JPWO2023132119A5 - - Google Patents
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- Publication number
- JPWO2023132119A5 JPWO2023132119A5 JP2023572358A JP2023572358A JPWO2023132119A5 JP WO2023132119 A5 JPWO2023132119 A5 JP WO2023132119A5 JP 2023572358 A JP2023572358 A JP 2023572358A JP 2023572358 A JP2023572358 A JP 2023572358A JP WO2023132119 A5 JPWO2023132119 A5 JP WO2023132119A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- main body
- stretchable
- body portion
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 2
- 239000011800 void material Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022000247 | 2022-01-04 | ||
| JP2022000247 | 2022-01-04 | ||
| PCT/JP2022/040172 WO2023132119A1 (ja) | 2022-01-04 | 2022-10-27 | 伸縮配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023132119A1 JPWO2023132119A1 (https=) | 2023-07-13 |
| JPWO2023132119A5 true JPWO2023132119A5 (https=) | 2024-08-21 |
| JP7563632B2 JP7563632B2 (ja) | 2024-10-08 |
Family
ID=87073439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023572358A Active JP7563632B2 (ja) | 2022-01-04 | 2022-10-27 | 伸縮配線基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240357738A1 (https=) |
| JP (1) | JP7563632B2 (https=) |
| CN (1) | CN118511655A (https=) |
| WO (1) | WO2023132119A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039109A (ja) * | 2003-07-17 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 回路基板 |
| JP4312702B2 (ja) * | 2004-12-09 | 2009-08-12 | 日本メクトロン株式会社 | プリント基板 |
| JP4812686B2 (ja) * | 2006-05-15 | 2011-11-09 | パナソニック株式会社 | 回路基板とその製造方法及び半導体装置 |
| US20200132520A1 (en) * | 2017-07-14 | 2020-04-30 | Sony Corporation | Sensor and method of manufacturing sensor |
| US10959326B2 (en) * | 2017-11-07 | 2021-03-23 | Dai Nippon Printing Co., Ltd. | Stretchable circuit substrate and article |
| JP2019165048A (ja) * | 2018-03-19 | 2019-09-26 | 株式会社フジクラ | 伸縮性配線板及び伸縮性配線板の製造方法 |
-
2022
- 2022-10-27 JP JP2023572358A patent/JP7563632B2/ja active Active
- 2022-10-27 WO PCT/JP2022/040172 patent/WO2023132119A1/ja not_active Ceased
- 2022-10-27 CN CN202280087545.3A patent/CN118511655A/zh active Pending
-
2024
- 2024-07-02 US US18/761,690 patent/US20240357738A1/en active Pending
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