WO2023130570A1 - Procédé et appareil d'inspection de qualité de sertissage et support d'enregistrement lisible par ordinateur - Google Patents

Procédé et appareil d'inspection de qualité de sertissage et support d'enregistrement lisible par ordinateur Download PDF

Info

Publication number
WO2023130570A1
WO2023130570A1 PCT/CN2022/080741 CN2022080741W WO2023130570A1 WO 2023130570 A1 WO2023130570 A1 WO 2023130570A1 CN 2022080741 W CN2022080741 W CN 2022080741W WO 2023130570 A1 WO2023130570 A1 WO 2023130570A1
Authority
WO
WIPO (PCT)
Prior art keywords
crimping
connector
quality
value
curve
Prior art date
Application number
PCT/CN2022/080741
Other languages
English (en)
Chinese (zh)
Inventor
董典桥
汪志坤
邹旭军
刘红卫
张迪
李丹霞
谢志伟
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2023130570A1 publication Critical patent/WO2023130570A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • G01R31/69—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board of terminals at the end of a cable or a wire harness; of plugs; of sockets, e.g. wall sockets or power sockets in appliances
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Definitions

  • the embodiments of the present application relate to but are not limited to the technical field of intelligent manufacturing, and in particular relate to a crimping quality detection method, device and computer-readable storage medium.
  • crimping detection methods include AOI (Automated Optical Inspection) automatic optical detector, X-ray X-ray detection equipment, ICT (In Circuit Tester) and other means. direction and pressure deviation, but it is impossible to identify the problem of insufficient crimping;
  • X-ray detection method is currently a relatively effective means for crimping insufficient, but currently the single board is limited to the size range of 600mm, and it is completely dependent on personnel screening, and cannot Automatically screen out faulty single boards;
  • ICT can only identify crimping and disconnection, but cannot fully identify the problem of crimping that is not in place, and cannot accurately locate the fault.
  • Embodiments of the present application provide a crimping quality detection method, device, and computer-readable storage medium.
  • the embodiment of the present application provides a crimping quality detection method, including: obtaining the crimping data of the connector crimped to the printed circuit board; generating a crimping curve according to the crimping data; The crimping characteristic parameter value is extracted from the curve; the crimping quality of the connector is judged according to the crimping characteristic parameter value.
  • the embodiment of the present application provides a crimping quality detection device, including: a memory, a processor, and a computer program stored in the memory and operable on the processor, when the processor executes the computer program Realize the crimping quality inspection method as described in the first aspect above.
  • an embodiment of the present application provides an electronic device, including: a memory, a processor, and a computer program stored on the memory and operable on the processor, and the processor implements the above-mentioned first step when executing the computer program.
  • the crimping quality detection method is one aspect, the crimping quality detection method.
  • the embodiment of the present application provides a computer-readable storage medium, the computer-readable storage medium stores a computer-executable program, and the computer-executable program is used to make the computer perform the above-mentioned first aspect. Crimp quality inspection method.
  • Fig. 1 is the main flowchart of a crimping quality detection method provided by an embodiment of the present application
  • Fig. 2 is a schematic diagram of a crimping curve of a connector provided by an embodiment of the present application
  • Fig. 3 is a schematic structural diagram of a high-speed connector provided by an embodiment of the present application.
  • Fig. 4 is a schematic structural diagram of a socket provided by an embodiment of the present application.
  • Fig. 5 is a schematic structural diagram of a connector inserted into a socket provided by an embodiment of the present application
  • Fig. 6 is a schematic structural diagram of a PCB backplane with a connector and a socket provided by an embodiment of the present application;
  • Fig. 7 is a schematic structural diagram of a crimping quality detection device provided by an embodiment of the present application.
  • Fig. 8 is a sub-flow chart of a crimping quality detection method provided by an embodiment of the present application.
  • Fig. 9 is a statistical analysis diagram of the normal distribution of crimping characteristic parameters provided by an embodiment of the present application.
  • Fig. 10 is a schematic diagram of a standard interval band of a crimping curve provided by an embodiment of the present application.
  • Fig. 11 is a sub-flow chart of a crimping quality detection method provided by an embodiment of the present application.
  • Fig. 12 is an operation principle diagram of crimping quality inspection provided by an embodiment of the present application.
  • Fig. 13 is a schematic structural diagram of a crimping quality detection device provided by an embodiment of the present application.
  • Fig. 14 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • multiple means more than two, greater than, less than, exceeding, etc. are understood as not including the original number, and above, below, within, etc. are understood as including the original number. If there is a description of "first”, “second”, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the indicated The sequence relationship of the technical characteristics.
  • crimping detection methods include AOI (Automated Optical Inspection) automatic optical detector, X-ray X-ray detection equipment, ICT (In Circuit Tester) and other means.
  • AOI Automated Optical Inspection
  • X-ray X-ray detection equipment ICT (In Circuit Tester) and other means.
  • AOI can only identify the curved needle, Reverse and bias, but it is impossible to identify the problem of insufficient crimping
  • X-ray detection method is currently a relatively effective means for crimping insufficient, but currently the single board is limited to a size range of 600mm, and it is completely dependent on personnel screening. Faulty single boards cannot be automatically screened out; ICT can only identify crimping and disconnection, but cannot fully identify the problem of crimping that is not in place, and cannot accurately locate the fault.
  • the embodiments of the present application provide a crimping quality detection method, device, and computer-readable storage medium to obtain the crimping quality of the connector to the printed circuit.
  • the crimping curve is generated according to the crimping data
  • the crimping characteristic parameter value is extracted from the crimping curve
  • the crimping quality of the connector is judged according to the crimping characteristic parameter value.
  • This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.
  • FIG. 1 is a flowchart of a crimping quality detection method provided by an embodiment of the present application.
  • the crimping quality inspection method includes but not limited to the following steps:
  • Step 101 obtaining the crimping data of the connector being crimped to the printed circuit board
  • Step 102 generating a crimping curve according to the crimping data
  • Step 103 extracting crimping characteristic parameter values from the crimping curve
  • Step 104 judging the crimping quality of the connector according to the crimping characteristic parameter value.
  • the connectors include high-speed connectors, and this method can solve the problem of improper crimping of the backplane of the 15KV5 bearing high-speed connector.
  • the crimping data of the connector crimped to the printed circuit board is obtained, the crimping curve is generated from the crimping data, the crimping characteristic parameter value is extracted from the pressure curve, and the crimping of the connector is identified by the crimping characteristic parameter value Quality problems, so as to realize the control of crimping quality.
  • the crimping characteristic parameter value is generally selected from the turning point where the slope of the crimping curve changes significantly, so as to reflect the key characteristics of the crimping curve at different stages, and use it as a control index for judging the crimping quality .
  • the pressure sensor and the distance sensor of the crimping equipment can be used to obtain the crimping data collected during the crimping process of the connector, and the distribution of the pressure with the distance can be used to generate correlation curve, the crimping curve can be obtained.
  • the crimping curve can represent the corresponding relationship between crimping displacement and crimping force.
  • the crimping curve for high-speed connectors can be divided into four stages. 1
  • the fisheye terminal contacts the PCB hole of the printed circuit board, and the elastically deformable fisheye terminal begins to compress and deform. As the deformation of the fisheye terminal increases, the crimping force increases and the slope of the curve increases. 2
  • the deformation of the fisheye terminal reaches the maximum in the PCB hole, the crimping force reaches the peak value, and the curve appears an obvious inflection point.
  • 3 The fisheye terminal continues to slide in the PCB hole, the crimping force decreases to a certain extent, and the slope of the curve appears negative. 4When the connector body touches the surface of the PCB, the crimping force increases rapidly, and the slope of the curve increases rapidly.
  • Figure 3 is a schematic structural diagram of a high-speed connector
  • Figure 4 is a structural schematic diagram of a socket
  • Figure 5 is a structural schematic diagram of a connector inserted into a socket
  • Figure 6 is a schematic structural diagram of a connector with a connector.
  • the device 100 has a pin 110, and one end of the pin 110 facing the socket 200 is provided with a fisheye terminal 120, and the fisheye terminal 120 is elastically deformable.
  • the crimping characteristic parameter values extracted from the crimping curve include the first crimping displacement value h0, the second crimping displacement value h1, the first crimping force value f0, the The second crimping force value f1, the third crimping force value f2, the fourth crimping force value f3, and the fifth crimping force value f4, the first crimping displacement value h0 are used to represent the absolute distance that the pin 110 slides in the socket 310,
  • the second crimping displacement value h1 is used to represent the movement distance of the pin 110 sliding in the socket 310 after the fisheye terminal 120 completes the maximum deformation
  • the first crimping force value f0 is used to represent when the high-
  • f0 is the pressure when the pressure module first contacts the connector
  • p0 is the Z-axis position at this time
  • h0 is the absolute distance that the connector pin slides in the PCB hole, which can effectively indicate whether the crimping is complete.
  • the size of h0 should be close to the size H of the pin protruding from the PCB surface during pre-insertion.
  • the starting position p1 of h0 is confirmed.
  • the looper touches the surface of the PCB and begins to slide.
  • the corresponding pressure is f1.
  • the end position p4 is the crimping stop position.
  • Both the connector and the PCB have dimensional tolerances, so the starting position can fluctuate slightly from side to side.
  • h1 is the absolute distance that the connector pin slides in the PCB hole after the maximum deformation is completed, the starting position p2 is the peak position of the curve, and the end position p3 is the valley position of the curve, that is, the connector body touches the surface of the socket, and f3 is when it is just in contact The corresponding pressure size.
  • the reduction of h1 indicates that the connector may be raised; f2 is the crimping force when the connector pin is deformed at the maximum, that is, the crimping force at the peak of the curve. f2 decreases, indicating that the number of pins may be reduced when the pin is deformed at the maximum or the PCB aperture/pin size is abnormal.
  • h1 and f2 can effectively characterize whether the connector pin is kneeling (that is, the pin hits the foreign object in the PCB hole and is not bending occurs).
  • f4 is the maximum crimping force during the crimping process, which can effectively indicate whether the connector is over-pressed.
  • the crimping quality of the connector is judged according to the crimping characteristic parameter value.
  • the crimping threshold range corresponding to the control of the first crimping displacement value h0 is expressed as H0, when h0 is less than H0, it can be determined that the connector is "incomplete crimping", it should be pointed out that, as shown in Figure 2 , H0 is the difference between p4 and p1.
  • the crimping threshold range corresponding to the second crimping displacement value h1 is denoted as H1
  • the crimping threshold range corresponding to the third crimping force value f2 is denoted as F2
  • H1 is the difference between p3 and p2.
  • H1 is the difference between p3 and p2.
  • h1 is greater than or equal to H1 and f2 is less than F2
  • the PCB aperture/connector pin size is abnormal.
  • the characteristic parameters such as H0 and H1 are missing, it may be determined that "connector pressure leakage”.
  • this application can realize the automatic identification of crimping failure, kneeling pins, and pressure leakage of 5G bearer products, and realize the interception control and fault location of faulty products, realize the automatic identification and control of faulty products of 5G bearer products, and ensure product crimping quality.
  • the crimping quality inspection device may include a scanning device 10 , a crimping device 20 , a data analysis system 30 and a quality control system 40 .
  • the crimping equipment 20 may include an indenter 21 and a pressure sensor 22
  • the data analysis system may include a crimping data acquisition module, a crimping curve characteristic parameter analysis module, a characteristic parameter verification transfer module and a threshold self-learning module
  • a quality control system 40 may include an NG cache area, a maintenance entry area and a data query area.
  • the crimping device 20 can be a common servo-driven crimping machine or any other type of crimping machine, which can control the speed, displacement and applied force of the indenter 21 in the vertical direction with a certain program; and the pressure sensor 22 is used to detect the pressure.
  • the crimping force in the splicing process can realize the feedback of the crimping curve.
  • the crimping data acquisition module in the data analysis system 30 is used to collect the displacement data of the indenter and the corresponding crimping force data during the crimping process, and simultaneously generate the crimping curve of displacement-crimping force; the crimping curve characteristic parameter analysis module has built-in crimping
  • the curve feature parameter extraction algorithm quickly calculates the feature parameters of the output crimping curve, the feature parameters are verified and forwarded to the module, the feature parameters are compared with the threshold value, and the system determines whether the crimping is bad;
  • the threshold self-learning module is used to read batch crimping standard curves, Calculate the initial threshold of characteristic parameters, and carry out self-learning on the maintenance data. It should be noted that the data analysis system can be connected with any number of crimping devices 20 that meet the functions.
  • the NG buffer area in the quality control system 40 is used for alarming and intercepting the products with abnormal crimping quality determined by the system; the maintenance entry area is used for entering the actual maintenance results of the crimping process; the data query area is used to support time, program, curve Wait for all crimping process data queries.
  • the method of this application may also include but not limited to the following sub-steps:
  • Step 801 perform normal distribution statistical analysis on the crimping data to generate a standard interval of the crimping curve, the standard interval includes an upper interval and a lower interval, wherein the upper interval is used to represent the upper limit of the crimping threshold , the lower interval is used to represent the lower limit of the crimping threshold, and the crimping threshold range is determined by the upper limit and the lower limit;
  • Step 802 when it is determined that the crimping curve is located between the upper zone and the lower zone, it is determined that the crimping quality of the connector meets the quality requirement.
  • the crimping is normal, and the characteristic parameters h0, h1, f0, f1, f2, f3, f4 can be obtained from the pressure curve, and the corresponding crimping quality of the connector can be obtained from the upper and lower intervals
  • Control the threshold range H0, H1, F0, F1, F2, F3, F4 calculate and compare whether the characteristic parameters of the crimping curve meet the threshold after the connector crimping is completed, and determine whether the quality of the connector crimping is good.
  • the displacement characteristics of the crimping process are used to intercept faults, breaking through the size limit of the single board, and quickly detecting connectors with crimping faults.
  • the method of this application may also include but not limited to the following sub-steps:
  • Step 1101 when it is determined that the value of the crimping characteristic parameter is outside the range of the crimping threshold, output a re-inspection instruction, the re-inspection instruction is used to instruct the manual re-inspection of the crimping quality of the connector;
  • Step 1102 when it is determined that the crimping quality of the manually re-inspected connector meets the quality requirements, add the re-acquired crimping data after the manual re-inspection to the normal distribution statistical analysis, so as to regenerate the standard interval band of the crimping curve .
  • the crimping characteristic parameter value when it is determined that the crimping characteristic parameter value is within the crimping threshold range, it is determined that the crimping quality of the connector meets the quality requirement. However, when it is determined that the crimping characteristic parameter value is outside the crimping threshold range, it is not directly judged as a defective product, and a re-inspection is required to manually confirm the crimping quality of the connector. For example, if the crimping characteristic parameter value is not within the connector crimping threshold range, this part of the crimping data will be recorded as maintenance data, and the corresponding connector will be stored in the NG cache area, and the connector will be manually reset by a professional engineer.
  • the crimping quality of the manual re-inspection connector meets the quality requirements, enter the corresponding crimping data, and add the crimping data to the normal distribution statistical analysis to regenerate the standard interval band of the crimping curve. It makes it possible to optimize the standard interval band of the crimping curve through continuous self-learning, and continuously correct and converge the crimping threshold range, thereby continuously improving the accuracy of judging the crimping quality of the connector.
  • step 101 it may also include but not limited to the following sub-steps:
  • the product information includes product name, product barcode and crimping program, wherein the crimping program includes at least one of the following: crimping device, crimping position, Crimp speed and crimp force.
  • the crimping equipment will read the product information of the connector before the crimping operation, including the product name, product barcode and crimping program, so as to generate the corresponding product name and product barcode according to the read product name and product barcode.
  • the crimping curve and according to the read crimping program, select the crimping device, and crimp the crimping position of the product according to the corresponding crimping speed and crimping force, so as to ensure the standardization of crimping operation.
  • this application Based on this, this application generates crimping curves from crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.
  • this embodiment is described with the following crimping quality detection operation flow.
  • the crimping equipment 001 controls the indenter to complete one connector crimping according to the crimping procedure.
  • the crimping equipment has a built-in pressure sensor, which can detect the crimping force in the process in real time and record the crimping data in real time.
  • the crimping equipment 001 has a crimping data acquisition module and a crimping curve characteristic parameter analysis module. Among them, the crimping data acquisition module collects the crimping data recorded by the crimping equipment, and generates the displacement-crimping force curve; at the same time, it reads the crimping product information, including product name, barcode, crimping device, crimping position, etc.
  • connection data corresponds to the crimping process one by one.
  • the crimp curve characteristic parameter analysis module reads the collected crimp data in real time, and calculates whether the curve pressure value of each crimp meets the pressure range and satisfies the crimp curve characteristics h0, h1, f0, f2, f4 .
  • the crimping curve learning module 002 is used for fitting calculations based on a large number of historical crimping curves and PCB advance contact displacement values, and for self-learning of crimping maintenance data.
  • the connector and the connector to be crimped are of the same model.
  • Crimp curve standard library 003 is used to store crimp threshold standards for different connectors. This module reads batch crimp standard curves to obtain a large number of normal crimp curve data, and obtains the upper and lower crimp interval zones and crimp curves through 3 ⁇ normal distribution. The characteristic threshold of the normal curve.
  • the crimping curve testing module 004 is used to judge whether the current crimping value satisfies the crimping range.
  • the verification transfer module 005 judges whether to transfer to the NG cache area 006 or the next process segment 007 according to the connector standard.
  • the product enters the transfer verification through the transfer verification module 005, and obtains product information by scanning, including product barcode, name, crimping program (crimping program includes crimping device, crimping position, speed and pressure setting), and through the main crimping
  • crimping program includes crimping device, crimping position, speed and pressure setting
  • the characteristic value is controlled and judged, and the judgment criteria include but are not limited to the following:
  • the standard threshold ranges H0, H1, F0, F2, and F4 are continuously corrected and converged, and the self-learning function standard threshold ranges H0, H1, F0, F2, and F4 that further improve the system's judgment accuracy will be With the continuous generation of crimping, self-learning and optimization parameter standards are stored in the standard library.
  • the crimping After the crimping is completed, if it is within the threshold range of the connector, it will be crimped in place, enter the automatic scanning and transfer module, check the barcode information of the board, and continue to the next process according to the crimping result, if it is not within the threshold range of the connector crimping , otherwise, it will be stored in the NG cache area. After the engineer confirms on site and enters the corresponding maintenance data, the system will automatically obtain the maintenance data and measurement values for data optimization.
  • the embodiment of the present application also provides a crimping quality detection device.
  • the crimping quality detection device includes: one or more processors and memory, and one processor and memory is taken as an example in FIG. 13 .
  • the processor and the memory may be connected through a bus or in other ways, and connection through a bus is taken as an example in FIG. 13 .
  • the memory can be used to store non-transitory software programs and non-transitory computer-executable programs, such as the crimping quality detection method in the above embodiments of the present application.
  • the processor executes the non-transitory software program and the program stored in the memory, so as to realize the crimping quality detection method in the above embodiment of the present application.
  • the memory can include a program storage area and a data storage area, wherein the program storage area can store the operating system and at least one application program required by the function; data etc.
  • the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid-state storage devices.
  • the memory may include a memory that is remotely located relative to the processor, and these remote memories may be connected to the crimping quality detection device through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
  • the non-transitory software programs and programs required to realize the crimping quality detection method in the above-mentioned embodiments of the present application are stored in the memory, and when executed by one or more processors, the crimping quality detection method in the above-mentioned embodiments of the present application is executed.
  • the detection method for example, executes method steps 101 to 104 in FIG. 1 described above, method steps 801 to 802 in FIG. 8 , and method steps 1101 to 1102 in FIG.
  • the crimping curve is generated according to the crimping data, the crimping characteristic parameter value is extracted from the crimping curve, and the crimping quality of the connector is judged according to the crimping characteristic parameter value.
  • This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control.
  • this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.
  • the embodiment of the present application also provides an electronic device.
  • the electronic device includes: one or more processors and memories, and one processor and memories are taken as an example in FIG. 14 .
  • the processor and the memory may be connected through a bus or in other ways. In FIG. 14, connection through a bus is taken as an example.
  • the memory can be used to store non-transitory software programs and non-transitory computer-executable programs, such as the crimping quality detection method in the above embodiments of the present application.
  • the processor executes the non-transitory software program and the program stored in the memory, so as to realize the crimping quality detection method in the above embodiment of the present application.
  • the memory can include a program storage area and a data storage area, wherein the program storage area can store the operating system and at least one application program required by the function; data etc.
  • the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid-state storage devices.
  • the memory may include a memory that is remotely located relative to the processor, and these remote memories may be connected to the crimping quality detection device through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
  • the non-transitory software programs and programs required to realize the crimping quality detection method in the above-mentioned embodiments of the present application are stored in the memory, and when executed by one or more processors, the crimping quality detection method in the above-mentioned embodiments of the present application is executed.
  • the detection method for example, executes method steps 101 to 104 in FIG. 1 described above, method steps 801 to 802 in FIG. 8 , and method steps 1101 to 1102 in FIG.
  • the crimping curve is generated according to the crimping data, the crimping characteristic parameter value is extracted from the crimping curve, and the crimping quality of the connector is judged according to the crimping characteristic parameter value.
  • This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control.
  • this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.
  • the embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores a computer-executable program, and the computer-executable program is executed by one or more control processors, for example, shown in FIG. 13 Execution by one of the processors may cause the above-mentioned one or more processors to execute the crimping quality detection method in the above-mentioned embodiment of the present application, for example, to execute the method steps 101 to 104 in FIG. 1 described above, and in FIG. 8 The method step 801 to step 802, the method step 1101 to step 1102 in Fig.
  • this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.
  • the embodiment of the present application includes: obtaining the crimping data of the connector crimped to the printed circuit board, generating the crimping curve according to the crimping data, extracting the crimping characteristic parameter value from the crimping curve, and judging the connector according to the crimping characteristic parameter value Crimp quality.
  • This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control.
  • this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.
  • Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, tape, magnetic disk storage or other magnetic storage devices, or Any other medium used to store desired information and which can be accessed by a computer.
  • communication media typically embodies computer readable programs, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media .

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

Procédé et appareil d'inspection de qualité de sertissage et support d'enregistrement lisible par ordinateur. Le procédé comprend : l'acquisition de données de sertissage d'un connecteur serti sur une carte de circuit imprimé (101) ; la génération d'une courbe de sertissage en fonction des données de sertissage (102) ; l'extraction de valeurs de paramètre de caractéristique de sertissage de la courbe de sertissage (103) ; et la détermination de la qualité de sertissage du connecteur en fonction des valeurs de paramètre de caractéristique de sertissage (104).
PCT/CN2022/080741 2022-01-05 2022-03-14 Procédé et appareil d'inspection de qualité de sertissage et support d'enregistrement lisible par ordinateur WO2023130570A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210007362.8 2022-01-05
CN202210007362.8A CN116413636A (zh) 2022-01-05 2022-01-05 压接质量检测方法、装置和计算机可读存储介质

Publications (1)

Publication Number Publication Date
WO2023130570A1 true WO2023130570A1 (fr) 2023-07-13

Family

ID=87058616

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/080741 WO2023130570A1 (fr) 2022-01-05 2022-03-14 Procédé et appareil d'inspection de qualité de sertissage et support d'enregistrement lisible par ordinateur

Country Status (2)

Country Link
CN (1) CN116413636A (fr)
WO (1) WO2023130570A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140065855A1 (en) * 2012-08-28 2014-03-06 Zierick Manufacturing Corporation Surface mount zipcord connector and method of making electrical contact with zipcord conductors
CN105514754A (zh) * 2016-01-30 2016-04-20 宾兴 一种连接器自动压接机、压接系统及其压接工艺
CN106197810A (zh) * 2016-08-30 2016-12-07 王建波 一种基于传导机构的大量程高精度压力实时监测系统及其监测方法
CN214899174U (zh) * 2021-02-20 2021-11-26 华为技术有限公司 连接器及电路板组件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140065855A1 (en) * 2012-08-28 2014-03-06 Zierick Manufacturing Corporation Surface mount zipcord connector and method of making electrical contact with zipcord conductors
CN105514754A (zh) * 2016-01-30 2016-04-20 宾兴 一种连接器自动压接机、压接系统及其压接工艺
CN106197810A (zh) * 2016-08-30 2016-12-07 王建波 一种基于传导机构的大量程高精度压力实时监测系统及其监测方法
CN214899174U (zh) * 2021-02-20 2021-11-26 华为技术有限公司 连接器及电路板组件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WU, HUAIBING: "Research on Crimping Process of LRMD Ultra-high Speed Connector and PCB", NEW TECHNOLOGY & NEW PROCESS, no. 9, 30 November 2021 (2021-11-30), pages 9 - 14, XP009547705, ISSN: 1003-5311, DOI: 10.16635/j.cnki.1003-5311.2021.09.003 *

Also Published As

Publication number Publication date
CN116413636A (zh) 2023-07-11

Similar Documents

Publication Publication Date Title
CN113030121B (zh) 用于电路板元器件的自动光学检测方法、系统、及设备
CN106529369A (zh) 元件安装状态检测方法和系统
CN110874691A (zh) 一种总装下线控制方法及系统
WO2023130570A1 (fr) Procédé et appareil d'inspection de qualité de sertissage et support d'enregistrement lisible par ordinateur
CN110516375B (zh) 一种异常板卡的检测方法、装置、电子设备及存储介质
CN117572209A (zh) 一种智能门锁主板pcba测试方法
US20140055160A1 (en) Apparatus and method for inspection of marking
CN116008787A (zh) 待测器件dut异常识别方法、装置及设备
TWI785579B (zh) 元件辨識模型之自動模型重建方法及系統
CN113538725B (zh) 一种硬件产品的测试方法及相关设备
CN105069705A (zh) 基于巡检机器人的数据考核方法和系统
CN112798109B (zh) 一种主板质量的检测评价装置
WO2023137850A1 (fr) Procédé et système de détection pour état de sertissage de connecteur, dispositif de commande et support d'enregistrement
KR20150104766A (ko) 검사공정에서의 불량 이력 추적 방법
CN117686516B (zh) 基于机器视觉的芯片外观缺陷自动检测系统
CN116744573B (zh) Pcb追踪控制系统和方法
JP2001077600A (ja) 検査システム
CN113515507B (zh) 应用于大坝渗水检测的方法及系统
US20230344186A1 (en) Method and system for machine determining wire contact insertion
JP6822207B2 (ja) 検査装置
CN115768103A (zh) 印制电路板贴片监控方法、装置、计算机设备和存储介质
CN115097914B (zh) 一种内存插槽、内存插拔控制系统及其工作方法
CN117316248B (zh) 基于深度学习的tf卡运行智能检测系统
CN111190830B (zh) 自动识别电脑端口状态并启动测试程序的方法及装置
CN115808887A (zh) 电路板制程控制系统及其方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22918036

Country of ref document: EP

Kind code of ref document: A1