JPWO2023132119A1 - - Google Patents

Info

Publication number
JPWO2023132119A1
JPWO2023132119A1 JP2023572358A JP2023572358A JPWO2023132119A1 JP WO2023132119 A1 JPWO2023132119 A1 JP WO2023132119A1 JP 2023572358 A JP2023572358 A JP 2023572358A JP 2023572358 A JP2023572358 A JP 2023572358A JP WO2023132119 A1 JPWO2023132119 A1 JP WO2023132119A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023572358A
Other languages
Japanese (ja)
Other versions
JPWO2023132119A5 (https=
JP7563632B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023132119A1 publication Critical patent/JPWO2023132119A1/ja
Publication of JPWO2023132119A5 publication Critical patent/JPWO2023132119A5/ja
Application granted granted Critical
Publication of JP7563632B2 publication Critical patent/JP7563632B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2023572358A 2022-01-04 2022-10-27 伸縮配線基板 Active JP7563632B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022000247 2022-01-04
JP2022000247 2022-01-04
PCT/JP2022/040172 WO2023132119A1 (ja) 2022-01-04 2022-10-27 伸縮配線基板

Publications (3)

Publication Number Publication Date
JPWO2023132119A1 true JPWO2023132119A1 (https=) 2023-07-13
JPWO2023132119A5 JPWO2023132119A5 (https=) 2024-08-21
JP7563632B2 JP7563632B2 (ja) 2024-10-08

Family

ID=87073439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572358A Active JP7563632B2 (ja) 2022-01-04 2022-10-27 伸縮配線基板

Country Status (4)

Country Link
US (1) US20240357738A1 (https=)
JP (1) JP7563632B2 (https=)
CN (1) CN118511655A (https=)
WO (1) WO2023132119A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2006165389A (ja) * 2004-12-09 2006-06-22 Nippon Mektron Ltd プリント基板
JP2007335851A (ja) * 2006-05-15 2007-12-27 Matsushita Electric Ind Co Ltd 回路基板とその製造方法及び半導体装置
WO2019012909A1 (ja) * 2017-07-14 2019-01-17 ソニー株式会社 センサおよびセンサの製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039109A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 回路基板
JP2006165389A (ja) * 2004-12-09 2006-06-22 Nippon Mektron Ltd プリント基板
JP2007335851A (ja) * 2006-05-15 2007-12-27 Matsushita Electric Ind Co Ltd 回路基板とその製造方法及び半導体装置
WO2019012909A1 (ja) * 2017-07-14 2019-01-17 ソニー株式会社 センサおよびセンサの製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Also Published As

Publication number Publication date
US20240357738A1 (en) 2024-10-24
CN118511655A (zh) 2024-08-16
WO2023132119A1 (ja) 2023-07-13
JP7563632B2 (ja) 2024-10-08

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