WO2023130570A1

WO2023130570A1 - Crimping quality inspection method and apparatus and computer readable storage medium

Info

Publication number: WO2023130570A1
Application number: PCT/CN2022/080741
Authority: WO
Inventors: 董典桥; 汪志坤; 邹旭军; 刘红卫; 张迪; 李丹霞; 谢志伟
Original assignee: 中兴通讯股份有限公司
Priority date: 2022-01-05
Filing date: 2022-03-14
Publication date: 2023-07-13
Also published as: CN116413636A

Abstract

A crimping quality inspection method and apparatus and a computer readable storage medium. The method comprises: acquiring crimping data of a connector crimped to a printed circuit board (101); generating a crimping curve according to the crimping data (102); extracting crimping feature parameter values from the crimping curve (103); and determining the crimping quality of the connector according to the crimping feature parameter values (104).

Description

Crimp quality detection method, device and computer-readable storage medium

Cross References to Related Applications

This application is based on a Chinese patent application with application number 202210007362.8 and a filing date of January 5, 2022, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.

technical field

The embodiments of the present application relate to but are not limited to the technical field of intelligent manufacturing, and in particular relate to a crimping quality detection method, device and computer-readable storage medium.

Background technique

In related technical solutions, crimping detection methods include AOI (Automated Optical Inspection) automatic optical detector, X-ray X-ray detection equipment, ICT (In Circuit Tester) and other means. direction and pressure deviation, but it is impossible to identify the problem of insufficient crimping; X-ray detection method is currently a relatively effective means for crimping insufficient, but currently the single board is limited to the size range of 600mm, and it is completely dependent on personnel screening, and cannot Automatically screen out faulty single boards; ICT can only identify crimping and disconnection, but cannot fully identify the problem of crimping that is not in place, and cannot accurately locate the fault.

At present, the most cutting-edge 5G bearer products have the characteristics of high requirements for backplane crimping process, many connectors, and large board size. The complexity of crimping is much higher than that of general crimping products, and some current backplane crimping Detection technologies such as AOI, ICT and other equipment cannot accurately locate defects such as crimping in place, pressure leakage, kneeling needles, etc., and X-RAY equipment that can detect such defects has limitations in relying on personnel's visual inspection and product size. Therefore, Existing detection methods are not suitable for 5G bearer products.

Contents of the invention

The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.

Embodiments of the present application provide a crimping quality detection method, device, and computer-readable storage medium.

In the first aspect, the embodiment of the present application provides a crimping quality detection method, including: obtaining the crimping data of the connector crimped to the printed circuit board; generating a crimping curve according to the crimping data; The crimping characteristic parameter value is extracted from the curve; the crimping quality of the connector is judged according to the crimping characteristic parameter value.

In the second aspect, the embodiment of the present application provides a crimping quality detection device, including: a memory, a processor, and a computer program stored in the memory and operable on the processor, when the processor executes the computer program Realize the crimping quality inspection method as described in the first aspect above.

In a third aspect, an embodiment of the present application provides an electronic device, including: a memory, a processor, and a computer program stored on the memory and operable on the processor, and the processor implements the above-mentioned first step when executing the computer program. In one aspect, the crimping quality detection method.

In the fourth aspect, the embodiment of the present application provides a computer-readable storage medium, the computer-readable storage medium stores a computer-executable program, and the computer-executable program is used to make the computer perform the above-mentioned first aspect. Crimp quality inspection method.

Additional features and advantages of the application will be set forth in the description which follows, and, in part, will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Description of drawings

The accompanying drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solution of the present application, and do not constitute a limitation to the technical solution of the present application.

Fig. 1 is the main flowchart of a crimping quality detection method provided by an embodiment of the present application;

Fig. 2 is a schematic diagram of a crimping curve of a connector provided by an embodiment of the present application;

Fig. 3 is a schematic structural diagram of a high-speed connector provided by an embodiment of the present application;

Fig. 4 is a schematic structural diagram of a socket provided by an embodiment of the present application;

Fig. 5 is a schematic structural diagram of a connector inserted into a socket provided by an embodiment of the present application;

Fig. 6 is a schematic structural diagram of a PCB backplane with a connector and a socket provided by an embodiment of the present application;

Fig. 7 is a schematic structural diagram of a crimping quality detection device provided by an embodiment of the present application;

Fig. 8 is a sub-flow chart of a crimping quality detection method provided by an embodiment of the present application;

Fig. 9 is a statistical analysis diagram of the normal distribution of crimping characteristic parameters provided by an embodiment of the present application;

Fig. 10 is a schematic diagram of a standard interval band of a crimping curve provided by an embodiment of the present application;

Fig. 11 is a sub-flow chart of a crimping quality detection method provided by an embodiment of the present application;

Fig. 12 is an operation principle diagram of crimping quality inspection provided by an embodiment of the present application;

Fig. 13 is a schematic structural diagram of a crimping quality detection device provided by an embodiment of the present application;

Fig. 14 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

It should be understood that in the description of the embodiments of the present application, multiple (or multiple) means more than two, greater than, less than, exceeding, etc. are understood as not including the original number, and above, below, within, etc. are understood as including the original number. If there is a description of "first", "second", etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the indicated The sequence relationship of the technical characteristics.

In related technical solutions, crimping detection methods include AOI (Automated Optical Inspection) automatic optical detector, X-ray X-ray detection equipment, ICT (In Circuit Tester) and other means. AOI can only identify the curved needle, Reverse and bias, but it is impossible to identify the problem of insufficient crimping; X-ray detection method is currently a relatively effective means for crimping insufficient, but currently the single board is limited to a size range of 600mm, and it is completely dependent on personnel screening. Faulty single boards cannot be automatically screened out; ICT can only identify crimping and disconnection, but cannot fully identify the problem of crimping that is not in place, and cannot accurately locate the fault.

Aiming at the problem that the existing detection technology cannot automatically identify the defective faults of 5G bearer products that are not properly crimped, the embodiments of the present application provide a crimping quality detection method, device, and computer-readable storage medium to obtain the crimping quality of the connector to the printed circuit. According to the crimping data of the board, the crimping curve is generated according to the crimping data, the crimping characteristic parameter value is extracted from the crimping curve, and the crimping quality of the connector is judged according to the crimping characteristic parameter value. This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.

As shown in FIG. 1 , FIG. 1 is a flowchart of a crimping quality detection method provided by an embodiment of the present application. The crimping quality inspection method includes but not limited to the following steps:

Step 101, obtaining the crimping data of the connector being crimped to the printed circuit board;

Step 102, generating a crimping curve according to the crimping data;

Step 103, extracting crimping characteristic parameter values from the crimping curve;

Step 104, judging the crimping quality of the connector according to the crimping characteristic parameter value.

It can be understood that the connectors include high-speed connectors, and this method can solve the problem of improper crimping of the backplane of the 15KV5 bearing high-speed connector. Specifically, the crimping data of the connector crimped to the printed circuit board is obtained, the crimping curve is generated from the crimping data, the crimping characteristic parameter value is extracted from the pressure curve, and the crimping of the connector is identified by the crimping characteristic parameter value Quality problems, so as to realize the control of crimping quality. It should be noted that the crimping characteristic parameter value is generally selected from the turning point where the slope of the crimping curve changes significantly, so as to reflect the key characteristics of the crimping curve at different stages, and use it as a control index for judging the crimping quality .

It can be understood that, for the method of generating the crimping curve based on the crimping data, the pressure sensor and the distance sensor of the crimping equipment can be used to obtain the crimping data collected during the crimping process of the connector, and the distribution of the pressure with the distance can be used to generate correlation curve, the crimping curve can be obtained. At this time, the crimping curve can represent the corresponding relationship between crimping displacement and crimping force.

It can be understood that, as shown in Figure 2, the crimping curve for high-speed connectors can be divided into four stages. ① The fisheye terminal contacts the PCB hole of the printed circuit board, and the elastically deformable fisheye terminal begins to compress and deform. As the deformation of the fisheye terminal increases, the crimping force increases and the slope of the curve increases. ②The deformation of the fisheye terminal reaches the maximum in the PCB hole, the crimping force reaches the peak value, and the curve appears an obvious inflection point. ③The fisheye terminal continues to slide in the PCB hole, the crimping force decreases to a certain extent, and the slope of the curve appears negative. ④When the connector body touches the surface of the PCB, the crimping force increases rapidly, and the slope of the curve increases rapidly.

It can be understood that, as shown in Figures 3 to 6, Figure 3 is a schematic structural diagram of a high-speed connector, Figure 4 is a structural schematic diagram of a socket, Figure 5 is a structural schematic diagram of a connector inserted into a socket, and Figure 6 is a schematic structural diagram of a connector with a connector. Schematic diagram of the structure of the PCB backplane and the socket, for the high-speed connector 100, the high-speed connector 100 is plugged into the printed circuit board 300 through the socket 200, the socket 200 is provided with a through hole 210, and the printed circuit board 300 is provided with a jack 310. The device 100 has a pin 110, and one end of the pin 110 facing the socket 200 is provided with a fisheye terminal 120, and the fisheye terminal 120 is elastically deformable. As shown in Figure 2, a schematic diagram of the crimping curve of a high-speed connector, the crimping characteristic parameter values extracted from the crimping curve include the first crimping displacement value h0, the second crimping displacement value h1, the first crimping force value f0, the The second crimping force value f1, the third crimping force value f2, the fourth crimping force value f3, and the fifth crimping force value f4, the first crimping displacement value h0 are used to represent the absolute distance that the pin 110 slides in the socket 310, The second crimping displacement value h1 is used to represent the movement distance of the pin 110 sliding in the socket 310 after the fisheye terminal 120 completes the maximum deformation, and the first crimping force value f0 is used to represent when the high-speed connector 100 is just crimped The second crimping force value f1 is used to represent the pressure value when the fisheye terminal 120 just contacts the surface of the printed circuit board 300, and the third crimping force value f2 is used to represent the maximum deformation of the fisheye terminal 120 through the through hole 210 The fourth crimping force value f3 is used to represent the pressure value when the high-speed connector 100 just contacts the receptacle 200, and the fifth crimping force value f4 is used to represent the maximum pressure value during the crimping process.

It is understandable that by analyzing the relationship between connector pins and PCB aperture design, crimped good products and crimped defective products, and their corresponding crimping curves, the characteristic parameters of connector crimping curves h0, h1, f0, f1 are obtained , f2, f3, f4, as shown in Figure 2. Among them, f0 is the pressure when the pressure module first contacts the connector, p0 is the Z-axis position at this time, and h0 is the absolute distance that the connector pin slides in the PCB hole, which can effectively indicate whether the crimping is complete. The size of h0 should be close to the size H of the pin protruding from the PCB surface during pre-insertion. According to this principle, the starting position p1 of h0 is confirmed. At this time, the looper touches the surface of the PCB and begins to slide. The corresponding pressure is f1. Try to eliminate PCB warpage, PCB thickness tolerance, crimping mold tolerance, and crimping during the crimping process. The influence of the mechanical coupling of the equipment; the end position p4 is the crimping stop position. Both the connector and the PCB have dimensional tolerances, so the starting position can fluctuate slightly from side to side. h1 is the absolute distance that the connector pin slides in the PCB hole after the maximum deformation is completed, the starting position p2 is the peak position of the curve, and the end position p3 is the valley position of the curve, that is, the connector body touches the surface of the socket, and f3 is when it is just in contact The corresponding pressure size. The reduction of h1 indicates that the connector may be raised; f2 is the crimping force when the connector pin is deformed at the maximum, that is, the crimping force at the peak of the curve. f2 decreases, indicating that the number of pins may be reduced when the pin is deformed at the maximum or the PCB aperture/pin size is abnormal. The combination of h1 and f2 can effectively characterize whether the connector pin is kneeling (that is, the pin hits the foreign object in the PCB hole and is not bending occurs). f4 is the maximum crimping force during the crimping process, which can effectively indicate whether the connector is over-pressed.

It can be understood that the crimping quality of the connector is judged according to the crimping characteristic parameter value. For example, the crimping threshold range corresponding to the control of the first crimping displacement value h0 is expressed as H0, when h0 is less than H0, it can be determined that the connector is "incomplete crimping", it should be pointed out that, as shown in Figure 2 , H0 is the difference between p4 and p1. For another example, the crimping threshold range corresponding to the second crimping displacement value h1 is denoted as H1, and the crimping threshold range corresponding to the third crimping force value f2 is denoted as F2, if h1 is less than H1 and f2 is less than F2, then It can be determined that the connector is "crimped kneeling pin", where, as shown in Figure 2, H1 is the difference between p3 and p2. For another example, if h1 is greater than or equal to H1 and f2 is less than F2, it can be determined that "the PCB aperture/connector pin size is abnormal". For another example, if the characteristic parameters such as H0 and H1 are missing, it may be determined that "connector pressure leakage". Based on this, this application can realize the automatic identification of crimping failure, kneeling pins, and pressure leakage of 5G bearer products, and realize the interception control and fault location of faulty products, realize the automatic identification and control of faulty products of 5G bearer products, and ensure product crimping quality.

It can be understood that, for implementing the method of the present application as a hardware carrier, a crimping quality detection device may be used to implement the method. As shown in FIG. 7 , the crimping quality inspection device may include a scanning device 10 , a crimping device 20 , a data analysis system 30 and a quality control system 40 . Wherein, the crimping equipment 20 may include an indenter 21 and a pressure sensor 22, the data analysis system may include a crimping data acquisition module, a crimping curve characteristic parameter analysis module, a characteristic parameter verification transfer module and a threshold self-learning module, and a quality control system 40 may include an NG cache area, a maintenance entry area and a data query area.

The crimping device 20 can be a common servo-driven crimping machine or any other type of crimping machine, which can control the speed, displacement and applied force of the indenter 21 in the vertical direction with a certain program; and the pressure sensor 22 is used to detect the pressure. The crimping force in the splicing process can realize the feedback of the crimping curve.

The crimping data acquisition module in the data analysis system 30 is used to collect the displacement data of the indenter and the corresponding crimping force data during the crimping process, and simultaneously generate the crimping curve of displacement-crimping force; the crimping curve characteristic parameter analysis module has built-in crimping The curve feature parameter extraction algorithm quickly calculates the feature parameters of the output crimping curve, the feature parameters are verified and forwarded to the module, the feature parameters are compared with the threshold value, and the system determines whether the crimping is bad; the threshold self-learning module is used to read batch crimping standard curves, Calculate the initial threshold of characteristic parameters, and carry out self-learning on the maintenance data. It should be noted that the data analysis system can be connected with any number of crimping devices 20 that meet the functions.

The NG buffer area in the quality control system 40 is used for alarming and intercepting the products with abnormal crimping quality determined by the system; the maintenance entry area is used for entering the actual maintenance results of the crimping process; the data query area is used to support time, program, curve Wait for all crimping process data queries.

As shown in Figure 8, the method of this application may also include but not limited to the following sub-steps:

Step 801, perform normal distribution statistical analysis on the crimping data to generate a standard interval of the crimping curve, the standard interval includes an upper interval and a lower interval, wherein the upper interval is used to represent the upper limit of the crimping threshold , the lower interval is used to represent the lower limit of the crimping threshold, and the crimping threshold range is determined by the upper limit and the lower limit;

Step 802, when it is determined that the crimping curve is located between the upper zone and the lower zone, it is determined that the crimping quality of the connector meets the quality requirement.

It can be understood that, through the analysis of a large number of standard crimping curve data, data analysis is performed on the pressure value under each pressure displacement, such as the statistical analysis model of 3σ normal distribution, as shown in Figure 9, to obtain the standard interval of the crimping curve The belt is shown in Figure 10. When the pressure curve is within the upper and lower intervals of the standard curve pressure, the crimping is normal, and the characteristic parameters h0, h1, f0, f1, f2, f3, f4 can be obtained from the pressure curve, and the corresponding crimping quality of the connector can be obtained from the upper and lower intervals Control the threshold range H0, H1, F0, F1, F2, F3, F4, calculate and compare whether the characteristic parameters of the crimping curve meet the threshold after the connector crimping is completed, and determine whether the quality of the connector crimping is good. The displacement characteristics of the crimping process are used to intercept faults, breaking through the size limit of the single board, and quickly detecting connectors with crimping faults.

As shown in Figure 11, the method of this application may also include but not limited to the following sub-steps:

Step 1101, when it is determined that the value of the crimping characteristic parameter is outside the range of the crimping threshold, output a re-inspection instruction, the re-inspection instruction is used to instruct the manual re-inspection of the crimping quality of the connector;

Step 1102, when it is determined that the crimping quality of the manually re-inspected connector meets the quality requirements, add the re-acquired crimping data after the manual re-inspection to the normal distribution statistical analysis, so as to regenerate the standard interval band of the crimping curve .

It can be understood that when it is determined that the crimping characteristic parameter value is within the crimping threshold range, it is determined that the crimping quality of the connector meets the quality requirement. However, when it is determined that the crimping characteristic parameter value is outside the crimping threshold range, it is not directly judged as a defective product, and a re-inspection is required to manually confirm the crimping quality of the connector. For example, if the crimping characteristic parameter value is not within the connector crimping threshold range, this part of the crimping data will be recorded as maintenance data, and the corresponding connector will be stored in the NG cache area, and the connector will be manually reset by a professional engineer. When the crimping quality of the manual re-inspection connector meets the quality requirements, enter the corresponding crimping data, and add the crimping data to the normal distribution statistical analysis to regenerate the standard interval band of the crimping curve. It makes it possible to optimize the standard interval band of the crimping curve through continuous self-learning, and continuously correct and converge the crimping threshold range, thereby continuously improving the accuracy of judging the crimping quality of the connector.

Before step 101, it may also include but not limited to the following sub-steps:

Read the product information of the connector to obtain the crimping data corresponding to the product information. The product information includes product name, product barcode and crimping program, wherein the crimping program includes at least one of the following: crimping device, crimping position, Crimp speed and crimp force.

It is understandable that the crimping equipment will read the product information of the connector before the crimping operation, including the product name, product barcode and crimping program, so as to generate the corresponding product name and product barcode according to the read product name and product barcode. According to the crimping curve, and according to the read crimping program, select the crimping device, and crimp the crimping position of the product according to the corresponding crimping speed and crimping force, so as to ensure the standardization of crimping operation.

Based on this, this application generates crimping curves from crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.

The method for detecting crimping quality provided by the present application will be further described below in conjunction with specific embodiments.

As shown in FIG. 12 , this embodiment is described with the following crimping quality detection operation flow.

The crimping equipment 001 controls the indenter to complete one connector crimping according to the crimping procedure. The crimping equipment has a built-in pressure sensor, which can detect the crimping force in the process in real time and record the crimping data in real time. The crimping equipment 001 has a crimping data acquisition module and a crimping curve characteristic parameter analysis module. Among them, the crimping data acquisition module collects the crimping data recorded by the crimping equipment, and generates the displacement-crimping force curve; at the same time, it reads the crimping product information, including product name, barcode, crimping device, crimping position, etc. The connection data (curve) corresponds to the crimping process one by one. The crimp curve characteristic parameter analysis module reads the collected crimp data in real time, and calculates whether the curve pressure value of each crimp meets the pressure range and satisfies the crimp curve characteristics h0, h1, f0, f2, f4 .

The crimping curve learning module 002 is used for fitting calculations based on a large number of historical crimping curves and PCB advance contact displacement values, and for self-learning of crimping maintenance data. The connector and the connector to be crimped are of the same model.

Crimp curve standard library 003 is used to store crimp threshold standards for different connectors. This module reads batch crimp standard curves to obtain a large number of normal crimp curve data, and obtains the upper and lower crimp interval zones and crimp curves through 3σ normal distribution. The characteristic threshold of the normal curve.

The crimping curve testing module 004 is used to judge whether the current crimping value satisfies the crimping range.

The verification transfer module 005 judges whether to transfer to the NG cache area 006 or the next process segment 007 according to the connector standard.

The product enters the transfer verification through the transfer verification module 005, and obtains product information by scanning, including product barcode, name, crimping program (crimping program includes crimping device, crimping position, speed and pressure setting), and through the main crimping The characteristic value is controlled and judged, and the judgment criteria include but are not limited to the following:

If h0<H0, it is judged that "crimping is not complete", where H0 is the difference between p4 and p1;

If h1<H1 and f2<F2, then determine "crimping kneeling needle", where H1 is the difference between p3 and p2;

If h1≥H1 and f2<F2, it is determined that "PCB aperture/connector pin size is abnormal";

If f4>F4, then determine "connector overvoltage";

If f0>F0 and the difference is large, then determine "connector offset";

If the characteristic parameters such as H0 and H1 are missing, it may be determined that "connector leakage pressure".

For crimping data that is determined to be abnormal and enters the NG buffer area 006, an alarm and judgment are performed, and the next process is prohibited, and it is automatically transferred to the buffer area module. At the same time, the alarm is specific to the product barcode and the specific location of the fault. If the judgment is normal, it will be directly transferred to the next process. 007. By reading the fault data entered by maintenance, the standard threshold ranges H0, H1, F0, F2, and F4 are continuously corrected and converged, and the self-learning function standard threshold ranges H0, H1, F0, F2, and F4 that further improve the system's judgment accuracy will be With the continuous generation of crimping, self-learning and optimization parameter standards are stored in the standard library.

For example, in actual operation, confirm that the code of the crimped connector and the connector to be produced are of the same model, and design a DOE experiment to extract the displacement value information when the connector and the PCB board are in contact according to the pressure value information of the crimping curve manually tested in the first half of the year , according to the big data crimping algorithm to fit the eigenvalues to obtain the upper and lower threshold range of the advance contact displacement value. After the crimping is completed, if it is within the threshold range of the connector, it will be crimped in place, enter the automatic scanning and transfer module, check the barcode information of the board, and continue to the next process according to the crimping result, if it is not within the threshold range of the connector crimping , otherwise, it will be stored in the NG cache area. After the engineer confirms on site and enters the corresponding maintenance data, the system will automatically obtain the maintenance data and measurement values for data optimization.

As shown in FIG. 13 , the embodiment of the present application also provides a crimping quality detection device.

Specifically, the crimping quality detection device includes: one or more processors and memory, and one processor and memory is taken as an example in FIG. 13 . The processor and the memory may be connected through a bus or in other ways, and connection through a bus is taken as an example in FIG. 13 .

As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs, such as the crimping quality detection method in the above embodiments of the present application. The processor executes the non-transitory software program and the program stored in the memory, so as to realize the crimping quality detection method in the above embodiment of the present application.

The memory can include a program storage area and a data storage area, wherein the program storage area can store the operating system and at least one application program required by the function; data etc. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may include a memory that is remotely located relative to the processor, and these remote memories may be connected to the crimping quality detection device through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The non-transitory software programs and programs required to realize the crimping quality detection method in the above-mentioned embodiments of the present application are stored in the memory, and when executed by one or more processors, the crimping quality detection method in the above-mentioned embodiments of the present application is executed. The detection method, for example, executes method steps 101 to 104 in FIG. 1 described above, method steps 801 to 802 in FIG. 8 , and method steps 1101 to 1102 in FIG. According to the crimping data of the circuit board, the crimping curve is generated according to the crimping data, the crimping characteristic parameter value is extracted from the crimping curve, and the crimping quality of the connector is judged according to the crimping characteristic parameter value. This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.

As shown in FIG. 14 , the embodiment of the present application also provides an electronic device.

Specifically, the electronic device includes: one or more processors and memories, and one processor and memories are taken as an example in FIG. 14 . The processor and the memory may be connected through a bus or in other ways. In FIG. 14, connection through a bus is taken as an example.

In addition, the embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores a computer-executable program, and the computer-executable program is executed by one or more control processors, for example, shown in FIG. 13 Execution by one of the processors may cause the above-mentioned one or more processors to execute the crimping quality detection method in the above-mentioned embodiment of the present application, for example, to execute the method steps 101 to 104 in FIG. 1 described above, and in FIG. 8 The method step 801 to step 802, the method step 1101 to step 1102 in Fig. 11, by obtaining the crimping data that the connector is crimped to the printed circuit board, generating a crimping curve according to the crimping data, and extracting the crimping from the crimping curve Characteristic parameter value, judge the crimping quality of the connector according to the crimping characteristic parameter value. This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.

The embodiment of the present application includes: obtaining the crimping data of the connector crimped to the printed circuit board, generating the crimping curve according to the crimping data, extracting the crimping characteristic parameter value from the crimping curve, and judging the connector according to the crimping characteristic parameter value Crimp quality. This application generates crimping curves through crimping data, extracts crimping characteristic parameter values from pressure curves, and uses crimping characteristic parameter values to identify crimping quality problems of connectors, thereby realizing crimping quality control. Based on this, according to the characteristics of crimping connectors in the crimping process, this application extracts the crimping characteristic parameter values from the crimping curve as the control index for judging the crimping quality, which can realize the crimping of 5G bearer products. Needle and pressure leakage are automatically identified, and faulty products are intercepted, controlled, and faulty located, realizing automatic identification and control of faulty 5G bearer products, ensuring product crimping quality, and enhancing product competitiveness.

Those skilled in the art can understand that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware and an appropriate combination thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit . Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). As known to those of ordinary skill in the art, the term computer storage media includes both volatile and nonvolatile media implemented in any method or technology for storage of information, such as computer readable programs, data structures, program modules, or other data. permanent, removable and non-removable media. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, tape, magnetic disk storage or other magnetic storage devices, or Any other medium used to store desired information and which can be accessed by a computer. In addition, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable programs, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media .

The above is a specific description of some implementations of the present application, but the present application is not limited to the above-mentioned embodiments, and those skilled in the art can also make various equivalent deformations or replacements without violating the sharing conditions of the scope of the present application. Equivalent modifications or replacements are all included within the scope defined by the claims of the present application.

Claims

A crimping quality detection method, comprising:

Obtain crimp data for connectors crimped to printed circuit boards;

generating a crimping curve based on the crimping data;

extracting crimp characteristic parameter values from the crimp curve;

The crimping quality of the connector is judged according to the crimping characteristic parameter value.
The method according to claim 1, wherein the judging the crimping quality of the connector according to the crimping characteristic parameter value comprises:

When it is determined that the crimping characteristic parameter value is within the crimping threshold range, it is determined that the crimping quality of the connector meets the quality requirement.
The method according to claim 1, wherein the crimping curve is used to characterize the corresponding relationship between crimping displacement and crimping force, and the crimping characteristic parameter values include crimping displacement value and crimping force value, and according to the The crimping quality of the connector is judged by the crimping characteristic parameter values, including:

The crimping quality of the connector is determined according to the crimping displacement value and the crimping force value.
The method according to claim 3, wherein the judging the crimping quality of the connector according to the crimping displacement value and the crimping force value comprises:

When it is determined that the crimping displacement value is within the crimping displacement threshold range, and/or the crimping force value is within the crimping force threshold range, it is determined that the crimping quality of the connector meets the quality requirement.
The method according to claim 3, wherein the connector is plugged into the printed circuit board through a socket, the socket is provided with a through hole, the printed circuit board has a socket, and the connector has a socket A pin, one end of the pin facing the socket is provided with a fish-eye terminal, and the fish-eye terminal is elastically deformable;

The extraction of crimp characteristic parameter values from the crimp curve includes:

extracting the crimp displacement value and the crimp force value from the crimp curve;

Wherein, the crimping displacement value includes a first crimping displacement value and a second crimping displacement value, and the crimping force value includes a first crimping force value, a second crimping force value, a third crimping force value, a fourth crimping force value, and a crimping force value. The relay force value and the fifth crimping force value, the first crimping displacement value is used to represent the absolute distance that the pin slides in the socket, and the second crimping displacement value is used to represent the The movement distance of the pin sliding in the socket after the maximum deformation is completed, the first crimping force value is used to represent the pressure value when the connector is just crimped, and the second crimping force value is used to represent The pressure value when the fisheye terminal just contacts the surface of the printed circuit board, the third crimping force value is used to characterize the pressure value when the fisheye terminal undergoes maximum deformation through the through hole, and the first The four crimping force values are used to represent the pressure value when the connector just contacts the socket, and the fifth crimping force value is used to represent the maximum pressure value during the crimping process.
The method according to claim 2, further comprising:

Performing a normal distribution statistical analysis on the crimping data to generate a standard interval of the crimping curve, the standard interval includes an upper interval and a lower interval, wherein the upper interval is used to represent the crimping The upper limit of the threshold, the lower interval is used to represent the lower limit of the crimping threshold, and the range of the crimping threshold is determined by the upper limit and the lower limit;

When it is determined that the crimping curve is located between the upper interval zone and the lower interval zone, it is determined that the crimping quality of the connector meets the quality requirement.
The method according to claim 6, further comprising:

When it is determined that the crimping characteristic parameter value is outside the crimping threshold range, a re-inspection instruction is output, and the re-inspection instruction is used to instruct manual re-inspection of the crimping quality of the connector;

When it is determined that the crimping quality of the connector manually re-inspected meets the quality requirements, the crimping data re-acquired after the manual re-inspection is added to the normal distribution statistical analysis to regenerate the crimping curve. Standard range.
The method according to claim 1, further comprising:

Obtain crimping position information where the connector is crimped to the printed circuit board.
The method according to any one of claims 1 to 8, wherein, before obtaining the crimping data of the connector being crimped to the printed circuit board, further comprising:

reading the product information of the connector to obtain the crimping data corresponding to the product information, the product information including product name, product barcode and crimping procedure, wherein the crimping procedure includes at least one of the following:

crimping device;

Crimp position;

crimping speed;

Crimp strength.
A crimping quality detection device, comprising: a memory, a processor, and a computer program stored in the memory and operable on the processor, wherein, when the processor executes the computer program, the implementation of the claims 1 to 9 is achieved. Any one of the crimping quality testing methods.
An electronic device, comprising: a memory, a processor, and a computer program stored on the memory and operable on the processor, wherein, when the processor executes the computer program, any one of claims 1 to 9 is realized The crimping quality testing method described above.
A computer-readable storage medium storing a computer-executable program, wherein the computer-executable program is used to make a computer execute the crimping quality inspection method according to any one of claims 1-9.