CN118511655A - 伸缩布线基板 - Google Patents

伸缩布线基板 Download PDF

Info

Publication number
CN118511655A
CN118511655A CN202280087545.3A CN202280087545A CN118511655A CN 118511655 A CN118511655 A CN 118511655A CN 202280087545 A CN202280087545 A CN 202280087545A CN 118511655 A CN118511655 A CN 118511655A
Authority
CN
China
Prior art keywords
wiring
cover layer
peel strength
base material
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280087545.3A
Other languages
English (en)
Chinese (zh)
Inventor
浅井辽
胜勇人
西田圭佑
小幡孝义
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118511655A publication Critical patent/CN118511655A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202280087545.3A 2022-01-04 2022-10-27 伸缩布线基板 Pending CN118511655A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-000247 2022-01-04
JP2022000247 2022-01-04
PCT/JP2022/040172 WO2023132119A1 (ja) 2022-01-04 2022-10-27 伸縮配線基板

Publications (1)

Publication Number Publication Date
CN118511655A true CN118511655A (zh) 2024-08-16

Family

ID=87073439

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280087545.3A Pending CN118511655A (zh) 2022-01-04 2022-10-27 伸缩布线基板

Country Status (4)

Country Link
US (1) US20240357738A1 (https=)
JP (1) JP7563632B2 (https=)
CN (1) CN118511655A (https=)
WO (1) WO2023132119A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP4312702B2 (ja) * 2004-12-09 2009-08-12 日本メクトロン株式会社 プリント基板
JP4812686B2 (ja) * 2006-05-15 2011-11-09 パナソニック株式会社 回路基板とその製造方法及び半導体装置
US20200132520A1 (en) * 2017-07-14 2020-04-30 Sony Corporation Sensor and method of manufacturing sensor
US10959326B2 (en) * 2017-11-07 2021-03-23 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Also Published As

Publication number Publication date
US20240357738A1 (en) 2024-10-24
JPWO2023132119A1 (https=) 2023-07-13
WO2023132119A1 (ja) 2023-07-13
JP7563632B2 (ja) 2024-10-08

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