609430B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/36—Isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/387—Strip line circulators

Definitions

  • the present disclosure relates to non-reciprocal circuits.
  • Non-reciprocal circuits such as circulators and isolators are used in transmission/reception circuits of communication equipment.
  • Non-reciprocal circuits generally have frequency characteristics that transmit high-frequency signals in the transmission direction with little attenuation and greatly attenuate high-frequency signals in the opposite direction.
  • Patent Literature 1 describes a non-reciprocal circuit in which a through hole is provided in a dielectric substrate and a permanent magnet is arranged inside the through hole, thereby making it possible to reduce the thickness and cost.
  • the present disclosure is intended to solve the above problems, and aims to obtain a non-reciprocal circuit that can operate over a wide frequency band without degrading the strength of the dielectric substrate.
  • a nonreciprocal circuit includes a magnetic substrate having a first main surface and a second main surface opposite to the first main surface, and a first ground conductor provided in the second main surface of the magnetic substrate; a central conductor provided on the second main surface of the magnetic substrate; one input/output terminal, a second ground conductor provided on the second main surface of the magnetic substrate, and a conductor connecting portion electrically connecting the first ground conductor and the second ground conductor.
  • the thickness of the second permanent magnet is thinner than the height of the first metal connection and the height of the second metal connection, when providing the second permanent magnet on the dielectric substrate Moreover, no hole is required for arranging the second permanent magnet. Therefore, the strength of the dielectric substrate is not degraded.
  • the surface of the second permanent magnet facing the dielectric substrate has a sufficient area to apply a uniform bias magnetic field to the center conductor. can do.
  • the cavity formed in the non-reciprocal circuit 1 can be made smaller than the propagation wavelength of the high frequency signal, the cavity resonance shifts to higher frequencies. This allows the non-reciprocal circuit according to the present disclosure to operate over a wide frequency band without degrading the strength of the dielectric substrate.
  • FIG. 1 is a longitudinal sectional view showing the configuration of a non-reciprocal circuit according to Embodiment 1; FIG. It is a top view which shows the 1st main surface of a magnetic substrate.
  • FIG. 4 is a plan view showing the second main surface of the magnetic substrate;
  • FIG. 4 is a plan view showing the second main surface of the magnetic substrate on which solder connections are arranged;
  • FIG. 4 is a plan view showing a third main surface of a dielectric substrate;
  • 1 is a plan view showing a non-reciprocal circuit according to Embodiment 1;
  • FIG. FIG. 10 is a longitudinal sectional view showing the configuration of a non-reciprocal circuit according to Embodiment 2;
  • FIG. 8 is a plan view showing a non-reciprocal circuit according to Embodiment 2;
  • FIG. 1 is a longitudinal sectional view showing the configuration of a non-reciprocal circuit 1 according to Embodiment 1.
  • FIG. FIG. 2 is a plan view showing the first main surface of the magnetic substrate 21, showing the first main surface of the magnetic substrate 21 excluding the permanent magnets 27a.
  • FIG. 3 is a plan view showing the second main surface of the magnetic substrate 21, showing the second main surface of the magnetic substrate 21 excluding the permanent magnet 27b, the solder connection portions 36a, 36b, 36c and 41.
  • a non-reciprocal circuit 1 includes a non-reciprocal circuit element 2 and a dielectric substrate 3.
  • a nonreciprocal circuit element 2 is mounted on a dielectric substrate 3 .
  • the nonreciprocal circuit element 2 includes a magnetic substrate 21, ground conductors 22a and 22b, a center conductor 23, input/output terminals 24a, 24b and 24c, and a plurality of It has through holes 25, permanent magnets 27a, and permanent magnets 27b.
  • the magnetic substrate 21 is a magnetic substrate having a first principal surface and a second principal surface opposite to the first principal surface.
  • the ground conductor 22 a is a first ground conductor provided on the first main surface of the magnetic substrate 21 .
  • the ground conductor 22 a is a conductor pattern uniformly formed on the first main surface of the magnetic substrate 21 .
  • the ground conductor 22 b is a second ground conductor provided on the second main surface of the magnetic substrate 21 .
  • the ground conductor 22b is a conductor pattern provided on the second main surface of the magnetic substrate 21 around a central conductor 23 integrally formed with input/output terminals 24a, 24b and 24c. is.
  • the central conductor 23 is a circular conductor provided on the second main surface of the magnetic substrate 21, and is a conductor through which a high-frequency signal in the working frequency band propagates.
  • the input/output terminals 24 a , 24 b and 24 c are a plurality of first input/output terminals electrically connected to the central conductor 23 on the second main surface of the magnetic substrate 21 .
  • the input/output terminals 24a, 24b and 24c are transmission lines radially extending from the central conductor 23, as shown in FIG.
  • a plurality of through-holes 25 are provided in the magnetic substrate 21 at intervals of less than half the propagation wavelength of the frequency band used, and penetrate the magnetic substrate 21 to electrically connect the ground conductors 22a and 22b. It is a first conductor connection portion for connecting.
  • the plurality of through-holes 25 are spaced apart by half or less of the propagation wavelength of the frequency band used, as shown in FIGS. It is provided so as to surround the conductor 23 .
  • the permanent magnet 27a is a first permanent magnet provided facing the permanent magnet 27b with the magnetic substrate 21 interposed therebetween.
  • a permanent magnet 27a is fixed on the ground conductor 22a using an adhesive 28 .
  • the permanent magnet 27b is a second permanent magnet that faces the permanent magnet 27a with the magnetic substrate 21 interposed therebetween.
  • the permanent magnet 27b is fixed on the center conductor 23 by an adhesive 28.
  • the thickness of the permanent magnet 27b is thinner than the height of the solder joints 36a, 36b, 36c and 41, as shown in FIG.
  • the area of the permanent magnet 27b is large enough not to contact the input/output terminals 24a, 24b and 24c and the input/output terminals 31a, 31b and 31c.
  • For the permanent magnets 27a and 27b for example, samarium-cobalt magnets with excellent heat resistance are used.
  • the central conductor 23 is arranged between the permanent magnets 27a and 27b.
  • FIG. 4 is a plan view showing the second main surface of the magnetic substrate 21 on which the solder connections 36a, 36b, 36c and 41 are arranged.
  • FIG. 5 is a plan view showing the third main surface of the dielectric substrate 3, showing the third main surface of the dielectric substrate 3 excluding the non-reciprocal circuit element 2.
  • FIG. 6 is a plan view showing the non-reciprocal circuit 1, showing the structure of the non-reciprocal circuit 1 viewed from the non-reciprocal circuit element 2 side. 1 and 5, the dielectric substrate 3 includes a multilayer substrate 30, a ground conductor 32a, a ground conductor 32b, a ground conductor removed portion 40, input/output terminals 31a, 31b and 31c, and signal conductors. 33a, 33b and 33c; via holes 34a, 34b and 34c; a plurality of through holes 35;
  • the dielectric substrate 3 is a multi-layer substrate 30 having a third main surface and a fourth main surface opposite to the third main surface, and having a laminated dielectric structure.
  • Ground conductor 32 a is a third ground conductor provided on the third main surface of dielectric substrate 3 . As shown in FIG. 5, the ground conductor 32a surrounds the input/output terminals 31a, 31b and 31c, the signal conductors 33a, 33b and 33c, and the ground conductor removed portion 40. It is a conductor pattern formed on the main surface.
  • the ground conductor 32b is a fourth ground conductor provided on the fourth main surface of the dielectric substrate 3, and is a conductor pattern uniformly formed on the fourth main surface of the dielectric substrate 3. .
  • the ground conductor removed portion 40 is a portion obtained by removing a part of the ground conductor 32a provided on the third main surface of the dielectric substrate 3 . As shown in FIG. 5, the ground conductor removed portion 40 is a portion where the conductor pattern of the ground conductor 32a is not formed and the dielectric of the dielectric substrate 3 is exposed in a circular shape.
  • Input/output terminals 31a, 31b and 31c are provided on the third main surface of dielectric substrate 3, as shown in FIGS. A plurality of second input/output terminals electrically connected to 24a, 24b and 24c, respectively.
  • Signal conductors 33a, 33b and 33c are provided in the inner layer (inside) of multilayer substrate 30, as shown in FIGS. They are electrically connected to each other.
  • Signal conductors 33 a , 33 b and 33 c are formed in the inner layers of multilayer substrate 30 . Therefore, in FIG. 5, the signal conductors 33a, 33b and 33c are indicated by broken lines to distinguish them from the components on the third main surface of the dielectric substrate.
  • the plurality of through holes 35 are second conductor connecting portions that penetrate the dielectric substrate 3 and electrically connect the ground conductors 32a and 32b. As shown in FIG. 5, the plurality of through-holes 35 are provided on the third main surface of the dielectric substrate 3 at intervals equal to or less than half the propagation wavelength of the operating frequency band.
  • the non-reciprocal circuit element 2 is mounted on the dielectric substrate 3 using the second main surface of the magnetic substrate 21 as a mounting surface. With the non-reciprocal circuit element 2 arranged on the third main surface of the dielectric substrate 3 , the permanent magnet 27 b is positioned above the ground conductor removed portion 40 formed on the third main surface of the dielectric substrate 3 . placed in A plurality of solder balls are arranged between the non-reciprocal circuit element 2 and the dielectric substrate 3 when manufacturing the non-reciprocal circuit 1 . Specifically, a plurality of solder balls are arranged between input/output terminals 24a, 24b and 24c and input/output terminals 31a, 31b and 31c. Furthermore, a plurality of solder balls are arranged so as to surround a central conductor 23 integrally formed with input/output terminals 24a, 24b and 24c between ground conductors 22b and 32a.
  • solder connections 36a, 36b and 36c are provided between the magnetic substrate 21 and the dielectric substrate 3 to connect the input/output terminals 24a, 24b and 24c to the input/output terminal 31a. , 31b and 31c.
  • the plurality of solder connection portions 41 are provided between the magnetic substrate 21 and the dielectric substrate 3, and are second metal connection portions that electrically connect the ground conductors 22b and 32a.
  • a cavity 50 is formed in a portion surrounded by a dashed line in FIGS. 1 and 5 .
  • the cavity 50 includes a plurality of through holes 35 arranged surrounding the ground conductor removed portion 40 of the dielectric substrate 3 and a ground conductor electrically connected through these through holes 35. It is composed of a cylindrical conductor wall made up of 32a and a ground conductor 32b, and a center conductor 23 arranged on top of this cylindrical conductor wall. Between the cylindrical conductor wall and the center conductor 23, there is a gap corresponding to the height of the solder joints 36a, 36b, 36c and 41.
  • the size of the cylindrical cavity 50 is set to a value smaller than the propagation wavelength at the high end of the operating frequency band in which the non-reciprocal circuit 1 operates.
  • the ground conductor removed portion 40 is a perfect circle, and the diameter of the cylindrical cavity 50 is D.
  • D the diameter of the cylindrical cavity 50
  • TM 010 resonance the lowest order resonance.
  • TM is an abbreviation for Transverse Magnetic.
  • the diameter D of the cavity 50 in the non-reciprocal circuit 1 is determined by the following formula (2) with respect to the propagation wavelength ⁇ h at the high end of the frequency band used for operating the non-reciprocal circuit 1. As shown, it is set to a value less than about 0.8 (about four fifths). By giving such a diameter D, in the non-reciprocal circuit 1, the frequency at which unwanted resonance occurs is shifted to the higher frequency side. D ⁇ 0.766 ⁇ h ⁇ 0.8 ⁇ h (2)
  • a bias magnetic field which is a DC magnetic field
  • Permanent magnets 27a and 27b apply a magnetic field only in one direction to magnetic substrate 21, so that high-frequency signals propagated through any of signal conductors 33a, 33b and 33c are transferred to input/output terminals 24a, 24b and 24c. output from an input/output terminal in a specific direction.
  • a high-frequency signal input to the input/output terminal 24a propagates through the central conductor 23 with little attenuation and is output from the input/output terminal 24b.
  • the high-frequency signal output from the input/output terminal 24c is greatly attenuated while propagating through the central conductor 23.
  • the high-frequency signal input to the input/output terminal 24b propagates through the central conductor 23 with little attenuation and is output from the input/output terminal 24c.
  • the high-frequency signal output from the input/output terminal 24a is greatly attenuated while propagating through the central conductor 23.
  • the high-frequency signal input to the input/output terminal 24c is propagated through the central conductor 23 with little attenuation and output from the input/output terminal 24a.
  • the high-frequency signal output from the input/output terminal 24b is greatly attenuated while propagating through the central conductor 23.
  • the non-reciprocal circuit 1 has the characteristic that it hardly attenuates the high-frequency signal in the transmission direction, but greatly attenuates the high-frequency signal in the reverse direction.
  • the non-reciprocal circuit 1 includes the magnetic substrate 21, the ground conductor 22a, the central conductor 23, the input/output terminals 24a, 24b and 24c, the ground conductor 22b, the through holes 25, a non-reciprocal circuit element 2 having a permanent magnet 27a and a permanent magnet 27b, input/output terminals 31a, 31b and 31c, a ground conductor 32a, a ground conductor removed portion 40, solder connections 36a, 36b, 36c and 41, the ground conductor removed portion 40 is disposed on the dielectric substrate 3 at a position facing the permanent magnet 27b, and the thickness of the permanent magnet 27b is equal to that of the solder connection portions 36a and 36b.
  • the non-reciprocal circuit 1 can operate over a wide frequency band without degrading the strength of the dielectric substrate 3 .
  • the ground conductor 22b is provided around the central conductor 23 of the magnetic substrate 21 .
  • a plurality of through holes 25 electrically connect the ground conductors 22a and 22b.
  • the ground conductor 32a is provided around the ground conductor removed portion 40 of the dielectric substrate 3 and around each of the input/output terminals 31a, 31b and 31c.
  • the solder connection portion 41 is provided around the central conductor 23 and electrically connects the ground conductor 22b and the ground conductor 32a.
  • the non-reciprocal circuit 1 includes signal conductors 33a, 33b and 33c provided in the inner layer of the dielectric substrate 3 and electrically connected to the input/output terminals 31a, 31b and 31c, respectively, and provided on the dielectric substrate 3. and a through hole 35 for electrically connecting the ground conductor 32a and the ground conductor 32b.
  • the cavity 50 formed in the non-reciprocal circuit 1 can be a cavity smaller than the propagation wavelength ⁇ h of the high frequency signal and the TM 010 resonance shifted to a higher frequency.
  • the ground conductor removed portion 40 has a circular shape, and the diameter of the ground conductor removed portion 40 is four fifths or less of the propagation wavelength of the operating frequency band. .
  • the cavity 50 formed in the nonreciprocal circuit 1 can be a cavity whose TM 010 resonance is shifted to a higher frequency than the propagation wavelength ⁇ h of the high frequency signal.
  • FIG. 7 is a longitudinal sectional view showing the configuration of a non-reciprocal circuit 1A according to the second embodiment.
  • FIG. 8 is a plan view showing the non-reciprocal circuit 1A, showing the structure of the non-reciprocal circuit 1A viewed from the side to which the magnetic substrate 21 is attached.
  • the nonreciprocal circuit 1A includes a nonreciprocal circuit element 2, a dielectric substrate 3, and a resin fixing portion 60.
  • the non-reciprocal circuit 1A is obtained by adding a resin fixing portion 60 to the non-reciprocal circuit 1.
  • FIG. The non-reciprocal circuit 1A operates in the same manner as the non-reciprocal circuit 1 does.
  • the resin fixing portion 60 is configured by filling a resin material so as to surround the end portion of the magnetic substrate 21 on the third main surface of the dielectric substrate 3 .
  • the resin fixing portion 60 fixes the magnetic substrate 21 to the dielectric substrate 3 by applying a liquid hardening resin to the side surface portion of the end portion of the magnetic substrate 21 and heating and hardening it.
  • the adhesion between the non-reciprocal circuit element 2 and the dielectric substrate 3 is strengthened by providing the resin fixing portion 60 .
  • the non-reciprocal circuit 1A is made of the resin material provided at the end portion of the magnetic substrate 21 in the dielectric substrate 3. It has a resin fixing part 60 fixed to the . Since the resin fixing portion 60 strengthens the adhesion between the non-reciprocal circuit element 2 and the dielectric substrate 3, the solder connection portions 36a, 36b, 36c and 41 are prevented from being damaged or missing due to thermal stress or vibration. reduced. As a result, the non-reciprocal circuit 1A is improved in durability and reliability.
  • a non-reciprocal circuit according to the present disclosure can be used, for example, as a circulator or isolator provided in communication equipment.

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  • Non-Reversible Transmitting Devices (AREA)
PCT/JP2022/008016 2022-02-25 2022-02-25 非可逆回路 Ceased WO2023162175A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB2411122.1A GB2633206B (en) 2022-02-25 2022-02-25 Non-reciprocal circuit
JP2024501091A JP7490158B2 (ja) 2022-02-25 2022-02-25 非可逆回路
PCT/JP2022/008016 WO2023162175A1 (ja) 2022-02-25 2022-02-25 非可逆回路
US18/783,137 US12609430B2 (en) 2022-02-25 2024-07-24 Non-reciprocal circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/008016 WO2023162175A1 (ja) 2022-02-25 2022-02-25 非可逆回路

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/783,137 Continuation US12609430B2 (en) 2022-02-25 2024-07-24 Non-reciprocal circuit

Publications (1)

Publication Number Publication Date
WO2023162175A1 true WO2023162175A1 (ja) 2023-08-31

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Application Number Title Priority Date Filing Date
PCT/JP2022/008016 Ceased WO2023162175A1 (ja) 2022-02-25 2022-02-25 非可逆回路

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US (1) US12609430B2 (https=)
JP (1) JP7490158B2 (https=)
GB (1) GB2633206B (https=)
WO (1) WO2023162175A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100026409A1 (en) * 2008-07-30 2010-02-04 Raytheon Company Low profile and compact surface mount circulator on ball grid array
JP2015080056A (ja) * 2013-10-16 2015-04-23 三菱電機株式会社 非可逆回路素子およびその製造方法
WO2015072252A1 (ja) * 2013-11-14 2015-05-21 株式会社村田製作所 非可逆回路素子
WO2021124375A1 (ja) * 2019-12-16 2021-06-24 三菱電機株式会社 非可逆回路

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9455486B2 (en) * 2013-07-03 2016-09-27 The Boeing Company Integrated circulator for phased arrays
EP3057173B1 (en) * 2013-10-11 2020-05-20 Mitsubishi Electric Corporation Non-reciprocal circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100026409A1 (en) * 2008-07-30 2010-02-04 Raytheon Company Low profile and compact surface mount circulator on ball grid array
JP2015080056A (ja) * 2013-10-16 2015-04-23 三菱電機株式会社 非可逆回路素子およびその製造方法
WO2015072252A1 (ja) * 2013-11-14 2015-05-21 株式会社村田製作所 非可逆回路素子
WO2021124375A1 (ja) * 2019-12-16 2021-06-24 三菱電機株式会社 非可逆回路

Also Published As

Publication number Publication date
JP7490158B2 (ja) 2024-05-24
GB2633206A (en) 2025-03-05
US20240380088A1 (en) 2024-11-14
GB202411122D0 (en) 2024-09-11
GB2633206B (en) 2025-09-24
JPWO2023162175A1 (https=) 2023-08-31
US12609430B2 (en) 2026-04-21

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