CN110516375B - Abnormal board card detection method and device, electronic equipment and storage medium - Google Patents

Abnormal board card detection method and device, electronic equipment and storage medium Download PDF

Info

Publication number
CN110516375B
CN110516375B CN201910809406.7A CN201910809406A CN110516375B CN 110516375 B CN110516375 B CN 110516375B CN 201910809406 A CN201910809406 A CN 201910809406A CN 110516375 B CN110516375 B CN 110516375B
Authority
CN
China
Prior art keywords
board card
abnormal
small
actual
standard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910809406.7A
Other languages
Chinese (zh)
Other versions
CN110516375A (en
Inventor
任胜伍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inspur Power Commercial Systems Co Ltd
Original Assignee
Inspur Power Commercial Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inspur Power Commercial Systems Co Ltd filed Critical Inspur Power Commercial Systems Co Ltd
Priority to CN201910809406.7A priority Critical patent/CN110516375B/en
Publication of CN110516375A publication Critical patent/CN110516375A/en
Application granted granted Critical
Publication of CN110516375B publication Critical patent/CN110516375B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Processing (AREA)

Abstract

The application discloses a detection method of an abnormal board card, which aims to solve the defects that in the prior art, abnormal finding is late due to the fact that a detection process is at the tail, and further, the repairing cost is high, the repairing difficulty is large and the loss is large. The application also discloses a detection device for the abnormal board card, electronic equipment and a computer readable storage medium, and the detection device has the beneficial effects.

Description

Abnormal board card detection method and device, electronic equipment and storage medium
Technical Field
The present disclosure relates to the field of board manufacturing technologies, and in particular, to a method and an apparatus for detecting an abnormal board, an electronic device, and a computer-readable storage medium.
Background
SMT, English is called Surface Mounted Technology entirely, Chinese name is: surface mount technology is widely used as an important process in semiconductor and electronic manufacturing technology.
The current SMT line process flow is as follows: printing (or dispensing) → mounting → curing (with or without) → reflow soldering → cleaning → detecting → repairing. The mounting specifically comprises small-size component mounting and large-size component mounting which are sequentially carried out. In practical situations, among the abnormal board cards detected in the detection process, there are some abnormal board cards which are abnormal in the mounting process, especially between the previous small-size component mounting step and the subsequent large-size component mounting step, some small-size wafers or irregular components often fall at positions where the small-size wafers or irregular components should not appear, so that the components appear below the large-size components, and further the overall quality and function of the board cards are affected by the components.
The inspection process can detect these situations based on the results, but due to the sequencing of the inspection process in the SMT line process, the rework after the problem is found becomes very complicated (requiring separation of large-sized components and small-sized components that have been mounted), and some of them are still irreversible, resulting in high rework cost, difficulty and loss.
Therefore, how to overcome the technical defects in the prior art and provide an abnormal board detection mechanism with more timely problem discovery, lower repair cost and less loss is a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The application aims to provide a method and a device for detecting an abnormal board card, electronic equipment and a computer readable storage medium, and aims to enable problems to be found more timely, repair cost to be lower and loss to be smaller.
In order to achieve the above object, the present application provides a method for detecting an abnormal board, including:
acquiring standard image characteristics of a board card for normally finishing the mounting of a small-size element;
when a board card exists in a preset area, shooting to obtain an actual image of the board card;
extracting actual image features from the actual image;
comparing the actual image features with the standard image features;
and when the actual image characteristics are different from the standard image characteristics, judging that the board card is abnormal in the small-size element mounting process, and marking the board card as an abnormal board card.
Optionally, when the actual image feature is different from the standard image feature, the method further includes:
receiving the actual mechanical characteristics fed back by the mechanical arm completing the mounting operation of the large-size element;
comparing the actual mechanical characteristics with standard mechanical characteristics; the standard mechanical characteristics are mechanical characteristics fed back by the mechanical arm under the condition that no abnormity occurs during mounting of the small-size component;
when the actual mechanical characteristics are different from the standard mechanical characteristics, judging that the board card is abnormal in the small-size element mounting process, and marking the board card as an abnormal board card;
and stopping the large-size component mounting operation currently performed on the abnormal board card.
Optionally, after the board card is marked as an abnormal board card, the method further includes:
and modifying the next assembly line process of the abnormal board card into a small-size element mounting error repairing process.
Optionally, the method for detecting an abnormal board card further includes:
and when the small-size component mounting error repairing process cannot complete repairing of the abnormal board card, sending prompt information which cannot automatically complete repairing through a preset path.
In order to achieve the above object, the present application further provides a device for detecting an abnormal board card, the device including:
the standard image characteristic acquisition unit is used for acquiring the standard image characteristics of the board card which normally finishes the mounting of the small-size element;
the real image acquisition unit is used for shooting to obtain a real image of the board card when the board card exists in a preset area;
the actual image feature extraction unit is used for extracting actual image features from the actual image;
an image feature comparison unit for comparing the actual image feature with the standard image feature;
and the abnormal board card first judging unit is used for judging that the board card is abnormal in the small-size element mounting process when the actual image characteristic is different from the standard image characteristic, and marking the board card as an abnormal board card.
Optionally, the apparatus for detecting an abnormal board card further includes:
the actual mechanical characteristic receiving unit is used for receiving the actual mechanical characteristics fed back by the mechanical arm completing the large-size component mounting operation when the actual image characteristics are different from the standard image characteristics;
the mechanical characteristic comparison unit is used for comparing the actual mechanical characteristic with a standard mechanical characteristic; the standard mechanical characteristics are mechanical characteristics fed back by the mechanical arm under the condition that no abnormity occurs during mounting of the small-size component;
a second abnormal board card judging unit, configured to judge that the board card is abnormal in a small-size component mounting process when the actual mechanical characteristic is different from the standard mechanical characteristic, and mark the board card as an abnormal board card;
and the large-size component mounting stopping unit is used for stopping the large-size component mounting operation currently performed on the abnormal board card.
Optionally, the apparatus for detecting an abnormal board card further includes:
and the assembly line process adjusting unit is used for modifying the next assembly line process of the abnormal board card into a small-size element mounting error repairing process after the board card is marked as the abnormal board card.
Optionally, the apparatus for detecting an abnormal board card further includes:
and the prompt information sending unit is used for sending prompt information which cannot automatically finish the repair through a preset path when the repair of the abnormal board card cannot be finished in the small-size component mounting error repair process.
To achieve the above object, the present application also provides an electronic device, including:
a memory for storing a computer program;
and the processor is used for realizing the detection method of the abnormal board card when the computer program is executed.
To achieve the above object, the present application further provides a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the method for detecting an abnormal board as described above.
The application provides a method for detecting an abnormal board card, which comprises the following steps: acquiring standard image characteristics of a board card for normally finishing the mounting of a small-size element; when a board card exists in a preset area, shooting to obtain an actual image of the board card; extracting actual image features from the actual image; comparing the actual image features with the standard image features; and when the actual image characteristics are different from the standard image characteristics, judging that the board card is abnormal in the small-size element mounting process, and marking the board card as an abnormal board card.
In order to solve the defects that in the prior art, abnormity is found late due to the fact that a detection process is located at the tail, and further, the defects that the repair cost is high, the repair difficulty is large and the loss is large are caused.
The application also provides a detection device for the abnormal board card, the electronic equipment and a computer readable storage medium, which have the beneficial effects and are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a method for detecting an abnormal board card according to an embodiment of the present application;
fig. 2 is a flowchart of another method for detecting an abnormal board card according to the embodiment of the present application;
fig. 3 is a block diagram of a structure of a device for detecting an abnormal board card according to an embodiment of the present application;
fig. 4 is a schematic process flow diagram of a new SMT line according to an embodiment of the present application.
Detailed Description
The application aims to provide a method and a device for detecting an abnormal board card, electronic equipment and a computer readable storage medium, and aims to enable problems to be found more timely, repair cost to be lower and loss to be smaller.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a flowchart of a method for detecting an abnormal board card according to an embodiment of the present application, including the following steps:
s101: acquiring standard image characteristics of a board card for normally finishing the mounting of a small-size element;
this step is intended to acquire a standard image feature, which is a feature extracted from a standard image that is an image obtained by shooting a board normally completing mounting of a small-sized component or other similar means, first.
S102: when a board card exists in a preset area, shooting to obtain an actual image of the board card;
in the step, the actual image of the board card actually completing the mounting operation of the small-size component is obtained, wherein in the mounting process, the mounting of the small-size component is performed firstly, and then the mounting of the large-size component is performed, which is embodied on an SMT line, and the two small steps are required to be at different positions or in different areas of the production line. Therefore, the preset area corresponds to an area where the board card after the small-size mounting operation is to be located.
S103: extracting actual image features from the actual image;
in addition to S102, the step is intended to extract actual image features from the actual image, and it should be noted that the manner of extracting the actual image features from the actual features should be the same as the manner of extracting the standard image features from the standard image, so that consistency comparison between the two subsequent images is performed on the same reference line.
Specifically, there are many ways to extract corresponding image features from an image, and different feature extraction algorithms have different side points, and according to the characteristics of the image in the specific scene of board card anomaly detection, the method and the device can flexibly select a suitable feature extraction algorithm convenient for highlighting anomalies, and are not specifically limited here.
S104: comparing the actual image features with the standard image features;
on the basis of S101 and S103, the present step is intended to determine whether the actual image features are different from the standard image features by way of comparison, in order to determine whether there is an abnormal situation (e.g., flying, pressing, missing, etc.) in the small-sized component mounting process of the board card according to the comparison result.
S105: and when the actual image characteristics are different from the standard image characteristics, judging that the board card is abnormal in the mounting process of the small-size element, and marking the board card as an abnormal board card.
In this step, in response to the comparison result obtained in S104 indicating that the actual image characteristic is different from the standard image characteristic, it is determined that the board card is abnormal in the mounting process of the small-sized component, and the board card is further marked as an abnormal board card for facilitating subsequent repair.
In order to solve the defects that in the prior art, due to the fact that the detection process is at the end, abnormity is found late, and further, the defects that the repair cost is high, the repair difficulty is large and the loss is large are caused.
It can be seen that, in the above embodiment, whether the board card has an abnormality in the small-sized component mounting process is detected specifically by means of image feature comparison. However, due to the complexity of the actual situation, the omission of the feature extraction algorithm, the brightness and the angle of the external light source when the actual image is obtained by shooting, and the like, some very special anomalies cannot be found in the image feature-based mode. Therefore, in order to avoid omission as much as possible, in this case, for the case that the determination result obtained in S104 is that the actual image feature is the same as the standard image feature, a further anomaly detection mode is additionally provided to achieve comprehensive detection as much as possible, which can be seen in the flowchart shown in fig. 2:
s201: receiving the actual mechanical characteristics fed back by the mechanical arm completing the mounting operation of the large-size element;
in order to achieve the purpose of enabling the mechanical arm to feed back mechanical characteristics, the mechanical sensor or other devices capable of achieving similar purposes are additionally arranged on the mechanical arm in advance.
S202: comparing the actual mechanical characteristics with the standard mechanical characteristics;
the standard mechanical characteristics are mechanical characteristics fed back by the mechanical arm under the condition that no abnormity occurs during mounting of the small-size component.
On the basis of S201, this step is intended to determine whether there is an abnormality by the result of comparison between the actual mechanical features and the standard mechanical features.
It should be understood that if flying, missing or pressing parts occur, the large-size components are inevitably subjected to abnormal stress due to the components which should not occur when the components are mounted.
S203: when the actual mechanical characteristics are different from the standard mechanical characteristics, judging that the board card is abnormal in the small-size element mounting process, and marking the board card as an abnormal board card;
in this step, in response to the fact that the determination result of S202 is that the actual mechanical characteristics are different from the standard mechanical characteristics, it is determined that the board card is abnormal in the mounting process of the small-sized component, and the board card is further marked as an abnormal board card for facilitating repair.
S204: and stopping the large-size component mounting operation currently performed on the abnormal board card.
On the basis of S203, this step is intended to stop the large-size component mounting operation currently being performed on the abnormal board, so as to prevent the large-size component or the rest of the components below from being damaged in the abnormal mounting operation due to the abnormal condition as much as possible, and reduce the repair difficulty as much as possible.
On the basis of the above embodiment, the present embodiment makes up a part that may be lacking in the process of performing anomaly detection and determination through image features from another angle through mechanical features, so that anomaly detection is more comprehensive.
On the basis of any one of the above embodiments, in order to repair the abnormal board card in time, the next assembly line process of the abnormal board card can be modified into a small-size component mounting error repairing process, and the adjustment of the process can be realized by modifying the branch trend of the next process.
When the machine is repaired, all the abnormalities can not be automatically repaired through the machine or equipment, and for the abnormalities which can not be automatically repaired by the machine or equipment, prompt information which can not be automatically repaired can be sent through a preset path, so that the help of related technicians can be sought through the prompt information. The preset path may be embodied as a pop-up window, a warning, a mail, a short message, various instant messaging applications, an audible and visual alarm, and the like on the system interface.
Because the situation is complicated and cannot be illustrated by a list, a person skilled in the art can realize that many examples exist according to the basic method principle provided by the application and the practical situation, and the protection scope of the application should be protected without enough inventive work.
Referring to fig. 3, fig. 3 is a block diagram of a structure of a device for detecting an abnormal board card according to an embodiment of the present application, where the device may include:
a standard image feature obtaining unit 100, configured to obtain a standard image feature of a board card that normally completes mounting of a small-sized component;
the actual image acquiring unit 200 is used for shooting to obtain an actual image of the board card when the board card exists in the preset area;
an actual image feature extraction unit 300, configured to extract actual image features from an actual image;
an image feature comparison unit 400 for comparing the actual image feature with the standard image feature;
the abnormal board card first determination unit 500 is configured to determine that the board card is abnormal in the small-size component mounting process when the actual image feature is different from the standard image feature, and mark the board card as an abnormal board card.
Further, the detection device for the abnormal board card may further include:
the actual mechanical characteristic receiving unit is used for receiving the actual mechanical characteristics fed back by the mechanical arm completing the large-size component mounting operation when the actual image characteristics are different from the standard image characteristics;
the mechanical characteristic comparison unit is used for comparing the actual mechanical characteristic with the standard mechanical characteristic; the standard mechanical characteristics are mechanical characteristics fed back by the mechanical arm under the condition that no abnormity occurs during mounting of the small-size element;
the second judging unit of the abnormal board card is used for judging that the board card is abnormal in the mounting process of the small-size element when the actual mechanical characteristics are different from the standard mechanical characteristics, and marking the board card as the abnormal board card;
and the large-size component mounting stopping unit is used for stopping the large-size component mounting operation currently performed on the abnormal board card.
Further, the detection device for the abnormal board card may further include:
and the assembly line process adjusting unit is used for marking the board card as an abnormal board card and then taking the next assembly line process of the abnormal board card as a small-size element mounting error repairing process.
Further, the apparatus for detecting an abnormal board card may further include:
and the prompt information sending unit is used for sending prompt information which cannot automatically finish repairing through a preset path when the repairing of the abnormal board card cannot be finished in the small-size component mounting error repairing process.
The present embodiment exists as a product embodiment corresponding to the above method embodiment, and has all the beneficial effects of the method embodiment, and details are not repeated here.
In the above, how to timely find the abnormality existing in the mounting process is described in detail through some embodiments, the present application further provides an entity hardware device corresponding to the method, the content principle of this portion corresponds to the scheme portion, the portion implementing the principle is not described herein again, and the following will describe the hardware composition of the entity hardware device:
an electronic device may include a memory and a processor, where the memory stores a computer program, and when the processor calls the computer program in the memory, the steps of the method for detecting an abnormal board card provided in the foregoing embodiment may be implemented. Of course, the electronic device may also include various necessary network interfaces, power supplies, other components, and the like.
Specifically, the electronic apparatus may be embodied as an AOI (Automated Optical Inspection) apparatus that is erected between a small-sized component mounting process and a large-sized component mounting process to implement abnormality detection and determination based on image characteristics based on an Optical Inspection instrument mounted on the apparatus.
On the basis, a partial process diagram of an improved SMT line can be seen in fig. 4, and it can be seen that an additional AOI device is erected between the small-sized component mounting process and the large-sized component mounting process, and a corresponding rework process is provided.
The present application also provides a computer-readable storage medium, on which a computer program is stored, which, when executed by an execution terminal or processor, can implement the steps provided by the above-mentioned embodiments. The storage medium may include: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It will be apparent to those skilled in the art that various changes and modifications can be made in the present invention without departing from the principles of the invention, and these changes and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Claims (8)

1. A method for detecting an abnormal board card is characterized by comprising the following steps:
acquiring standard image characteristics of a board card for normally finishing the mounting of a small-size element;
when a board card exists in a preset area, shooting to obtain an actual image of the board card;
extracting actual image features from the actual image;
comparing the actual image features with the standard image features;
when the actual image characteristics are different from the standard image characteristics, judging that the board card is abnormal in the small-size element mounting process, and marking the board card as an abnormal board card;
when the actual image feature is the same as the standard image feature, the method further comprises:
receiving the actual mechanical characteristics fed back by the mechanical arm completing the mounting operation of the large-size element; the mounting process comprises the steps of sequentially mounting the small-size element and the large-size element;
comparing the actual mechanical characteristics with standard mechanical characteristics; the standard mechanical characteristics are mechanical characteristics fed back by the mechanical arm under the condition that no abnormity occurs during mounting of the small-size component;
when the actual mechanical characteristics are different from the standard mechanical characteristics, judging that the board card is abnormal in the small-size element mounting process, and marking the board card as an abnormal board card;
and stopping the large-size component mounting operation currently performed on the abnormal board card.
2. The method according to claim 1, wherein after the board is marked as an abnormal board, the method further comprises:
and modifying the next assembly line process of the abnormal board card into a small-size element mounting error repairing process.
3. The detection method according to claim 2, further comprising:
and when the small-size component mounting error repairing process cannot complete repairing of the abnormal board card, sending prompt information which cannot automatically complete repairing through a preset path.
4. The utility model provides a detection apparatus of unusual integrated circuit board which characterized in that includes:
the standard image characteristic acquisition unit is used for acquiring the standard image characteristics of the board card which normally finishes the mounting of the small-size element;
the real image acquisition unit is used for shooting to obtain a real image of the board card when the board card exists in a preset area;
the actual image feature extraction unit is used for extracting actual image features from the actual image;
an image feature comparison unit for comparing the actual image feature with the standard image feature;
the abnormal board card first judging unit is used for judging that the board card is abnormal in the small-size component mounting process when the actual image characteristic is different from the standard image characteristic, and marking the board card as an abnormal board card;
further comprising:
the actual mechanical characteristic receiving unit is used for receiving the actual mechanical characteristics fed back by the mechanical arm completing the large-size component mounting operation when the actual image characteristics are the same as the standard image characteristics; the mounting process comprises the steps of sequentially mounting the small-size element and the large-size element;
the mechanical characteristic comparison unit is used for comparing the actual mechanical characteristic with a standard mechanical characteristic; the standard mechanical characteristics are mechanical characteristics fed back by the mechanical arm under the condition that no abnormity occurs during mounting of the small-size component;
a second abnormal board card judging unit, configured to judge that the board card is abnormal in a small-size component mounting process when the actual mechanical characteristic is different from the standard mechanical characteristic, and mark the board card as an abnormal board card;
and the large-size component mounting stopping unit is used for stopping the large-size component mounting operation currently performed on the abnormal board card.
5. The detection device of claim 4, further comprising:
and the assembly line process adjusting unit is used for modifying the next assembly line process of the abnormal board card into a small-size element mounting error repairing process after the board card is marked as the abnormal board card.
6. The detection device of claim 5, further comprising:
and the prompt information sending unit is used for sending prompt information which cannot automatically finish the repair through a preset path when the repair of the abnormal board card cannot be finished in the small-size component mounting error repair process.
7. An electronic device, comprising:
a memory for storing a computer program;
a processor for implementing the method for detecting an abnormal board according to any one of claims 1 to 3 when executing the computer program.
8. A computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, and when executed by a processor, the computer program implements the method for detecting an abnormal board according to any one of claims 1 to 3.
CN201910809406.7A 2019-08-29 2019-08-29 Abnormal board card detection method and device, electronic equipment and storage medium Active CN110516375B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910809406.7A CN110516375B (en) 2019-08-29 2019-08-29 Abnormal board card detection method and device, electronic equipment and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910809406.7A CN110516375B (en) 2019-08-29 2019-08-29 Abnormal board card detection method and device, electronic equipment and storage medium

Publications (2)

Publication Number Publication Date
CN110516375A CN110516375A (en) 2019-11-29
CN110516375B true CN110516375B (en) 2021-06-01

Family

ID=68629049

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910809406.7A Active CN110516375B (en) 2019-08-29 2019-08-29 Abnormal board card detection method and device, electronic equipment and storage medium

Country Status (1)

Country Link
CN (1) CN110516375B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111395717A (en) * 2020-03-19 2020-07-10 广东博智林机器人有限公司 Paving device, floor tile paving robot and floor tile paving method
CN116991131B (en) * 2023-09-26 2023-12-01 南通新丰威机械科技有限公司 Production circulation control method and system based on sensor cooperation

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7015467B2 (en) * 2002-10-10 2006-03-21 Applied Materials, Inc. Generating electrons with an activated photocathode
CN101755229A (en) * 2007-10-17 2010-06-23 Ads技术株式会社 Apparatus for adjusting the degree of freedom using sensor in assembling optical device
CN102236569A (en) * 2011-07-20 2011-11-09 大唐移动通信设备有限公司 Embedded system and starting method thereof
CN103048610A (en) * 2012-12-24 2013-04-17 上海金东唐精机科技有限公司 Entrance waiting time-free automatic test system for printed circuit board (PCB)
CN103252579A (en) * 2013-03-21 2013-08-21 常州镭赛科技有限公司 Laser welder
CN203608457U (en) * 2013-09-26 2014-05-21 北大方正集团有限公司 Bearing device, bearing assembly and conveying device
CN204248161U (en) * 2014-09-09 2015-04-08 镇江泛沃汽车零部件有限公司 A kind of system of processing of warm braw motor brush rocker workpiece
CN105328699A (en) * 2014-08-05 2016-02-17 罗伯特·博世有限公司 Intelligent robot welding system and method
CN105531582A (en) * 2013-09-17 2016-04-27 富士机械制造株式会社 Mounting inspection device
CN105550081A (en) * 2015-12-07 2016-05-04 广州视源电子科技股份有限公司 Board card error display method and system
CN105631878A (en) * 2015-12-28 2016-06-01 广州视源电子科技股份有限公司 Board card error detection method and system
CN105751200A (en) * 2014-12-05 2016-07-13 济南鲁智电子科技有限公司 Action method of fully hydraulic autonomous moving mechanical arm
CN205643192U (en) * 2016-03-11 2016-10-12 河北工业大学 Check out test set of SMT masterplate quality
CN205905553U (en) * 2016-06-20 2017-01-25 唐双华 Counterpoint and spout seal and solidify split type seal system of spouting
CN106659113A (en) * 2015-10-30 2017-05-10 由田新技股份有限公司 Material inspection system and material inspection method
CN106914701A (en) * 2017-03-01 2017-07-04 绍兴创新激光科技有限公司 A kind of robotic laser's welding method and system
CN207832224U (en) * 2018-01-23 2018-09-07 广州勤润电子有限公司 A kind of SMT patches quality detection device
CN109048150A (en) * 2018-09-03 2018-12-21 成都福莫斯智能系统集成服务有限公司 The method that welding robot is automatically drained out failure
CN109580646A (en) * 2018-12-21 2019-04-05 苏州绿控传动科技股份有限公司 A method of by camera to PCBA appearance test
CN109759755A (en) * 2019-02-28 2019-05-17 武汉三工智能装备制造有限公司 AI intelligent process anomalous identification processing system and solar cell chip bonding machine
CN110024511A (en) * 2016-12-01 2019-07-16 株式会社富士 The production management system of element mounting production line

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101336072B (en) * 2007-06-29 2010-08-04 富葵精密组件(深圳)有限公司 Surface-mounted contraposition apparatus and method thereof
TW201423088A (en) * 2012-12-07 2014-06-16 Hon Hai Prec Ind Co Ltd Electronic element checking system and checking method
CN103376270A (en) * 2013-07-03 2013-10-30 华南理工大学 Component-counting method on basis of X-ray linear scanning and counting device thereof
JP6233061B2 (en) * 2014-01-30 2017-11-22 オムロン株式会社 Quality control device and quality control method
CN105070672B (en) * 2015-08-06 2018-01-19 杭州灏元自动化设备有限公司 The detection of bad particle and processing equipment and method in Chip-R
CN105424721B (en) * 2015-12-11 2018-07-13 南京神源生智能科技有限公司 A kind of metal strain meter defect automatic checkout system

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7015467B2 (en) * 2002-10-10 2006-03-21 Applied Materials, Inc. Generating electrons with an activated photocathode
CN101755229A (en) * 2007-10-17 2010-06-23 Ads技术株式会社 Apparatus for adjusting the degree of freedom using sensor in assembling optical device
CN102236569A (en) * 2011-07-20 2011-11-09 大唐移动通信设备有限公司 Embedded system and starting method thereof
CN103048610A (en) * 2012-12-24 2013-04-17 上海金东唐精机科技有限公司 Entrance waiting time-free automatic test system for printed circuit board (PCB)
CN103252579A (en) * 2013-03-21 2013-08-21 常州镭赛科技有限公司 Laser welder
CN105531582A (en) * 2013-09-17 2016-04-27 富士机械制造株式会社 Mounting inspection device
CN203608457U (en) * 2013-09-26 2014-05-21 北大方正集团有限公司 Bearing device, bearing assembly and conveying device
CN105328699A (en) * 2014-08-05 2016-02-17 罗伯特·博世有限公司 Intelligent robot welding system and method
CN204248161U (en) * 2014-09-09 2015-04-08 镇江泛沃汽车零部件有限公司 A kind of system of processing of warm braw motor brush rocker workpiece
CN105751200A (en) * 2014-12-05 2016-07-13 济南鲁智电子科技有限公司 Action method of fully hydraulic autonomous moving mechanical arm
CN106659113A (en) * 2015-10-30 2017-05-10 由田新技股份有限公司 Material inspection system and material inspection method
CN105550081A (en) * 2015-12-07 2016-05-04 广州视源电子科技股份有限公司 Board card error display method and system
CN105631878A (en) * 2015-12-28 2016-06-01 广州视源电子科技股份有限公司 Board card error detection method and system
CN205643192U (en) * 2016-03-11 2016-10-12 河北工业大学 Check out test set of SMT masterplate quality
CN205905553U (en) * 2016-06-20 2017-01-25 唐双华 Counterpoint and spout seal and solidify split type seal system of spouting
CN110024511A (en) * 2016-12-01 2019-07-16 株式会社富士 The production management system of element mounting production line
CN106914701A (en) * 2017-03-01 2017-07-04 绍兴创新激光科技有限公司 A kind of robotic laser's welding method and system
CN207832224U (en) * 2018-01-23 2018-09-07 广州勤润电子有限公司 A kind of SMT patches quality detection device
CN109048150A (en) * 2018-09-03 2018-12-21 成都福莫斯智能系统集成服务有限公司 The method that welding robot is automatically drained out failure
CN109580646A (en) * 2018-12-21 2019-04-05 苏州绿控传动科技股份有限公司 A method of by camera to PCBA appearance test
CN109759755A (en) * 2019-02-28 2019-05-17 武汉三工智能装备制造有限公司 AI intelligent process anomalous identification processing system and solar cell chip bonding machine

Also Published As

Publication number Publication date
CN110516375A (en) 2019-11-29

Similar Documents

Publication Publication Date Title
TWI757825B (en) System and method for pcb inspection based on false defect detection
EP3102018B1 (en) Quality management device and method for controlling quality management device
KR102022496B1 (en) Process management and monitoring system using vision image detection and a method thereof
JP2018530800A (en) Method for assembling electric switch and assembly assist device for simplifying assembly of such switch
WO2019155593A1 (en) System for creating learned model for component image recognition, and method for creating learned model for component image recognition
CN110516375B (en) Abnormal board card detection method and device, electronic equipment and storage medium
JP2006317266A (en) Inspection standard setting system, inspection standard setting method and process inspection device
JP4661371B2 (en) Board inspection system
US8260727B2 (en) Method and apparatus for estimating a factor/defect affecting quality/reliability wherein the priority of user input data is determined
CN111386024A (en) Pin self-adaptive positioning insertion method and system for double-pin electronic component
EP3499330A1 (en) Management system, management device, management method, and program
CN106846294B (en) Visual detection method, device and equipment
KR102191704B1 (en) cable harness inspection method based on machine vision
CN113822385B (en) Coal conveying abnormity monitoring method, device and equipment based on image and storage medium
CN111421954B (en) Intelligent judgment feedback method and device
CN113780235A (en) Icon flaw detection method and system
CN105136818A (en) Printing substrate image detecting method
CN112272968B (en) Inspection method, inspection system, and recording medium
US7551765B2 (en) Electronic component detection system
CN112330583A (en) Product defect detection method, device, equipment and storage medium
KR101664413B1 (en) Method for detecting mount error of SMT machine
KR20150104766A (en) Tracking method for badness history in inspection process
EP0535610A2 (en) Printed matter inspection method
JP2007327824A (en) Terminal lead inspection method
CN113593074A (en) Monitoring video generation method and device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant