JP7563632B2 - 伸縮配線基板 - Google Patents

伸縮配線基板 Download PDF

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Publication number
JP7563632B2
JP7563632B2 JP2023572358A JP2023572358A JP7563632B2 JP 7563632 B2 JP7563632 B2 JP 7563632B2 JP 2023572358 A JP2023572358 A JP 2023572358A JP 2023572358 A JP2023572358 A JP 2023572358A JP 7563632 B2 JP7563632 B2 JP 7563632B2
Authority
JP
Japan
Prior art keywords
wiring
cover layer
substrate
peel strength
stretchable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023572358A
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English (en)
Japanese (ja)
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JPWO2023132119A1 (https=
JPWO2023132119A5 (https=
Inventor
遼 浅井
勇人 勝
圭佑 西田
孝義 小幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023132119A1 publication Critical patent/JPWO2023132119A1/ja
Publication of JPWO2023132119A5 publication Critical patent/JPWO2023132119A5/ja
Application granted granted Critical
Publication of JP7563632B2 publication Critical patent/JP7563632B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2023572358A 2022-01-04 2022-10-27 伸縮配線基板 Active JP7563632B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022000247 2022-01-04
JP2022000247 2022-01-04
PCT/JP2022/040172 WO2023132119A1 (ja) 2022-01-04 2022-10-27 伸縮配線基板

Publications (3)

Publication Number Publication Date
JPWO2023132119A1 JPWO2023132119A1 (https=) 2023-07-13
JPWO2023132119A5 JPWO2023132119A5 (https=) 2024-08-21
JP7563632B2 true JP7563632B2 (ja) 2024-10-08

Family

ID=87073439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572358A Active JP7563632B2 (ja) 2022-01-04 2022-10-27 伸縮配線基板

Country Status (4)

Country Link
US (1) US20240357738A1 (https=)
JP (1) JP7563632B2 (https=)
CN (1) CN118511655A (https=)
WO (1) WO2023132119A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2006165389A (ja) 2004-12-09 2006-06-22 Nippon Mektron Ltd プリント基板
JP2007335851A (ja) 2006-05-15 2007-12-27 Matsushita Electric Ind Co Ltd 回路基板とその製造方法及び半導体装置
WO2019012909A1 (ja) 2017-07-14 2019-01-17 ソニー株式会社 センサおよびセンサの製造方法
WO2019093069A1 (ja) 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019165048A (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2006165389A (ja) 2004-12-09 2006-06-22 Nippon Mektron Ltd プリント基板
JP2007335851A (ja) 2006-05-15 2007-12-27 Matsushita Electric Ind Co Ltd 回路基板とその製造方法及び半導体装置
WO2019012909A1 (ja) 2017-07-14 2019-01-17 ソニー株式会社 センサおよびセンサの製造方法
WO2019093069A1 (ja) 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019165048A (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Also Published As

Publication number Publication date
US20240357738A1 (en) 2024-10-24
JPWO2023132119A1 (https=) 2023-07-13
CN118511655A (zh) 2024-08-16
WO2023132119A1 (ja) 2023-07-13

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