CN106529369A - Component mounting state detection method and system - Google Patents
Component mounting state detection method and system Download PDFInfo
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- CN106529369A CN106529369A CN201610887899.2A CN201610887899A CN106529369A CN 106529369 A CN106529369 A CN 106529369A CN 201610887899 A CN201610887899 A CN 201610887899A CN 106529369 A CN106529369 A CN 106529369A
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- 238000001514 detection method Methods 0.000 title claims description 46
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims abstract description 4
- 238000012360 testing method Methods 0.000 claims description 86
- 210000000746 body region Anatomy 0.000 claims description 42
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000007689 inspection Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1417—2D bar codes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/22—Matching criteria, e.g. proximity measures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
- G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
- G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/09—Recognition of logos
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- Bioinformatics & Computational Biology (AREA)
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a method and a system for detecting the installation state of a component, wherein the method comprises the following steps: scanning a first icon on the circuit board; wherein the first icon is associated with mounting information of a component mounted on the circuit board, the mounting information including a unique identification of the component and position information of the component on the circuit board; positioning a component to be tested from a circuit board according to the position information, and comparing the component to be tested with the component corresponding to the unique identifier; and if the element to be tested is not matched with the element corresponding to the unique identifier, judging that the element to be tested is installed wrongly.
Description
Technical field
The present invention relates to automatic optics inspection technical field, more particularly to a kind of element installment state detection method and it is
System.
Background technology
AOI (Automatic Optic Inspection, automatic optics inspection), is circuit board to be welded using optical principle
The equipment detected by the common deficiency occurred in producing of delivering a child.For the circuit board of plug-in unit, common defects detection includes
Missing part detection, wrong part detection, the detection of anti-part, more than one piece detection etc..Wherein, wrong part detection refers to the feature for extracting element to be detected,
And be compared with template, it is whether correct so as to judge the element for inserting circuit board.
At present, the wrong part detection of element is mainly by manually being detected, but, this detection mode is less efficient, and,
Testing result easily malfunctions, and detection accuracy is relatively low.
The content of the invention
Based on this, it is necessary to for the low problem of detection efficiency and accuracy, there is provided a kind of element installment state detection side
Method and system.
A kind of element installment state detection method, comprises the following steps：
The first icon on scanning circuit plate；Wherein, first icon and the element being arranged on the circuit board
Mount message is associated, and the mount message includes the unique mark of the element and the element on the circuit board
Positional information；
Element under test is positioned from circuit board according to the positional information, and by the element under test and the unique mark
Corresponding element is compared；
If element under test element corresponding with the unique mark is mismatched, judge that the element under test is installed wrong
By mistake.
A kind of element installment state detecting system, comprises the following steps：
Scan module, for the first icon on scanning circuit plate；Wherein, first icon be arranged on the circuit
The mount message of the element on plate is associated, and the mount message includes the unique mark of the element and the element in institute
State the positional information on circuit board；
Comparison module, for positioning element under test according to the positional information, and by the element under test from circuit board
Element corresponding with the unique mark is compared；
Judge module, if mismatching for element under test element corresponding with the unique mark, treats described in judgement
Survey element setup error.
Said elements installment state detection method and system, by the mount message and circuit of the element installed on circuit boards
The first icon on plate is associated, in detection, directly according to the positional information positioning element under test in mount message, and will peace
The corresponding element of unique mark in dress information is compared with the element under test oriented, if the two mismatch, can determine that peace
Wrongly installed mistake, realizes element installment state automatic detection, and detection efficiency and accuracy rate are high.
Description of the drawings
Element installment state detection method flow charts of the Fig. 1 for one embodiment；
Structural representations of the Fig. 2 for the element installment state detecting system of one embodiment.
Specific embodiment
Below in conjunction with the accompanying drawings technical scheme is illustrated.
Element installment state detection method flow charts of the Fig. 1 for one embodiment.As shown in figure 1, the element installs shape
State detection method may include following steps：
S1, the first icon on scanning circuit plate；Wherein, first icon and the element being arranged on the circuit board
Mount message be associated, the mount message includes the unique mark of the element and the element on the circuit board
Positional information；
First icon can be Quick Response Code or bar code, or other can carry the figure of the mount message
Shape or symbol.The mount message can be directly recorded in first icon, it is also possible to record a link, the link can be right
A webpage or a memory space is answered, the mount message can be stored in the webpage or memory space.It is described that letter is installed
The effect of breath is the element for uniquely determining the corresponding position on the circuit board.Only can carry in the mount message
The mount message of one element, it is also possible to carry the mount message of multiple element.The unique mark can be element model,
Title or its combination, or other can uniquely determine the mark of the element.The positional information can be a seat
Mark (for example, it may be the upper left corner of element coordinate on circuit boards), or coordinate range (for example, element
Body region coordinate range on circuit boards).
S2, positions element under test from circuit board according to the positional information, and the element under test is unique with described
Identify corresponding element to be compared；
When relatively, the image of the corresponding element under test of the positional information can be shot, extract described from described image
The characteristic information (for example, color, shape facility etc.) of element under test, by the unit characteristic information corresponding with the unique mark
The characteristic information of part is compared.The unique mark (for example, title, model etc.) of the element under test can also be obtained, by institute
The unique mark and the unique mark in the mount message for stating element under test is compared.Element is in production, a kind of common
Way be that the title of element, model etc. are arranged in the body region of element.When being compared, the master can be read
The information such as title, model in body region, and above- mentioned information is compared with the corresponding informance in the mount message.Or
Person, it is also possible to generate the second icon (for example, Quick Response Code, bar code etc.) according to the unique mark of the element under test, will be described
Second icon is arranged on the body region of the element under test, when comparing, can read the master for being arranged on the element under test
The second icon in body region, obtains the unique mark from second icon, and by the unique mark and the installation
Corresponding informance in information is compared.
When the second icon in the body region is read, the master of the body region of the element under test can be first obtained
Body region image, reads the characteristic information (including word, symbol, identification code or image etc.) in the body region image, and
The second icon of the component information is obtained from the characteristic information.
For the ease of reading the characteristic information, after the body region image is got, can also be to the master
Body region image carries out binary conversion treatment, and the body region image to Jing binary conversion treatments is amplified process.Putting
After big, then read the characteristic information.
S3, if element under test element corresponding with the unique mark is mismatched, judges that the element under test is installed
Mistake.
It is if what is compared in step S2 is the unique mark (for example, title, model) of element, unique when the element under test
Identify with the mount message in unique mark differ when, can determine that the element under test setup error.When described to be measured
When the unique mark of element is identical with the unique mark in the mount message, can determine that the element under test is installed correct.Class
As, if what is compared in step S2 is the information such as color, the shape of element, when judging, the color, shape when the element under test
When the information such as color, shape in the information such as shape and the mount message are differed, the element under test setup error is can determine that.
When the information such as the information such as color, shape when the element under test and the color in the mount message, shape are identical, can determine that
The element under test is installed correct.
Wrong part detection can be carried out by said method to element, that is, detect the whether wrong plug of element on circuit board.
In one embodiment, anti-part detection can also be carried out using said method to element.Anti- part detection is referred to two
The element of the polarizeds such as pole pipe, electric capacity, socket detected, judges which whether there is reverse phenomenon in the circuit board.Specifically
Ground, can also carry the polarity information of element in the mount message, the polarity information is used for representing the polarity of the element
Positional information of the region on the circuit board.The polar region can be certain pole (for example, positive pole, anode etc.) of element
Region on the circuit board.When relatively, the polar region of the element under test can be obtained on the circuit board
First polarity information, first polarity information and the polarity information are compared, if first polarity information and institute
Polarity information mismatch is stated, the element under test setup error is judged, i.e., anti-part, otherwise, it is determined that the not anti-part of element under test.May be used also
To generate the 3rd icon (for example, positive pole icon is represented with "+") according to the polarity information of the element under test, by the 3rd figure
Mark is arranged on the body region of the element under test.When first polarity information is obtained, the 3rd icon can be obtained
Positional information in the body region, the positional information on the circuit board and the described 3rd according to the element under test
First polarity information described in positional information calculation of the icon in the body region.
Said elements installment state detection method, realizes element installment state (including anti-part and wrong part) automatic detection,
Detection efficiency and accuracy rate are high.
With said elements installment state detection method accordingly, the present invention also provides a kind of element installment state detection system
System, as shown in Fig. 2 the element installment state detecting system may include：
Scan module 10, for the first icon on scanning circuit plate；Wherein, first icon be arranged on the electricity
The mount message of the element on the plate of road is associated, and the mount message includes that the unique mark of the element and the element exist
Positional information on the circuit board；
First icon can be Quick Response Code or bar code, or other can carry the figure of the mount message
Shape or symbol.The mount message can be directly recorded in first icon, it is also possible to record a link, the link can be right
A webpage or a memory space is answered, the mount message can be stored in the webpage or memory space.It is described that letter is installed
The effect of breath is the element for uniquely determining the corresponding position on the circuit board.Only can carry in the mount message
The mount message of one element, it is also possible to carry the mount message of multiple element.The unique mark can be element model,
Title or its combination, or other can uniquely determine the mark of the element.The positional information can be a seat
Mark (for example, it may be the upper left corner of element coordinate on circuit boards), or coordinate range (for example, element
Body region coordinate range on circuit boards).
Comparison module 20, for positioning element under test according to the positional information, and by the unit to be measured from circuit board
Part element corresponding with the unique mark is compared；
When relatively, the image of the corresponding element under test of the positional information can be shot, extract described from described image
The characteristic information (for example, color, shape facility etc.) of element under test, by the unit characteristic information corresponding with the unique mark
The characteristic information of part is compared.The unique mark (for example, title, model etc.) of the element under test can also be obtained, by institute
The unique mark and the unique mark in the mount message for stating element under test is compared.Element is in production, a kind of common
Way be that the title of element, model etc. are arranged in the body region of element.When being compared, the master can be read
The information such as title, model in body region, and above- mentioned information is compared with the corresponding informance in the mount message.Or
Person, it is also possible to generate the second icon (for example, Quick Response Code, bar code etc.) according to the unique mark of the element under test, will be described
Second icon is arranged on the body region of the element under test, when comparing, can read the master for being arranged on the element under test
The second icon in body region, obtains the unique mark from second icon, and by the unique mark and the installation
Corresponding informance in information is compared.
When the second icon in the body region is read, the master of the body region of the element under test can be first obtained
Body region image, reads the characteristic information (including word, symbol, identification code or image etc.) in the body region image, and
The second icon of the component information is obtained from the characteristic information.
For the ease of reading the characteristic information, after the body region image is got, can also be to the master
Body region image carries out binary conversion treatment, and the body region image to Jing binary conversion treatments is amplified process.Putting
After big, then read the characteristic information.
Judge module 30, if mismatching for element under test element corresponding with the unique mark, judges described
Element under test setup error.
If what is compared in comparison module 20 is the unique mark (for example, title, model) of element, when the element under test
When unique mark in unique mark and the mount message is differed, the element under test setup error is can determine that.When described
When the unique mark of element under test is identical with the unique mark in the mount message, can determine that the element under test is just installed
Really.Similarly, if what is compared in comparison module 20 is the information such as color, the shape of element, when judging, when the element under test
Color, the color in the information such as shape and the mount message, the information such as shape is when differing, and can determine that the element under test
Setup error.The information such as the information such as color, shape when the element under test and the color in the mount message, shape are identical
When, can determine that the element under test is installed correct.
Wrong part detection can be carried out by said system to element, that is, detect the whether wrong plug of element on circuit board.
In one embodiment, anti-part detection can also be carried out using said system to element.Anti- part detection is referred to two
The element of the polarizeds such as pole pipe, electric capacity, socket detected, judges which whether there is reverse phenomenon in the circuit board.Specifically
Ground, can also carry the polarity information of element in the mount message, the polarity information is used for representing the polarity of the element
Positional information of the region on the circuit board.The polar region can be certain pole (for example, positive pole, anode etc.) of element
Region on the circuit board.When relatively, the polar region of the element under test can be obtained on the circuit board
First polarity information, first polarity information and the polarity information are compared, if first polarity information and institute
Polarity information mismatch is stated, the element under test setup error is judged, i.e., anti-part, otherwise, it is determined that the not anti-part of element under test.May be used also
To generate the 3rd icon (for example, positive pole icon is represented with "+") according to the polarity information of the element under test, by the 3rd figure
Mark is arranged on the body region of the element under test.When first polarity information is obtained, the 3rd icon can be obtained
Positional information in the body region, the positional information on the circuit board and the described 3rd according to the element under test
First polarity information described in positional information calculation of the icon in the body region.
Said elements installment state detecting system, realizes element installment state (including anti-part and wrong part) automatic detection,
Detection efficiency and accuracy rate are high.
The element installment state detecting system of the present invention is corresponded with the element installment state detection method of the present invention,
The technical characteristic and its advantage that the embodiment of said elements installment state detection method is illustrated is applied to element and installs shape
In the embodiment of state detecting system, hereby give notice that.
Each technical characteristic of embodiment described above arbitrarily can be combined, for making description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but and
Therefore can not be construed as limiting the scope of the patent.It should be pointed out that for one of ordinary skill in the art comes
Say, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (10)
1. a kind of element installment state detection method, it is characterised in that comprise the following steps：
The first icon on scanning circuit plate；Wherein, the installation of first icon and the element being arranged on the circuit board
Information is associated, and the mount message includes the position of the unique mark of the element and the element on the circuit board
Information；
Element under test is positioned from circuit board according to the positional information, and the element under test is corresponding with the unique mark
Element be compared；
If element under test element corresponding with the unique mark is mismatched, the element under test setup error is judged.
2. element installment state detection method according to claim 1, it is characterised in that by the element under test with it is described
The step of corresponding element of unique mark is compared includes：
Obtain the unique mark of the element under test；
The unique mark of the element under test is compared with the unique mark in the mount message；
If the element under test is mismatched with the element, judge the element under test setup error the step of include：
If the unique mark of the element under test is differed with the unique mark in the mount message, the element under test is judged
Setup error.
3. element installment state detection method according to claim 2, it is characterised in that further comprising the steps of：
Second icon is generated according to the unique mark of the element under test；
Second icon is arranged on into the body region of the element under test；
The step of unique mark for obtaining the element under test, includes：
Reading is arranged on the second icon in the body region of the element under test；
The unique mark is obtained from second icon.
4. element installment state detection method according to claim 3, it is characterised in that reading is arranged on the unit to be measured
The step of the second icon in the body region of part, includes：
Obtain the body region image of the body region of the element under test；
Read the characteristic information in the body region image；
The second icon of the component information is obtained from the characteristic information.
5. element installment state detection method according to claim 4, it is characterised in that reading the body region figure
It is before characteristic information as in, further comprising the steps of：
Binary conversion treatment is carried out to the body region image；
Process is amplified to the body region image of Jing binary conversion treatments.
6. element installment state detection method according to claim 1, it is characterised in that the mount message also includes institute
State the polarity information of element；Wherein, the polarity information is used for representing the polar region of the element on the circuit board
Positional information；
The step of element element under test corresponding with the unique mark is compared includes：
Obtain first polarity information of the polar region of the element under test on the circuit board；
First polarity information and the polarity information are compared；
If first polarity information is mismatched with the polarity information, the element under test setup error is judged.
7. element installment state detection method according to claim 6, it is characterised in that further comprising the steps of：
3rd icon is generated according to the polarity information of the element under test；
3rd icon is arranged on into the body region of the element under test；
The step of obtaining the first polarity information of the polar region of the element under test on the circuit board includes：
Obtain positional information of the 3rd icon in the body region；
Positional information and the 3rd icon according to the element under test on the circuit board is in the body region
First polarity information described in positional information calculation.
8. element installment state detection method according to claim 1, it is characterised in that first icon is Quick Response Code
Or bar code, and/or
Second icon is Quick Response Code or bar code.
9. element installment state detection method according to claim 4, it is characterised in that the characteristic information be word,
Symbol, identification code or image.
10. a kind of element installment state detecting system, it is characterised in that comprise the following steps：
Scan module, for the first icon on scanning circuit plate；Wherein, first icon be arranged on the circuit board on
Element mount message be associated, the mount message includes the unique mark of the element and the element in the electricity
Positional information on the plate of road；
Comparison module, for positioning element under test according to the positional information, and by the element under test and institute from circuit board
State the corresponding element of unique mark to be compared；
Judge module, if mismatching for element under test element corresponding with the unique mark, judges the unit to be measured
Part setup error.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610887899.2A CN106529369A (en) | 2016-10-11 | 2016-10-11 | Component mounting state detection method and system |
| PCT/CN2016/113150 WO2018068418A1 (en) | 2016-10-11 | 2016-12-29 | Component mounting state detection method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610887899.2A CN106529369A (en) | 2016-10-11 | 2016-10-11 | Component mounting state detection method and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106529369A true CN106529369A (en) | 2017-03-22 |
Family
ID=58331280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610887899.2A Pending CN106529369A (en) | 2016-10-11 | 2016-10-11 | Component mounting state detection method and system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106529369A (en) |
| WO (1) | WO2018068418A1 (en) |
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| CN107610088A (en) * | 2017-07-03 | 2018-01-19 | 刘胜贤 | A kind of board recognition method and system |
| CN110391510A (en) * | 2018-04-17 | 2019-10-29 | 威德米勒界面有限公司及两合公司 | For the Automated assembly of electrical equipment and the method and system of wiring |
| CN110517260A (en) * | 2019-08-30 | 2019-11-29 | 北京地平线机器人技术研发有限公司 | The detection method and device of circuit board, storage medium, electronic equipment |
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| CN111289537A (en) * | 2020-02-21 | 2020-06-16 | 杭州海兴电力科技股份有限公司 | Method, device, equipment and medium for detecting polar electronic component of circuit board |
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