WO2023132119A1 - 伸縮配線基板 - Google Patents

伸縮配線基板 Download PDF

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Publication number
WO2023132119A1
WO2023132119A1 PCT/JP2022/040172 JP2022040172W WO2023132119A1 WO 2023132119 A1 WO2023132119 A1 WO 2023132119A1 JP 2022040172 W JP2022040172 W JP 2022040172W WO 2023132119 A1 WO2023132119 A1 WO 2023132119A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
cover layer
peel strength
base material
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/040172
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
遼 浅井
勇人 勝
圭佑 西田
孝義 小幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202280087545.3A priority Critical patent/CN118511655A/zh
Priority to JP2023572358A priority patent/JP7563632B2/ja
Publication of WO2023132119A1 publication Critical patent/WO2023132119A1/ja
Priority to US18/761,690 priority patent/US20240357738A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present disclosure relates to an expandable wiring board.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2019-140292
  • the stretchable wiring board has a first wiring and a second wiring on the first surface of the stretchable base material, and the first wiring and the second wiring are electrically connected via a connecting portion.
  • stretchable wiring boards are sometimes attached to flexible and moving objects such as living organisms, and stress from multiple directions can be applied to them. Therefore, there is a problem that the connecting portion between the first wiring and the second wiring is broken and disconnected.
  • an object of the present disclosure is to provide an expandable wiring board that can suppress disconnection even when attached to a flexible and moving object such as a living body.
  • an expandable wiring board which is one aspect of the present disclosure, a main body; a stretchable first wiring and a second wiring laminated on the main body, the first wiring and the second wiring are connected to each other;
  • the peel strength in the main body is smaller than the peel strength between the first wiring and the second wiring.
  • lamination refers not only to the case where the first wiring and the second wiring are arranged on the main body (hereinafter also referred to as the "stress relaxation section"), but also to the case where the main body (stress relaxation section) is arranged in a plurality members, and the first wiring and the second wiring are arranged between the plurality of members.
  • the peel strength in the main body (stress relieving portion) means the peel strength between the main body (stress relieving portion) and the first wiring, and the peel strength between the main body (stress relieving portion) and the second wiring.
  • the body portion (stress relaxation portion) has a plurality of members, it also means the peel strength between two adjacent members in addition to the above two.
  • the peel strength in the main body is smaller than the peel strength between the first wiring and the second wiring. Therefore, when the stretchable wiring board is bent, there will be a plurality of stresses between the main body (stress relieving portion) and the first wiring, between the main body (stress relieving portion) and the second wiring, and between the main body (stress relieving portion). , the stress is released by peeling of at least one between two adjacent members, and the peeling of the first wiring and the second wiring is suppressed. Therefore, the electrical connection between the first wiring and the second wiring can be maintained.
  • At least one of the peel strength between the main body portion and the first wiring and the peel strength between the main body portion and the second wiring is higher than the peel strength between the first wiring and the second wiring. is also small.
  • At least one of the peel strength between the body portion (stress relaxation portion) and the first wiring and the peel strength between the body portion (stress relaxation portion) and the second wiring is the first It is smaller than the peel strength between the wiring and the second wiring. Therefore, when the stretchable wiring board is bent, at least one between the main body portion (stress relieving portion) and the first wiring and between the main body portion (stress relieving portion) and the second wiring delaminates, thereby releasing the stress. It is released, and peeling of the first wiring and the second wiring is suppressed. Therefore, the electrical connection between the first wiring and the second wiring can be maintained.
  • the main body includes a plurality of members laminated together, At least one of the peel strength between the main body portion and the first wiring, the peel strength between the main body portion and the second wiring, and the peel strength between two adjacent members is It is smaller than the peel strength between the wiring and the second wiring.
  • the main body (stress relieving part) includes a plurality of members laminated to each other, the peel strength between the main body (stress relieving part) and the first wiring, the peel strength of the main body (stress relieving part) At least one of the peel strength between and the second wiring and the peel strength between two adjacent members is smaller than the peel strength between the first wiring and the second wiring. Therefore, when the stretchable wiring board is bent, at least the gaps between the main body (stress relieving portion) and the first wiring, between the main body (stress relieving portion) and the second wiring, and between two adjacent members The peeling of one of the wirings releases the stress, and the peeling of the first wiring and the second wiring is suppressed. Therefore, the electrical connection between the first wiring and the second wiring can be maintained.
  • the peel strength between the body portion and the first wiring is different from the peel strength between the body portion and the second wiring.
  • the peel strength between the main body (stress relaxation part) and the first wiring is different from the peel strength between the main body (stress relaxation part) and the second wiring. Therefore, when the stretchable wiring board is bent, one of the first wiring and the second wiring and the main body (stress alleviating portion) are first peeled off, and the other comes into contact with the main body (stress alleviating portion). is retained. Therefore, peeling of the base material and the wiring can be minimized, and at least part of the wiring can be protected by the main body portion (stress relaxation portion). In addition, by maintaining contact between at least a part of the wiring and the main body (stress relief portion), moisture can be prevented from entering, and the reliability of the stretchable wiring board can be maintained.
  • the main body includes a base material having stretchability,
  • the first wiring and the second wiring are arranged on the substrate.
  • the main body portion includes a stretchable base material, and the first wiring and the second wiring are arranged on the base material. Therefore, the shapes of the first wiring and the second wiring can be maintained while maintaining the stretchability of the flexible wiring board.
  • the main body includes a waterproof layer.
  • the body portion (stress relaxation portion) includes a waterproof layer having waterproof properties. Therefore, moisture can be prevented from entering, and the reliability of the expansion wiring board can be maintained.
  • the stretchable wiring board it is arranged between the base material and the first wiring and the second wiring.
  • a waterproof layer having waterproof properties is arranged between the base material and the wiring. Therefore, moisture can be prevented from entering from the substrate side, and the reliability of the stretchable wiring board can be maintained.
  • one embodiment of the stretchable wiring board further comprises a rigid portion.
  • the expandable wiring board includes the hard portion, so that excessive deformation of the expandable wiring board due to external force can be suppressed.
  • the hard portion covers a portion where the first wiring and the second wiring are connected to each other, and is in contact with the substrate.
  • the hard portion covers the portion where the first wiring and the second wiring are connected to each other, and is in contact with the base material. Therefore, it is possible to prevent moisture intrusion while suppressing excessive deformation of the base material and wiring at locations where the shape of the base material and wiring needs to be maintained.
  • the stretchable wiring board which is one aspect of the present disclosure, a main body; a stretchable first wiring and a second wiring laminated on the main body; a gap, and The first wiring and the second wiring are connected to each other.
  • the stretchable wiring board has voids. Therefore, when the stretchable wiring board is bent, stress is absorbed by the voids, so that peeling of the first wiring and the second wiring can be suppressed. Therefore, the electrical connection between the first wiring and the second wiring can be maintained.
  • the void is located at least one between the main body and the first wiring and between the main body and the second wiring.
  • the void in the stretchable wiring board is positioned at least one between the main body (stress relieving section) and the first wiring and between the main body (stress relieving section) and the second wiring. Therefore, when the stretchable wiring board is bent, the stress is absorbed by the voids located near the first wiring and the second wiring, so that the separation of the first wiring and the second wiring can be suppressed. Therefore, the electrical connection between the first wiring and the second wiring can be maintained.
  • the main body includes a plurality of members laminated together,
  • the gap is located at least one between the main body and the first wiring, between the main body and the second wiring, and between two adjacent members.
  • the main body (stress relieving portion) includes a plurality of members laminated to each other, and the gaps in the stretchable wiring board are formed between the main body (stress relieving portion) and the first wiring. at least one between the relief portion) and the second wiring and between two adjacent members. Therefore, when the stretchable wiring board is bent, stress is absorbed by the voids, so that separation between the first wiring and the first wiring can be suppressed. Therefore, the electrical connection between the first wiring and the second wiring can be maintained.
  • the main body includes a base material having stretchability,
  • the first wiring and the second wiring are arranged on the substrate.
  • the main body portion includes a stretchable base material, and the first wiring and the second wiring are arranged on the base material. Therefore, the shapes of the first wiring and the second wiring can be maintained while maintaining the stretchability of the flexible wiring board.
  • the main body includes a waterproof layer.
  • the body portion (stress relaxation portion) includes a waterproof layer having waterproof properties. Therefore, even if the stretchable wiring board includes voids, it is possible to prevent moisture from entering and maintain the reliability of the stretchable wiring board.
  • the stretchable wiring board it is arranged between the base material and the first wiring and the second wiring.
  • a waterproof layer having waterproof properties is arranged between the base material and the wiring. Therefore, moisture can be prevented from entering from the substrate side, and the reliability of the flexible wiring board can be maintained even when the flexible wiring board includes voids.
  • one embodiment of the stretchable wiring board further comprises a rigid portion.
  • the expandable wiring board includes the hard portion, so that excessive deformation of the expandable wiring board due to external force can be suppressed.
  • the hard portion covers a portion where the first wiring and the second wiring are connected to each other, and is in contact with the substrate.
  • the hard portion covers the portion where the first wiring and the second wiring are connected to each other, and is in contact with the base material. Therefore, it is possible to suppress excessive deformation of the base material and wiring in places where the shape of the base material and wiring needs to be maintained, and to prevent moisture from entering even if the stretchable wiring board has voids. can.
  • disconnection can be suppressed even when attached to a flexible and moving object such as a living body.
  • FIG. 2 is an enlarged view of a portion A in FIG. 1 and is a plan view showing the first embodiment of the stretchable wiring board.
  • 3 is a cross-sectional view taken along line III-III of FIG. 2;
  • FIG. While showing 2nd Embodiment of an expansion-contraction wiring board, it is sectional drawing which expanded one part. While showing 3rd Embodiment of an expansion-contraction wiring board, it is sectional drawing which expanded one part. While showing 4th Embodiment of an expansion-contraction wiring board, it is sectional drawing which expanded one part. It is sectional drawing which expanded one part while showing 5th Embodiment of an expansion-contraction wiring board.
  • FIG. 1 is a plan view of an expandable wiring board.
  • FIG. 2 is an enlarged view of the portion A in FIG. 1, and is a plan view showing the first embodiment of the expandable wiring board.
  • FIG. 3 is a cross-sectional view taken along line III-III of FIG.
  • the stretchable wiring board is used, for example, to contact a living body and measure a biological signal.
  • the stretchable wiring board 1 includes a base material 11, first wirings 21, second wirings 22, third wirings 23 and fourth wirings 24 provided on the base material 11, and an electronic component 31.
  • first wiring 21 and third wiring 23 are electrically connected to electronic component 31 .
  • the first wiring 21 and the third wiring 23, the second wiring 22 and the fourth wiring 24, the third wiring 23 and the fourth wiring 24 three-dimensionally cross each other, and a plurality of wirings three-dimensionally cross each other.
  • An insulating layer 41 exists between the plurality of wirings in the region. 2 and 3 show the base material 11 and the first wiring 21 and the second wiring 22.
  • the flexible wiring board 1 includes the base material 11 and the first wiring 21 and the second wiring provided on the base material 11. 2 wiring 22 is provided.
  • the base material 11 corresponds to an example of the body portion (stress relaxation portion) described in the claims.
  • the base material 11 is made of an elastic resin material such as styrene resin, olefin resin, epoxy resin, urethane resin, acrylic resin, or silicone resin, preferably urethane resin.
  • Urethane resins include thermoplastic polyurethane (TPU).
  • Styrene resins include styrene-butadiene-styrene copolymer resins (SBS).
  • the expansion ratio of the base material 11 is preferably 50% or more. By setting the stretch rate to the above range, the adaptability of the stretchable wiring board to the living body is improved.
  • the Young's modulus of the base material 11 is preferably 100 MPa or less, more preferably 30 MPa or less. By setting the Young's modulus as described above, it is possible to suppress the user's discomfort.
  • the thickness of the base material 11 is, for example, 0.1 to 100 ⁇ m.
  • the base material 11 includes a first major surface 111 and a second major surface 112 facing each other.
  • the first wiring 21 and the second wiring 22 are made of a conductive material.
  • a conductive material for example, a metal foil of silver, copper, nickel, or the like may be used.
  • a mixture consisting of The thickness of the metal foil is preferably 0.01 ⁇ m or more and 10 ⁇ m or less, and the average particle diameter D50 of the metal powder is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the shape of the metal powder may be a spherical shape, a flat shape, an irregular shape having projections, or the like.
  • the first wiring 21 and the second wiring 22 may be stretchable. When the first wiring 21 and the second wiring 22 are stretchable, the followability to the living body is improved.
  • the thickness of the first wiring 21 and the second wiring 22 is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, and preferably 1 ⁇ m or more, more preferably 10 ⁇ m or more.
  • the width of the first wiring 21 and the second wiring 22 is preferably 100 ⁇ m or more and 10,000 ⁇ m or less, more preferably 200 ⁇ m or more and 5,000 ⁇ m or less.
  • the first wiring 21 and the second wiring 22 are arranged on the second main surface 112 and extend along the second main surface 112 .
  • the first wiring 21 and the second wiring 22 are formed by screen printing, inkjet printing, dispensing, or etching of metal foil so as to be in direct contact with the second major surface 112 .
  • the first wiring and the second wiring may be covered with an insulating coating layer (not shown).
  • the term “on the main surface” refers to the direction toward the outside, between the outer side and the inner side of the base material bounded by the main surface, rather than an absolute direction such as the vertical direction defined in the direction of gravity. Point. Therefore, “on the major surface” is a relative direction determined by the orientation of the major surface.
  • “above” an element includes not only the position directly above (on) in contact with the element, but also the upper position away from the element, that is, the upper position via another object on the element. It also includes a spaced above position.
  • upper layer refers to an outward direction between the outer side and the inner side of the substrate bounded by the main surface of the layer, rather than an absolute direction such as the vertical direction defined by the direction of gravity. Point. Therefore, "on the layer” is a relative direction determined by the orientation of the major surfaces of the layer.
  • the first wiring 21 contacts and is electrically connected to the second wiring 22 .
  • a portion of the first wiring 21 and a portion of the second wiring 22 may overlap. 2 and 3, one end of the second wiring 22 in the extending direction is arranged to overlap one end of the first wiring 21 in the extending direction.
  • the first wiring 21 and the second wiring are composed of straight portions, but are not limited to this, and may have corner portions and curved portions.
  • the contact area between the first wiring 21 and the second wiring 22 preferably has an area of 0.03 mm 2 or more when viewed from above, and preferably has a length of 200 ⁇ m or more in the extending direction of the wiring. By increasing the area of the contact region, the reliability of connection can be further improved.
  • At least one of the peel strength S1 between the base material 11 and the first wiring 21 and the peel strength S2 between the base material 11 and the second wiring 22 is equal to the peel strength S0 between the first wiring 21 and the second wiring 22. less than the peel strength.
  • the peel strength represents the resistance to peeling when two layers in contact are tried to be peeled, and the higher the peel strength, the more difficult it is for the two layers to peel. Therefore, when stretchable wiring board 1 is bent and stress is applied in a direction orthogonal to second main surface 112, S1 between base material 11 and first wiring 21 and between base material 11 and second wiring 22 At least one of the spaces S2 is first peeled off, thereby releasing the stress and suppressing the peeling of the first wiring 21 and the second wiring 22 . Therefore, electrical connection between the first wiring 21 and the second wiring 22 can be maintained.
  • the peel strength between the base material 11 and the first wiring 21 can be measured according to JIS K5600-5-6, and is preferably 1 or more and 4 or less.
  • the peel strength classification is 4 or less, the base material 11 and the first wiring 21 do not peel and can follow the movement of the living body.
  • the peel strength classification is 1 or more, even when stress is applied in a direction orthogonal to the second main surface 112, the stress can be absorbed by first peeling the base material 11 and the first wiring 21. , separation of the first wiring 21 and the second wiring 22 can be suppressed. Therefore, electrical connection between the first wiring 21 and the second wiring 22 can be maintained.
  • the peel strength between the first wiring 21 and the second wiring 22 is preferably 0.1 N/10 mm or more, more preferably 0.2 N/10 mm or more.
  • it can be measured by the following method.
  • Method for measuring peel strength between first wiring and second wiring A first wiring is formed on a resin substrate, and a part of the first wiring is covered with a release film. Next, a second wiring is formed on the first wiring so as to cover at least part of the release film. The mold release film is removed, and the first wiring and the second wiring are molded to have a width of 10 mm to prepare a test piece. A 180-degree peel test is performed on the prepared test piece at a peel speed of 1 mm/s.
  • the fact that the peel strength between the substrate 11 and the first wiring 21 is smaller than the peel strength between the first wiring 21 and the second wiring 22 means that the first wiring 21 and the second wiring 22 are in contact with each other.
  • the base material 11 and the first wiring 21 are peeled, but the contact between the first wiring 21 and the second wiring 22 is maintained. This can be confirmed by
  • the peel strength between the base material 11 and the second wiring 22 is smaller than the peel strength between the first wiring 21 and the second wiring 22 . Therefore, when stress is applied in a direction orthogonal to the second main surface 112, the stress is released by first separating the base material 11 and the second wiring 22, and the first wiring 21 and the second wiring 22 are separated. Peeling is suppressed. Therefore, electrical connection between the first wiring 21 and the second wiring 22 can be maintained.
  • the peel strength between the base material 11 and the second wiring 22 can be measured according to JIS K5600-5-6, and is preferably 1 or more and 4 or less.
  • the peel strength classification is 4 or less, the substrate 11 and the second wiring 22 do not peel and can follow the movement of the living body.
  • the peel strength classification is 1 or more, even when stress is applied in a direction orthogonal to the second main surface 112, the stress can be absorbed by first peeling the base material 11 and the second wiring 22. , separation of the first wiring 21 and the second wiring 22 can be suppressed. Therefore, electrical connection between the first wiring 21 and the second wiring 22 can be maintained.
  • the fact that the peel strength between the substrate 11 and the second wiring 22 is smaller than the peel strength between the first wiring 21 and the second wiring 22 means that the first wiring 21 and the second wiring 22 are in contact with each other.
  • the base material 11 and the second wiring 22 are peeled, but the contact between the first wiring 21 and the second wiring 22 is maintained. This can be confirmed by
  • the peel strength between the base material 11 and the first wiring 21 is preferably different from the peel strength between the base material 11 and the second wiring 22 . Therefore, when stress is applied in a direction orthogonal to the second main surface 112, either one of the first wiring 21 and the second wiring 22 and the substrate 11 are first peeled off, and the substrate and the wiring are separated. Delamination is minimized while contact between the other and the substrate 11 is maintained. Therefore, at least part of the wiring is protected by the base material 11 . In addition, by maintaining contact between at least a part of the wiring and the base material 11, moisture can be prevented from entering, and the reliability of the stretchable wiring board 1 can be maintained.
  • the peel strength between the base material 11 and the second wiring 22 is smaller than the peel strength between the base material 11 and the first wiring 21 .
  • the peel strength between the base material 11 and the first wiring 21 or the second wiring 22 is determined by irradiating the base material 11 with ultraviolet rays before forming the first wiring 21 or the second wiring 22 on the base material 11. Alternatively, it can be adjusted by forming a release agent layer provided in contact with the second major surface 112 .
  • the base material 11 and the first wiring 21 and the base material 11 and the second wiring 22 are in contact with each other. Any part between the material 11 and the second wiring 22 may be separated from each other. In this case, at least one gap may exist between the base material 11 and the first wiring 21 and between the base material 11 and the second wiring 22 at the peeled portion.
  • FIG. 4 shows a second embodiment of an expandable wiring board and is a partially enlarged cross-sectional view, which specifically corresponds to FIG.
  • the second embodiment differs from the first embodiment in that a buffer layer is further provided, and the first wiring and the second wiring are arranged on the buffer layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the first embodiment, and the same reference numerals as those of the first embodiment are given, and the description thereof is omitted.
  • an expandable wiring board 1A of the second embodiment includes a buffer layer 12 laminated on a second main surface 112A of a base material 11A and having a third main surface 121 and a fourth main surface 122. .
  • the first wiring 21A and the second wiring 22A are arranged on the fourth main surface 122 and extend along the fourth main surface 122 .
  • the buffer layer 12 can protect the first wiring 21A and the second wiring 22A.
  • the base material 11A and the buffer layer 12 correspond to an example of a plurality of members included in the main body portion (stress relaxation portion) described in the claims.
  • the buffer layer 12 is made of a resin material such as epoxy resin, urethane resin, acrylic resin, silicone resin, phenol resin, or polyimide resin, and may contain glass fiber or paper fiber.
  • the buffer layer 12 may be stretchable.
  • the stretch ratio of the buffer layer 12 is preferably from 5%. This makes it easier to follow the living body.
  • the Young's modulus of the buffer layer 12 is preferably 100-1000 MPa. As a result, the easiness of peeling between the base material 11A and the buffer layer 12 can be adjusted within an appropriate range.
  • the thickness of the buffer layer 12 is, for example, 5-30 ⁇ m.
  • the buffer layer 12 is preferably waterproof. As a result, the penetration of moisture can be prevented, and the reliability of the flexible wiring board 1A can be maintained.
  • the buffer layer 12 corresponds to a plurality of members that the main body (stress relaxation portion) has, and when it has waterproof properties, such a buffer layer 12 is described in the claims. It corresponds to an example of a waterproof layer.
  • the buffer layer 12 includes a third main surface 121 and a fourth main surface 122 facing each other.
  • At least one of the peel strength S3 between the base material 11A and the buffer layer 12, the peel strength S4 between the buffer layer 12 and the first wiring 21A, and the peel strength S5 between the buffer layer 12 and the second wiring 21A is is smaller than the peel strength S0 between the first wiring 21A and the second wiring 22A. Therefore, when stress is applied in a direction perpendicular to the fourth main surface 122, S3 between the base material 11A and the buffer layer 12, S4 between the buffer layer 12 and the first wiring 21A, and between the buffer layer 12 and the first wiring 21A. At least one of S5 between the two wirings 22A is peeled first, and the contact between the first wiring 21A and the second wiring 22A can be protected. Therefore, the buffer layer 12 can protect the first wiring 21A and the second wiring 22A and maintain electrical connection between the first wiring 21A and the second wiring 22A.
  • the peel strength between the buffer layer 12 and the second wiring 22A is smaller than the peel strength between the first wiring 21A and the second wiring 22A. Therefore, when stress is applied in a direction orthogonal to the fourth main surface 122, the buffer layer 12 and the second wiring 22A are peeled off to release the stress, and the first wiring 21A and the second wiring 22A are peeled off. is suppressed. Therefore, electrical connection between the first wiring 21A and the second wiring 22A can be maintained.
  • the peel strength between the base material 11A and the buffer layer 12 can be measured according to JIS K 5600-5-6, and is preferably 1 or more and 4 or less.
  • the peel strength classification is 4 or less, the base material 11A and the buffer layer 12 do not separate and can follow the movement of the living body.
  • the peel strength classification is 1 or more, even when stress is applied in a direction orthogonal to the fourth main surface 122, the base material 11A and the buffer layer 12 first peel off, so that the stress can be absorbed. Separation of the first wiring 21A and the second wiring A can be suppressed.
  • the peel strength between the base material 11A and the buffer layer 12 can be improved by irradiating the base material 11A with ultraviolet rays before forming the buffer layer 12 on the base material 11A, or by contacting the second main surface 112A. It can be adjusted by forming a release agent layer provided.
  • the peel strength between the buffer layer 12 and the first wiring 21 is different from the peel strength between the buffer layer 12 and the second wiring 22 . Therefore, when the expandable wiring board is bent and stress is applied in a direction orthogonal to the fourth main surface 122A, one of the first wiring 21A and the second wiring 22A and the buffer layer 12 are first peeled off. This minimizes peeling of the buffer layer 12 and the wiring, while maintaining contact between the other and the buffer layer 12 . Therefore, at least part of the wiring is protected by the buffer layer 12 . Further, by maintaining contact between at least a portion of the wiring and the buffer layer 12, moisture can be prevented from entering, and the reliability of the flexible wiring board 1 can be maintained.
  • the base material 11A and the buffer layer 12, and the buffer layer 12 and the first wiring 21A are in contact with each other. and the first wiring 21A may be separated from each other. In this case, a gap may exist either between the base material 11A and the buffer layer 12 or between the buffer layer 12 and the first wiring 21A at the peeled portion. Since other effects of the configuration are the same as those of the first embodiment, description thereof will be omitted.
  • FIG. 5 is a partially enlarged cross-sectional view showing a third embodiment of an expandable wiring board, and specifically corresponds to FIG.
  • the third embodiment differs from the first embodiment in that it further includes a first cover layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the first embodiment, and the same reference numerals as those of the first embodiment are given, and the description thereof is omitted.
  • the stretchable wiring board 1B of the third embodiment further includes a first cover layer 13 laminated on the second main surface 112B.
  • First wiring 21B and second wiring 22B are arranged between base material 11B and first cover layer 13 . Thereby, the first wiring 21B and the second wiring 22B can be protected.
  • the base material 11B and the first cover layer 13 correspond to an example of a member included in the main body portion (stress relaxation portion) described in the claims.
  • the first cover layer 13 is made of a resin material such as epoxy resin, urethane resin, acrylic resin, silicone resin, phenol resin, or polyimide resin.
  • the first cover layer 13 may be stretchable.
  • the stretch ratio of the first cover layer 13 is preferably from 5%. This makes it easier to follow the living body.
  • the Young's modulus of the first cover layer 13 is preferably 10-1000 MPa. This makes it easier to protect the first wiring 21B and the second wiring 22B.
  • the thickness of the first cover layer 13 is, for example, 5 to 30 ⁇ m.
  • the first cover layer 13 is preferably waterproof. As a result, the penetration of moisture can be prevented, and the reliability of the flexible wiring board 1B can be maintained.
  • the first cover layer 13 may cover a portion of the periphery of the first wiring 21B where the first wiring 21B and the base material 11B are not in contact. preferable.
  • the peel strength of S6 between the base material 11B and the first wiring 21B, the peel strength of S7 between the base material 11B and the second wiring 22B, the peel strength of S8 between the first wiring 21B and the first cover layer 13, and the peel strength of S8 between the first wiring 21B and the first cover layer 13 At least one of the peel strengths S9 between the second wiring 22B and the first cover layer 13 is smaller than the peel strength S0 between the first wiring 21B and the second wiring 22B. Therefore, when stress is applied in a direction orthogonal to the second main surface 112B, S6 between the base material 11B and the first wiring 21B, S7 between the base material 11B and the second wiring 22B, and S7 between the first wiring 21B and the first wiring 21B are applied.
  • At least one of S8 between the first cover layer 13 and S9 between the second wiring 22B and the first cover layer 13 is peeled first, and peeling of the first wiring 21B and the second wiring 22B is suppressed. Therefore, the first wiring 21B and the second wiring 22B can be protected by the first cover layer 13, and the electrical connection between the first wiring 21B and the second wiring 22B can be maintained.
  • the peel strength between the first cover layer 13 and the second wiring 22B is smaller than the peel strength between the first wiring 21B and the second wiring 22B. Therefore, when stress is applied in a direction perpendicular to the second main surface 112B, the first cover layer 13 and the second wiring 22B are peeled off, and the peeling of the first wiring 21B and the second wiring 22B is suppressed. . Therefore, the first wiring 21B and the second wiring 22B can be protected by the first cover layer 13, and the electrical connection between the first wiring 21B and the second wiring 22B can be maintained.
  • the peel strength between the first cover layer 13 and the first wiring 21B is different from the peel strength between the first cover layer 13 and the second wiring 22B. Therefore, when stress is applied in a direction perpendicular to the second main surface 112B, one of the first wiring 21B and the second wiring 22B is first peeled off from the first cover layer 13, and the other peels off from the second wiring 22B. 1
  • the contact with the cover layer 13 is maintained. Therefore, at least part of the wiring is protected by the first cover layer 13 . Therefore, moisture can be prevented from entering, and the reliability of the expansion wiring board 1B can be maintained.
  • the peel strength between the base material 11B and the first cover layer 13 is smaller than the peel strength between the first wiring 21B and the second wiring 22B. Therefore, when stress is applied in a direction perpendicular to the second main surface 112B, the base material 11B and the first cover layer 13 are first peeled off, thereby minimizing the peeling of the first cover layer 13 and the wiring. , delamination of the first wiring 21B and the second wiring 22B is suppressed. Therefore, the first wiring 21B and the second wiring 22B can be protected by the first cover layer 13, and the electrical connection between the first wiring 21B and the second wiring 22B can be maintained.
  • the peel strength between the first cover layer 13 and the first wiring 21B, the peel strength between the first cover layer 13 and the second wiring 22B, and the peel strength between the substrate 11B and the first cover layer 13 are Both can be measured according to JIS K 500-5-6.
  • the peel strength between the first cover layer 13 and the first wiring 21B and the peel strength between the first cover layer 13 and the second wiring 22B are preferably 0 or more and 4 or less.
  • the peel strength between the base material 11B and the first cover layer 13 is preferably 0 or more and 4 or less.
  • the peel strength between the first cover layer 13 and the first wiring 21B, the peel strength between the first cover layer 13 and the second wiring 22B, and the peel strength between the substrate 11B and the first cover layer 13 are based on Before forming the first cover layer 13 on the material 11B, the first wiring 21B, and the second wiring 22B, irradiating these with ultraviolet rays, or forming a release agent layer provided in contact therewith. can be adjusted by Since other effects of the configuration are the same as those of the first embodiment, description thereof will be omitted.
  • the base material 11B and the first wiring 21B and the first wiring 21B and the first cover layer are in contact with each other, but are not limited to this. At least one between the first wiring 21B and the first cover layer may be separated from each other. In this case, at least one gap may exist between the base material 11B and the first wiring 21B and between the first wiring 21B and the first cover layer.
  • FIG. 6 shows a fourth embodiment of an expandable wiring board and is a partially enlarged cross-sectional view, specifically corresponding to FIG.
  • the fourth embodiment differs from the second embodiment in that it further includes a first cover layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the second embodiment, and the same reference numerals as those of the second embodiment are given, and the description thereof is omitted.
  • the stretchable wiring board 1C of the fourth embodiment further includes a first cover layer 13C laminated on the fourth main surface 122C.
  • the first wiring 21C and the second wiring 22C are arranged between the base material 11C and the first cover layer 13C. Thereby, the first wiring 21C and the second wiring 22C can be protected.
  • the base material 11C, the buffer layer 12C, and the first cover layer 13C correspond to an example of a member included in the main body portion (stress relaxation portion) described in the claims.
  • composition of the first cover layer 13C properties such as expansion ratio, Young's modulus, thickness, etc., and the configuration related to the peel strength between the first cover layer 13C and the first wiring 21C or the second wiring 22C are those of the third embodiment.
  • the configuration is the same as in
  • the first cover layer 13C may cover a portion of the periphery of the first wiring 21C where the first wiring 21C and the buffer layer 12C are not in contact. preferable.
  • the peel strength of S10 between the base material 11C and the buffer layer 12C, the peel strength of S11 between the buffer layer 12C and the first wiring 21C, the peel strength of S12 between the buffer layer 12C and the second wiring 22C, the first wiring 21C and the At least one of the peel strength S13 between the first cover layer 13C and the peel strength S14 between the second wiring 22C and the first cover layer 13C is equal to the peel strength S0 between the first wiring 21C and the second wiring 22C. less than Therefore, when stress is applied in a direction perpendicular to the fourth main surface 122C, S10 between the base material 11C and the buffer layer 12C, S11 between the buffer layer 12C and the first wiring 21C, and S11 between the buffer layer 12C and the second wiring 21C.
  • At least one of S12 between 22C, S13 between first wiring 21C and first cover layer 13C, and S14 between second wiring 22C and first cover layer 13C is peeled off, and first wiring 21C and second wiring 22C are separated.
  • the contact of S0 is maintained during . Therefore, the first wiring 21C and the second wiring 22C can be protected by the buffer layer 12C and the first cover layer 13C, and the electrical connection between the first wiring 21C and the second wiring 22C can be maintained.
  • the peel strength between the buffer layer 12C and the first cover layer 13C is smaller than the peel strength between the first wiring 21C and the second wiring 22C. Therefore, when stress is applied in a direction orthogonal to the fourth main surface 122C, the buffer layer 12C and the first cover layer 13C are peeled off, and peeling of the first wiring 21C and the second wiring 22C is suppressed. Therefore, the first wiring 21C and the second wiring 22C can be protected by the first cover layer 13C, and the electrical connection between the first wiring 21C and the second wiring 22C can be maintained.
  • the peel strength between the buffer layer 12C and the first cover layer 13C can be measured according to JIS K 500-5-6.
  • the peel strength between the buffer layer 12C and the first cover layer 13C is preferably 0 or more and 4 or less.
  • the peel strength between the buffer layer 12C and the first cover layer 13C can be improved by irradiating the buffer layer 12C with ultraviolet rays or by contacting the buffer layer 12C before forming the first cover layer 13C on the buffer layer 12C. It can be adjusted by forming a release agent layer provided on the surface. Since other effects of the configuration are the same as those of the second embodiment, description thereof will be omitted.
  • the base material 11C and the buffer layer 12C, the buffer layer 12C and the first wiring 21C, and the first wiring 21C and the first cover layer 13C are in contact with each other. At least one of between 11C and buffer layer 12C, between buffer layer 12C and first wiring 21C, and between first wiring 21C and first cover layer 13C may be separated from each other. In this case, at least one gap may exist between the base material 11C and the buffer layer 12C, between the buffer layer 12C and the first wiring 21C, and between the first wiring 21C and the first cover layer 13C. .
  • FIG. 7 shows a fifth embodiment of an expandable wiring board and is a partially enlarged cross-sectional view, which specifically corresponds to FIG.
  • the fifth embodiment differs from the third embodiment in that it further includes a second cover layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the third embodiment, and the same reference numerals as those of the third embodiment are given, and the description thereof is omitted.
  • the stretchable wiring board 1D of the fifth embodiment further includes a second cover layer 14 laminated on the second main surface 112D.
  • the first wiring 21D and the second wiring 22D are arranged between the base material 11D and the second cover layer 14 . Thereby, the first wiring 21D and the second wiring 22D can be further protected.
  • the base material 11D and the second cover layer 14 correspond to an example of a member included in the main body portion (stress relaxation portion) described in the claims.
  • the second cover layer 14 is made of an elastic resin material such as ionomer resin, polyester resin, styrene resin, olefin resin, epoxy resin, urethane resin, acrylic resin, or silicone resin, preferably urethane resin.
  • Urethane resins include thermoplastic polyurethane (TPU).
  • Styrene resins include styrene-butadiene-styrene copolymer resins (SBS).
  • the second cover layer 14 may be the same member as the first cover layer.
  • the second cover layer 14 is preferably non-stretchable, and the stretch ratio of the second cover layer 14 is preferably 100% or less. Thereby, the first wiring 21D and the second wiring 22D can be appropriately fixed.
  • the Young's modulus of the second cover layer 14 is preferably 100 MPa or more and 10000 MPa or less. Thereby, the first wiring 21D and the second wiring 22D can be further protected.
  • the thickness of the second cover layer 14 is, for example, 10-50 ⁇ m.
  • the second cover layer 14 is preferably waterproof. As a result, moisture can be prevented from entering, and the reliability of the flexible wiring board 1D can be maintained.
  • the second cover layer 14 may cover a portion of the periphery of the first wiring 21D where the first wiring 21D and the base material 11D are not in contact. preferable.
  • the peel strength of S15 between the base material 11D and the first wiring 21D, the peel strength of S16 between the base material 11D and the second wiring 22D, the peel strength of S17 between the first wiring 21D and the second cover layer 14, and the peel strength of S17 between the first wiring 21D and the second cover layer 14 At least one of the peeling strengths S18 between the second wiring 22D and the second cover layer 14 is smaller than the peeling strength S0 between the first wiring 21D and the second wiring 22D. Therefore, when stress is applied in a direction orthogonal to the second main surface 12D, S15 between the base material 11D and the first wiring 21D, S16 between the base material 11D and the second wiring 22D, and S16 between the first wiring 21D and the first wiring 21D are applied.
  • At least one of S17 between the two cover layers 14 and S18 between the second wiring 22D and the second cover layer 14 is peeled first, and peeling of the first wiring 21D and the second wiring 22D is suppressed. Therefore, the second cover layer 14 can protect the first wiring 21D and the second wiring 22D, and maintain electrical connection between the first wiring 21D and the second wiring 22D.
  • the peel strength between the substrate 11D and the first wiring 21D or the second wiring 22D is preferably smaller than the peel strength between the substrate 11D and the first cover layer 14. As a result, when stress is applied in a direction perpendicular to the second main surface 112D, the substrate 11D and the first wiring 21D or the second wiring 22D are separated, and the contact between the substrate 11D and the first cover layer 14 is maintained. and can protect the first wiring 21D and the second wiring 22D.
  • the peel strength between the second cover layer 14 and the second wiring 22D is smaller than the peel strength between the first wiring 21D and the second wiring 22D. Therefore, when stress is applied in a direction orthogonal to the second main surface 112D, the second cover layer 14 and the second wiring 22D are peeled off, and the peeling of the first wiring 21D and the second wiring 22D is suppressed. . Therefore, the second cover layer 14 can protect the first wiring 21D and the second wiring 22D, and maintain electrical connection between the first wiring 21D and the second wiring 22D.
  • the peel strength between the second cover layer 14 and the first wiring 21D is different from the peel strength between the second cover layer 14 and the second wiring 22D. Therefore, when stress is applied in a direction orthogonal to the second main surface 112D, at least one of the first wiring 21D and the second wiring 22D and the second cover layer 14 are first peeled off, and the second cover layer 14 is peeled off. Delamination of the layer 14 and the wiring is minimized, while contact between the other and the second cover layer 14 is maintained. Therefore, at least part of the wiring is protected by the second cover layer 14 . Therefore, moisture can be prevented from entering, and the reliability of the stretchable wiring board 1D can be maintained.
  • the peel strength between the base material 11D and the second cover layer 14 is smaller than the peel strength between the first wiring 21D and the second wiring 22D. Therefore, when stress is applied in a direction orthogonal to the second main surface 112D, the base material 11D and the second cover layer 14 are separated, and the separation of the first wiring 21D and the second wiring 22D is suppressed. Therefore, the second cover layer 14 can protect the first wiring 21D and the second wiring 22D, and maintain electrical connection between the first wiring 21D and the second wiring 22D.
  • the peel strength between the second cover layer 14 and the first wiring 21D, the peel strength between the second cover layer 14 and the second wiring 22D, and the peel strength between the substrate 11D and the first cover layer 14 are Both can be measured according to JIS K 500-5-6.
  • the peel strength between the second cover layer 14 and the first wiring 21D and the peel strength between the second cover layer 14 and the second wiring 22D are preferably 0 or more and 4 or less.
  • the peel strength between the base material 11D and the second cover layer 14 is preferably 4 or more and 4 or less.
  • the peel strength between the second cover layer 14 and the first wiring 21D, the peel strength between the second cover layer 14 and the second wiring 22D, and the peel strength between the substrate 11D and the second cover layer 14 are based on Before forming the second cover layer 14 on the material 11D, the first wiring 21D, and the second wiring 22D, irradiating these with ultraviolet rays, or forming a release agent layer provided in contact therewith. can be adjusted by Since other effects of the configuration are the same as those of the first embodiment, description thereof will be omitted.
  • the base material 11D and the first wiring 21D and the first wiring 21D and the second cover layer 14 are in contact with each other, but are not limited to this. and at least one between the first wiring 21D and the second cover layer 14 may be separated from each other. In this case, a gap may exist either between the substrate 11D and the first wiring 21D or between the first wiring 21D and the second cover layer .
  • FIG. 8 shows a sixth embodiment of an expandable wiring board and is a partially enlarged cross-sectional view, which specifically corresponds to FIG.
  • the sixth embodiment differs from the second embodiment in that it further includes a second cover layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the second embodiment, and the same reference numerals as those of the second embodiment are given, and the description thereof is omitted.
  • the expandable wiring board 1E of the sixth embodiment further includes a second cover layer 14E laminated on the fourth main surface 122E.
  • the first wiring 21E and the second wiring 22E are arranged between the base material 11E and the second cover layer 14E. Thereby, the first wiring 21E and the second wiring 22E can be protected.
  • the base material 11E, the buffer layer 12E, and the second cover layer 14E correspond to an example of members included in the main body portion (stress relaxation portion) described in the claims.
  • composition of the second cover layer 14E the characteristics such as expansion ratio, Young's modulus, thickness, etc., and the configuration related to the peel strength between the second cover layer 14E and the first wiring 21E or the second wiring 22E are those of the fifth embodiment.
  • the configuration is the same as in
  • the second cover layer 14E may cover a portion of the periphery of the first wiring 21E where the first wiring 21E and the buffer layer 12E are not in contact. preferable.
  • the peel strength of S19 between the base material 11E and the buffer layer 12E, the peel strength of S20 between the buffer layer 12E and the first wiring 21E, the peel strength of S21 between the buffer layer 12E and the second wiring 22E, and the peel strength of S21 between the first wiring 21E and the first wiring 21E At least one of the peel strength S22 between the two cover layers 14E and the peel strength S23 between the second wiring 22E and the second cover layer 14E is equal to the peel strength S0 between the first wiring 21E and the second wiring 22E.
  • the peel strength between the buffer layer 12E and the second cover layer 14E is smaller than the peel strength between the first wiring 21E and the second wiring 22E. Therefore, when stress is applied in a direction perpendicular to the fourth main surface 122E, the buffer layer 12E and the second cover layer 14E are peeled off, and the peeling of the first wiring 21E and the second wiring 22E is suppressed. Therefore, the second cover layer 14E can protect the first wiring 21E and the second wiring 22E, and maintain electrical connection between the first wiring 21E and the second wiring 22E.
  • the peel strength between the buffer layer 12E and the first wiring 21E or the second wiring 22E is preferably smaller than the peel strength between the buffer layer 12E and the first cover layer 14E.
  • the peel strength between the buffer layer 12E and the second cover layer 14E can be measured according to JIS K 500-5-6.
  • the peel strength between the buffer layer 12E and the second cover layer 14E is preferably 0 or more and 4 or less.
  • the peel strength between the buffer layer 12E and the second cover layer 14E can be improved by irradiating the buffer layer 12E with ultraviolet light or by contacting the buffer layer 12E before forming the second cover layer 14E on the buffer layer 12E. It can be adjusted by forming a release agent layer provided on the surface. Since other effects of the configuration are the same as those of the second embodiment, description thereof will be omitted.
  • the base material 11E and the buffer layer 12E, the buffer layer 12E and the first wiring 21E, and the first wiring 21E and the second cover layer 14 are in contact with each other. At least one of between 11E and buffer layer 12E, between buffer layer 12E and first wiring 21E, and between first wiring 21E and second cover layer 14 may be separated from each other. In this case, at least one gap exists between the base material 11E and the first wiring buffer layer 12E, between the buffer layer 12E and the first wiring 21E, and between the first wiring 21E and the second cover layer 14. good too.
  • FIG. 9 shows a seventh embodiment of an expandable wiring board and is a partially enlarged cross-sectional view, specifically corresponding to FIG.
  • the seventh embodiment differs from the third embodiment in that it further includes a second cover layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the third embodiment, and the same reference numerals as those of the third embodiment are given, and the description thereof is omitted.
  • the stretchable wiring board 1F of the seventh embodiment further includes a first cover layer 13F and a second cover layer 14F laminated on the second main surface 112F. , is laminated on the first cover layer 13F. Therefore, excessive deformation of the base material 11F and wiring can be suppressed at locations where the shape of the base material 11F and wiring needs to be maintained. Furthermore, even if deformation occurs, the deformation can be absorbed by the flexible first cover layer 13F, and the first wiring 21F and the second wiring 22F can be protected.
  • the base material 11F, the first cover layer 13F, and the second cover layer 14F correspond to an example of a member included in the main body portion (stress relaxation portion) described in the claims.
  • composition of the second cover layer 14F and the composition of the characteristics such as expansion ratio, Young's modulus, and thickness are the same as those of the fifth embodiment.
  • At least one of S26 between the cover layers, S27 between the second wiring and the first cover layer, and S28 between the first cover layer and the second cover layer is peeled first, and the first wiring 21F and the second wiring 22F are separated. Contact can be maintained. Therefore, the first wiring 21F and the second wiring 22F are protected by the first cover layer 13F and the second cover layer 14F, and excessive deformation of the base material and the wiring is prevented in places where the shape of the base material and the wiring needs to be maintained. can be suppressed. Furthermore, even if deformation occurs, the deformation can be absorbed by the flexible first cover layer 13F, and the first wiring 21F and the second wiring 22F can be protected.
  • the peel strength between the first cover layer 13F and the second cover layer 14F is smaller than the peel strength between the first wiring 21F and the second wiring 22F. Therefore, when stress is applied in a direction orthogonal to the second main surface 112F, the first cover layer 13F and the second cover layer 14F are peeled off, and the peeling of the first wiring 21F and the second wiring 22F is suppressed. . Therefore, the first wiring 21F and the second wiring 22F can be protected by the first cover layer 13F and the second cover layer 14F, and the electrical connection between the first wiring 21F and the second wiring 22F can be maintained.
  • the peel strength between the first cover layer 13F and the second cover layer 14F can be measured according to JIS K 500-5-6.
  • the peel strength between the first cover layer 13F and the second cover layer 14F is preferably 0 or more and 4 or less.
  • the peel strength between the first cover layer 13F and the second cover layer 14F can be improved by irradiating the first cover layer 13F with ultraviolet rays before forming the second cover layer 14F on the first cover layer 13F, or It can be adjusted by forming a release agent layer provided in contact with the first cover layer 13F. Since other effects of the configuration are the same as those of the third embodiment, description thereof will be omitted.
  • the base material 11F and the first wiring 21F, the first wiring 21F and the first cover layer 13F, and the first cover layer 13F and the second cover layer 14F are in contact with each other, but the present invention is not limited to this.
  • at least one gap exists between the base material 11F and the first wiring 21F, between the first wiring 21F and the first cover layer 13F, and between the first cover layer 13F and the second cover layer 14F. You may have
  • FIG. 10 is a partially enlarged cross-sectional view showing an eighth embodiment of an expandable wiring board, and specifically corresponds to FIG.
  • the eighth embodiment differs from the fourth embodiment in that it further includes a second cover layer.
  • This different configuration is described below. The rest of the configuration is the same as that of the fourth embodiment, and the same reference numerals as those of the fourth embodiment are given, and the description thereof is omitted.
  • the stretchable wiring board 1G of the eighth embodiment further includes a first cover layer 13G and a second cover layer 14G laminated on the second main surface 112G. , is laminated on the first cover layer 13G. Therefore, excessive deformation of the base material 11G and wiring can be suppressed at locations where the shape of the base material 11G and wiring needs to be maintained. Furthermore, even if deformation occurs, the deformation can be absorbed by the flexible first cover layer 13G, and the first wiring 21G and the second wiring 22G can be protected.
  • the base material 11G, the buffer layer 12G, the first cover layer 13G, and the second cover layer 14G correspond to examples of members that the main body portion (stress relaxation portion) has.
  • the constituent material, expansion ratio, Young's modulus, thickness and other properties of the second cover layer 14G are the same as those in the fifth embodiment.
  • the second main surface 112G may have a region not covered with the first cover layer 13G, and a region where the substrate 11G and the second cover layer 14G are in direct contact. There may be.
  • One is smaller than the peel strength of S0 between the first wiring 21G and the second wiring 22G.
  • the buffer layer 12G, the first cover layer 13G, and the second cover layer 14G protect the first wiring 21G and the second wiring 22G, and at places where the shape of the base material and the wiring needs to be maintained, the base material and the wiring are protected. Excessive deformation of the can be suppressed. Furthermore, even if deformation occurs, the deformation can be absorbed by the flexible first cover layer 13G, and the first wiring 21G and the second wiring 22G can be protected.
  • the peel strength between the first cover layer 13G and the second cover layer 14G is smaller than the peel strength between the first wiring 21G and the second wiring 22G. Therefore, when stress is applied in a direction orthogonal to the second main surface 112G, the first cover layer 13G and the second cover layer 14G are peeled off, and the peeling of the first wiring 21G and the second wiring 22G is suppressed. . Therefore, the first wiring 21G and the second wiring 22G can be protected by the first cover layer 13G and the second cover layer 14G, and the electrical connection between the first wiring 21G and the second wiring 22G can be maintained.
  • the peel strength between the first cover layer 13G and the second cover layer 14G can be measured according to JIS K 500-5-6.
  • the peel strength between the first cover layer 13G and the second cover layer 14G is preferably 0 or more and 4 or less.
  • the peel strength between the first cover layer 13G and the second cover layer 14G can be obtained by irradiating the first cover layer 13G with ultraviolet rays before forming the second cover layer 14G on the first cover layer 13G, or It can be adjusted by forming a release agent layer provided in contact with the first cover layer 13G. Since other effects of the configuration are the same as those of the fourth embodiment, description thereof will be omitted.
  • the base material 11G and the buffer layer 12G, the buffer layer 12G and the first wiring 21G, the first wiring and the first cover layer 13G, and the first cover layer 13G and the second cover layer 14G are in contact with each other.
  • a void may be present in at least one of the .
  • the present invention is not limited to this, and the first cover layer 13G may be arranged on the second cover layer 14G.
  • the peel strength between the base material 11G and the buffer layer 12G, the peel strength between the buffer layer 12G and the first wiring 21G, the peel strength between the first wiring 21G and the second cover layer 14G, and the second cover layer At least one peel strength between 14G and first cover layer 13G is smaller than the peel strength between first wiring 21G and second wiring 22G.
  • FIG. 11 shows a ninth embodiment of an expandable wiring board and is a partially enlarged cross-sectional view, which specifically corresponds to FIG.
  • the ninth embodiment differs from the first embodiment in that a gap is provided between the base material and the second wiring.
  • This different configuration is described below. The rest of the configuration is the same as that of the first embodiment, and the same reference numerals as those of the first embodiment are given, and the description thereof is omitted.
  • the stretchable wiring board 1H of the ninth embodiment has a gap 51 between the base material 11H and the second wiring 22H.
  • the base material 11H corresponds to an example of the main body portion (stress relaxation portion) described in the claims.
  • the present invention there is a gap 51 between the base material 11H and the second wiring 22H, but the present invention is not limited to this, and the gap 51 may be provided between the base material 11H and the first wiring 21H. . Further, in the first to eighth embodiments, the gap 51 may be provided at any position among the interfaces S1 to S43 shown in FIGS. 3 to 10. FIG. For example, as shown in FIG. 12, in the eighth embodiment, a gap 51 may be provided at a position S39 between the buffer layer 12G and the second wiring 22G.
  • the base material 11H, the buffer layer 12H, the first cover layer 13H, and the second cover layer 15H correspond to an example of a member included in the main body portion (stress relaxation portion) described in the claims. Since other effects of the configuration are the same as those of the first embodiment, description thereof will be omitted.
  • the ninth embodiment there is a gap between the substrate and the first wiring or the second wiring, but it is not limited to this. between the first wiring or the second wiring and the first cover layer, between the first wiring or the second wiring and the second cover layer, or between the first cover layer and the second cover layer may have
  • FIG. 13 is a partially enlarged cross-sectional view showing a tenth embodiment of an expandable wiring board, and specifically corresponds to FIG. 14 is a cross-sectional view taken along line XIV-XIV of FIG. 13.
  • FIG. The tenth embodiment differs from the first embodiment in that it further has a hard portion. This different configuration is described below. The rest of the configuration is the same as that of the first embodiment, and the same reference numerals as those of the fifth embodiment are given, and the description thereof is omitted.
  • an expandable wiring board 1I of the tenth embodiment includes a base material 11I and first wirings 21I and second wirings 22I arranged on a second main surface 112I of the base material 11I. and further includes a rigid portion 15 .
  • the hard portion 15 covers the portion where the first wiring 21I and the second wiring 22I are in contact with each other, and is in contact with the base material 11I.
  • the edges of the first wiring 21I and the second wiring 22I are covered with the hard portion 15, so that moisture can be prevented from entering the first wiring 21I and the second wiring 22I.
  • the base material 11I corresponds to an example of the main body portion (stress relaxation portion) described in the claims.
  • the constituent material of the hard part 15 is not particularly limited, it is preferably a material having a Young's modulus higher than that of the stretchable base material 1I. Since the hard part 15 has a higher Young's modulus than the stretchable base material 1I, it is possible to more reliably suppress the intrusion of moisture into the first wirings 21I and the second wirings 22I.
  • Examples of materials having a higher Young's modulus than the elastic base material 1I include polyvinyl chloride, polyethylene, polystyrene, polycarbonate, polyvinylidene fluoride, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenol resin, epoxy resin, urethane resin, Elastomer-based resins such as resins, acrylic resins, silicone-based resins, and styrene/butadiene-based resins can be used.
  • the hard part 15 is preferably hard to stretch, and the stretch ratio of the hard part 15 is preferably 100% or less. Thereby, the first wiring 21D and the second wiring 22D can be appropriately fixed.
  • the Young's modulus of the hard portion 15 is preferably 100 MPa or more and 10,000 MPa or less. This makes it possible to further suppress the intrusion of moisture.
  • the thickness of the hard portion 15 is, for example, 10-50 ⁇ m.
  • the hard part 15 preferably has waterproofness. As a result, the penetration of moisture can be prevented, and the reliability of the expansion wiring board 1I can be maintained.
  • the hard portion 15 covers the portion where the first wiring 21I and the second wiring 22I are connected to each other, and is in contact with the base material 11I. As a result, the hard portion 15 protects the portion where the first wiring 21I and the second wiring 22I are in contact, and the first wiring 21I and the second wiring 22I located inside the hard portion 15 are exposed to the outside. Therefore, it is possible to prevent moisture from entering the first wiring 21I and the second wiring 22I.
  • the hard portion 15 may be further provided, and the hard portion may cover the portion where the first wiring and the second wiring are in contact with each other and may be in contact with the substrate.
  • the end of the buffer layer and the edges of the first wiring and the second wiring are all covered with the hard portion. Therefore, it is possible to prevent moisture from entering the first wiring and the second wiring.
  • a hard portion may be further provided, and the hard portion may cover the portion where the first wiring and the second wiring are in contact with each other and may be in contact with the substrate.
  • the edges of the buffer layer, the edges of the first wiring and the second wiring, and the edges of the first cover layer and the second cover layer are all covered with the hard portion. Therefore, it is possible to prevent moisture from entering the first wiring and the second wiring. Since other effects of the configuration are the same as those of the fifth embodiment, description thereof will be omitted.
  • the buffer layer has waterproofness, but it is not limited to this, and at least one of the base material, first cover layer, second cover layer and hard part may have waterproofness.
  • the waterproof base material, buffer layer, first cover layer, second cover layer, or hard part corresponds to an example of the waterproof layer described in the claims.
  • the number of layers of the base material, the buffer layer, the first cover layer, the second cover layer, and the hard portion is one, but the number is not limited to this, and the total number can be freely increased or decreased.
  • the peel strength in at least one of the combinations of two adjacent layers is It should be smaller than the peeling strength between the first wiring and the second wiring.
  • each layer included in the main body is not essential to the present invention.
  • the main body portion may be composed of only the base material and the hard part, or may be composed of only the base material and the second cover layer. The same applies to other combinations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
PCT/JP2022/040172 2022-01-04 2022-10-27 伸縮配線基板 Ceased WO2023132119A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202280087545.3A CN118511655A (zh) 2022-01-04 2022-10-27 伸缩布线基板
JP2023572358A JP7563632B2 (ja) 2022-01-04 2022-10-27 伸縮配線基板
US18/761,690 US20240357738A1 (en) 2022-01-04 2024-07-02 Stretchable wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-000247 2022-01-04
JP2022000247 2022-01-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/761,690 Continuation US20240357738A1 (en) 2022-01-04 2024-07-02 Stretchable wiring board

Publications (1)

Publication Number Publication Date
WO2023132119A1 true WO2023132119A1 (ja) 2023-07-13

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ID=87073439

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Application Number Title Priority Date Filing Date
PCT/JP2022/040172 Ceased WO2023132119A1 (ja) 2022-01-04 2022-10-27 伸縮配線基板

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JP (1) JP7563632B2 (https=)
CN (1) CN118511655A (https=)
WO (1) WO2023132119A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2006165389A (ja) * 2004-12-09 2006-06-22 Nippon Mektron Ltd プリント基板
JP2007335851A (ja) * 2006-05-15 2007-12-27 Matsushita Electric Ind Co Ltd 回路基板とその製造方法及び半導体装置
WO2019012909A1 (ja) * 2017-07-14 2019-01-17 ソニー株式会社 センサおよびセンサの製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2006165389A (ja) * 2004-12-09 2006-06-22 Nippon Mektron Ltd プリント基板
JP2007335851A (ja) * 2006-05-15 2007-12-27 Matsushita Electric Ind Co Ltd 回路基板とその製造方法及び半導体装置
WO2019012909A1 (ja) * 2017-07-14 2019-01-17 ソニー株式会社 センサおよびセンサの製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

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US20240357738A1 (en) 2024-10-24
JPWO2023132119A1 (https=) 2023-07-13
CN118511655A (zh) 2024-08-16
JP7563632B2 (ja) 2024-10-08

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