JPWO2024070591A1 - - Google Patents

Info

Publication number
JPWO2024070591A1
JPWO2024070591A1 JP2024549982A JP2024549982A JPWO2024070591A1 JP WO2024070591 A1 JPWO2024070591 A1 JP WO2024070591A1 JP 2024549982 A JP2024549982 A JP 2024549982A JP 2024549982 A JP2024549982 A JP 2024549982A JP WO2024070591 A1 JPWO2024070591 A1 JP WO2024070591A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024549982A
Other languages
Japanese (ja)
Other versions
JP7758216B2 (ja
JPWO2024070591A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024070591A1 publication Critical patent/JPWO2024070591A1/ja
Publication of JPWO2024070591A5 publication Critical patent/JPWO2024070591A5/ja
Application granted granted Critical
Publication of JP7758216B2 publication Critical patent/JP7758216B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0283Stretchable printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/058Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0753Insulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2024549982A 2022-09-28 2023-09-08 伸縮性デバイス Active JP7758216B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022155135 2022-09-28
JP2022155135 2022-09-28
PCT/JP2023/032845 WO2024070591A1 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024070591A1 true JPWO2024070591A1 (https=) 2024-04-04
JPWO2024070591A5 JPWO2024070591A5 (https=) 2025-04-17
JP7758216B2 JP7758216B2 (ja) 2025-10-22

Family

ID=90477429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549982A Active JP7758216B2 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Country Status (3)

Country Link
US (1) US20250203765A1 (https=)
JP (1) JP7758216B2 (https=)
WO (1) WO2024070591A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088055A (ja) * 2005-09-20 2007-04-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板およびその製造方法
WO2008059571A1 (en) * 2006-11-15 2008-05-22 Panasonic Corporation Circuit board connection structure and circuit board
JP2010129803A (ja) * 2008-11-28 2010-06-10 Nitto Denko Corp 配線回路基板およびその製造方法
JP2013135172A (ja) * 2011-12-27 2013-07-08 Sumitomo Electric Printed Circuit Inc プリント配線板及びプリント配線板の接続構造
WO2013105402A1 (ja) * 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
US20170040306A1 (en) * 2015-06-30 2017-02-09 Apple Inc. Electronic Devices With Soft Input-Output Components
JP2017195230A (ja) * 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018010967A (ja) * 2016-07-13 2018-01-18 日本メクトロン株式会社 フレキシブルプリント配線板及びその製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088055A (ja) * 2005-09-20 2007-04-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板およびその製造方法
WO2008059571A1 (en) * 2006-11-15 2008-05-22 Panasonic Corporation Circuit board connection structure and circuit board
JP2010129803A (ja) * 2008-11-28 2010-06-10 Nitto Denko Corp 配線回路基板およびその製造方法
JP2013135172A (ja) * 2011-12-27 2013-07-08 Sumitomo Electric Printed Circuit Inc プリント配線板及びプリント配線板の接続構造
WO2013105402A1 (ja) * 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
US20170040306A1 (en) * 2015-06-30 2017-02-09 Apple Inc. Electronic Devices With Soft Input-Output Components
JP2017195230A (ja) * 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018010967A (ja) * 2016-07-13 2018-01-18 日本メクトロン株式会社 フレキシブルプリント配線板及びその製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Also Published As

Publication number Publication date
JP7758216B2 (ja) 2025-10-22
WO2024070591A1 (ja) 2024-04-04
US20250203765A1 (en) 2025-06-19

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