WO2023155411A1 - 半导体元件转运设备 - Google Patents

半导体元件转运设备 Download PDF

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Publication number
WO2023155411A1
WO2023155411A1 PCT/CN2022/115667 CN2022115667W WO2023155411A1 WO 2023155411 A1 WO2023155411 A1 WO 2023155411A1 CN 2022115667 W CN2022115667 W CN 2022115667W WO 2023155411 A1 WO2023155411 A1 WO 2023155411A1
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WIPO (PCT)
Prior art keywords
transfer
axis
module
driving mechanism
drive
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PCT/CN2022/115667
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English (en)
French (fr)
Inventor
赵凯
梁猛
林海涛
卢升
时威
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上海世禹精密机械有限公司
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Publication of WO2023155411A1 publication Critical patent/WO2023155411A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the technical field of workpiece transfer and transportation, in particular to a semiconductor element transfer device.
  • the existing semiconductor component transfer equipment cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs processing
  • the transportation period cannot guarantee the accuracy of the construction period, so a transfer device with an adsorption arm is designed for this.
  • the transit module includes:
  • the transfer box, the transfer box is located on one side of the flip module
  • Transfer box driving device the transfer box driving device is located at the bottom of the transfer box, used to drive the transfer box movement;
  • the fork picker which is located in the transfer box, is used to fork the workpiece
  • a fork lifter driving device the fork lifter drive device is arranged in the transfer box, the fork lifter drive device is connected with the fork lifter, and is used to drive the fork lifter to move;
  • the first conveyor belt, the first conveyor belt is arranged in the transfer box, and is used for conveying workpieces.
  • the transfer box driving device includes:
  • the first rotating mechanism, the first rotating mechanism is arranged at the bottom of the transfer box, and is used to drive the transfer box to rotate.
  • the transfer box drive device also includes:
  • a first Y-axis driving mechanism is arranged at the bottom of the rotating mechanism, and is used to drive the transfer box to move along the Y-axis;
  • the X-axis driving mechanism is arranged on the bottom of the first Y-axis driving mechanism, and is used to drive the transfer box to move along the X-axis;
  • the first Z-axis driving mechanism, the first Z-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism, and is used to drive the transfer box to move along the Z-axis.
  • the fork drive device includes:
  • a second Z-axis driving mechanism the second Z-axis driving mechanism is arranged in the transfer box, the output end of the second Z-axis driving mechanism is connected with the fork, and is used to drive the fork to move along the Z-axis;
  • the second Y-axis driving mechanism, the second Y-axis driving mechanism is arranged in the transfer box, the output end of the second Y-axis driving mechanism is connected with the second Z-axis driving mechanism, and is used to drive the fork to move along the Y-axis.
  • the transfer module also includes: a code reader connected to the transfer box.
  • the flipping module contains:
  • the frame body, the frame body is located on one side of the transfer module
  • a third Z-axis driving mechanism the third Z-axis driving mechanism is arranged on the frame body;
  • the docking box is arranged on the output end of the third Z-axis driving mechanism
  • the second conveyor belt, the second conveyor belt is arranged in the docking box, and is used for docking the workpieces transferred by the transfer module;
  • the linear module is connected to the output end of the third Z-axis drive mechanism
  • Jacking platform the jacking platform is set at the output end of the linear module, and a pair of electric stoppers are arranged on both sides of the jacking platform;
  • a pair of overturning mechanisms, one pair of overturning mechanisms are respectively arranged on both sides of the top of the frame body;
  • a pair of pneumatic grippers are respectively arranged at the output ends of a pair of turning mechanisms.
  • a grabbing and rotating module the grabbing and rotating module is arranged on one side of the turning module, and is used for grabbing and rotating the turned workpiece.
  • the grab rotation module contains:
  • the suction cup is set on the top of the turning module, and is used to absorb the turned workpiece;
  • the suction cup driving device is arranged on one side of the turning module, and the suction cup driving device is connected with the suction cup for driving the suction cup to move.
  • suction cup drive unit includes:
  • a fourth Z-axis driving mechanism is arranged on one side of the turning module, and is used to provide a driving force along the Z-axis;
  • the second rotation mechanism, the second rotation mechanism is arranged on the output end of the second Z-axis drive mechanism, and the output end of the second rotation mechanism is connected with the suction cup for driving the suction cup to rotate.
  • the semiconductor element transfer equipment of the embodiment of the present invention different positions of parts can be allocated according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, realize intelligent workpiece processing and transportation, without manual operation, transfer
  • the process is smooth, and the speed is fast and the efficiency is high, which can ensure the stability of the processing cycle and save labor costs.
  • the flip structure With the flip structure, the workpiece can be flipped during transfer and transportation, and the problem of flipping for special workpieces can be solved.
  • FIG. 1 is a schematic diagram of a first three-dimensional structure of a semiconductor device transfer device according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a second three-dimensional structure of a semiconductor device transfer device according to an embodiment of the present invention.
  • FIG. 3 is a schematic perspective view of a flipping module of a semiconductor component transfer device according to an embodiment of the present invention.
  • FIG. 4 is a schematic perspective view of a transfer module of a semiconductor device transfer device according to an embodiment of the present invention.
  • FIGS. 1-3 which is used for transfer and transfer of workpieces (such as PCB boards, wafers, etc.), and has a wide range of application scenarios.
  • the semiconductor element transfer equipment As shown in FIGS. 1 to 4 , the semiconductor element transfer equipment according to the embodiment of the present invention has a transfer module and an overturn module.
  • the transfer module is used to transfer and transport workpieces
  • the turning module is arranged on one side of the transfer module, and is used for docking and turning over the workpieces transferred by the transfer module.
  • the mutual cooperation of the transfer module and the turning module can realize the automatic conveying, docking and turning of the workpiece without manual operation.
  • the transfer process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs.
  • the transfer module includes: a transfer box 11, a drive device for the transfer box, a forklift 13, a drive device for the forklift, and a first conveyor belt 15.
  • the transfer box 11 is located on one side of the turning module, and the transfer box driving device is located at the bottom of the transfer box 11, which is used to drive the transfer box 11 to facilitate the position adjustment of the transfer box 11, so as to adapt to the docking of transfer modules in different positions , to improve flexibility
  • the fork taker 13 is located in the transfer box 11, and is used to fork the workpiece.
  • the fork picker 13 to move, so that the fork picker 13 can fork the workpiece, and place the forked workpiece on the first conveyor belt 15, the first conveyor belt 15 is arranged in the transfer box 11, For transporting workpieces.
  • the transfer box drive device includes: a first rotation mechanism 121, the first rotation mechanism 121 is arranged at the bottom of the transfer box 11 for driving the transfer box 11 Rotate to transport workpieces at different angles, which is more flexible and convenient.
  • the transfer box driving device further includes: a first Y-axis driving mechanism 122 , an X-axis driving mechanism 123 and a first Z-axis driving mechanism 124 .
  • the first Y-axis driving mechanism 122 is arranged at the bottom of the rotating mechanism.
  • the first Y-axis driving mechanism adopts a motor screw driving mechanism for driving the transfer box 11 to move along the Y-axis.
  • the X-axis driving mechanism 123 is arranged on the first Y-axis At the bottom of the driving mechanism 122, the X-axis driving mechanism 123 adopts a motor belt driving mechanism for driving the transfer box 11 to move along the X-axis.
  • the first Z-axis driving mechanism 124 is arranged at the bottom of the first Y-axis driving mechanism 122.
  • the first The Z-axis drive mechanism 124 adopts a motor screw drive mechanism to drive the transfer box 11 to move along the Z-axis.
  • the transfer box body 11 can adjust the position of the Y-axis, X-axis and Z-axis, so that it can be used in cooperation with the turning module.
  • the forklift drive device includes: a second Z-axis drive mechanism 141 and a second Y-axis drive mechanism 142 .
  • the second Z-axis drive mechanism 141 is arranged in the transfer box 11, the output end of the second Z-axis drive mechanism 141 is connected with the fork picker 13, and the second Z-axis drive mechanism 141 adopts a cylinder drive mechanism for driving the fork picker 13 moves along the Z-axis
  • the second Y-axis driving mechanism 142 is arranged in the transfer box 11, the output end of the second Y-axis driving mechanism 142 is connected with the second Z-axis driving mechanism 141, and the second Y-axis driving mechanism 142 adopts a motor
  • the screw drive mechanism is used to drive the fork lifter 13 to move along the Y-axis
  • the second Z-axis drive mechanism 141 can drive the fork lifter 13 to move along the Z-axis, so as to adjust to the height of the
  • the transfer module also includes: a code reader 16, which is connected to the transfer box 11, and the code reader 16 is used to read the code of the workpiece , identify the identification of the workpiece, and facilitate the recording and statistics of the workpiece.
  • a code reader 16 which is connected to the transfer box 11, and the code reader 16 is used to read the code of the workpiece , identify the identification of the workpiece, and facilitate the recording and statistics of the workpiece.
  • the overturning module includes: a frame body 21, a third Z-axis driving mechanism 22, a docking box 23, a second conveyor belt 24, a linear module 25, a jacking Platform 26 , a pair of turning mechanisms 27 and a pair of pneumatic grippers 28 .
  • the frame body 21 is located on one side of the transfer module, and the frame body 21 is used to play a supporting role.
  • the third Z-axis drive mechanism 22 is arranged on the frame body 21.
  • the third Z-axis drive mechanism 22 adopts a motor screw drive mechanism.
  • the docking box 23 is arranged on the output end of the third Z-axis driving mechanism 22, and the second conveyor belt 24 is arranged in the docking box 23 for
  • the linear module 25 is connected to the output end of the third Z-axis drive mechanism 22, and the linear module 25 is used to drive the jacking platform 26 to move up and down, that is, to move along the Z axis.
  • the jacking platform 26 is set on The output end of the linear module 25, the jacking platform 26 is used to place the workpiece, and a pair of electric stoppers 261 are arranged on both sides of the jacking platform 26.
  • the electric stoppers 261 are used to block the workpiece to prevent the workpiece from falling.
  • the pair of overturning mechanisms 27 are respectively arranged on both sides of the top of the frame body 21, and a pair of pneumatic grippers 28 are respectively arranged at the output ends of the pair of overturning mechanisms 27. Drive a pair of pneumatic clamping jaws 28 to turn over, thereby drive the workpiece to turn over.
  • the semiconductor element transfer equipment of the embodiment of the present invention further includes: a grasping and rotating module, which is arranged on one side of the turning module, for The workpiece is grasped and rotated.
  • the grasping and rotating module includes: a suction cup 31 and a driving device for the suction cup 31 .
  • Suction cup 31 is arranged on the top of turning module, is used for absorbing the workpiece after turning over, and suction cup 31 driving device is arranged on one side of turning module, and sucking cup 31 driving device is connected with sucking cup 31, is used to drive sucking cup 31 to move, and sucking cup 31 can be opposite The workpiece is adsorbed.
  • the driving device for the suction cup 31 includes: a fourth Z-axis driving mechanism 321 and a second rotating mechanism 322 .
  • the fourth Z-axis driving mechanism 321 is arranged on one side of the turning module.
  • the fourth Z-axis driving mechanism 321 adopts a motor screw driving mechanism to provide a driving force along the Z-axis to make the sucker 31 move up and down.
  • the second rotating mechanism 322 is set at the output end of the second Z-axis driving mechanism 141 , the second rotating mechanism 322 adopts a motor driving mechanism, and the output end of the second rotating mechanism 322 is connected with the sucker 31 for driving the sucker 31 to rotate.
  • the first Y-axis drive mechanism 122, the X-axis drive mechanism 123, and the first Z-axis drive mechanism 124 cooperate with each other to drive the transfer box 11 to adjust the position of the X-axis, Y-axis, and Z-axis, so that the transfer
  • the box body 11 and the docking box body 23 are facing each other, and then the second Y-axis drive mechanism 142 drives the fork lifter 13 to advance to a suitable position and stops, and the second Z-axis drive mechanism 141 drives the fork lifter 13 to rise to a suitable height.
  • the workpiece is forked by the fork lifter 13, and then the second Y-axis drive mechanism 142 drives the fork lifter 13 to retreat and reset.
  • the code reader 16 When passing the code reader 16, the code reader 16 reads and records the workpiece, and then retreats and resets. After reaching the proper position, the fork lifter 13 is driven down by the second Z-axis drive mechanism 141, so that the workpiece falls on the first conveyor belt 15, and then the transfer box 11 is driven to rotate 180 degrees by the first rotation mechanism 121, at this time the first The first conveyor belt 15 and the second conveyor belt 24 run simultaneously, and the electric stopper 261 positioned at the rear end of the jacking platform 26 lies down to prevent the electric stopper 261 from interfering with the docking of the workpiece, then the first conveyor belt 15 transports the workpiece, and the second conveyor belt 24 butt the workpiece conveyed by the first conveyor belt 15, and place the workpiece in the docking box 23 on the jacking platform 26.
  • the jacking platform 26 is flush with the second conveyor belt 24, and then the jacking platform 26
  • the electric block 261 at the rear end stands up to block the workpiece, and then the jacking platform 26 is raised to the flip position through the linear module 25, and a pair of pneumatic grippers 28 grab and hold the workpiece on the jacking platform 26,
  • the third Z-axis driving mechanism 22 drives the docking box 23 and the linear module 25 down to a suitable position without blocking the overturning, and then a pair of overturning mechanisms 27 run to drive the workpiece to overturn.
  • the jacking platform 26 is lowered to the same height as the second conveyor belt 24, and the fourth Z-axis driving mechanism 321 drives the suction cup 31 to drop to a suitable position to suck the workpiece on the jacking platform 26 , then rise to a suitable height, drive the suction cup 31 to rotate through the second rotating mechanism 322, and then drive the workpiece to rotate, and transport the rotated workpiece to the next process. If there is no adsorption action, the jacking platform 26 will be lowered to the bottom. At this time, the workpiece falls onto the second conveyor belt 24, and the workpiece is transported to the next process by the second conveyor belt 24. In addition, in this case, according to the requirements of the subsequent process, different positions of each component can be allocated to achieve modularized transfer.
  • the semiconductor element transfer equipment according to the embodiment of the present invention has been described with reference to FIGS.
  • the workpiece is processed and transported without human operation.
  • the transfer process is smooth, fast, and efficient, which can ensure the stability of the processing cycle and save labor costs.
  • the flipping structure can realize the flipping of the workpiece during transfer, which solves the problem of special The problem that the workpiece needs to be flipped.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

本发明公开了一种半导体元件转运设备，可以实现智能化的工件加工输送，无需人为操作，中转过程流畅，且速度快、效率高，可以保证加工周期的稳定，并节省人工成本，且通过设有翻转结构，可以实现中转输送时工件的翻转，解决对于特殊工件需要翻转的问题。本发明可以根据后面工序的生产要求，来进行各零部件不同的位置分配，来达到模块化的中转转运，实现智能化的工件加工输送，无需人为操作，中转过程流畅，且速度快、效率高，可以保证加工周期的稳定，并节省人工成本，且通过设有翻转结构，可以实现中转输送时工件的翻转，解决对于特殊工件需要翻转的问题。

Description

半导体元件转运设备 技术领域
本发明涉及工件中转输送技术领域，特别涉及一种半导体元件转运设备。
背景技术
现有的半导体元件转运设备不能模块化去搭配满足不同工艺生产的需求，也不能使得车间可以做到完全自动化运转产品线，且洁净等级不满足更高的要求，影响产品的生产加工，延长加工运输的周期，无法保证工期的准确性，对此设计一种带吸附手臂的中转装置。
发明内容
根据本发明实施例，提供了一种
进一步，中转模块包含：
中转箱体，中转箱体位于翻转模块的一侧；
中转箱体驱动装置，中转箱体驱动装置位于中转箱体的底部，用于驱动中转箱体运动；
叉取器，叉取器位于中转箱体内，用于对工件进行叉取；
叉取器驱动装置，叉取器驱动装置设置在中转箱体内，叉取器驱动装置与叉取器相连，用于驱动叉取器运动；
第一输送带，第一输送带设置在中转箱体内，用于输送工件。
进一步，中转箱体驱动装置包含：
第一旋转机构，第一旋转机构设置在中转箱体的底部，用于驱动中转箱体旋转。
进一步，中转箱体驱动装置还包含：
第一Y轴驱动机构，第一Y轴驱动机构设置在旋转机构的底部，用于驱动中转箱体沿Y轴移动；
X轴驱动机构，X轴驱动机构设置在第一Y轴驱动机构的底部，用于驱 动中转箱体沿X轴移动；
第一Z轴驱动机构，第一Z轴驱动机构设置在第一Y轴驱动机构的底部，用于驱动中转箱体沿Z轴移动。
进一步，叉取器驱动装置包含：
第二Z轴驱动机构，第二Z轴驱动机构设置在中转箱体内，第二Z轴驱动机构的输出端与叉取器相连，用于驱动叉取器沿Z轴移动；
第二Y轴驱动机构，第二Y轴驱动机构设置在中转箱体内，第二Y轴驱动机构的输出端与第二Z轴驱动机构相连，用于驱动叉取器沿Y轴移动。
进一步，中转模块还包含：读码器，读码器与中转箱体相连。
进一步，翻转模块包含：
架体，架体位于中转模块的一侧；
第三Z轴驱动机构，第三Z轴驱动机构设置在架体上；
对接箱体，对接箱体设置在第三Z轴驱动机构的输出端上；
第二输送带，第二输送带设置在对接箱体内，用于对接中转模块中转输送的工件；
直线模组，直线模组与第三Z轴驱动机构的输出端相连；
顶升平台，顶升平台设置在直线模组的输出端，顶升平台的两侧设有一对电动挡块；
一对翻转机构，一对翻转机构分别设置在架体的顶部两侧；
一对气动夹爪，一对气动夹爪分别设置在一对翻转机构的输出端。
进一步，还包含：抓取旋转模块，抓取旋转模块设置在翻转模块的一侧，用于对翻转后的工件进行抓取、旋转。
进一步，抓取旋转模块包含：
吸盘，吸盘设置在翻转模块的顶部，用于吸附翻转后的工件；
吸盘驱动装置，吸盘驱动装置设置在翻转模块的一侧，吸盘驱动装置与吸盘连接，用于驱动吸盘运动。
进一步，吸盘驱动装置包含：
第四Z轴驱动机构，第四Z轴驱动机构设置在翻转模块的一侧，用于提供沿Z轴的驱动力；
第二旋转机构，第二旋转机构设置在第二Z轴驱动机构的输出端，第二 旋转机构的输出端与吸盘相连，用于驱动吸盘旋转。
根据本发明实施例的半导体元件转运设备，可以根据后面工序的生产要求，来进行各零部件不同的位置分配，来达到模块化的中转转运，实现智能化的工件加工输送，无需人为操作，中转过程流畅，且速度快、效率高，可以保证加工周期的稳定，并节省人工成本，且通过设有翻转结构，可以实现中转输送时工件的翻转，解决对于特殊工件需要翻转的问题。
要理解的是，前面的一般描述和下面的详细描述两者都是示例性的，并且意图在于提供要求保护的技术的进一步说明。
附图说明
图1为根据本发明实施例半导体元件转运设备的第一立体结构示意图。
图2为根据本发明实施例半导体元件转运设备的第二立体结构示意图。
图3为根据本发明实施例半导体元件转运设备的翻转模块的立体结构示意图。
图4为根据本发明实施例半导体元件转运设备的中转模块的立体结构示意图。
具体实施方式
以下将结合附图，详细描述本发明的优选实施例，对本发明做进一步阐述。
首先，将结合图1～3描述根据本发明实施例的半导体元件转运设备，用于工件(如PCB板、晶圆等)的中转转运，其应用场景很广。
如图1～4所示，本发明实施例的半导体元件转运设备，具有中转模块以及翻转模块。
具体地，如图1～2所示，在本实施例中，中转模块用于对工件进行中转输送，翻转模块设置在中转模块的一侧，用于对接、翻转中转模块中转输送的工件，通过中转模块和翻转模块的相互配合，可以实现工件自动的输送、对接、翻转，无需人为操作，中转过程流畅，且速度快、效率高，可以保证加工周期的稳定，并节省人工成本。
进一步，如图1～2、4所示，在本实施例中，中转模块包含：中转箱体 11、中转箱体驱动装置、叉取器13、叉取器驱动装置以及第一输送带15。中转箱体11位于翻转模块的一侧，中转箱体驱动装置位于中转箱体11的底部，用于驱动中转箱体11运动，便于中转箱体11进行位置调整，从而适应对接不同位置的中转模块，提高灵活性，叉取器13位于中转箱体11内，用于对工件进行叉取，叉取器驱动装置设置在中转箱体11内，叉取器驱动装置与叉取器13相连，用于驱动叉取器13运动，从而使得叉取器13可以对工件进行叉取，并将叉取后的工件放置在第一输送带15上，第一输送带15设置在中转箱体11内，用于输送工件。
进一步，如图1～2所示，在本实施例中，中转箱体驱动装置包含：第一旋转机构121，第一旋转机构121设置在中转箱体11的底部，用于驱动中转箱体11旋转，从而进行不同角度的输送工件，更加的灵活方便。
进一步，如图1～2所示，在本实施例中，中转箱体驱动装置还包含：第一Y轴驱动机构122、X轴驱动机构123以及第一Z轴驱动机构124。第一Y轴驱动机构122设置在旋转机构的底部，第一Y轴驱动结构采用电机丝杆驱动机构，用于驱动中转箱体11沿Y轴移动，X轴驱动机构123设置在第一Y轴驱动机构122的底部，X轴驱动机构123采用电机皮带驱动机构，用于驱动中转箱体11沿X轴移动，第一Z轴驱动机构124设置在第一Y轴驱动机构122的底部，第一Z轴驱动机构124采用电机丝杆驱动机构，用于驱动中转箱体11沿Z轴移动，通过第一Y轴驱动机构122、X轴驱动机构123以及第一Z轴驱动机构124相互配合，可以使得中转箱体11进行Y轴、X轴、Z轴的位置调节，便于与翻转模块相互配合使用。
进一步，如图1～2、4所示，在本实施例中，叉取器驱动装置包含：第二Z轴驱动机构141以及第二Y轴驱动机构142。第二Z轴驱动机构141设置在中转箱体11内，第二Z轴驱动机构141的输出端与叉取器13相连，第二Z轴驱动机构141采用气缸驱动机构，用于驱动叉取器13沿Z轴移动，第二Y轴驱动机构142设置在中转箱体11内，第二Y轴驱动机构142的输出端与第二Z轴驱动机构141相连，第二Y轴驱动机构142采用电机丝杆驱动机构，用于驱动叉取器13沿Y轴移动，通过第二Z轴驱动机构141可以驱动叉取器13沿Z轴运动，从而调整到叉取的高度，在通过第二Y轴驱动机构142驱动叉取器13沿Y轴移动，从而相互配合，可以让叉取器13对工 件进行叉取。
进一步，如图1～2、4所示，在本实施例中，中转模块还包含：读码器16，读码器16与中转箱体11相连，读码器16用于对工件进行读码，识别工件的标识，便于工件的记录统计。
进一步，如图1～3所示，在本实施例中，翻转模块包含：架体21、第三Z轴驱动机构22、对接箱体23、第二输送带24、直线模组25、顶升平台26、一对翻转机构27以及一对气动夹爪28。架体21位于中转模块的一侧，架体21用于起到支撑的作用，第三Z轴驱动机构22设置在架体21上，第三Z轴驱动机构22采用电机丝杠驱动机构，用于驱动对接箱体23和直线模组25沿Z轴方向运动，对接箱体23设置在第三Z轴驱动机构22的输出端上，第二输送带24设置在对接箱体23内，用于对接中转模块中转输送的工件，直线模组25与第三Z轴驱动机构22的输出端相连，直线模组25用于驱动顶升平台26进行升降即沿Z轴运动，顶升平台26设置在直线模组25的输出端，顶升平台26用于放置工件，顶升平台26的两侧设有一对电动挡块261，电动挡块261用于对工件进行格挡，防止工件掉落，一对翻转机构27分别设置在架体21的顶部两侧，一对气动夹爪28分别设置在一对翻转机构27的输出端，一对气动夹爪28用于抓取工件，一对翻转机构27带动一对气动夹爪28翻转，从而带动工件翻转。
进一步，如图1～2所示，在本实施例中，本发明实施例的半导体元件转运设备还包含：抓取旋转模块，抓取旋转模块设置在翻转模块的一侧，用于对翻转后的工件进行抓取、旋转。
进一步，如图1～2所示，在本实施例中，抓取旋转模块包含：吸盘31以及吸盘31驱动装置。吸盘31设置在翻转模块的顶部，用于吸附翻转后的工件，吸盘31驱动装置设置在翻转模块的一侧，吸盘31驱动装置与吸盘31连接，用于驱动吸盘31运动，使得吸盘31可以对工件进行吸附。
进一步，如图1～2所示，在本实施例中，吸盘31驱动装置包含：第四Z轴驱动机构321以及第二旋转机构322。第四Z轴驱动机构321设置在翻转模块的一侧，第四Z轴驱动机构321采用电机丝杆驱动机构，用于提供沿Z轴的驱动力，可使吸盘31升降运动，第二旋转机构322设置在第二Z轴驱动机构141的输出端，第二旋转机构322采用电机驱动机构，第二旋转机构 322的输出端与吸盘31相连，用于驱动吸盘31旋转。
在使用的时候，先通过第一Y轴驱动机构122、X轴驱动机构123以及第一Z轴驱动机构124相互配合驱动中转箱体11进行X轴、Y轴、Z轴的位置调整，使得中转箱体11和对接箱体23正对，然后通过第二Y轴驱动机构142驱动叉取器13前进至合适位置停下，在通过第二Z轴驱动机构141驱动叉取器13上升合适高度至工件位，由叉取器13对工件进行叉取，然后第二Y轴驱动机构142驱动叉取器13后退复位，经过读码器16时，读码器16对工件进行读码记录，后退复位至合适位置后，通过第二Z轴驱动机构141驱动叉取器13下降，使得工件落在第一输送带15上，然后通过第一旋转机构121驱动中转箱体11旋转180度，此时第一输送带15和第二输送带24同时运行，位于顶升平台26的后端的电动挡块261躺下，防止电动挡块261干扰工件对接，然后第一输送带15输送工件，第二输送带24对接第一输送带15输送的工件，将工件放置在对接箱体23内，位于顶升平台26上，此时顶升平台26与第二输送带24齐平，再让顶升平台26的后端的电动挡块261立起来，对工件进行格挡，然后通过直线模组25将顶升平台26上升到翻转位，一对气动夹爪28抓取夹持住顶升平台26上的工件，然后第三Z轴驱动机构22驱动对接箱体23和直线模组25下降到合适位置，不会阻挡翻转，然后一对翻转机构27运行，带动工件进行翻转，翻转完成后顶升平台26在来接住工件，随后如果有需要吸附动作，顶升平台26下降到与第二输送带24齐平高度，通过第四Z轴驱动机构321驱动吸盘31下降到合适位置吸取顶升平台26上的工件，然后在上升合适高度，通过第二旋转机构322驱动吸盘31旋转，进而带动工件旋转，在将旋转后的工件输送到下一道工序，如果没有吸附动作，将顶升平台26下降到最底部，此时工件落到第二输送带24上，通过第二输送带24将工件输送到下一道工序。且本案也可以根据后面工序的要求，来进行各零部件不同的位置分配，来达到模块化的中转转运。
以上，参照图1～4描述了根据本发明实施例的半导体元件转运设备，可以根据后面工序的生产要求，来进行各零部件不同的位置分配，来达到模块化的中转转运，实现智能化的工件加工输送，无需人为操作，中转过程流畅，且速度快、效率高，可以保证加工周期的稳定，并节省人工成本，且通过设有翻转结构，可以实现中转输送时工件的翻转，解决对于特殊工件需要翻转 的问题。
需要说明的是，在本说明书中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包含……”限定的要素，并不排除在包括要素的过程、方法、物品或者设备中还存在另外的相同要素。
尽管本发明的内容已经通过上述优选实施例作了详细介绍，但应当认识到上述的描述不应被认为是对本发明的限制。在本领域技术人员阅读了上述内容后，对于本发明的多种修改和替代都将是显而易见的。因此，本发明的保护范围应由所附的权利要求来限定。

Claims (10)

  1. 一种半导体元件转运设备，其特征在于，包含：
    中转模块，用于对工件进行中转输送；
    翻转模块，所述翻转模块设置在所述中转模块的一侧，用于对接、翻转所述中转模块中转输送的工件。
  2. 如权利要求1所述半导体元件转运设备，其特征在于，所述中转模块包含：
    中转箱体，所述中转箱体位于所述翻转模块的一侧；
    中转箱体驱动装置，所述中转箱体驱动装置位于所述中转箱体的底部，用于驱动所述中转箱体运动；
    叉取器，所述叉取器位于所述中转箱体内，用于对所述工件进行叉取；
    叉取器驱动装置，所述叉取器驱动装置设置在所述中转箱体内，所述叉取器驱动装置与所述叉取器相连，用于驱动所述叉取器运动；
    第一输送带，所述第一输送带设置在所述中转箱体内，用于输送工件。
  3. 如权利要求2所述半导体元件转运设备，其特征在于，所述中转箱体驱动装置包含：
    第一旋转机构，所述第一旋转机构设置在所述中转箱体的底部，用于驱动所述中转箱体旋转。
  4. 如权利要求3所述半导体元件转运设备，其特征在于，所述中转箱体驱动装置还包含：
    第一Y轴驱动机构，所述第一Y轴驱动机构设置在所述旋转机构的底部，用于驱动所述中转箱体沿Y轴移动；
    X轴驱动机构，所述X轴驱动机构设置在所述第一Y轴驱动机构的底部，用于驱动所述中转箱体沿X轴移动；
    第一Z轴驱动机构，所述第一Z轴驱动机构设置在所述第一Y轴驱动机构的底部，用于驱动所述中转箱体沿Z轴移动。
  5. 如权利要求2所述半导体元件转运设备，其特征在于，所述叉取器驱动装置包含：
    第二Z轴驱动机构，所述第二Z轴驱动机构设置在所述中转箱体内，所述第二Z轴驱动机构的输出端与所述叉取器相连，用于驱动所述叉取 器沿Z轴移动；
    第二Y轴驱动机构，所述第二Y轴驱动机构设置在所述中转箱体内，所述第二Y轴驱动机构的输出端与所述第二Z轴驱动机构相连，用于驱动所述叉取器沿Y轴移动。
  6. 如权利要求2所述半导体元件转运设备，其特征在于，所述中转模块还包含：读码器，所述读码器与所述中转箱体相连。
  7. 如权利要求1所述半导体元件转运设备，其特征在于，所述翻转模块包含：
    架体，所述架体位于所述中转模块的一侧；
    第三Z轴驱动机构，所述第三Z轴驱动机构设置在所述架体上；
    对接箱体，所述对接箱体设置在所述第三Z轴驱动机构的输出端上；
    第二输送带，所述第二输送带设置在所述对接箱体内，用于对接所述中转模块中转输送的工件；
    直线模组，所述直线模组与所述第三Z轴驱动机构的输出端相连；
    顶升平台，所述顶升平台设置在所述直线模组的输出端，所述顶升平台的两侧设有一对电动挡块；
    一对翻转机构，所述一对翻转机构分别设置在所述架体的顶部两侧；
    一对气动夹爪，所述一对气动夹爪分别设置在所述一对翻转机构的输出端。
  8. 如权利要求1所述半导体元件转运设备，其特征在于，还包含：抓取旋转模块，所述抓取旋转模块设置在所述翻转模块的一侧，用于对翻转后的工件进行抓取、旋转。
  9. 如权利要求8所述半导体元件转运设备，其特征在于，所述抓取旋转模块包含：
    吸盘，所述吸盘设置在所述翻转模块的顶部，用于吸附翻转后的工件；
    吸盘驱动装置，所述吸盘驱动装置设置在所述翻转模块的一侧，所述吸盘驱动装置与所述吸盘连接，用于驱动所述吸盘运动。
  10. 如权利要求9所述半导体元件转运设备，其特征在于，所述吸盘驱动装置包含：
    第四Z轴驱动机构，所述第四Z轴驱动机构设置在所述翻转模块的一侧，用于提供沿Z轴的驱动力；
    第二旋转机构，所述第二旋转机构设置在所述第二Z轴驱动机构的输出端，所述第二旋转机构的输出端与所述吸盘相连，用于驱动所述吸盘旋转。
PCT/CN2022/115667 2022-02-21 2022-08-30 半导体元件转运设备 WO2023155411A1 (zh)

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