CN106127746A - Circuit board component missing part detection method and system - Google Patents

Circuit board component missing part detection method and system Download PDF

Info

Publication number
CN106127746A
CN106127746A CN201610438902.2A CN201610438902A CN106127746A CN 106127746 A CN106127746 A CN 106127746A CN 201610438902 A CN201610438902 A CN 201610438902A CN 106127746 A CN106127746 A CN 106127746A
Authority
CN
China
Prior art keywords
pin
image
circuit board
sample image
training
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610438902.2A
Other languages
Chinese (zh)
Inventor
李红匣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Shiyuan Electronics Thecnology Co Ltd
Original Assignee
Guangzhou Shiyuan Electronics Thecnology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Shiyuan Electronics Thecnology Co Ltd filed Critical Guangzhou Shiyuan Electronics Thecnology Co Ltd
Priority to CN201610438902.2A priority Critical patent/CN106127746A/en
Publication of CN106127746A publication Critical patent/CN106127746A/en
Priority to PCT/CN2016/113126 priority patent/WO2017215241A1/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/0008Industrial image inspection checking presence/absence
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20081Training; Learning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)

Abstract

The present invention relates to a kind of circuit board component missing part detection method and system, the method includes: obtain the sample image of the Pin locations of multiple circuit boards, carries out sample training according to component's feet position on described sample image, obtains pin disaggregated model;Obtain the detection image of circuit board the most to be detected, and determine the Pin locations of components and parts according to described detection image;Utilize described pin disaggregated model that the described Pin locations of detection image is detected, it is judged that the pin insert state of the components and parts of described circuit board.This technical scheme, it is possible to the missing part phenomenon of detecting element exactly, improves Detection results.

Description

Circuit board component missing part detection method and system
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of circuit board component missing part detection method and system.
Background technology
Assembling in production process at circuit board, due to the operation of workman, the reason such as mechanical shock of production line, element is often There will be disappearance, the phenomenon of skew, thus cause element not in the position specified, cause serious quality problems.For understanding Certainly find these defects and ensure quality, needing each element on circuit board is detected, to guarantee that each element exists It specifies position.
At present, the method for element testing mainly includes two kinds: one is traditional algorithm, i.e. utilizes the basic calculation of image procossing Method, such as color histogram, template matching, feature extraction etc., detects element.Another kind is intelligent algorithm, i.e. utilizes deep Degree learning algorithm, such as CNN (Convolutional Neural Network, convolutional neural networks) etc., the training sample to collection Originally it is trained, the method again element detected after obtaining element testing model.
But in process of production, there is open defect in above two method:
First, some element is close, the most identical with the color of circuit board base plate, and i.e. element presence or absence is the most also Significantly difference can not be presented, so using traditional algorithm to be difficult to separate element with base plate;Intelligent algorithm is for this Situation can not reach preferable Detection results.In process of production, the black horizontal capacitor in green circuit board, its background is also It is black;Element in black circuit board, is also black such as diode, horizontal capacitor etc..So, utilize traditional algorithm, As element is detected by the method such as color histogram, template matching, it is extremely difficult to preferable Detection results, as it is shown in figure 1, figure 1 exists and non-existent comparison diagram for element, there is element in upper figure, and figure below is to there is not element, by two figures Still it is difficult to well distinguish.
Secondly as the faulty operation of workman or the mechanical vibration of production line, element there will be the situation of skew, causes unit The pin of part is not inserted in the component pin circular hole specified, i.e. element exist but the pin of element goes out foot.
In sum, above-mentioned traditional algorithm and intelligent algorithm are used, it is difficult to detect the missing part phenomenon of element exactly, inspection Survey effect is poor.
Summary of the invention
Based on this, it is necessary to for the problem that detection accuracy is relatively low, it is provided that a kind of circuit board component missing part detection method And system.
A kind of circuit board component missing part detection method, comprises the steps:
Obtain the sample image of the Pin locations of multiple circuit boards;
Carry out sample training according to component's feet position on described sample image, obtain pin disaggregated model;
Obtain the detection image of circuit board the most to be detected, and determine the pin position of components and parts according to described detection image Put;
Utilize described pin disaggregated model that the described Pin locations of detection image is detected, it is judged that described circuit board The pin insert state of components and parts.
A kind of circuit board component missing part detecting system, including:
Sample collection module, for obtaining the sample image of the Pin locations of multiple circuit boards;
Model training module, for carrying out sample training according to component's feet position on described sample image, is drawn Foot disaggregated model;
Pin locating module, for obtaining the detection image of circuit board the most to be detected, and according to described detection image Determine the Pin locations of components and parts;
Pin detection module, for utilizing described pin disaggregated model to examine the described Pin locations of detection image Survey, it is judged that the pin insert state of the components and parts of described circuit board.
Foregoing circuit panel element missing part detection method and system, the sample image of element based on circuit board, extracts it and draws Placement of foot training pin disaggregated model, by the Pin locations of the detection image of circuit board to be detected, the unit of testing circuit plate The pin insert state of device, the basis for estimation being element missing part with pinout information, eliminate the interference of circuit board base plate, it is possible to The missing part phenomenon of detecting element, improves Detection results exactly.
Accompanying drawing explanation
Fig. 1 is that element exists and non-existent comparison diagram;
Fig. 2 is the circuit board component missing part detection method flow chart of an embodiment;
Fig. 3 is the schematic flow sheet of sample collection;
Fig. 4 is the schematic flow sheet of sample training;
Fig. 5 is the circuit board component missing part detecting system structure chart of an embodiment.
Detailed description of the invention
Illustrate circuit board component missing part detection method and the embodiment of system of the present invention below in conjunction with the accompanying drawings.
The solution of the present invention is applied in circuit board assembles production process, at the ring of the circular hole that element is inserted into circuit board Joint, detects each element on circuit board, solves disappearance, the problem of skew that element occurs, promptly and accurately detects Go out the missing part phenomenon of circuit board, to guarantee that each element specifies position at it.
With reference to shown in Fig. 2, Fig. 2 is the circuit board component missing part detection method flow chart of an embodiment, comprises the steps:
Step S10, obtains the sample image of the Pin locations of multiple circuit boards;
In this step, in the mainly sample collection stage, it is trained by the sample of the Pin locations of collecting circuit plate, For training the grader of pin.
In one embodiment, with reference to shown in Fig. 3, Fig. 3 is the schematic flow sheet of sample collection, can include walking as follows Rapid:
S101, according to image and the multiple sample image of Pin locations acquisition of information thereof of multiple circuit boards;
Concrete, the image of the circuit board of multiple color, model and batch can be obtained, demarcate the pin position of each element Confidence ceases, and obtains multiple sample image;
In order to ensure the multiformity of training sample, the circuit board image of different colours, model and batch can be collected;Pass through Demarcate the Pin locations information of each element, obtain N number of training sample, T={ (x can be designated as1,y1),(x2,y2),...,(xN, yN)};
Wherein, xi∈ χ=Rn,yi∈ 0,1}, i=1,2 ..., N, xiFor i-th training sample, yiFor xiClass labelling, Work as yiWhen=0, represent xiFor not inserting the circular hole of pin;Work as yiWhen=1, represent xiFor inserting the circular hole of pin.
S102, for the training sample image of training and several are for testing to obtain several according to described sample image Test sample image;
Concrete, described sample image can be carried out image procossing, obtain several training sample figures for training Picture is used for the test sample image of test with several;
For the process of sample image, may include that described sample image is rotated, cutting or brightness adjustment;
Rotation can be sample image dextrorotation respectively is turn 90 degrees, 180 degree and 270 degree etc.;Shearing can be former Beginning sample image is sheared the subimage being sized, and this sub-picture pack circular hole Han pin;Brightness adjustment can be by sample Image carries out point processing on spatial domain, such as image enhaucament, brightness/contrast regulation or gamma value adjustment etc..
Due to the impact of various factors, the training sample image collected in reality is often limited, therefore, in order to ensure The multiformity of sample image, the situation that covering pin is likely to occur as much as possible, by the above-mentioned sample image to having collected Carry out rotating, cutting, the adjustment of brightness;Multiple sample images and test image can be obtained.
Step S20, carries out sample training according to component's feet position on described sample image, obtains pin classification mould Type;
In this step, the mainly training pattern stage, utilize by collect sample be trained, thus obtain for The grader of detection pin.
In one embodiment, with reference to shown in Fig. 4, Fig. 4 is the schematic flow sheet of sample training, can include walking as follows Rapid:
S201, utilizes described training sample image to be trained obtaining pinouts as disaggregated model;
Concrete, the network model of pinouts picture can be defined, utilize training sample image to be trained obtaining pinouts As disaggregated model;
Such as, after defining applicable network model as required, input training sample image data T={ (x1,y1),(x2, y2),...,(xN,yN), then start to train pin disaggregated model, training process to be mainly two stages:
The propagated forward stage (first stage): read training sample image data T={ (x1,y1),(x2,y2),...,(xN, yN) in any one sample data (xi,yi), by xiInput described network model, from input layer through converting step by step and transmitting To output layer, calculate real output value oi=Fn(..(F2(F1(XiW(1))W(2))..)W(n));
The back-propagating stage (second stage): calculate real output value oiWith corresponding idea output yiBetween difference, Build minimization error functionAdjust weight matrix;
Through weight matrix iteration several times, when difference EiThe deconditioning when reaching the threshold value set, obtains pinouts picture Disaggregated model.
S202, tests as disaggregated model described pinouts according to test sample image;Concrete, can be according to survey Examination sample image sets up test set, utilizes pin not to be plugged and has been plugged the test set of two kinds of test sample image with pin to pin The accuracy rate of image disaggregated model detects, statistics rate of false alarm and rate of failing to report, until pinouts makes a reservation for as disaggregated model meets Requirement.
Step S30, obtains the detection image of circuit board the most to be detected, and determines components and parts according to described detection image Pin locations;
In this step, being the application to pin disaggregated model, in preferred circuit plate image, user annotation needs detection The pin of element;In circuit board image to be detected, positioning pins.
In one embodiment, positioning pins position, can first obtain the detection image of the circuit board of standard;Then in institute State mark in detection image and need the pin of detecting element;In the detection image of circuit board to be detected, fixed according to described mark The position of position pin.
Step S40, utilizes described pin disaggregated model to detect the described Pin locations of detection image, it is judged that described The pin insert state of the components and parts of circuit board.
In this step, behind positioning pins position, detection image input pin grader is detected, testing circuit plate The pin insert state of components and parts.
In one embodiment, the detection image input pin image disaggregated model comprising pin is detected, detection The element missing part state of the pin circular hole of circuit board.
At pinouts as, in disaggregated model, if this pin state is 0, then the circular hole that this pin is corresponding does not insert pin, if The state of this pin is 1, then the circular hole that pin is corresponding has inserted pin;Further, if this pin state is 0, pin is sent It is not plugged warning, in order to related personnel checks and keeps in repair.
The scheme of summary embodiment, compared with existing traditional algorithm and intelligent algorithm, is not to pay close attention to element body Itself, but start with from the pin of element, detecting element exist with not in the presence of the circular hole of component pin have significantly difference, only Pay close attention to the information of pin circular hole, remove the interference of circuit board base plate, have only to when user uses specify component pin to be detected Position, thus complete element testing element whether missing part;Scheme can efficiently solve element identical with board color time not A difficult problem for missing part detection can be carried out, improve the recall rate of AOI equipment.
With reference to shown in Fig. 5, Fig. 5 is the circuit board component missing part detecting system structure chart of an embodiment, including:
Sample collection module 10, for obtaining the sample image of the Pin locations of multiple circuit boards;
Model training module 20, for carrying out sample training according to component's feet position on described sample image, obtains Pin disaggregated model;
Pin locating module 30, for obtaining the detection image of circuit board the most to be detected, and according to described detection figure As determining the Pin locations of components and parts;
Pin detection module 40, for utilizing described pin disaggregated model to examine the described Pin locations of detection image Survey, it is judged that the pin insert state of the components and parts of described circuit board.
The circuit board component missing part detection method of the circuit board component missing part detecting system of the present invention and the present invention one a pair Should, technical characteristic and beneficial effect thereof that the embodiment in foregoing circuit panel element missing part detection method illustrates all are applicable to circuit In the embodiment of panel element missing part detecting system, hereby give notice that.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also Can not therefore be construed as limiting the scope of the patent.It should be pointed out that, come for those of ordinary skill in the art Saying, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection of the present invention Scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a circuit board component missing part detection method, it is characterised in that comprise the steps:
Obtain the sample image of the Pin locations of multiple circuit boards;
Carry out sample training according to component's feet position on described sample image, obtain pin disaggregated model;
Obtain the detection image of circuit board the most to be detected, and determine the Pin locations of components and parts according to described detection image;
Utilize described pin disaggregated model that the described Pin locations of detection image is detected, it is judged that first device of described circuit board The pin insert state of part.
Circuit board component missing part detection method the most according to claim 1, it is characterised in that according on described sample image Component's feet position carries out sample training, and the step obtaining pin disaggregated model includes:
Image according to multiple circuit boards and the multiple sample image of Pin locations acquisition of information thereof;
For the training sample image of training and several are for the test specimens tested to obtain several according to described sample image This image;
Carrying out sample training according to component's feet position on described sample image, the step obtaining pin disaggregated model includes:
Described training sample image is utilized to be trained obtaining pinouts as disaggregated model;
According to test sample image, described pinouts is tested as disaggregated model.
Circuit board component missing part detection method the most according to claim 1, it is characterised in that according to the figure of multiple circuit boards The step of picture and the multiple sample image of Pin locations acquisition of information thereof includes:
Obtain the image of the circuit board of multiple color, model and batch, demarcate the Pin locations information of each element, obtain multiple Sample image;
For the training sample image of training and several are for the test specimens tested to obtain several according to described sample image The step of this image includes:
Described sample image is carried out image procossing, and for the training sample image of training and several are for surveying to obtain several The test sample image of examination;
Utilize described training sample image to be trained obtaining pinouts to include as the step of disaggregated model:
The network model of definition pinouts picture, utilizes training sample image to be trained obtaining pinouts as disaggregated model;
Include according to the step that described pinouts is tested by test sample image as disaggregated model:
Set up test set according to test sample image, utilize pin not to be plugged the survey being plugged two kinds of test sample image with pin Examination set pair pinouts detects as the accuracy rate of disaggregated model, statistics rate of false alarm and rate of failing to report, until pinouts picture classification mould Type meets predetermined requirement.
Circuit board component missing part detection method the most according to claim 1, it is characterised in that described to described sample image The step carrying out image procossing includes:
Sample image is rotated, original sample image is sheared the subimage being sized, or by sample image at sky Point processing is carried out on territory.
Circuit board component missing part detection method the most according to claim 3, it is characterised in that described utilize training sample figure Include as the step of disaggregated model as being trained obtaining pinouts:
Read training sample image data T={ (x1,y1),(x2,y2),...,(xN,yN) in any one sample data (xi, yi), by xiInput described network model, from input layer through converting and be transferred to output layer step by step, calculate real output value oi= Fn(..(F2(F1(XiW(1))W(2))..)W(n));
Calculate real output value oiWith corresponding idea output yiBetween difference, build minimization error functionAdjust weight matrix;
Through weight matrix iteration several times, when difference EiThe deconditioning when reaching the threshold value set, obtains pinouts picture classification mould Type.
Circuit board component missing part detection method the most according to claim 1, it is characterised in that obtain electricity the most to be detected The detection image of road plate, and determine that according to described detection image the step of the Pin locations of components and parts includes:
The detection image of the circuit board of acquisition standard;
In described detection image, mark needs the pin of detecting element;
In the detection image of circuit board to be detected, according to the position of described mark positioning pins.
Circuit board component missing part detection method the most according to claim 1, it is characterised in that utilize described pin classification mould The step that the described Pin locations of detection image is detected by type includes:
The detection image input pin image disaggregated model comprising pin is detected, the unit of the pin circular hole of testing circuit plate Part missing part state.
Circuit board component missing part detection method the most according to claim 7, it is characterised in that drawing of described testing circuit plate The step of the element missing part state of foot circular hole includes:
At pinouts as in disaggregated model, if this pin state is 0, then it is judged to that the circular hole that this pin is corresponding does not insert pin; If the state of this pin is 1, then it is judged to that the circular hole that pin is corresponding has inserted pin.
Circuit board component missing part detection method the most according to claim 8, it is characterised in that also include: if this pin shape State is 0, sends pin and is not plugged warning.
10. a circuit board component missing part detecting system, it is characterised in that including:
Sample collection module, for obtaining the sample image of the Pin locations of multiple circuit boards;
Model training module, for carrying out sample training according to component's feet position on described sample image, obtains pin and divides Class model;
Pin locating module, for obtaining the detection image of circuit board the most to be detected, and determines according to described detection image The Pin locations of components and parts;
Pin detection module, for utilizing described pin disaggregated model to detect the described Pin locations of detection image, sentences The pin insert state of the components and parts of disconnected described circuit board.
CN201610438902.2A 2016-06-16 2016-06-16 Circuit board component missing part detection method and system Pending CN106127746A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610438902.2A CN106127746A (en) 2016-06-16 2016-06-16 Circuit board component missing part detection method and system
PCT/CN2016/113126 WO2017215241A1 (en) 2016-06-16 2016-12-29 Circuit board element missing detection method and system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610438902.2A CN106127746A (en) 2016-06-16 2016-06-16 Circuit board component missing part detection method and system

Publications (1)

Publication Number Publication Date
CN106127746A true CN106127746A (en) 2016-11-16

Family

ID=57470810

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610438902.2A Pending CN106127746A (en) 2016-06-16 2016-06-16 Circuit board component missing part detection method and system

Country Status (2)

Country Link
CN (1) CN106127746A (en)
WO (1) WO2017215241A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106525876A (en) * 2016-12-30 2017-03-22 杭州耕德电子有限公司 Automatic missing die-cutting part detecting system and method
CN106886800A (en) * 2017-03-20 2017-06-23 上海与德科技有限公司 The positioner and method of leakage current failure
WO2017215241A1 (en) * 2016-06-16 2017-12-21 广州视源电子科技股份有限公司 Circuit board element missing detection method and system
CN108827974A (en) * 2018-06-28 2018-11-16 广东科达洁能股份有限公司 A kind of ceramic tile defect inspection method and system
CN109959661A (en) * 2017-12-25 2019-07-02 由田新技股份有限公司 Automatic optical detection method, equipment and its deep learning system
CN110111293A (en) * 2018-01-29 2019-08-09 国科赛思(北京)科技有限公司 The failure recognition methods of plastic device and device
CN110415240A (en) * 2019-08-01 2019-11-05 国信优易数据有限公司 Sample image generation method and device, circuit board defect detection method and device
CN110736755A (en) * 2019-10-30 2020-01-31 珠海格力智能装备有限公司 Detection method and device for circuit board excess material and electronic equipment
CN110967350A (en) * 2019-11-05 2020-04-07 北京地平线机器人技术研发有限公司 Chip testing method and device based on image recognition and electronic equipment
CN111784674A (en) * 2020-07-02 2020-10-16 深圳明锐理想科技有限公司 Component detection method, component detection device, computer equipment and storage medium
CN113030121A (en) * 2021-03-11 2021-06-25 微讯智造(广州)电子有限公司 Automatic optical detection method, system and equipment for circuit board components
CN113808067A (en) * 2020-06-11 2021-12-17 广东美的白色家电技术创新中心有限公司 Circuit board detection method, visual detection equipment and device with storage function
CN114202515A (en) * 2021-11-29 2022-03-18 广州海谷电子科技有限公司 Method for detecting defect of printed carbon line of humidity sensor
CN116152251A (en) * 2023-04-20 2023-05-23 成都数之联科技股份有限公司 Television backboard detection method, model training method, device, equipment and medium

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110309865A (en) * 2019-06-19 2019-10-08 上海交通大学 A kind of unmanned plane patrolling power transmission lines pin defect system image-recognizing method
CN111189475A (en) * 2020-01-10 2020-05-22 珠海格力智能装备有限公司 Neglected loading detection device
CN111815567A (en) * 2020-06-15 2020-10-23 国网上海市电力公司 Automatic labeling method and device for high-recognition-rate power equipment
CN112102258A (en) * 2020-08-28 2020-12-18 无锡卡尔曼导航技术有限公司 Air-suction type seeder seeding detection method based on machine vision
CN117036228A (en) * 2022-12-05 2023-11-10 珠海祺力电子有限公司 PCBA production flow monitoring management system and method based on Internet of things
CN116245882A (en) * 2023-05-11 2023-06-09 深圳市世宗自动化设备有限公司 Circuit board electronic element detection method and device and computer equipment
CN117409261B (en) * 2023-12-14 2024-02-20 成都数之联科技股份有限公司 Element angle classification method and system based on classification model

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060023934A1 (en) * 2004-07-30 2006-02-02 Fujitsu Limited Component edge detecting method, component edge detecting program and component inspection apparatus
CN101424645A (en) * 2008-11-20 2009-05-06 上海交通大学 Soldered ball surface defect detection device and method based on machine vision
CN101915769A (en) * 2010-06-29 2010-12-15 华南理工大学 Automatic optical inspection method for printed circuit board comprising resistance element
CN103745475A (en) * 2014-01-22 2014-04-23 哈尔滨工业大学 Detection and positioning method used for spherical pin element
CN103954627A (en) * 2014-04-21 2014-07-30 杭州电子科技大学 Electronic component surface defect detection method based on sample library dictionary
CN104867145A (en) * 2015-05-15 2015-08-26 广东工业大学 IC element solder joint defect detection method based on VIBE model
CN104899871A (en) * 2015-05-15 2015-09-09 广东工业大学 Missing solder detection method of IC element solder joints
CN105303573A (en) * 2015-10-26 2016-02-03 广州视源电子科技股份有限公司 Method and system of pin detection of gold needle elements

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106127746A (en) * 2016-06-16 2016-11-16 广州视源电子科技股份有限公司 Circuit board component missing part detection method and system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060023934A1 (en) * 2004-07-30 2006-02-02 Fujitsu Limited Component edge detecting method, component edge detecting program and component inspection apparatus
CN101424645A (en) * 2008-11-20 2009-05-06 上海交通大学 Soldered ball surface defect detection device and method based on machine vision
CN101915769A (en) * 2010-06-29 2010-12-15 华南理工大学 Automatic optical inspection method for printed circuit board comprising resistance element
CN103745475A (en) * 2014-01-22 2014-04-23 哈尔滨工业大学 Detection and positioning method used for spherical pin element
CN103954627A (en) * 2014-04-21 2014-07-30 杭州电子科技大学 Electronic component surface defect detection method based on sample library dictionary
CN104867145A (en) * 2015-05-15 2015-08-26 广东工业大学 IC element solder joint defect detection method based on VIBE model
CN104899871A (en) * 2015-05-15 2015-09-09 广东工业大学 Missing solder detection method of IC element solder joints
CN105303573A (en) * 2015-10-26 2016-02-03 广州视源电子科技股份有限公司 Method and system of pin detection of gold needle elements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
刘阳: "基于图像处理的PCB焊接缺陷检测技术研究", 《中国优秀硕士学位论文全文数据库》 *

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017215241A1 (en) * 2016-06-16 2017-12-21 广州视源电子科技股份有限公司 Circuit board element missing detection method and system
CN106525876A (en) * 2016-12-30 2017-03-22 杭州耕德电子有限公司 Automatic missing die-cutting part detecting system and method
CN106886800A (en) * 2017-03-20 2017-06-23 上海与德科技有限公司 The positioner and method of leakage current failure
CN106886800B (en) * 2017-03-20 2020-10-27 上海科文斯集成微电有限公司 Leakage current fault positioning device and method
CN109959661A (en) * 2017-12-25 2019-07-02 由田新技股份有限公司 Automatic optical detection method, equipment and its deep learning system
CN110111293B (en) * 2018-01-29 2021-05-11 国科赛思(北京)科技有限公司 Failure identification method and device for plastic package device
CN110111293A (en) * 2018-01-29 2019-08-09 国科赛思(北京)科技有限公司 The failure recognition methods of plastic device and device
CN108827974A (en) * 2018-06-28 2018-11-16 广东科达洁能股份有限公司 A kind of ceramic tile defect inspection method and system
CN108827974B (en) * 2018-06-28 2024-01-09 广东科达洁能股份有限公司 Ceramic tile defect detection method and system
CN110415240A (en) * 2019-08-01 2019-11-05 国信优易数据有限公司 Sample image generation method and device, circuit board defect detection method and device
CN110736755A (en) * 2019-10-30 2020-01-31 珠海格力智能装备有限公司 Detection method and device for circuit board excess material and electronic equipment
CN110967350A (en) * 2019-11-05 2020-04-07 北京地平线机器人技术研发有限公司 Chip testing method and device based on image recognition and electronic equipment
CN110967350B (en) * 2019-11-05 2023-04-11 北京地平线机器人技术研发有限公司 Chip testing method and device based on image recognition and electronic equipment
CN113808067A (en) * 2020-06-11 2021-12-17 广东美的白色家电技术创新中心有限公司 Circuit board detection method, visual detection equipment and device with storage function
CN111784674A (en) * 2020-07-02 2020-10-16 深圳明锐理想科技有限公司 Component detection method, component detection device, computer equipment and storage medium
CN113030121A (en) * 2021-03-11 2021-06-25 微讯智造(广州)电子有限公司 Automatic optical detection method, system and equipment for circuit board components
CN114202515A (en) * 2021-11-29 2022-03-18 广州海谷电子科技有限公司 Method for detecting defect of printed carbon line of humidity sensor
CN116152251A (en) * 2023-04-20 2023-05-23 成都数之联科技股份有限公司 Television backboard detection method, model training method, device, equipment and medium
CN116152251B (en) * 2023-04-20 2023-07-14 成都数之联科技股份有限公司 Television backboard detection method, model training method, device, equipment and medium

Also Published As

Publication number Publication date
WO2017215241A1 (en) 2017-12-21

Similar Documents

Publication Publication Date Title
CN106127746A (en) Circuit board component missing part detection method and system
CN112053318B (en) Two-dimensional PCB defect real-time automatic detection and classification device based on deep learning
CN105510348B (en) A kind of defect inspection method of printed circuit board, device and detection device
CN103091331B (en) System and method for visual inspection on burrs and stain defects of radio frequency identification (RFID) antennae
Mahalingam et al. Pcb-metal: A pcb image dataset for advanced computer vision machine learning component analysis
CN111899241B (en) Quantitative on-line detection method and system for defects of PCB (printed Circuit Board) patches in front of furnace
CN105588840B (en) A kind of electronic units fix method and device
CN109946303A (en) Check device and method
CN110929720B (en) Component detection method based on LOGO matching and OCR
TWI618940B (en) Device and method for detecting blind hole of printed circuit board
CN105303573B (en) The pin detection method and system of acupuncture needle class component
US11315229B2 (en) Method for training defect detector
TWI715051B (en) Machine learning method and automatic optical inspection device using the method thereof
EP4046072A1 (en) Image analysis system for testing in manufacturing
CN104201130A (en) Optical detection method for defect classification
CN110346704A (en) Determination method, apparatus, equipment and the storage medium of test file in board test
CN105354816B (en) A kind of electronic units fix method and device
KR102174424B1 (en) Method for Inspecting Component basesd Server and system and apparatus therefor
Santoso et al. Development of pcb defect detection system using image processing with yolo cnn method
Caliskan et al. Design and realization of an automatic optical inspection system for PCB solder joints
Khare et al. PCB-fire: Automated classification and fault detection in PCB
CN113822836A (en) Method of marking an image
TWI755953B (en) Automatic detection system and operation method thereof
CN109975686B (en) Circuit board short circuit automatic identification method based on infrared image processing
CN112529902A (en) Hole checking method of PCB (printed circuit board)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20161116

RJ01 Rejection of invention patent application after publication